CN202907334U - High-efficiency heat-dissipation type PCB - Google Patents
High-efficiency heat-dissipation type PCB Download PDFInfo
- Publication number
- CN202907334U CN202907334U CN 201220569738 CN201220569738U CN202907334U CN 202907334 U CN202907334 U CN 202907334U CN 201220569738 CN201220569738 CN 201220569738 CN 201220569738 U CN201220569738 U CN 201220569738U CN 202907334 U CN202907334 U CN 202907334U
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- Prior art keywords
- copper
- heat
- efficiency heat
- dissipation type
- pcb
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- Expired - Fee Related
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Abstract
The utility model discloses a high-efficiency heat-dissipation type PCB (1), comprising a copper-clad zone (2), wherein the copper-clad zone (2) of the PCB (1) is in a mesh shape, the width of each mesh is 10mil, and the distance is 10mil. The high-efficiency heat-dissipation type PCB (1) has better heat dissipation performance under high temperature working condition, meets the requirements of high temperature working condition, reduces the consumption of copper by adopting the meshed copper-clad zone (2), and saves the production cost.
Description
Technical field
The utility model relates to a kind of pcb board, and particularly a kind of high-efficient heat-dissipating pcb board belongs to pcb board manufacturing technology field.
Background technology
The heat that produces during electronic device works rises rapidly the device interior temperature, if untimely with this dissipation of heat, equipment can be persistently overheating, and device will be because of overheating failure, and the reliability of electronic equipment will descend.Therefore, circuit board is carried out radiating treatment very important.
The pcb board material of at present extensive use is to cover copper/epoxy glass fabric base material or phenolic resins glass cloth base material, also has a small amount of paper-based copper-coated board material that uses.Although these base materials have good electric property and processing characteristics, poor radiation as the heat radiation approach of high heater element, almost can not be look to by the resin conduction of PCB heat own, but dispel the heat the air towards periphery from the surface of element.
Along with electronic product has entered into parts miniaturization, high-density installation, thermalization occurred frequently assembling epoch, be very inadequate if the element surface that only the Pictest area is very little dispels the heat.Simultaneously because a large amount of uses of the surface mounted components such as QFP, BGA, the heat that components and parts produce is passed to pcb board in large quantities, therefore, the best method that solves heat radiation is to improve the heat-sinking capability of the PCB self that directly contacts with heater element, conducts or distributes by pcb board.
But because PCB product large tracts of land is covered copper, under high-temperature work environment, can't better dispel the heat in base material inside, affect properties of product.
The utility model content
Technical problem to be solved in the utility model provides a kind of high-efficient heat-dissipating pcb board, and this pcb board can better dispel the heat.
In order to solve above-mentioned technical problem, the technical solution of the utility model is: a kind of high-efficient heat-dissipating pcb board, and comprise and cover the copper district, the copper district of covering of described pcb board is latticed.
The described latticed copper district mesh width that covers is 10mil, and spacing is 10mil.
PCB product of the present utility model has better heat dispersion under high-temperature work environment, satisfy the high-temperature work environment requirement.And the utility model to cover the copper district be the latticed use that reduces copper, saved production cost.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, high-efficient heat-dissipating pcb board 1 of the present utility model comprises and covers copper district 2, the copper district 2 of covering of described pcb board 1 is latticed, described latticed copper district 2 mesh widths that cover are 10mil, and spacing is 10mil, and the latticed like this copper district 2 of covering can not affect electrically conducting.
Power-efficient is not only improved in the latticed copper district 2 of covering of the utility model, reduces High-frequency Interference, and outward appearance is more beautiful, and has better heat dispersion, can satisfy the high-temperature work environment requirement, particularly resists the high high-frequency circuit of interference requirement.
Above-described embodiment limits the utility model never in any form, and every employing is equal to replaces or technical scheme that the mode of equivalent transformation obtains all drops in the protection range of the present utility model.
Claims (1)
1. a high-efficient heat-dissipating pcb board (1) comprises and covers copper district (2), and what it is characterized in that described pcb board (1) covers copper district (2) for latticed, and described mesh width is 10mil, and spacing is 10mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220569738 CN202907334U (en) | 2012-11-01 | 2012-11-01 | High-efficiency heat-dissipation type PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220569738 CN202907334U (en) | 2012-11-01 | 2012-11-01 | High-efficiency heat-dissipation type PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202907334U true CN202907334U (en) | 2013-04-24 |
Family
ID=48127946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220569738 Expired - Fee Related CN202907334U (en) | 2012-11-01 | 2012-11-01 | High-efficiency heat-dissipation type PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202907334U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103731978A (en) * | 2013-12-31 | 2014-04-16 | 深圳市华星光电技术有限公司 | Printed circuit board and display device utilizing same |
-
2012
- 2012-11-01 CN CN 201220569738 patent/CN202907334U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103731978A (en) * | 2013-12-31 | 2014-04-16 | 深圳市华星光电技术有限公司 | Printed circuit board and display device utilizing same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SUZHOU KANGBO CIRCUIT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHUNYAN ELECTRONIC TECHNOLOGY (SUZHOU) CO., LTD. Effective date: 20150521 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150521 Address after: 215533 No. 72 Huangpu Road, Changshu hi tech Industrial Development Zone, Jiangsu, Changshou City, China Patentee after: SUZHOU COMBO CIRCUIT TECHNOLOGY CO., LTD. Address before: 215533, Huangpu Road, Changshou City Southeast Economic Development Zone, Jiangsu, Suzhou 72, China Patentee before: Chun Yan Electronic Technology (Suzhou) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20151101 |
|
| EXPY | Termination of patent right or utility model |