CN203407061U - Isolating PCB - Google Patents
Isolating PCB Download PDFInfo
- Publication number
- CN203407061U CN203407061U CN201320420434.8U CN201320420434U CN203407061U CN 203407061 U CN203407061 U CN 203407061U CN 201320420434 U CN201320420434 U CN 201320420434U CN 203407061 U CN203407061 U CN 203407061U
- Authority
- CN
- China
- Prior art keywords
- layer
- pcb
- heat dissipating
- heat radiation
- dissipating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims abstract description 5
- 230000004888 barrier function Effects 0.000 claims description 10
- 230000005855 radiation Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a PCB, and especially relates to an isolating PCB. The PCB comprises a conducting layer, an insulating layer, and a heat radiation layer. The insulating layer is disposed on the heat radiation layer. The conducting layer is disposed on the insulating layer. The heat radiation layer is a tooth-shaped copper layer. A bottom board is fixed on the bottom of the heat radiation layer. The bottom board is a ceramic plate. The PCB can effectively reduce heat thereof, thereby preventing deformation caused by high temperature, and prolonging service life thereof.
Description
Technical field
The utility model relates to a kind of pcb board, especially empty every type pcb board.
Background technology
PCB(Printed Circuit Board), Chinese is printed circuit board, claims again printed circuit board (PCB), printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.In prior art, PCB plate is widely used, and well-known electronic component is to produce heat in the course of the work, so the thermal diffusivity of PCB plate is an important index, and the pcb board thermal diffusivity of prior art is poor.
Utility model content
In order to overcome the deficiency of existing pcb board poor radiation, it is empty every type pcb board that the utility model provides.
The utility model solves the technical scheme that its technical problem adopts: emptyly every type pcb board, comprise conductive layer, insulating barrier and heat dissipating layer, heat dissipating layer is provided with insulating barrier, and insulating barrier is provided with conductive layer, and heat dissipating layer is dentation copper layer.
According to another embodiment of the present utility model, further comprise that base plate is fixed on heat dissipating layer bottom, base plate is ceramic wafer.
The beneficial effects of the utility model are that this pcb board can effectively reduce its heat, thereby prevents that it from deformation occurring because of high temperature, has extended its useful life.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model;
1. conductive layers in figure, 2. insulating barrier, 3. heat dissipating layer, 4. base plate.
Embodiment
If Fig. 1 is structural representation of the present utility model, empty every type pcb board, comprise conductive layer 1, insulating barrier 2 and heat dissipating layer 3, heat dissipating layer 3 is provided with insulating barrier 2, and insulating barrier 2 is provided with conductive layer 1, and heat dissipating layer 3 is dentation copper layers, base plate 4 is fixed on heat dissipating layer 3 bottoms, and base plate 4 is ceramic wafer.
Claims (2)
1. sky, every type pcb board, comprises conductive layer (1), insulating barrier (2) and heat dissipating layer (3), and heat dissipating layer (3) is provided with insulating barrier (2), and insulating barrier (2) is provided with conductive layer (1), it is characterized in that, heat dissipating layer (3) is dentation copper layer.
2. sky according to claim 1, every type pcb board, is characterized in that, base plate (4) is fixed on heat dissipating layer (3) bottom, and base plate (4) is ceramic wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320420434.8U CN203407061U (en) | 2013-07-16 | 2013-07-16 | Isolating PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320420434.8U CN203407061U (en) | 2013-07-16 | 2013-07-16 | Isolating PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407061U true CN203407061U (en) | 2014-01-22 |
Family
ID=49942979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320420434.8U Expired - Fee Related CN203407061U (en) | 2013-07-16 | 2013-07-16 | Isolating PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407061U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120343807A (en) * | 2025-04-28 | 2025-07-18 | 东莞市龙谊电子科技有限公司 | A flexible circuit board preparation process capable of dynamic thermal management |
-
2013
- 2013-07-16 CN CN201320420434.8U patent/CN203407061U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120343807A (en) * | 2025-04-28 | 2025-07-18 | 东莞市龙谊电子科技有限公司 | A flexible circuit board preparation process capable of dynamic thermal management |
| CN120343807B (en) * | 2025-04-28 | 2025-09-26 | 东莞市龙谊电子科技有限公司 | A flexible circuit board preparation process capable of dynamic thermal management |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20170716 |