CN206938106U - A kind of copper-clad plate of high heat conduction - Google Patents
A kind of copper-clad plate of high heat conduction Download PDFInfo
- Publication number
- CN206938106U CN206938106U CN201720852037.6U CN201720852037U CN206938106U CN 206938106 U CN206938106 U CN 206938106U CN 201720852037 U CN201720852037 U CN 201720852037U CN 206938106 U CN206938106 U CN 206938106U
- Authority
- CN
- China
- Prior art keywords
- heat
- copper
- aluminium sheet
- clad plate
- conducting glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Surface Heating Bodies (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of copper-clad plate of high heat conduction, including aluminium sheet, at the top of the aluminium sheet and bottom is all provided with fluted, the aluminium sheet side is uniformly provided with heat emission hole, heat-conducting glue layer is provided with the top of the aluminium sheet, copper foil is provided with the top of the heat-conducting glue layer, the utility model passes through provided with heat-conducting glue layer and groove made of boron nitride heat-conducting glue, surface of aluminum plate product is increased while ensureing that original heat conductivility is good, so as to make heat conductivility improve again on the basis of original, make the better quality of copper-clad plate.
Description
Technical field
Copper-clad plate field is the utility model is related to, more particularly to a kind of copper-clad plate of high heat conduction.
Background technology
Copper-clad plate also known as base material, supporting material is soaked with resin, one or both sides are coated with copper foil, one formed through hot pressing
Kind board-like material, referred to as copper-clad laminate.It is the stock for being PCB, is often base material.When it is produced for multi-layer sheet
When, core plate is also, copper-clad plate is mainly used in circuit fabrication, suitable for the electrical equipment such as electricity-saving lamp or element, plays in the industrial production
Critically important effect, the height of heat conductivility is one of an important factor for determining copper-clad plate quality.Therefore, a kind of height is invented to lead
The copper-clad plate of heat is necessary to solve the above problems.
Utility model content
The purpose of this utility model is to provide a kind of copper-clad plate of high heat conduction, to solve what is proposed in above-mentioned background technology
Problem.
To achieve the above object, the utility model provides following technical scheme：A kind of copper-clad plate of high heat conduction, including aluminium
Plate, at the top of the aluminium sheet and bottom are all provided with fluted, and the aluminium sheet side is uniformly provided with heat emission hole, is provided with and leads at the top of the aluminium sheet
Hot glue layer, the heat-conducting glue layer top are provided with copper foil.
Preferably, the heat emission hole is equipped with multiple with groove.
Preferably, the heat emission hole runs through aluminium sheet.
Preferably, the heat-conducting glue layer is made up of boron nitride heat-conducting glue.
Technique effect of the present utility model and advantage：The utility model passes through provided with the heat conduction made of boron nitride heat-conducting glue
Glue-line and groove, surface of aluminum plate product is increased while ensureing that original heat conductivility is good, so as to make to lead on the basis of original
Hot property improves again, makes the better quality of copper-clad plate, by provided with heat emission hole, in order to be radiated for aluminium sheet, prevent because
Work long hours and caused high temperature deforms upon aluminium sheet, the problems such as causing copper-clad plate not use, increase copper-clad plate and use
Life-span.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present utility model.
Fig. 2 is groove structure schematic diagram of the present utility model.
In figure：1 aluminium sheet, 2 grooves, 3 heat emission holes, 4 heat-conducting glue layers, 5 copper foils.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
The utility model provides a kind of copper-clad plate of high heat conduction as shown in Figure 1-2, including aluminium sheet 1, and the aluminium sheet 1 pushes up
Portion and bottom are all provided with fluted 2, and the side of aluminium sheet 1 is uniformly provided with heat emission hole 3, and the top of aluminium sheet 1 is provided with heat-conducting glue layer 4,
The top of heat-conducting glue layer 4 is provided with copper foil 5.
The heat emission hole 3 is equipped with multiple with groove 2, is easy to improve radiating effect and heat-conducting effect, the heat emission hole 3 and passes through
Aluminium sheet 1 is worn, so as to strengthen radiating effect, prevents aluminium sheet 1 because high temperature deforms, the heat-conducting glue layer 4 is by boron nitride heat-conducting glue
It is made, there is good thermal conductivity.
This practical operation principle：During work, the utility model passes through provided with the heat-conducting glue layer 4 made of boron nitride heat-conducting glue
With groove 2, the surface area of aluminium sheet 1 is increased while ensureing that original heat conductivility is good, so as to make heat conduction on the basis of original
Performance improves again, makes the better quality of copper-clad plate, by provided with heat emission hole 3, in order to be radiated for aluminium sheet 1, prevent because
Work long hours and caused high temperature deforms upon aluminium sheet 1, the problems such as causing copper-clad plate not use, increase copper-clad plate and use
Life-span.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Progress equivalent substitution, all within the spirit and principles of the utility model, any modification, equivalent substitution and improvements made etc.,
It should be included within the scope of protection of the utility model.
Claims (4)
1. a kind of copper-clad plate of high heat conduction, including aluminium sheet（1）, it is characterised in that：The aluminium sheet（1）Top and bottom are equipped with recessed
Groove（2）, the aluminium sheet（1）Side is uniformly provided with heat emission hole（3）, the aluminium sheet（1）Top is provided with heat-conducting glue layer（4）, it is described to lead
Hot glue layer（4）Top is provided with copper foil（5）.
A kind of 2. copper-clad plate of high heat conduction according to claim 1, it is characterised in that：The heat emission hole（3）With groove（2）
It is equipped with multiple.
A kind of 3. copper-clad plate of high heat conduction according to claim 1, it is characterised in that：The heat emission hole（3）Through aluminium sheet
（1）.
A kind of 4. copper-clad plate of high heat conduction according to claim 1, it is characterised in that：The heat-conducting glue layer（4）By nitrogenizing
Boron heat-conducting glue is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852037.6U CN206938106U (en) | 2017-07-14 | 2017-07-14 | A kind of copper-clad plate of high heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720852037.6U CN206938106U (en) | 2017-07-14 | 2017-07-14 | A kind of copper-clad plate of high heat conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206938106U true CN206938106U (en) | 2018-01-30 |
Family
ID=61368091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720852037.6U Expired - Fee Related CN206938106U (en) | 2017-07-14 | 2017-07-14 | A kind of copper-clad plate of high heat conduction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206938106U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109181602A (en) * | 2018-07-06 | 2019-01-11 | 浙江俊萱电子科技有限公司 | The processing technology and composite aluminum substrate of composite aluminum substrate Halogen glue |
-
2017
- 2017-07-14 CN CN201720852037.6U patent/CN206938106U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109181602A (en) * | 2018-07-06 | 2019-01-11 | 浙江俊萱电子科技有限公司 | The processing technology and composite aluminum substrate of composite aluminum substrate Halogen glue |
| CN109181602B (en) * | 2018-07-06 | 2021-07-30 | 浙江俊萱电子科技有限公司 | Processing technology of halogen-free glue for composite aluminum substrate and composite aluminum substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102395249B (en) | Manufacturing method of four-layer copper-based metal plate | |
| CN201513770U (en) | Heat-dissipation type LED light source module | |
| CN203446104U (en) | Insulating thermal conductive substrate | |
| CN206938106U (en) | A kind of copper-clad plate of high heat conduction | |
| CN107592726A (en) | A kind of metal high efficiency and heat radiation board manufacturing method | |
| CN103987211B (en) | A kind of high-efficiency heat-radiating aluminum plate based on increase aluminium base face and preparation method thereof | |
| CN210617507U (en) | High-transmittance heat-conducting aluminum-based copper-clad plate | |
| CN202702725U (en) | Insulation graphite sheet | |
| CN206446211U (en) | A kind of high proof voltage aluminum-based copper-clad plate | |
| CN102856466A (en) | LED radiating substrate | |
| CN214046113U (en) | High-thermal-conductivity aluminum-based copper-clad plate | |
| CN209731684U (en) | A kind of copper base of the radium-shine blind hole of band | |
| CN211942401U (en) | Low-dielectric-constant double-sided flexible copper-clad plate | |
| CN211865712U (en) | Baking device for aluminum substrate after hot pressing | |
| CN204593313U (en) | A kind of LED metal base printed circuit board heat abstractor | |
| CN206349395U (en) | A kind of LED-baseplate | |
| CN202507609U (en) | Substrate | |
| CN207014900U (en) | A kind of aluminium nitride substrate | |
| CN102376659A (en) | Radiating structure of heat source | |
| CN210274685U (en) | Copper-clad plate with strong oxidation resistance | |
| CN111954368A (en) | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof | |
| CN210016685U (en) | HDI high density laminated plate | |
| CN208247649U (en) | A kind of insulation copper-clad plate | |
| CN209354974U (en) | A kind of aluminum substrate ontology with installation foundation trench | |
| CN210257528U (en) | High-voltage-resistant high-thermal-conductivity aluminum-based copper-clad plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180130 Termination date: 20210714 |