CN205265994U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
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- CN205265994U CN205265994U CN201520965528.2U CN201520965528U CN205265994U CN 205265994 U CN205265994 U CN 205265994U CN 201520965528 U CN201520965528 U CN 201520965528U CN 205265994 U CN205265994 U CN 205265994U
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Abstract
The utility model discloses a printed circuit board, including first base plate and second base plate, first base plate sets up in second base plate upper portion, is provided with the heat -conducting plate between first base plate and the second base plate, is provided with printing copper sheet layer on the first base plate, first base plate includes porous FR4 sheet layer I, and the upper and lower surface of porous FR4 sheet layer I is provided with insulating sheet layer I, insulating sheet layer I not with I contact of FR4 sheet layer be provided with heat -conducting layer I on the surface, the second base plate includes porous FR4 sheet layer II, and the upper and lower surface of porous FR4 sheet layer II is provided with insulating sheet layer II, insulating sheet layer II not with II contacts of FR4 sheet layer be provided with heat -conducting layer II on the surface. The utility model has the advantages of prior art's drawback, the reasonable novelty of structural design can be overcome to it.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB), belongs to field of circuit boards.
Background technology
The pcb board material of extensive use is at present to cover copper/epoxy glass fabric base material or phenolic resins glass cloth base material, also has a small amount of paper-based copper-coated board material using. Although these base materials have good electric property and processing characteristics, poor radiation, as the heat radiation approach of high heater element, almost can not look to by the resin conduction of PCB heat own, but air, dispel the heat towards periphery from the surface of element. But along with electronic product has entered into parts miniaturization, high-density installation, thermalization occurred frequently assembling epoch, be very inadequate if the element surface that only Pictest area is very little dispels the heat. While is due to a large amount of uses of the surface mounted component such as QFP, BGA, the heat that components and parts produce is passed to pcb board in large quantities, therefore, the best method that solves heat radiation is to improve the heat-sinking capability of the PCB self directly contacting with heater element, is conducted or is distributed by pcb board. Furtherly, due to the discrete component of super large-scale integration and high heating property, as integrated chip, LED etc. require more and more highlyer to heat dispersion, so that common printed substrate can not change conventional upwards heat-conducting mode, heat conduction is inhomogeneous, and thermal resistivity is large. By pcb board, heat is conducted or distributed, this requires, and pcb board heat conduction is even and thermal resistivity is little.
Utility model content
The deficiency existing for prior art, technical problem to be solved in the utility model is to provide a kind of printed circuit board (PCB), perfect heat-dissipating, long service life.
For solving the problems of the technologies described above, the technical scheme that the utility model is taked is, a kind of printed circuit board (PCB), comprise first substrate and second substrate, first substrate is arranged at second substrate top, between first substrate and second substrate, is provided with heat-conducting plate, is provided with print copper lamella on first substrate; Described first substrate comprises porous FR4 flaggy I, and the upper and lower surface of porous FR4 flaggy I is provided with layer of insulation board I, on the surface that layer of insulation board I does not contact with FR4 flaggy I, is provided with heat-conducting layer I; Described second substrate comprises porous FR4 flaggy II, and the upper and lower surface of porous FR4 flaggy II is provided with layer of insulation board II, on the surface that layer of insulation board II does not contact with FR4 flaggy II, is provided with heat-conducting layer II; In described porous FR4 flaggy I and porous FR4 flaggy II, be provided with blind hole, the corresponding setting in blind hole position of porous FR4 flaggy I and porous FR4 flaggy II and the blind hole of porous FR4 flaggy I and porous FR4 flaggy II communicate; In described blind hole, be provided with titanium alloy coat.
Optimize, above-mentioned printed circuit board (PCB), layer of insulation board I and layer of insulation board II are polytetrafluoroethylene floor.
Optimize, above-mentioned printed circuit board (PCB), the outer edge place of described heat-conducting plate is provided with some subsiders, is provided with titanium alloy coat in subsider.
Optimize, above-mentioned printed circuit board (PCB), described heat-conducting plate is polycrystalline graphite plate, is provided with some subsiders of evenly arranging in the upper and lower surface of heat-conducting plate, is provided with heat-conducting silicone grease in subsider.
Optimize, above-mentioned printed circuit board (PCB), described heat-conducting layer I and heat-conducting layer II are polycrystalline graphite coat, and the thickness of heat-conducting layer I is 1/4 of porous FR4 flaggy I thickness, and the thickness of heat-conducting layer II is 1/6 of porous FR4 flaggy II thickness.
Optimize, above-mentioned printed circuit board (PCB), the thickness of described layer of insulation board I is 1/4.5 of porous FR4 flaggy I thickness, the thickness of layer of insulation board II is 1/5 of porous FR4 flaggy II thickness.
Optimize, above-mentioned printed circuit board (PCB), the thickness of described heat-conducting plate is 1/3.5 of first substrate thickness, the degree of depth of subsider is 2/3 of heat-conducting plate thickness.
The utility model has the advantage of that it can overcome the drawback of prior art, reasonable in design novelty. By subsider is set on heat-conducting plate, titanium alloy is installed simultaneously on subsider, components and parts are directly dispelled the heat by metal-based layer, thereby greatly improve the integral heat sink effect of wiring board and strengthen the mechanical strength of circuit slab integral, the service life of extension wire plate. The heat dispersion that titanium alloy has further improved circuit board is set in blind hole, and because the electric conductivity of titanium alloy is high, raising is the electric conductivity of mounting related components in the circuit board, has strengthened the overall utility of wiring board. The good heat conductivity of polycrystalline graphite coat, coordinates with heat-conducting plate, has strengthened the thermal conductivity of wiring board. Dimension scale in the application's technical scheme, through actual verification, can ensure heat conductivility and the bulk strength of wiring board, can save again material.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
Further set forth technical characterstic of the present utility model below in conjunction with accompanying drawing and specific embodiment.
The utility model is a kind of printed circuit board (PCB), comprises first substrate 1 and second substrate 2, and first substrate 1 is arranged at second substrate 2 tops, between first substrate 1 and second substrate 2, is provided with heat-conducting plate 3, is provided with print copper lamella 4 on first substrate 1; Described first substrate 1 comprises porous FR4 flaggy I 11, and the upper and lower surface of porous FR4 flaggy I 11 is provided with layer of insulation board I 12, on the surface that layer of insulation board I 12 does not contact with FR4 flaggy I 11, is provided with heat-conducting layer I 13; Described second substrate 2 comprises porous FR4 flaggy II 21, and the upper and lower surface of porous FR4 flaggy II 21 is provided with layer of insulation board II 22, on the surface that layer of insulation board II 22 does not contact with FR4 flaggy II 21, is provided with heat-conducting layer II 23; In described porous FR4 flaggy I 11 and porous FR4 flaggy II 21, be provided with blind hole, the corresponding setting in blind hole position of porous FR4 flaggy I 11 and porous FR4 flaggy II 21 and the blind hole of porous FR4 flaggy I 11 and porous FR4 flaggy II 21 communicate; In described blind hole, be provided with titanium alloy coat. Described insulating barrier is polytetrafluoroethylene floor. The outer edge place of heat-conducting plate 3 is provided with some subsiders 31, is provided with titanium alloy coat in subsider 31. Heat-conducting plate 3 is polycrystalline graphite plate, is provided with some subsiders of evenly arranging 31 in the upper and lower surface of heat-conducting plate 3, in subsider 31, is provided with heat-conducting silicone grease. Heat-conducting layer I 13 and heat-conducting layer II 23 are polycrystalline graphite coat, and the thickness of heat-conducting layer I 13 is 1/4 of porous FR4 flaggy I 11 thickness, and the thickness of heat-conducting layer II 23 is 1/6 of porous FR4 flaggy II 21 thickness. The thickness of layer of insulation board I 12 is 1/4.5 of porous FR4 flaggy I 11 thickness, and the thickness of layer of insulation board II 22 is 1/5 of porous FR4 flaggy II 21 thickness. The thickness of heat-conducting plate 3 is 1/3.5 of first substrate 1 thickness, and the degree of depth of subsider 31 is 2/3 of heat-conducting plate 3 thickness.
The utility model has the advantage of that it can overcome the drawback of prior art, reasonable in design novelty. By subsider is set on heat-conducting plate, titanium alloy is installed simultaneously on subsider, components and parts are directly dispelled the heat by metal-based layer, thereby greatly improve the integral heat sink effect of wiring board and strengthen the mechanical strength of circuit slab integral, the service life of extension wire plate. The heat dispersion that titanium alloy has further improved circuit board is set in blind hole, and because the electric conductivity of titanium alloy is high, raising is the electric conductivity of mounting related components in the circuit board, has strengthened the overall utility of wiring board. The good heat conductivity of polycrystalline graphite coat, coordinates with heat-conducting plate, has strengthened the thermal conductivity of wiring board. Dimension scale in the application's technical scheme, through actual verification, can ensure heat conductivility and the bulk strength of wiring board, can save again material.
Certainly, above-mentioned explanation is not to restriction of the present utility model, and the utility model is also not limited to above-mentioned giving an example; those skilled in the art; in essential scope of the present utility model, variation, remodeling, interpolation or the replacement made, all should belong to protection domain of the present utility model.
Claims (7)
1. a printed circuit board (PCB), is characterized in that: comprise first substrate and second substrate, first substrate is arranged at second substrate top, between first substrate and second substrate, is provided with heat-conducting plate, is provided with print copper lamella on first substrate; Described first substrate comprises porous FR4 flaggy I, and the upper and lower surface of porous FR4 flaggy I is provided with layer of insulation board I, on the surface that layer of insulation board I does not contact with FR4 flaggy I, is provided with heat-conducting layer I; Described second substrate comprises porous FR4 flaggy II, and the upper and lower surface of porous FR4 flaggy II is provided with layer of insulation board II, on the surface that layer of insulation board II does not contact with FR4 flaggy II, is provided with heat-conducting layer II; In described porous FR4 flaggy I and porous FR4 flaggy II, be provided with blind hole, the corresponding setting in blind hole position of porous FR4 flaggy I and porous FR4 flaggy II and the blind hole of porous FR4 flaggy I and porous FR4 flaggy II communicate; In described blind hole, be provided with titanium alloy coat.
2. printed circuit board (PCB) according to claim 1, is characterized in that: described layer of insulation board I and layer of insulation board II are polytetrafluoroethylene floor.
3. printed circuit board (PCB) according to claim 2, is characterized in that: the outer edge place of described heat-conducting plate is provided with some subsiders, is provided with titanium alloy coat in subsider.
4. printed circuit board (PCB) according to claim 3, is characterized in that: described heat-conducting plate is polycrystalline graphite plate, is provided with some subsiders of evenly arranging in the upper and lower surface of heat-conducting plate, is provided with heat-conducting silicone grease in subsider.
5. printed circuit board (PCB) according to claim 4, it is characterized in that: described heat-conducting layer I and heat-conducting layer II are polycrystalline graphite coat, the thickness of heat-conducting layer I is 1/4 of porous FR4 flaggy I thickness, and the thickness of heat-conducting layer II is 1/6 of porous FR4 flaggy II thickness.
6. printed circuit board (PCB) according to claim 5, is characterized in that: the thickness of described layer of insulation board I is 1/4.5 of porous FR4 flaggy I thickness, and the thickness of layer of insulation board II is 1/5 of porous FR4 flaggy II thickness.
7. printed circuit board (PCB) according to claim 6, is characterized in that: the thickness of described heat-conducting plate is 1/3.5 of first substrate thickness, and the degree of depth of subsider is 2/3 of heat-conducting plate thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520965528.2U CN205265994U (en) | 2015-11-30 | 2015-11-30 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520965528.2U CN205265994U (en) | 2015-11-30 | 2015-11-30 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205265994U true CN205265994U (en) | 2016-05-25 |
Family
ID=56007491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520965528.2U Active CN205265994U (en) | 2015-11-30 | 2015-11-30 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205265994U (en) |
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2015
- 2015-11-30 CN CN201520965528.2U patent/CN205265994U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |