CN209627789U - A kind of multi-layer PCB board with shielding radiator structure - Google Patents
A kind of multi-layer PCB board with shielding radiator structure Download PDFInfo
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- CN209627789U CN209627789U CN201821621363.7U CN201821621363U CN209627789U CN 209627789 U CN209627789 U CN 209627789U CN 201821621363 U CN201821621363 U CN 201821621363U CN 209627789 U CN209627789 U CN 209627789U
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- thermally conductive
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- pcb board
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Abstract
The utility model system provides a kind of multi-layer PCB board with shielding radiator structure, including insulating substrate, the side of insulating substrate is successively arranged first line layer, the first thermally conductive insulating layer, the first magnetic conductive board, and the other side of insulating substrate is successively arranged the second line layer, the second thermally conductive insulating layer, the second magnetic conductive board；Several equally distributed thermal conductive ceramic particles are equipped in insulating substrate, the first thermally conductive insulating layer and the second thermally conductive insulating layer；The several first thermally conductive items are additionally provided in first thermally conductive insulating layer, the first thermally conductive item leads to the nearest side end face of the first thermally conductive insulating layer, and the several second thermally conductive items are additionally provided in the second thermally conductive insulating layer, and the second thermally conductive item leads to the nearest side end face of the second thermally conductive insulating layer.The utility model has good heat dissipation performance and electromagnetic shielding performance, effectively can outwardly discharge the heat accumulated in line layer along the two sides of insulating layer；Magnetically attractive structure can effectively improve the interference free performance of multi-layer PCB board.
Description
Technical field
The utility model relates to the fields PCB, specifically disclose a kind of multi-layer PCB board with shielding radiator structure.
Background technique
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, pcb board,
It is important electronic component, is the supporter of electronic component, is the carrier of electronic component electrical connection.Since it is to use
Electron printing production, therefore referred to as printed circuit board.Multi-layer PCB board refers to two layers or more of pcb board, it is by several layers of insulation
The pad of connecting wire and erection welding electronic component on substrate forms.
With the continuous development of electronic information, the integrated level of pcb board is also higher and higher, leads to pcb board during the work time
Calorific value it is also increasing, but the heat dissipation effect of pcb board in the prior art is bad, cause the heat gathered in pcb board without
Method is discharged into external environment in time and influences pcb board and the thereon performance of electronic component；Pcb board in the prior art once by
To electromagnetic interference, it is easy to the electronic component on circuit board can be damaged, for integrated high pcb board, also easily caused whole
A pcb board is scrapped.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of multi-layer PCB board with shielding radiator structure, tool
There are good heat dissipation performance and electromagnetic shielding performance, can effectively ensure the normal function of pcb board.
To solve prior art problem, the utility model discloses a kind of multi-layer PCB board with shielding radiator structure, including
Insulating substrate, the side of insulating substrate are successively arranged first line layer, the first thermally conductive insulating layer, the first magnetic conductive board, insulating substrate
The other side be successively arranged the second line layer, the second thermally conductive insulating layer, the second magnetic conductive board；Insulating substrate, the first thermally conductive insulating layer
With several equally distributed thermal conductive ceramic particles are equipped in the second thermally conductive insulating layer；It is additionally provided in first thermally conductive insulating layer several
First thermally conductive item, the first thermally conductive item leads to the nearest side end face of the first thermally conductive insulating layer, if being additionally provided in the second thermally conductive insulating layer
Dry second thermally conductive item, the second thermally conductive item lead to the nearest side end face of the second thermally conductive insulating layer.
Further, insulating substrate is equipped with several passage of heat, and it is opposite that passage of heat both ends respectively lead to insulating substrate
Two side end faces.
Further, the first thermally conductive insulating layer and the second thermally conductive insulating layer are heat conduction silicone.
Further, the first thermally conductive item and the second thermally conductive item are heat-conducting metal item.
Further, the first thermally conductive item and the second thermally conductive item are cone shape, and first thermally conductive article of cone bottom is located at the
The side end face of one thermally conductive insulating layer, thickness of the cone bottom diameter less than the first thermally conductive insulating layer of the first thermally conductive item, the first thermally conductive item
The vertex of a cone be located at the layer median plane of the first thermally conductive insulating layer；The cone bottom of second thermally conductive item is located at the side of the second thermally conductive insulating layer
Face, for the cone bottom diameter of the second thermally conductive item less than the thickness of the second thermally conductive insulating layer, it is thermally conductive that the vertex of a cone of the second thermally conductive item is located at second
The layer median plane of insulating layer.
Further, the first magnetic conductive board far from the first thermally conductive insulating layer side be equipped with it is several first heat dissipation grooves, second
Magnetic conductive board is equipped with several second heat dissipation grooves far from the side of the second thermally conductive insulating layer.
The utility model has the following beneficial effects: the utility model discloses a kind of multi-layer PCB board with shielding radiator structure,
With good heat dissipation performance and electromagnetic shielding performance, special conductive structure is set, will effectively can be accumulated in line layer
Heat outwardly discharged along the two sides of insulating layer, the structure with different heating conductions cooperates each insulating layer effect, Neng Gouyou
Effect improves the heat dissipation effect of pcb board entirety；In addition, the magnetically attractive structure in two outsides can effectively absorb the magnetic field of surrounding, to mention
The interference free performance of high multi-layer PCB board can effectively ensure the normal function of pcb board.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of the utility model.
Appended drawing reference are as follows: insulating substrate 10, thermal conductive ceramic particle 11, passage of heat 12, first line layer 21, first are thermally conductive
Insulating layer 22, the first thermally conductive item 221, the first magnetic conductive board 23, first heat dissipation groove 231, the second line layer 31, the second heat conductive insulating
The 32, second thermally conductive item 321 of layer, the second magnetic conductive board 33, second heat dissipation groove 331.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
With reference to Fig. 1.
The utility model embodiment discloses a kind of multi-layer PCB board with shielding radiator structure, including insulating substrate 10, absolutely
The side of edge substrate 10 is successively arranged first line layer 21, the first thermally conductive insulating layer 22, the first magnetic conductive board 23, insulating substrate 10
The other side be successively arranged the second line layer 31, the second thermally conductive insulating layer 32, the second magnetic conductive board 33, thermally conductive magnetic sheet can for containing
The hiperloy plate of Ni, Nb, C and Fe, thermally conductive magnetic sheet can magnetic field effectively around adsorption multi-layer pcb board, can be effective
Interference electromagnetic wave around adsorbing, so as to effectively improve the shielding properties of multi-layer PCB board；Insulating substrate 10, first is thermally conductive
Several equally distributed thermal conductive ceramic particles 11, thermal conductive ceramic particle 11 are equipped in insulating layer 22 and the second thermally conductive insulating layer 32
With excellent insulation performance and heating conduction, the heat dissipation performance of each insulation system can be effectively improved；First thermally conductive insulating layer 22
Inside it is additionally provided with the several first thermally conductive items 221, the first thermally conductive item 221 leads to the nearest side end face of the first thermally conductive insulating layer 22, and second
It is additionally provided with the several second thermally conductive items 321 in thermally conductive insulating layer 32, it is nearest that the second thermally conductive item 321 leads to second thermally conductive insulating layer 32
Side end face, the setting of thermally conductive item can further increase the heat dissipation effect of thermally conductive insulating layer, can further increase multi-layer PCB
The working performance of plate.
The utility model has good heat dissipation performance and electromagnetic shielding performance, and special conductive structure, Neng Gouyou is arranged
Effect outwardly discharges the heat accumulated in line layer along the two sides of insulating layer, and the structure cooperation with different heating conductions is each
Insulating layer effect, can effectively improve the heat dissipation effect of pcb board entirety；In addition, the magnetically attractive structure in two outsides can effectively absorb
The magnetic field of surrounding can effectively ensure the normal function of pcb board to improve the interference free performance of multi-layer PCB board.
In the present embodiment, insulating substrate 10 is equipped with several passage of heat 12, and 12 both ends of passage of heat respectively lead to insulate
Two opposite side end faces of substrate 10, air are flowed out of passage of heat 12, and the line layer of 10 two sides of insulating substrate is at work
Heat will be generated, insulating substrate 10 is that multi-layer PCB board gathers the most place of heat, and passage of heat 12 can be effectively by accumulation
Heat derives at multi-layer PCB board center can effectively improve the radiating efficiency of multi-layer PCB board entirety.
In the present embodiment, the first thermally conductive insulating layer 22 and the second thermally conductive insulating layer 32 are heat conduction silicone, thermal conductive silicon
Glue has good heating conduction and insulation performance, can effectively improve the heat dissipation effect of first line layer 21 and the second line layer 31
Rate, while can effectively ensure that first line layer 21 and the second line layer 22 will not be short-circuited.
In the present embodiment, the first thermally conductive item 221 and the second thermally conductive item 321 are heat-conducting metal item, and heat-conducting metal has
Excellent heating conduction can effectively improve the heat dissipation effect of 32 entirety of the first thermally conductive insulating layer 22 and the second thermally conductive insulating layer.
In the present embodiment, the first thermally conductive item 221 and the second thermally conductive item 321 are cone shape, the first thermally conductive item 221
Cone bottom be located at the side end face of the first thermally conductive insulating layer 22, the heat dissipation effect that the first thermally conductive item 221 rises can be effectively improved,
Less than the thickness of the first thermally conductive insulating layer 22, the vertex of a cone of the first thermally conductive item 221 is located at first leads the cone bottom diameter of one thermally conductive item 221
The layer median plane of thermal insulation layer 22, i.e., the vertex of a cone of the first thermally conductive item 221 are located at the mid-depth position of the first thermally conductive insulating layer 22,
First thermally conductive item 221 will not be contacted with first line layer 21 or the first magnetic conductive board 23, can effectively ensure first line layer 21 not
It can be short-circuited；The cone bottom of second thermally conductive item 321 is located at the side end face of the second thermally conductive insulating layer 32, and it is thermally conductive can to effectively improve second
The heat dissipation effect that item 321 rises, less than the thickness of the second thermally conductive insulating layer 32, second leads the cone bottom diameter of the second thermally conductive item 321
The vertex of a cone of hot item 321 is located at the layer median plane of the second thermally conductive insulating layer 32, i.e., it is thermally conductive that the vertex of a cone of the second thermally conductive item 321 is located at second
The mid-depth position of insulating layer 32, the second thermally conductive item 321 will not be contacted with the second line layer 31 or the second magnetic conductive board 33, can
Effectively ensure that the second line layer 31 will not be short-circuited.
In the present embodiment, side of first magnetic conductive board 23 far from the first thermally conductive insulating layer 22 is recessed equipped with several first heat dissipations
Slot 231, the second magnetic conductive board 33 are equipped with several second heat dissipation grooves 331 far from the side of the second thermally conductive insulating layer 32, and radiate groove
Setting can effectively improve the heat dissipation effect of magnetic conductive board, to effectively improve the heat dissipation effect of multi-layer PCB board entirety.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (6)
1. a kind of multi-layer PCB board with shielding radiator structure, which is characterized in that including insulating substrate (10), the insulation base
The side of plate (10) is successively arranged first line layer (21), the first thermally conductive insulating layer (22), the first magnetic conductive board (23), the insulation
The other side of substrate (10) is successively arranged the second line layer (31), the second thermally conductive insulating layer (32), the second magnetic conductive board (33)；It is described
Several uniform points are equipped in insulating substrate (10), first thermally conductive insulating layer (22) and second thermally conductive insulating layer (32)
The thermal conductive ceramic particle (11) of cloth；It is additionally provided with the several first thermally conductive items (221) in first thermally conductive insulating layer (22), described the
One thermally conductive item (221) leads to the nearest side end face of first thermally conductive insulating layer (22), and second thermally conductive insulating layer (32) is interior
It is additionally provided with the several second thermally conductive items (321), it is nearest that the second thermally conductive item (321) leads to second thermally conductive insulating layer (32)
Side end face.
2. a kind of multi-layer PCB board with shielding radiator structure according to claim 1, which is characterized in that the insulation
Substrate (10) is equipped with several passage of heat (12), and it is opposite that passage of heat (12) both ends respectively lead to the insulating substrate (10)
Two side end faces.
3. a kind of multi-layer PCB board with shielding radiator structure according to claim 1, which is characterized in that described first
Thermally conductive insulating layer (22) and second thermally conductive insulating layer (32) are heat conduction silicone.
4. a kind of multi-layer PCB board with shielding radiator structure according to claim 1 or 3, which is characterized in that described the
One thermally conductive item (221) and the second thermally conductive item (321) are heat-conducting metal item.
5. a kind of multi-layer PCB board with shielding radiator structure according to claim 4, which is characterized in that described first
Thermally conductive item (221) and the second thermally conductive item (321) are cone shape, and the cone bottom of the first thermally conductive item (221) is located at
The side end face of first thermally conductive insulating layer (22), it is thermally conductive that the cone bottom diameter of the first thermally conductive item (221) is less than described first
The thickness of insulating layer (22), the vertex of a cone of the first thermally conductive item (221) are located at the layer center of first thermally conductive insulating layer (22)
Face；The cone bottom of the second thermally conductive item (321) is located at the side end face of second thermally conductive insulating layer (32), the second thermally conductive item
(321) cone bottom diameter is less than the thickness of second thermally conductive insulating layer (32), and the vertex of a cone of the second thermally conductive item (321) is located at
The layer median plane of second thermally conductive insulating layer (32).
6. a kind of multi-layer PCB board with shielding radiator structure according to claim 1, which is characterized in that described first
Magnetic conductive board (23) is equipped with several first far from the side of first thermally conductive insulating layer (22) and radiates groove (231), and described second
Magnetic conductive board (33) is equipped with several second heat dissipations groove (331) far from the side of second thermally conductive insulating layer (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821621363.7U CN209627789U (en) | 2018-09-30 | 2018-09-30 | A kind of multi-layer PCB board with shielding radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821621363.7U CN209627789U (en) | 2018-09-30 | 2018-09-30 | A kind of multi-layer PCB board with shielding radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209627789U true CN209627789U (en) | 2019-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821621363.7U Active CN209627789U (en) | 2018-09-30 | 2018-09-30 | A kind of multi-layer PCB board with shielding radiator structure |
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| CN (1) | CN209627789U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111655007A (en) * | 2020-06-22 | 2020-09-11 | 云谷（固安）科技有限公司 | Display screen heat abstractor |
-
2018
- 2018-09-30 CN CN201821621363.7U patent/CN209627789U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111655007A (en) * | 2020-06-22 | 2020-09-11 | 云谷（固安）科技有限公司 | Display screen heat abstractor |
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