CN210807783U - LED multilayer flexible circuit board - Google Patents
LED multilayer flexible circuit board Download PDFInfo
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- CN210807783U CN210807783U CN201921667244.XU CN201921667244U CN210807783U CN 210807783 U CN210807783 U CN 210807783U CN 201921667244 U CN201921667244 U CN 201921667244U CN 210807783 U CN210807783 U CN 210807783U
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Abstract
The utility model discloses a LED multilayer flexible circuit board, which comprises a double-sided circuit substrate, a pure glue attaching layer, a flexible conductive plate, a glue coating layer and an insulating protective layer; a first bonding surface is arranged on the double-sided circuit substrate, the pure glue attaching layer is attached to the first bonding surface, and a conduction window is formed in the pure glue attaching layer; glue coat attaches on insulating protective layer, and glue coat attaches on flexible current conducting plate, and flexible current conducting plate, glue coat and insulating protective layer constitute individual layer flexible circuit base plate and attach on the attached layer of pure glue of two-sided circuit base plate, make up into LED multilayer flexible line way board. The utility model discloses a can reduce the transmission loss of low pressure electric energy, reduce the loss of electric energy promptly, and then guarantee that the LED lamp pearl luminous intensity at lamp strip low pressure remote transmission both ends keeps unanimous for low pressure LED illumination remote transmission circuit can normal use.
Description
Technical Field
The utility model relates to a LED circuit board field especially relates to a LED multilayer flexible line way board.
Background
The LED circuit board is a short for printed circuit board, the LED aluminum substrate and the FR-4 glass fiber circuit board both belong to the same PCB, and in different terms, the LED aluminum substrate and the FR-4 glass fiber circuit board are only taken for comparison, the LED aluminum substrate is printed on a plane of aluminum material with better heat conductivity, and then an electronic element is welded on the plane. The aluminum substrate is mainly used for achieving good heat dissipation, and the high-power LED generates relatively large heat, so that most aluminum substrates are used for producing LED lighting lamps. The FR-4 glass fiber circuit board is a traditional electronic product circuit board, and has the characteristics of good insulation, corrosion resistance, pressure resistance, multilayer printing and the like, so that the FR-4 glass fiber circuit board is widely applied. The quality of the LED aluminum substrate mainly considers the material type, hardness, surface and thickness of the aluminum material, and the proper type size is selected according to the heat productivity of the product. FR-4 glass fiber circuit boards are mature products, and most of the FR-4 glass fiber circuit boards used on the LED display screen are used.
However, the thickness of the copper foil of the base material adopted by the existing traditional circuit board can only be 105 microns, and the transmission loss of low-voltage electric energy is relatively large in a limited width range. Traditional lamp strip in the industry wants to reach the industry standard under the condition that uses a power not additionally to take other gain equipment, and low pressure power transmission distance is only 5 meters, exceeds this scope and will produce the pressure drop, and electric energy loss is too big promptly, and then causes LED lamp pearl luminous intensity end to end inconsistent. In practical application, in some special environments, the low-voltage LED lighting circuit cannot be used normally because the length is insufficient and the power supply cannot be added midway. Such as swimming pools, underground mines, etc., where high voltage electrical energy cannot be used.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, provide a LED multilayer flexible line way board, can reduce the transmission loss of low pressure electric energy, reduce the loss of electric energy promptly, and then guarantee that the LED lamp pearl luminous intensity at lamp strip low pressure remote transmission both ends keeps unanimous for low pressure LED illumination remote transmission circuit can normal use.
The purpose of the utility model is realized through the following technical scheme:
an LED multilayer flexible wiring board comprising: the circuit board comprises a double-sided circuit substrate, a pure glue attaching layer, a flexible conductive plate, a glue coating layer and an insulating protective layer;
the double-sided circuit substrate is provided with a conductive hole, a first bonding surface is arranged on one side surface of the double-sided circuit substrate, the pure glue attaching layer is attached to the first bonding surface, the pure glue attaching layer is provided with a conduction window, and the conduction window is communicated with the conductive hole;
a side of glue coat in on the insulating layer, the glue coat is kept away from a side of insulating layer in on the flexible current conducting plate, the flexible current conducting plate the glue coat reaches individual layer flexible line base plate is constituteed to the insulating layer, the electric connecting hole has been seted up on the individual layer flexible line base plate, the individual layer flexible line base plate in attached layer is kept away from on the side of two-sided circuit base plate in pure glue, and the electric connecting hole with the electrically conductive hole intercommunication.
In one embodiment, the other side surface of the double-sided circuit substrate, which is opposite to the first bonding surface, is further provided with a second bonding surface, and the flexible circuit board further comprises a character layer, wherein the character layer is attached to the second bonding surface.
In one embodiment, the double-sided circuit substrate comprises a solder resist protection layer and a double-sided copper-clad plate, wherein a first side face of the double-sided copper-clad plate is attached to the pure glue attaching layer, and a second side face of the double-sided copper-clad plate is attached to the solder resist protection layer.
In one embodiment, the solder resist protection layer is provided with a plurality of front windows, and a space is respectively arranged between the front windows.
In one embodiment, the LED multilayer flexible circuit board further includes an LED lamp and a chip component, the LED lamp and the chip component are respectively disposed in the front window, and the LED lamp and the chip component are respectively electrically connected to the double-sided copper-clad plate.
In one embodiment, the double-sided copper-clad plate comprises a front-side circuit layer, a back-side circuit layer and a back-side protective layer, wherein the back-side circuit layer is provided with a first mounting surface and a second mounting surface which are oppositely arranged, the front-side circuit layer is arranged on the first mounting surface, and the back-side protective layer is attached to the second mounting surface.
In one embodiment, the double-sided copper-clad plate further comprises a double-sided board conduction layer, wherein a pure copper conduction hole or a solder paste welding hole is formed in the double-sided board conduction layer, and the pure copper conduction hole or the solder paste welding hole is used for conducting the front circuit layer and the back circuit layer.
In one embodiment, a conductive line is etched on the front surface circuit layer, and the conductive line is a copper-clad line.
In one embodiment, the reverse side circuit layer is formed by etching a plurality of copper foil strips formed by pure copper foil, and the copper foil strips are arranged in parallel with each other.
In one embodiment, the glue coating layer is an adhesive or a thermosetting adhesive film.
In one embodiment, the insulating protection layer is a PI insulating layer.
The utility model discloses compare in prior art's advantage and beneficial effect as follows:
the utility model relates to a LED multilayer flexible circuit board, which is provided with a double-sided circuit substrate, a pure glue attaching layer and a single-layer flexible circuit substrate; and set up the electrically conductive hole on two-sided circuit substrate, and set up the electric connection hole with the electrically conductive hole intercommunication on the individual layer flexible line substrate, thereby can increase an electric energy transmission thread on two-sided circuit substrate, the individual layer flexible line substrate is again by flexible current conducting plate simultaneously, glue coating and insulating protective layer constitute, make the flexible current conducting plate thickness that adopts pure copper foil not receive the restriction, can be with the thickness and the width of increasing flexible current conducting plate, solve the problem that traditional flexible line way board low pressure electric energy transmission distance only has 5 meters, thereby can reduce the transmission loss of low pressure electric energy, namely reduce the loss of electric energy, and then guarantee that the LED lamp pearl luminous intensity at lamp strip low pressure remote transmission both ends keeps unanimous, make low pressure LED illumination remote transmission circuit can normal use.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of an LED multilayer flexible circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of an LED multilayer flexible circuit board shown in FIG. 1;
fig. 3 is a schematic structural diagram of the double-sided circuit substrate shown in fig. 1.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, an LED multilayer flexible circuit board includes: the double-sided circuit board comprises a double-sided circuit substrate 100, a pure glue attaching layer 200, a flexible conductive plate 300, a glue coating layer 400 and an insulating protection layer 500; the double-sided circuit substrate 100 is used for electrically connecting an external LED lamp; the pure glue attaching layer 200 is used for bonding the double-sided circuit substrate and the flexible conductive plate, so that the flexible conductive plate can be stably fixed on the back of the double-sided circuit substrate, and the flexible conductive plate is electrically connected with the double-sided circuit substrate; the flexible conductive plate 300 can be selected to have a certain thickness and width according to requirements, and electric energy transmission without voltage drop is realized; the glue coating layer 400 is used for attaching the insulating protective layer to the flexible conductive plate; the insulating and protecting layer 500 serves to insulate and protect the flexible and conductive sheet.
The utility model discloses a length of LED multilayer flexible line way board is 0.5m ~ 2m, conveniently produces and improves production efficiency.
Referring to fig. 1 and 2, a conductive hole 110 is formed on the double-sided circuit substrate 100, a first bonding surface is disposed on one side surface of the double-sided circuit substrate, the pure glue attaching layer 200 is attached to the first bonding surface, a conductive window 210 is formed on the pure glue attaching layer 200, and the conductive window is communicated with the conductive hole. It should be noted that, by arranging the conduction window to be communicated with the conductive hole, the flexible conductive plate can be electrically connected with the double-sided circuit substrate through the conductive hole. And, further, the flexible circuit board still includes the tin cream welded layer, the welding of tin cream welded layer is on electrically conductive hole to make the electric connection of flexible current conducting board and two-sided circuit substrate more firm.
Referring to fig. 1 and 2, one side of the glue coating layer is attached to the insulating protective layer, one side of the glue coating layer away from the insulating protective layer is attached to the flexible conductive plate, the glue coating layer and the insulating protective layer form a single-layer flexible circuit substrate, an electrical connection hole 510 is formed in the single-layer flexible circuit substrate, the single-layer flexible circuit substrate is attached to one side of the pure glue attaching layer away from the double-sided circuit substrate, and the electrical connection hole is communicated with the electrical connection hole. It should be noted that, through setting up electric connecting hole and conducting hole intercommunication, can be so that flexible current conducting plate and another flexible current conducting plate carry out the electricity and connect, that is to say when needs a plurality of head and the tail concatenations of carrying on, then the flexible current conducting plate that leaks through the electric connecting hole carries out the electricity with the flexible current conducting plate of another LED multilayer flexible line way board and is connected, when realizing remote electric energy transmission, can also realize hardly having the pressure drop, the electric energy remote transmission of not reducing the loss.
Thus, the double-sided circuit substrate, the pure glue attaching layer and the single-layer flexible circuit substrate are arranged; and set up the electrically conductive hole on two-sided circuit substrate, and set up the electric connection hole with the electrically conductive hole intercommunication on the individual layer flexible line substrate, thereby can increase an electric energy transmission thread on two-sided circuit substrate, the individual layer flexible line substrate is again by flexible current conducting plate simultaneously, glue coating and insulating protective layer constitute, make the flexible current conducting plate thickness that adopts pure copper foil not receive the restriction, can be with the thickness and the width of increasing flexible current conducting plate, solve the problem that traditional flexible line way board low pressure electric energy transmission distance only has 5 meters, thereby can reduce the transmission loss of low pressure electric energy, namely reduce the loss of electric energy, and then guarantee that the LED lamp pearl luminous intensity at lamp strip low pressure remote transmission both ends keeps unanimous, make low pressure LED lighting circuit remote transmission can normal use.
Referring to fig. 2, a second bonding surface is further disposed on the other side surface of the double-sided circuit substrate opposite to the first bonding surface, and the LED multilayer flexible circuit board further includes a character layer 600 attached to the second bonding surface. Therefore, the character layer is arranged, and the function of identification can be achieved.
Referring to fig. 2, the double-sided circuit substrate 100 includes a solder resist protection layer 120 and a double-sided copper-clad plate 130, a first side of the double-sided copper-clad plate is attached to the pure glue attaching layer, and a second side of the double-sided copper-clad plate is attached to the solder resist protection layer. Therefore, the solder resist protection layer 120 is arranged to play a role in protection, and the double-sided electric connection is realized by arranging the double-sided copper clad plate 130.
Referring to fig. 2, the solder resist protection layer 120 is formed with a plurality of front windows 121, and a space is respectively disposed between the front windows. Furthermore, the plurality of front windows are arranged in order, so that each electronic component can be welded on the front windows.
The LED multilayer flexible circuit board further comprises an LED lamp and a chip component, wherein the LED lamp and the chip component are respectively arranged in the front window, and the LED lamp and the chip component are respectively electrically connected with the double-sided copper-clad plate. So, through setting up LED lamp and paster components and parts, can realize the function of illumination.
Specifically, the chip component comprises a chip resistor, a chip capacitor and the like, and the chip resistor and the chip capacitor are respectively and electrically connected with the front circuit layer of the double-sided copper-clad plate. So, through setting up chip resistor and paster electric capacity, can connect the LED lamp by the electricity, realize the power supply to the LED lamp.
Referring to fig. 2, the double-sided copper-clad plate 130 includes a front-side circuit layer 131, a back-side circuit layer 132 and a back-side protective layer 133, the back-side circuit layer has a first mounting surface and a second mounting surface which are oppositely arranged, the front-side circuit layer is arranged on the first mounting surface, and the back-side protective layer is attached to the second mounting surface. Thus, the front surface of the flexible circuit board can be electrically connected with the electronic component by arranging the front surface circuit layer 131; the reverse wiring layer 132 is provided to connect the front wiring and the external conductive layer, i.e., to connect the external flexible conductive plate 300.
Referring to fig. 3, the double-sided copper-clad plate 130 further includes a double-sided board conduction layer 134, the double-sided board conduction layer 134 is provided with a pure copper via hole 134a or a solder paste welding hole, and both the pure copper via hole 134a and the solder paste welding hole are used for conducting the front circuit layer and the back circuit layer. Further, in order to ensure that the double-sided circuit board is isolated and insulated, the double-sided board conducting layer 134 is arranged in the front-side and back-side circuit layers, and the pure copper conducting hole 134a or the solder paste welding hole 134b is arranged on the double-sided board conducting layer 134, so that the front-side and back-side circuit layers are conducted, the pure copper conducting hole 134a is used for achieving conduction of the front-side and back-side circuits through pure copper electroplating, and the solder paste welding hole 134b is used for achieving conduction of the front-side and back-side circuits through the solder paste arranged on the conducting hole.
It should be noted that a conductive line is etched on the front surface line layer, and the conductive line is a copper-clad line. Thus, by providing the conductive line, electrical connection can be achieved.
Referring to fig. 2, the reverse circuit layer 132 is formed by etching a plurality of copper foil strips formed by pure copper foil, and the copper foil strips are disposed in parallel. So, through setting up many copper foil strips, can realize that the positive pole and the negative pole of positive circuit switch on.
The glue coating layer is adhesive or a thermosetting adhesive film. The insulation protection layer is a PI insulation layer. So, through setting up adhesive and PI insulating layer, can improve the structural stability and the reliability of flexible line way board, and then improve the stability of electricity connection.
It should be further noted that the LED multilayer flexible circuit board of the present invention further has the following advantages: 1. the production of the product can be realized by adopting traditional equipment and conventional materials, development or purchase of new equipment is not needed, and resources are saved. 2. The flexible circuit board has the same overall dimension (0.5-2 m) as the traditional circuit board, and the product does not need to change the prior process and equipment, thereby being convenient for production. 3. The flexible circuit board can realize low-voltage long-distance transmission without voltage drop, and solves the problem that the voltage drop exists when the traditional product exceeds 5 meters.
The utility model discloses a process flow of LED multilayer flexible line way board as follows:
1. drilling, electroplating, exposing, etching and the like on the double-sided copper-clad plate to manufacture a flexible double-sided circuit board with front and back circuits;
2. adhering pure glue with a connecting window on the reverse side circuit of the flexible double-sided circuit board;
3. pasting a pure copper foil on a PI film with glue on one side to form a single-side copper-clad plate;
4. drilling, electroplating, exposing, etching and the like are carried out on the single-sided copper-clad plate to manufacture a flexible single-sided circuit board;
5. one side of the pure copper foil of the flexible single-sided circuit board is pasted on the reverse side of the flexible double-sided circuit board pasted with the pure glue;
6. and then laminating at high temperature to tightly combine the flexible double-sided circuit board and the flexible single-sided circuit board, and curing at high temperature to form a complete LED multilayer flexible circuit board.
The utility model discloses compare in prior art's advantage and beneficial effect as follows:
the utility model relates to a LED multilayer flexible circuit board, which is provided with a double-sided circuit substrate, a pure glue attaching layer and a single-layer flexible circuit substrate; and set up the electrically conductive hole on two-sided circuit substrate, and set up the electric connection hole with the electrically conductive hole intercommunication on the individual layer flexible line substrate, thereby can increase an electric energy transmission thread on two-sided circuit substrate, the individual layer flexible line substrate is again by flexible current conducting plate simultaneously, glue coating and insulating protective layer constitute, make the flexible current conducting plate thickness that adopts pure copper foil not receive the restriction, can be with the thickness and the width of increasing flexible current conducting plate, solve the problem that traditional flexible line way board low pressure electric energy transmission distance only has 5 meters, thereby can reduce the transmission loss of low pressure electric energy, namely reduce the loss of electric energy, and then guarantee that the LED lamp pearl luminous intensity at lamp strip low pressure remote transmission both ends keeps unanimous, make low pressure LED lighting circuit remote transmission can normal use.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An LED multilayer flexible wiring board, comprising: the circuit board comprises a double-sided circuit substrate, a pure glue attaching layer, a flexible conductive plate, a glue coating layer and an insulating protective layer;
the double-sided circuit substrate is provided with a conductive hole, a first bonding surface is arranged on one side surface of the double-sided circuit substrate, the pure glue attaching layer is attached to the first bonding surface, the pure glue attaching layer is provided with a conduction window, and the conduction window is communicated with the conductive hole;
a side of glue coat in on the insulating layer, the glue coat is kept away from a side of insulating layer in on the flexible current conducting plate, the flexible current conducting plate the glue coat reaches individual layer flexible line base plate is constituteed to the insulating layer, the electric connecting hole has been seted up on the individual layer flexible line base plate, the individual layer flexible line base plate in attached layer is kept away from on the side of two-sided circuit base plate in pure glue, and the electric connecting hole with the electrically conductive hole intercommunication.
2. The LED multilayer flexible wiring board of claim 1, wherein a second adhesive surface is further disposed on the other side of the double-sided circuit board opposite to the first adhesive surface, the flexible wiring board further comprising a character layer attached to the second adhesive surface.
3. The LED multilayer flexible circuit board of claim 1, wherein the double-sided circuit substrate comprises a solder resist protective layer and a double-sided copper-clad plate, a first side of the double-sided copper-clad plate is attached to the pure glue attaching layer, and a second side of the double-sided copper-clad plate is attached to the solder resist protective layer.
4. The LED multilayer flexible circuit board of claim 3, wherein a plurality of front windows are formed on the solder resist protection layer, and a space is respectively arranged between each front window.
5. The LED multilayer flexible circuit board according to claim 4, further comprising an LED lamp and a chip component, wherein the LED lamp and the chip component are respectively arranged in the front window, and the LED lamp and the chip component are respectively electrically connected with the double-sided copper-clad plate.
6. The LED multilayer flexible circuit board according to claim 3, wherein the double-sided copper-clad plate comprises a front side circuit layer, a back side circuit layer and a back side protective layer, the back side circuit layer is provided with a first mounting surface and a second mounting surface which are oppositely arranged, the front side circuit layer is arranged on the first mounting surface, and the back side protective layer is attached to the second mounting surface.
7. The LED multilayer flexible circuit board of claim 6, wherein the double-sided copper-clad plate further comprises a double-sided conductive layer, the double-sided conductive layer is provided with a pure copper via hole or a solder paste soldering hole, and the pure copper via hole or the solder paste soldering hole is used for conducting the front circuit layer and the back circuit layer.
8. The LED multilayer flexible circuit board of claim 6, wherein a conductive line is etched on the front surface circuit layer, and the conductive line is a copper-clad line.
9. The LED multilayer flexible circuit board of claim 6, wherein the reverse side circuit layer is formed by etching a plurality of copper foil strips from pure copper foil, and the copper foil strips are arranged in parallel with each other.
10. The LED multilayer flexible wiring board of claim 1, wherein the insulating protective layer is a PI insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667244.XU CN210807783U (en) | 2019-09-30 | 2019-09-30 | LED multilayer flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667244.XU CN210807783U (en) | 2019-09-30 | 2019-09-30 | LED multilayer flexible circuit board |
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| CN210807783U true CN210807783U (en) | 2020-06-19 |
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| CN201921667244.XU Active CN210807783U (en) | 2019-09-30 | 2019-09-30 | LED multilayer flexible circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245563A (en) * | 2021-11-23 | 2022-03-25 | 博罗康佳精密科技有限公司 | Metal-based printed circuit board for three-dimensional packaging and preparation process thereof |
-
2019
- 2019-09-30 CN CN201921667244.XU patent/CN210807783U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245563A (en) * | 2021-11-23 | 2022-03-25 | 博罗康佳精密科技有限公司 | Metal-based printed circuit board for three-dimensional packaging and preparation process thereof |
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