CN207305061U - A kind of heat radiation type flexible circuit board - Google Patents
A kind of heat radiation type flexible circuit board Download PDFInfo
- Publication number
- CN207305061U CN207305061U CN201721347785.5U CN201721347785U CN207305061U CN 207305061 U CN207305061 U CN 207305061U CN 201721347785 U CN201721347785 U CN 201721347785U CN 207305061 U CN207305061 U CN 207305061U
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- heat
- conducting layer
- copper foil
- circuit board
- flexible circuit
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Abstract
It the utility model is related to wiring board technology field, more particularly to a kind of heat radiation type flexible circuit board, including a core plate, multi-layered bonded piece, two flexible prepregs, two PET basic units, two copper foil layers and at least a heat-conducting layer, the opposite sides outer surface of the core plate is respectively provided with bonding sheet, the flexible prepreg of another side connection of bonding sheet, the outer surface of the flexibility prepreg connects PET basic units by bonding sheet, the outer surface of the PET basic units passes through bonding sheet connection copper foil layer, the left and right sides between copper foil layer described in two groups is vertically equipped with positioning through hole, middle part between copper foil layer described in two groups sets an at least straight slot, heat-conducting layer is provided with the straight slot, heat-conducting layer is in serpentine, heat-conducting layer both ends are in flared, the geomery of heat-conducting layer and the geomery of straight slot match.Compared with prior art, the heat radiation type flexible circuit board efficiency of transmission of the utility model is high, and heat dissipation performance is superior.
Description
【Technical field】
Wiring board technology field is the utility model is related to, more particularly to a kind of heat radiation type flexible circuit board.
【Background technology】
With the raising of the rate of information throughput and the increase of transinformation content, electronic product volume is less and less, integrates member
The density of part arrangement is increasing, promotes the direction of wiring board to high density, highly integrated, miniaturization and multiple stratification to develop.It is special
It is not that 4G networks are entered in the life of people with the fast development of society, brings the faster online experience of people, and to
Using 4G networks, 4G network line plates must be just used.For 4G networks during use, the rate request of communication is high, sends
Heat it is larger, therefore we need a kind of structure to radiate good wiring board to support the use of 4G networks.
【Utility model content】
In order to overcome the above problem, the utility model proposes a kind of superior heat radiation type flexible circuit board of heat dissipation performance.
The utility model solves a kind of technical solution that above-mentioned technical problem provides：A kind of heat radiating type flexible circuitry is provided
Plate, including a core plate, multi-layered bonded piece, two flexible prepreg, two PET basic units, two copper foil layers and an at least heat-conducting layers, it is described
The opposite sides outer surface of core plate is respectively provided with bonding sheet, and the flexible prepreg of another side connection of bonding sheet, described flexible half is solid
To change the outer surface of piece and PET basic units are connected by bonding sheet, the outer surfaces of the PET basic units is by bonding sheet connection copper foil layer, and two
The left and right sides between the group copper foil layer is vertically equipped with positioning through hole, the middle part setting at least one between copper foil layer described in two groups
Straight slot, is provided with heat-conducting layer in the straight slot, and heat-conducting layer is in serpentine, and heat-conducting layer both ends are in flared, the geomery of heat-conducting layer
Match with the geomery of straight slot.
Preferably, the positioning through hole is linear, and positioning through hole both ends are in flared.
Preferably, the heat-conducting layer is made of flexible material.
Preferably, the core plate is made of flexible material.
Preferably, the positioning through hole is equal with a distance from one end from closing on.
Preferably, the inner surface of the copper foil layer is provided with flash layer.
Compared with prior art, bonded between each laminate of the heat radiation type flexible circuit board of the utility model using bonding sheet,
So that the stability of whole wiring board is improved；The use of positioning through hole, the precise positioning being easy to implement between wiring board, at the same time
Heat dissipation performance can be improved；Heat-conducting layer is arranged in straight slot, is conducive to wiring board and is distributed heat during use, no
The use of wiring board can be influenced because heat is excessive, heat dissipation performance is superior；The use of PET basic units so that whole wiring board tool
There are good high frequency characteristics and high-speed transfer characteristic, ensure the efficient of transmission communication, allow people may feel that in use
Communication speed is obviously improved, while has good pliability concurrently；Copper foil layer also improves the thermal diffusivity and stabilization of wiring board
Property.
【Brief description of the drawings】
Fig. 1 is a kind of structure diagram of heat radiation type flexible circuit board of the utility model；
Fig. 2 is a kind of copper foil layer structure chart of heat radiation type flexible circuit board of the utility model.
【Embodiment】
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, is further elaborated the utility model.It should be appreciated that specific embodiment described herein is only used for explaining
The utility model, is not used to limit the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
The relative position being only limitted in given view, rather than absolute position.
In addition, and it cannot be managed in the utility model such as relating to the description of " first ", " second " etc. is only used for description purpose
Solve to indicate or implying its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " the
One ", at least one this feature can be expressed or be implicitly included to the feature of " second ".It is " more in the description of the utility model
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
Please refer to Fig.1 and Fig. 2, a kind of heat radiation type flexible circuit board of the utility model, including a core plate 1, multi-layered bonded
Piece 2, two flexible prepreg 3, two PET basic units 4, two copper foil layers 5 and an at least heat-conducting layer 8.Outside the opposite sides of the core plate 1
Surface is respectively provided with bonding sheet 2, the flexible prepreg 3 of another side connection of bonding sheet 2, the outer surface of the flexibility prepreg 3
PET basic units 4 are connected by bonding sheet 2, the outer surface of the PET basic units 4 is by 2 connection copper foil layer 5 of bonding sheet, copper described in two groups
The left and right sides between layers of foil 5 is vertically equipped with positioning through hole 6, and the middle part between copper foil layer 5 described in two groups sets an at least straight slot
7, heat-conducting layer 8 is provided with the straight slot 7.
The heat-conducting layer 8 is in serpentine, beneficial to increase heat-conducting area, improves heat dissipation effect.8 both ends of heat-conducting layer are in flared,
Beneficial to increasing heat radiation area, heat dissipation effect is improved.The geomery of heat-conducting layer 8 and the geomery of straight slot 7 match.It is described to lead
Thermosphere 8 is made of flexible material, beneficial to bending.Positioning through hole 6 is linear, beneficial to raising setting accuracy, positioning through hole
Both ends are in flared, and positioning also improves heat dissipation performance at the same time.The core plate 1 is made of flexible material, overall beneficial to raising
Pliability.
Wherein, the bonding sheet 2 is made of silica gel, convenient to bond each laminate, improves the stability of whole wiring board
And pliability, also improve the heat dissipation performance of wiring board.The heat-conducting layer 8 is made of flexible material, can give out heat
Go, improve the heat dissipation performance of whole wiring board.The positioning through hole 6 is equal with a distance from one end from closing on, and is easy to implement circuit
Precise positioning between plate, while also help heat dissipation.The inner surface of the copper foil layer 5 is provided with flash layer 51 so that copper foil layer 5
The roughness of inner surface be improved, so as to increase the contact area with bonding sheet 2, improve cohesive fastness so that
The stability of wiring board further improves.
Compared with prior art, bonded between each laminate of the heat radiation type flexible circuit board of the utility model using bonding sheet 2,
So that the stability of whole wiring board is improved；The use of positioning through hole 6, the precise positioning being easy to implement between wiring board, together
When can improve heat dissipation performance；Heat-conducting layer 8 is arranged in straight slot 7, is conducive to wiring board and is given out heat during use
Go, the use of wiring board will not be influenced because heat is excessive, heat dissipation performance is superior；The use of PET basic units 4 so that whole line
Road plate has good high frequency characteristics and high-speed transfer characteristic, ensures the efficient of transmission communication, allows people in use can
Feel being obviously improved for communication speed, while have good pliability concurrently；Copper foil layer 5 also improve the thermal diffusivity of wiring board with
And stability.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
Every any modification made within the design of the utility model, equivalent substitution and improvement etc. should be included in the utility model
Scope of patent protection in.
Claims (6)
- A kind of 1. heat radiation type flexible circuit board, it is characterised in that：Including a core plate, multi-layered bonded piece, two flexible prepregs, two PET basic units, two copper foil layers and an at least heat-conducting layer, the opposite sides outer surface of the core plate are respectively provided with bonding sheet, bonding sheet The flexible prepreg of another side connection, the outer surface of the flexibility prepreg connect PET basic units, the PET by bonding sheet By bonding sheet connection copper foil layer, it is logical that the left and right sides between copper foil layer described in two groups is vertically equipped with positioning for the outer surface of basic unit Hole, the middle part between copper foil layer described in two groups set an at least straight slot, heat-conducting layer are provided with the straight slot；The heat-conducting layer is in serpentine, and heat-conducting layer both ends are in flared, the geomery of heat-conducting layer and the geomery phase of straight slot Match somebody with somebody.
- 2. heat radiation type flexible circuit board as claimed in claim 1, it is characterised in that the positioning through hole is linear, positioning Through hole both ends are in flared.
- 3. heat radiation type flexible circuit board as claimed in claim 2, it is characterised in that the heat-conducting layer uses flexible material system Into.
- 4. heat radiation type flexible circuit board as claimed in claim 3, it is characterised in that the core plate is made of flexible material.
- 5. heat radiation type flexible circuit board as claimed in claim 4, it is characterised in that the positioning through hole from close on one end away from From equal.
- 6. heat radiation type flexible circuit board as claimed in claim 5, it is characterised in that the inner surface of the copper foil layer sets hairiness Boundary layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721347785.5U CN207305061U (en) | 2017-10-18 | 2017-10-18 | A kind of heat radiation type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721347785.5U CN207305061U (en) | 2017-10-18 | 2017-10-18 | A kind of heat radiation type flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207305061U true CN207305061U (en) | 2018-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721347785.5U Active CN207305061U (en) | 2017-10-18 | 2017-10-18 | A kind of heat radiation type flexible circuit board |
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| Country | Link |
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| CN (1) | CN207305061U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548277A (en) * | 2018-12-29 | 2019-03-29 | 万奔电子科技股份有限公司 | A kind of bend-resistance flexible circuitry soft board and preparation method thereof |
| CN113747764A (en) * | 2021-09-10 | 2021-12-03 | 深圳市精诚达电路科技股份有限公司 | Flexible thermostat for 5G smart phone and manufacturing method thereof |
-
2017
- 2017-10-18 CN CN201721347785.5U patent/CN207305061U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548277A (en) * | 2018-12-29 | 2019-03-29 | 万奔电子科技股份有限公司 | A kind of bend-resistance flexible circuitry soft board and preparation method thereof |
| CN113747764A (en) * | 2021-09-10 | 2021-12-03 | 深圳市精诚达电路科技股份有限公司 | Flexible thermostat for 5G smart phone and manufacturing method thereof |
| CN113747764B (en) * | 2021-09-10 | 2022-09-13 | 深圳市精诚达电路科技股份有限公司 | Flexible thermostat for 5G smart phone and manufacturing method thereof |
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