CN214046113U - High-thermal-conductivity aluminum-based copper-clad plate - Google Patents
High-thermal-conductivity aluminum-based copper-clad plate Download PDFInfo
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- CN214046113U CN214046113U CN202022694613.3U CN202022694613U CN214046113U CN 214046113 U CN214046113 U CN 214046113U CN 202022694613 U CN202022694613 U CN 202022694613U CN 214046113 U CN214046113 U CN 214046113U
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- clad plate
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- plate body
- heat dissipation
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Abstract
The utility model discloses a high heat conduction aluminium base copper-clad plate, including extrusion forming's copper-clad plate body, the copper-clad plate body includes insulating layer and metal level, the metal level includes aluminium system base plate, first copper foil layer and second copper foil layer, it has the louvre to open on the insulating layer, is fixed with the heat exchanger that looses through the supporting shoe above the copper-clad plate body, the below of copper-clad plate body is fixed with cooling device, cooling device includes cooler bin, heat conduction strip and fin, heat conduction strip submerges into the cooler bin, and the fin pierces through the lateral wall of cooler bin and submerges into the cooler bin, be full of the coolant in the cooler bin; the utility model discloses in, electronic component during operation can produce the heat, cools down electronic component through the heat exchanger that looses for thermal transmission on the electronic component, the heat conduction strip in the cooler bin pierces through insulating layer and second copper foil contact, dispels the heat fast to the intraformational metal level of insulating through cooling device, improves the radiating efficiency, prolongs the life of copper-clad plate.
Description
Technical Field
The utility model relates to a heat conduction aluminium base copper-clad plate makes the field, specifically is a high heat conduction aluminium base copper-clad plate.
Background
An aluminum-based copper clad laminate (aluminum substrate) is one of raw materials, is a plate-shaped material which is prepared by soaking electronic glass fiber cloth or other reinforcing materials in resin, single resin and the like as an insulating bonding layer and coating copper foil on one surface or two surfaces of the aluminum-based copper clad laminate (aluminum substrate) through hot pressing, is called a copper-clad laminated aluminum substrate, is called an aluminum-based copper clad laminate (aluminum-based copper clad laminate) for short, is a basic material in the electronic industry, is mainly used for processing and manufacturing printed circuit boards (PCB boards), and is widely used on electronic products such as televisions, radios, computers, mobile communication and the like; conventional copper-clad plate thickness is thick to and unable adaptation electronic industry's development trend, and when using, electronic component on the copper-clad plate can produce a large amount of heats, if untimely the scattering of these heats goes out the damage that will lead to the copper-clad plate, current aluminium base copper-clad plate mostly only relies on self material to carry out the heat conduction, the heat conduction effect is relatively poor, and large-scale PCB board heat abstractor's radiating effect is also not good, influence electronic equipment normal use, cause danger and economic loss.
Therefore, the inventor provides the high-thermal-conductivity aluminum-based copper-clad plate by combining various factors.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat conduction aluminium base copper-clad plate to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a high-thermal-conductivity aluminum-based copper-clad plate comprises an extruded copper-clad plate body, wherein heat dissipation holes are formed in the copper-clad plate body, a supporting block is fixed above the copper-clad plate body through welding, a heat dissipation cover is fixed above the supporting block through welding, and a cooling device is arranged below the copper-clad plate body; the utility model discloses in, electronic component during operation can produce the heat, the area of cuboid lug increase heat exchanger that looses through the heat exchanger top, make electronic component and the contact of heat exchanger that looses through heat conduction silica gel pad, dispel the heat to electronic component, accelerate thermal transmission on the electronic component, increase the heat dissipation capacity, improve the radiating efficiency, heat conduction strip in the cooler bin pierces through the insulating layer and contacts with second copper foil layer, dispel the heat fast through cooling device to the intraformational metal level of insulating, the efficiency of heat dissipation is improved, the life of extension copper-clad plate.
As a further aspect of the present invention: the cooling device comprises a cooling box, a heat conduction strip and a cooling fin, wherein the cooling box is fixed below the copper-clad plate body through welding, the heat conduction strip is arranged between the cooling box and the copper-clad plate body, the heat conduction strip is immersed in the cooling box, the cooling fin is fixed on the side wall of the cooling box through a bolt, a layer of graphene is coated between the cooling fin and the side wall of the cooling box, and a coolant is filled in the cooling box; the heat of the copper-clad plate metal layer is absorbed through the coolant, the copper-clad plate is prevented from being overheated, the coolant is cooled through the cooling fins, the environment is saved, and the cooling efficiency is improved.
As a further aspect of the present invention: the copper-clad plate body comprises an insulating layer and a metal layer, wherein the metal layer comprises an aluminum substrate, a first copper foil layer and a second copper foil layer, the first copper foil layer is laminated above the aluminum substrate, the second copper foil layer is laminated below the aluminum substrate, the surfaces of the first copper foil layer and the second copper foil layer are covered with the insulating layer, and the insulating layer is made of asbestos; the asbestos has high fire resistance, electrical insulation and thermal insulation, and the insulating layer can prevent the metal layer from being corroded and damaged, thereby ensuring the use safety and prolonging the service life of the copper-clad plate.
As a further aspect of the present invention: the insulating layer above the first copper foil layer is provided with heat dissipation holes, the second copper foil layer is provided with a fixing groove, the upper end of a heat conduction strip is arranged in the fixing groove, a heat conduction silica gel sheet is arranged between the heat conduction strip and the fixing groove, the lower end of the heat conduction strip penetrates through the insulating layer and is immersed in the cooling box, and the heat conduction strip is made of a synthetic graphite sheet; the synthetic graphite flake heat conduction effect is splendid, and synthetic graphite flake does not have the stickness, can not damage the copper-clad plate when dismantling the radiator.
As a further aspect of the present invention: a heat dissipation cover is arranged above the copper-clad plate body, the heat dissipation cover is hollow, ventilation openings are formed in the side face and the bottom face of the heat dissipation cover, an integrally formed cuboid bump is arranged on the top face of the heat dissipation cover, and a heat dissipation fan is fixed on the top face of the inner wall of the heat dissipation cover through a bolt; the copper-clad plate and the electronic element are cooled by the cooling fan, so that the cooling efficiency can be effectively improved.
As a further aspect of the present invention: an electronic element is welded on the surface of the copper-clad plate body, and a heat-conducting silica gel pad is arranged between the electronic element and the heat dissipation cover; the heat-conducting silica gel has good heat-conducting capacity and high-grade voltage-resistant insulating property, has certain flexibility and can be well attached to a device, so that the best heat-conducting and heat-radiating purposes are achieved.
Compared with the prior art, the utility model discloses the beneficial effect of following several aspects has:
1. the utility model provides a high heat conduction aluminium base copper-clad plate, the structure sets up ingeniously and arranges rationally, in the utility model, electronic component can produce the heat during operation, cools down electronic component through the heat exchanger that looses, accelerates the transmission of heat on the electronic component, and the heat conduction strip in the cooler bin pierces through the insulating layer and contacts with second copper foil layer, dispels the heat to the metal level in the insulating layer fast through cooling device, improves the radiating efficiency, prolongs the life of copper-clad plate;
2. the utility model discloses further designed cooling device, be equipped with the coolant in the cooler bin, the heat conduction strip submerges in the coolant, through the heat conduction strip to the metal level cooling of copper-clad plate, carry out the forced air cooling to the coolant through the fin simultaneously, effectively reduced the temperature of the metal level in the copper-clad plate, prevent that the overheated short circuit that causes of metal level, ensured copper-clad plate safe in utilization;
3. the utility model discloses further design the heat exchanger that looses, through the area of the cuboid lug increase heat exchanger that looses the heat exchanger top, be equipped with heat conduction silica gel pad between heat exchanger and the electronic component, make electronic component and the contact of scattered heat exchanger through heat conduction silica gel pad, dispel the heat to electronic component, there is cooling fan in the heat exchanger that looses, if the temperature of copper-clad plate is high always, then dispel the heat to copper-clad plate and electronic component through cooling fan, increase the heat dissipation capacity, improve the radiating efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a high thermal conductivity aluminum-based copper-clad plate.
Fig. 2 is a schematic structural diagram of a cooling device in a high-thermal-conductivity aluminum-based copper-clad plate.
FIG. 3 is a schematic structural diagram of a heat dissipation cover in a high thermal conductivity aluminum-based copper-clad plate.
In the figure: 1. a copper-clad plate body; 11. an insulating layer; 12. a first copper foil layer; 13. an aluminum substrate; 14. a second copper foil layer; 15. heat dissipation holes; 16. an electronic component; 2. a cooling device; 21. a cooling tank; 22. a heat conducting strip; 23. a heat sink; 24. a heat-conducting silica gel sheet; 25. a coolant; 3. a heat dissipation cover; 31. a support block; 32. a heat radiation fan; 33. a heat-conducting silica gel pad; 34. a vent; 35. a convex body.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Referring to fig. 1-3, a high thermal conductivity aluminum-based copper-clad plate comprises a copper-clad plate body 1, a cooling device 2 and a heat dissipation cover 3, wherein the copper-clad plate body 1 comprises an insulating layer 11 and a metal layer, the metal layer comprises an aluminum substrate 13, a first copper foil layer 12 and a second copper foil layer 14, the first copper foil layer 12 is laminated above the aluminum substrate 13, the second copper foil layer 14 is laminated below the aluminum substrate 13, the insulating layer 11 is covered on the surfaces of the first copper foil layer 12 and the second copper foil layer 14, the insulating layer 11 is provided with a heat dissipation hole 15, the insulating layer 11 is made of asbestos, the second copper foil layer 14 is provided with a fixing groove, and an electronic element 16 is fixed on the copper-clad plate body 1 by welding;
the cooling device 2 comprises a cooling box 21, a heat conducting strip 22, a cooling fin 23 and a heat conducting silica gel sheet 24, wherein the cooling box 21 is fixed with the bottom surface of the copper-clad plate body 1 through welding, the lower end of the heat conducting strip 22 penetrates through the box wall of the cooling box 21 and is immersed into the cooling box 21, the heat conducting strip 22 and the cooling box 21 are fixed together through heat-resistant waterproof glue, the upper end of the heat conducting strip 22 penetrates through an insulating layer 11 on the copper-clad plate body 1 and is immersed into a fixing groove, the heat conducting strip 22 is made of a synthetic graphite sheet, the heat conducting silica gel sheet 24 is adhered to the inner wall of the fixing groove, the heat conducting silica gel sheet 24 wraps the top end of the heat conducting strip 22, the cooling fin 23 is fixed with the side wall of the cooling box 21 through a bolt, a layer of graphene is coated between the cooling fin 23 and the side wall of the cooling box 21, and the cooling box 21 is filled with a coolant 25;
the heat dissipation cover 3 includes heat dissipation cover 3 body, supporting shoe 31, cooling fan 32 and heat conduction silica gel pad 33, heat dissipation cover 3 cavity, and it has vent 34 to open on the side of heat dissipation cover 3 and the bottom surface, there is the cuboid lug of integrated into one piece on the top surface of heat dissipation cover 3, the underrun welding of supporting shoe 31 is together fixed with copper-clad plate body 1, the top surface of supporting shoe 31 is together fixed through the bottom surface of welding with heat dissipation cover 3, cooling fan 32 passes through the bolt and is together fixed with the top surface of heat dissipation cover 3 inner wall, the top surface of heat conduction silica gel pad 33 glues together with the bottom surface of heat dissipation cover 3, the bottom surface of heat conduction silica gel pad 33 glues together with electronic component 16's top surface.
The utility model discloses a theory of operation is: in the utility model, the electronic component 16 can generate heat when working, the area of the heat dissipation cover 3 is increased through the cuboid lug above the heat dissipation cover 3, the heat conduction silica gel pad 33 is arranged between the heat dissipation cover 3 and the electronic component 16, the electronic component 16 is contacted with the heat dissipation cover 3 through the heat conduction silica gel pad 33, the heat dissipation is carried out on the electronic component 16, the heat dissipation fan 32 is arranged in the heat dissipation cover 3, if the temperature of the copper-clad plate is always high, the heat dissipation is carried out on the copper-clad plate and the electronic component 16 through the heat dissipation fan 32, the heat dissipation amount is increased, and the heat dissipation efficiency is improved; be equipped with coolant 25 in the cooler bin 21, in heat conduction strip 22 submerged coolant 25, heat conduction strip 22 in the cooler bin 21 pierces through insulating layer 11 and the 14 contacts of second copper foil layer, through the cooling of heat conduction strip 22 to the metal level of copper-clad plate, carry out the forced air cooling to coolant 25 through fin 23 simultaneously, effectively reduce the temperature of the metal level in the copper-clad plate, prevent that the overheated short circuit that causes of metal level, ensure that the copper-clad plate is safe in utilization, and the heat dissipation efficiency is improved, and the service life of copper-clad plate is prolonged.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (6)
1. The utility model provides a high heat conduction aluminium base copper-clad plate, includes extrusion's copper-clad plate body (1), its characterized in that, it has louvre (15) to open on copper-clad plate body (1), and copper-clad plate body (1) top has supporting shoe (31) through welded fastening, there is heat exchanger (3) supporting shoe (31) top through welded fastening, the below of copper-clad plate body (1) is equipped with cooling device (2).
2. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 1, wherein the cooling device (2) comprises a cooling box (21), a heat conducting strip (22) and a heat radiating fin (23), the cooling box (21) is fixed below the copper-clad plate body (1) through welding, the heat conducting strip (22) is arranged between the cooling box (21) and the copper-clad plate body (1), the heat conducting strip (22) is immersed in the cooling box (21), the heat radiating fin (23) is fixed on the side wall of the cooling box (21) through a bolt, a layer of graphene is coated between the heat radiating fin (23) and the side wall of the cooling box (21), and the cooling box (21) is filled with a coolant (25).
3. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 2, wherein the copper-clad plate body (1) comprises an insulating layer (11) and a metal layer, the metal layer comprises an aluminum substrate (13), a first copper foil layer (12) and a second copper foil layer (14), the first copper foil layer (12) is laminated above the aluminum substrate (13), the second copper foil layer (14) is laminated below the aluminum substrate (13), the insulating layer (11) covers the surfaces of the first copper foil layer (12) and the second copper foil layer (14), and the insulating layer (11) is made of asbestos.
4. The copper-clad plate with high thermal conductivity and aluminum base as claimed in claim 3, wherein the insulating layer (11) above the first copper foil layer (12) is provided with heat dissipation holes (15), the second copper foil layer (14) is provided with fixing grooves, the upper ends of the heat conduction strips (22) are arranged in the fixing grooves, a heat conduction silica gel sheet (24) is arranged between the heat conduction strips (22) and the fixing grooves, the lower ends of the heat conduction strips (22) penetrate through the insulating layer (11) and are immersed in the cooling box (21), and the heat conduction strips (22) are made of synthetic graphite sheets.
5. The high-thermal-conductivity aluminum-based copper-clad plate according to claim 3, wherein a heat dissipation cover (3) is arranged above the copper-clad plate body (1), the heat dissipation cover (3) is hollow, vent holes (34) are formed in the side surface and the bottom surface of the heat dissipation cover (3), a cuboid bump which is integrally formed is arranged on the top surface of the heat dissipation cover (3), and a heat dissipation fan (32) is fixed on the top surface of the inner wall of the heat dissipation cover (3) through a bolt.
6. The high-thermal-conductivity aluminum-based copper-clad plate according to any one of claims 1 to 5, wherein an electronic element (16) is welded on the surface of the copper-clad plate body (1), and a thermal-conductivity silica gel pad (33) is arranged between the electronic element (16) and the heat dissipation cover (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022694613.3U CN214046113U (en) | 2020-11-19 | 2020-11-19 | High-thermal-conductivity aluminum-based copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022694613.3U CN214046113U (en) | 2020-11-19 | 2020-11-19 | High-thermal-conductivity aluminum-based copper-clad plate |
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| CN214046113U true CN214046113U (en) | 2021-08-24 |
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| CN202022694613.3U Active CN214046113U (en) | 2020-11-19 | 2020-11-19 | High-thermal-conductivity aluminum-based copper-clad plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115837792A (en) * | 2022-12-12 | 2023-03-24 | 广东嘉元科技股份有限公司 | Automatic copper foil bonding device |
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2020
- 2020-11-19 CN CN202022694613.3U patent/CN214046113U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115837792A (en) * | 2022-12-12 | 2023-03-24 | 广东嘉元科技股份有限公司 | Automatic copper foil bonding device |
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