CN206963172U - A kind of high cooling circuit board - Google Patents
A kind of high cooling circuit board Download PDFInfo
- Publication number
- CN206963172U CN206963172U CN201720573033.4U CN201720573033U CN206963172U CN 206963172 U CN206963172 U CN 206963172U CN 201720573033 U CN201720573033 U CN 201720573033U CN 206963172 U CN206963172 U CN 206963172U
- Authority
- CN
- China
- Prior art keywords
- substrate body
- circuit board
- heat
- cooling circuit
- conducting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of high cooling circuit board, it is desirable to provide a kind of radiating that can accelerate circuit board, ensures the circuit board of the normal work of whole circuit.It includes substrate body, and substrate body edge placement is provided with high radiating element area, and substrate body centre position is provided with low heat emission device region, some fin are provided with around substrate body.Heat-conducting layer is provided with substrate body, heat-conducting layer is made in the correspondence position of low heat emission device region of copper product, and correspondence position of the heat-conducting layer in high radiating element area is made of aluminum alloy materials.
Description
Technical field
It the utility model is related to a kind of circuit board, more particularly to a kind of high cooling circuit board.
Background technology
Certain heat can be all produced for electronic equipment, during work, so that device interior temperature rises rapidly,
If not in time distributed the heat, heating that equipment will continue, device will fail because of overheat, electronic equipment
Unfailing performance will decline.Therefore, it is very important to carry out good radiating treatment to circuit board.
The sheet material being widely used at present is to cover copper/epoxy glass fabric base material or phenolic resin glass cloth base material, is also had a small amount of
The paper-based copper-coated board material used.Although these base materials are with excellent electric property and processing characteristics, poor radiation, as height
The sinking path of heater element, it can hardly look to conducting heat by resin itself, but from the surface of element to surrounding air
Middle radiating.But as electronic product has enter into part miniaturization, high-density installation, thermalization occurred frequently assembling epoch, if only Pictest
The very small element surface of area is very inadequate to radiate.Simultaneously because a large amount of of the surface mounted component such as QFP, BGA make
With heat is transmitted to plate in large quantities caused by component, causes the normal work for influenceing whole circuit.
Utility model content
The utility model is in order to overcome deficiency of the prior art, there is provided a kind of high cooling circuit board, can accelerate electricity
The radiating of road plate, ensure the normal work of whole circuit.
To achieve these goals, the utility model uses following technical scheme：
A kind of high cooling circuit board, including substrate body, substrate body edge placement are provided with high radiating element area, substrate
Body centre position is provided with low heat emission device region, and some fin are provided with around substrate body.By high-power, high radiator
Part is arranged on the high radiating element area on circuit board edge edge, to shorten heat-transfer path；Fin quickening heat is set up to scatter and disappear.
Preferably, being provided with heat-conducting layer in substrate body, heat-conducting layer uses copper in the correspondence position of low heat emission device region
Material is made, and correspondence position of the heat-conducting layer in high radiating element area is made of aluminum alloy materials.Heat-conducting layer is used to strengthen circuit
Plate heat conduction, radiating and conduction, because aluminum heat dispersion is higher than copper product, copper product heat conductivility is better than aluminum, this
The structure of sample can reduce the temperature in high radiating element area, and suitably lift the temperature of low heat emission device region, avoid on circuit board
The concentration of focus, holding circuit plate surface temperature performance it is uniform consistent, in order to avoid heat spot occur is influenceing whole circuit just
Often work.
Preferably, fin shape is V-type, the angle of V-type fin intermediate angle is 90 ° -180 °, V-type fin court
To device mounting surface.Such structure can reduce the space of fin occupancy.
Preferably, fin is arranged on around heat-conducting layer.
Preferably, some heat emission holes are provided with substrate body.
Therefore, the utility model has the advantages that：
（1）Accelerate the radiating of circuit board, ensure the normal work of whole circuit；
（2）Avoid the concentration of focus on circuit board, holding circuit plate surface temperature performance it is uniform consistent, in order to avoid occur
Heat spot influences the normal work of whole circuit.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure：1st, substrate body, 2, high radiating element area, 3, low heat emission device region, 4, fin, 5, heat-conducting layer, 6, dissipate
Hot hole.
Embodiment
Below by specific embodiment, and with reference to accompanying drawing, the technical solution of the utility model is made more specifically
It is bright.
As shown in figure 1, a kind of high cooling circuit board, including substrate body 1, the edge placement of substrate body 1 are provided with high dissipate
Thermal device area 2, the centre position of substrate body 1 are provided with low heat emission device region 3, and some V-arrangement radiatings are provided with around substrate body 1
Piece 4.
It is provided for strengthening the heat-conducting layer 5 of circuit board thermal conductive, radiating and conduction in substrate body 1, substrate body 1 uses
Phenolic resin glass material is made, and heat-conducting layer 5 is made in the correspondence position of low heat emission device region 3 of copper product, and heat-conducting layer 5 exists
The correspondence position in high radiating element area 2 is made of aluminum alloy materials.
Heat-conducting layer 5 is so made：Made a hole on aluminium alloy plate, aluminium alloy plate is heated to 400 DEG C, its hole is heated swollen
Swollen expansion, the copper billet after normal temperature or cooling is filled in the hole on aluminium alloy plate at high temperature, treat aluminium alloy plate cooling meat
Afterwards, copper billet is closely as one with aluminium alloy plate, and heat-conducting layer 5 is made after miller skill and grinding process.
The angle of the intermediate angle of V-type fin 4 is 150 °, and V-type fin 4 welds towards device mounting surface, V-type fin 4
Around heat-conducting layer 5.
Some heat emission holes 6 are provided with substrate body 1.
The high color of radiating element area 2 is red, and the color of low heat emission device region 3 is green.
It is not new to this practicality although above-mentioned specific embodiment of the present utility model is described with reference to accompanying drawing
The limitation of type protection domain, one of ordinary skill in the art should be understood that on the basis of the technical solution of the utility model, ability
Field technique personnel need not pay the various modifications that creative work can make or deformation still in protection model of the present utility model
Within enclosing.
Claims (5)
1. a kind of high cooling circuit board, including substrate body, it is characterized in that,
The substrate body edge placement is provided with high radiating element area, and the substrate body centre position is provided with low heat emission device
Part area, some fin are provided with around the substrate body.
2. a kind of high cooling circuit board according to claim 1, it is characterized in that, it is provided with heat conduction in the substrate body
Layer, the heat-conducting layer are made in the correspondence position of the low heat emission device region of copper product, and the heat-conducting layer is described high scattered
The correspondence position in thermal device area is made of aluminum alloy materials.
3. a kind of high cooling circuit board according to claim 1, it is characterized in that, the fin shape is V-type, the V
The angle of type fin intermediate angle is 90 ° -180 °, device mounting surface of the V-type fin towards the substrate body.
4. a kind of high cooling circuit board according to claim 2, it is characterized in that, the fin is arranged on the heat-conducting layer
Around.
5. a kind of high cooling circuit board according to claim 1, it is characterized in that, some dissipate is provided with the substrate body
Hot hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720573033.4U CN206963172U (en) | 2017-05-22 | 2017-05-22 | A kind of high cooling circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720573033.4U CN206963172U (en) | 2017-05-22 | 2017-05-22 | A kind of high cooling circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206963172U true CN206963172U (en) | 2018-02-02 |
Family
ID=61375316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720573033.4U Expired - Fee Related CN206963172U (en) | 2017-05-22 | 2017-05-22 | A kind of high cooling circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206963172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121299A (en) * | 2018-08-27 | 2019-01-01 | 常熟东南相互电子有限公司 | Tree plug perforation combination pressing production and technique |
-
2017
- 2017-05-22 CN CN201720573033.4U patent/CN206963172U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121299A (en) * | 2018-08-27 | 2019-01-01 | 常熟东南相互电子有限公司 | Tree plug perforation combination pressing production and technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180202 Termination date: 20210522 |