CN203407061U

CN203407061U - Isolating PCB

Info

Publication number: CN203407061U
Application number: CN201320420434.8U
Authority: CN
Inventors: 顾国文; 邵春华; 侯立梁
Original assignee: CHANGZHOU ZIYIN ELECTRONIC CIRCUIT Co Ltd
Current assignee: CHANGZHOU ZIYIN ELECTRONIC CIRCUIT Co Ltd
Priority date: 2013-07-16
Filing date: 2013-07-16
Publication date: 2014-01-22
Anticipated expiration: 2023-07-16

Abstract

The utility model relates to a PCB, and especially relates to an isolating PCB. The PCB comprises a conducting layer, an insulating layer, and a heat radiation layer. The insulating layer is disposed on the heat radiation layer. The conducting layer is disposed on the insulating layer. The heat radiation layer is a tooth-shaped copper layer. A bottom board is fixed on the bottom of the heat radiation layer. The bottom board is a ceramic plate. The PCB can effectively reduce heat thereof, thereby preventing deformation caused by high temperature, and prolonging service life thereof.

Description

Empty every type pcb board

Technical field

The utility model relates to a kind of pcb board, especially empty every type pcb board.

Background technology

PCB(Printed Circuit Board), Chinese is printed circuit board, claims again printed circuit board (PCB), printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.In prior art, PCB plate is widely used, and well-known electronic component is to produce heat in the course of the work, so the thermal diffusivity of PCB plate is an important index, and the pcb board thermal diffusivity of prior art is poor.

Utility model content

In order to overcome the deficiency of existing pcb board poor radiation, it is empty every type pcb board that the utility model provides.

The utility model solves the technical scheme that its technical problem adopts: emptyly every type pcb board, comprise conductive layer, insulating barrier and heat dissipating layer, heat dissipating layer is provided with insulating barrier, and insulating barrier is provided with conductive layer, and heat dissipating layer is dentation copper layer.

According to another embodiment of the present utility model, further comprise that base plate is fixed on heat dissipating layer bottom, base plate is ceramic wafer.

The beneficial effects of the utility model are that this pcb board can effectively reduce its heat, thereby prevents that it from deformation occurring because of high temperature, has extended its useful life.

Accompanying drawing explanation

Below in conjunction with drawings and Examples, the utility model is further illustrated.

Fig. 1 is structural representation of the present utility model;

1. conductive layers in figure, 2. insulating barrier, 3. heat dissipating layer, 4. base plate.

Embodiment

If Fig. 1 is structural representation of the present utility model, empty every type pcb board, comprise conductive layer 1, insulating barrier 2 and heat dissipating layer 3, heat dissipating layer 3 is provided with insulating barrier 2, and insulating barrier 2 is provided with conductive layer 1, and heat dissipating layer 3 is dentation copper layers, base plate 4 is fixed on heat dissipating layer 3 bottoms, and base plate 4 is ceramic wafer.

Heat dissipating layer 3 is dentation copper layer, this shape can increasing heat radiation area, and can promote air in the circulation of pcb board bottom, and copper material more XXL the radiating efficiency of heat dissipating layer 3, the base plate 4 of bottom, because be ceramic wafer, can be resisted the erosion of outside chemical article, and can not be subject to the impact of high temperature, this pcb board can effectively reduce its heat, thereby prevents that it from deformation occurring because of high temperature, has extended its useful life.

Claims

1. sky, every type pcb board, comprises conductive layer (1), insulating barrier (2) and heat dissipating layer (3), and heat dissipating layer (3) is provided with insulating barrier (2), and insulating barrier (2) is provided with conductive layer (1), it is characterized in that, heat dissipating layer (3) is dentation copper layer.

2. sky according to claim 1, every type pcb board, is characterized in that, base plate (4) is fixed on heat dissipating layer (3) bottom, and base plate (4) is ceramic wafer.