CN204466036U - A kind of aluminum-based circuit board - Google Patents
A kind of aluminum-based circuit board Download PDFInfo
- Publication number
- CN204466036U CN204466036U CN201520183944.7U CN201520183944U CN204466036U CN 204466036 U CN204466036 U CN 204466036U CN 201520183944 U CN201520183944 U CN 201520183944U CN 204466036 U CN204466036 U CN 204466036U
- Authority
- CN
- China
- Prior art keywords
- aluminium base
- insulating layer
- aluminum
- circuit board
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of aluminum-based circuit board, it can make the heat on electronic component fail to distribute rapidly.This aluminum-based circuit board comprises aluminium base, and aluminium base is provided with thermally conductive insulating layer, described thermally conductive insulating layer is provided with groove, is provided with conductive layer in a groove, be fixed with pad on the electrically conductive; In thermally conductive insulating layer, between the pad of electronic component cross-over connection, position forms projection, and this protruding electronic component contacts.
Description
Technical field
The utility model belongs to the technical field of wiring board, specifically relates to a kind of aluminum-based circuit board.
Background technology
At present, the aluminium base wiring board on market, is included in aluminium base and is provided with thermally conductive insulating layer, described thermally conductive insulating layer is provided with conductive layer, arranges pad on the electrically conductive.The aluminium base of this structure is by means of only the contact of conductive layer and thermally conductive insulating layer in electronic component and thermally conductive insulating layer heat transfer, and heat transference efficiency is not high, makes the heat on electronic component fail to distribute rapidly.
Summary of the invention
The purpose of this utility model is to provide a kind of aluminum-based circuit board, and it can make the heat on electronic component fail to distribute rapidly.
The purpose of this utility model is achieved in that a kind of aluminum-based circuit board, comprises aluminium base, and aluminium base is provided with thermally conductive insulating layer, described thermally conductive insulating layer is provided with groove, is provided with conductive layer in a groove, be fixed with pad on the electrically conductive; In thermally conductive insulating layer, between the pad of electronic component cross-over connection, position forms projection, and this protruding electronic component contacts.
On the basis of such scheme and as the preferred version of such scheme: be provided with some fins at the lower surface of described aluminium base.
On the basis of such scheme and as the preferred version of such scheme: described fin and described aluminium base one-body molded.
On the basis of such scheme and as the preferred version of such scheme: the lower surface of described aluminium base is in tilting.
The utility model gives prominence to compared to existing technology and useful technique effect is:
Aluminum-based circuit board of the present utility model, by being arranged in a groove by conductive layer, increases its contact area, to accelerate heat to be delivered to thermally conductive insulating layer; In addition by arranging bulge-structure, the heat on electronic component directly can be delivered on aluminium base by thermally conductive insulating layer, thus the heat on electronic component is distributed rapidly.
Accompanying drawing explanation
Fig. 1 is the sectional structure schematic diagram of local of the present utility model.
Fig. 2 is the sectional structure schematic diagram of the local of aluminium base.
Embodiment
The utility model is further described with specific embodiment below in conjunction with accompanying drawing, see Fig. 1-Fig. 2;
The aluminum-based circuit board that the present embodiment provides, comprises aluminium base 1, and aluminium base 1 is provided with thermally conductive insulating layer 2, described thermally conductive insulating layer 2 is provided with groove 3, is provided with conductive layer 4 in groove 3.As shown in fig. 1, conductive layer 4 embeds in thermally conductive insulating layer 2, increases contact area, to accelerate heat to be delivered to thermally conductive insulating layer.Conductive layer 4 is fixed with pad 5; In thermally conductive insulating layer 2, between the pad 5 of electronic component cross-over connection, position forms protruding 21, protruding one-body molded with thermally conductive insulating layer.These protruding 21 electronic components contact.Protruding protruding upward relative to the diapire of groove.By bulge-structure, the heat on electronic component directly can be delivered on aluminium base by thermally conductive insulating layer, thus the heat on electronic component is distributed rapidly.
On the architecture basics of the aluminum-based circuit board of said structure, be provided with some fins 6 at the lower surface 11 of described aluminium base 1.Preferably, described fin and described aluminium base one-body molded.As shown in FIG., fin, in flake, increases the surface area of aluminium base, makes heat Quick diffusing.
The lower surface 11 of described aluminium base 1 is in tilting.As shown in Figure 2, lower surface 11 is with respect to the horizontal plane tilt, and it forms guiding into air-flow, and thermal current is flowed out, and increases the heat-sinking capability of aluminium base.
Above-described embodiment is only preferred embodiment of the present utility model, not limits protection range of the present utility model according to this, therefore: all equivalence changes done according to structure of the present utility model, shape, principle, all should be covered by within protection range of the present utility model.
Claims (4)
1. an aluminum-based circuit board, comprises aluminium base, and aluminium base is provided with thermally conductive insulating layer, it is characterized in that: in described thermally conductive insulating layer, be provided with groove, be provided with conductive layer in a groove, be fixed with pad on the electrically conductive; In thermally conductive insulating layer, between the pad of electronic component cross-over connection, position forms projection, and this protruding electronic component contacts.
2. aluminum-based circuit board according to claim 1, is characterized in that: be provided with some fins at the lower surface of described aluminium base.
3. aluminum-based circuit board according to claim 2, is characterized in that: described fin and described aluminium base one-body molded.
4. aluminum-based circuit board according to claim 2, is characterized in that: the lower surface of described aluminium base is in tilting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520183944.7U CN204466036U (en) | 2015-03-30 | 2015-03-30 | A kind of aluminum-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520183944.7U CN204466036U (en) | 2015-03-30 | 2015-03-30 | A kind of aluminum-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204466036U true CN204466036U (en) | 2015-07-08 |
Family
ID=53672853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520183944.7U Expired - Fee Related CN204466036U (en) | 2015-03-30 | 2015-03-30 | A kind of aluminum-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204466036U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465167A (en) * | 2019-01-18 | 2020-07-28 | 欣兴电子股份有限公司 | Substrate structure and manufacturing method thereof |
-
2015
- 2015-03-30 CN CN201520183944.7U patent/CN204466036U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465167A (en) * | 2019-01-18 | 2020-07-28 | 欣兴电子股份有限公司 | Substrate structure and manufacturing method thereof |
| CN111465167B (en) * | 2019-01-18 | 2021-11-02 | 欣兴电子股份有限公司 | Substrate structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20160330 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |