CN203722987U - Simple heat radiation structure of multiple power devices - Google Patents
Simple heat radiation structure of multiple power devices Download PDFInfo
- Publication number
- CN203722987U CN203722987U CN201420004852.3U CN201420004852U CN203722987U CN 203722987 U CN203722987 U CN 203722987U CN 201420004852 U CN201420004852 U CN 201420004852U CN 203722987 U CN203722987 U CN 203722987U
- Authority
- CN
- China
- Prior art keywords
- power devices
- circuit board
- power device
- printed circuit
- radiation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 title claims description 19
- 230000017525 heat dissipation Effects 0.000 abstract 4
- 238000009413 insulation Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a simple heat dissipation structure of multiple power devices. The simple heat dissipation structure comprises a printed circuit board, power devices, a metal heat sink and a fastening screw for fastening, wherein the printed circuit board and the power devices are arranged in parallel, an insulation and heat conduction pad is disposed between the power devices and the metal heat sink, and the upper surface and the lower surface of each power device horizontally cling to the printed circuit board and the insulation and heat conduction pad respectively. With adoption of the simple heat dissipation structure of the multiple power devices, the heat dissipation efficiency of equipment is raised without influencing the size of the original equipment.
Description
Technical field
The utility model relates to the radiator structure of installation power device on a kind of circuit board, especially relates to a kind of simple heat radiation structure of many power devices.
Background technology
Along with the continuous progress of science and technology, increasing electronic product is all towards the developing direction development of high-power and miniaturization, and the radiator structure supporting to many power devices requires also more and more higher.Technical staff need to improve the radiating efficiency of equipment as much as possible in the situation that do not affect the volume of existing equipment, in order to avoid because the heat radiation requirement of power device can not meet, reduce the useful life of power device.
Utility model content
The purpose of this utility model is to provide a kind of simple heat radiation structure of many power devices, can be in the situation that do not affect the volume of existing equipment, the radiating efficiency of raising equipment.
For achieving the above object, the utility model provides a kind of simple heat radiation structure of many power devices, comprise printed circuit board (PCB), power device, metallic heat radiating plate and for fastening holding screw, described printed circuit board (PCB) and described power device be arranged in parallel, between described power device and described metallic heat radiating plate, be provided with insulating heat-conductive pad, the upper and lower surface of described power device is smooth on described printed circuit board (PCB) and described insulating heat-conductive pad.
Preferably, the pin of described power device is L word shape.
Preferably, on described printed circuit board (PCB), be also provided with pressing plate.
Preferably, on described metallic heat radiating plate, be also provided with louvre.
Preferably, described metallic heat radiating plate is plate.
Preferably, described metallic heat radiating plate is semi-shaped.
Therefore, the utility model adopts the simple heat radiation structure of many power devices of said structure, can be in the situation that do not affect the volume of existing equipment, the radiating efficiency of raising equipment.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of the simple heat radiation structure embodiment of the many power devices of the utility model;
Fig. 2 is the structural representation of power device described in the simple heat radiation structure embodiment of the many power devices of the utility model;
Fig. 3 is that described in the simple heat radiation structure embodiment of the many power devices of the utility model, metallic heat radiating plate is plate structural representation.
Embodiment
Embodiment
Fig. 1 is the structural representation of the simple heat radiation structure embodiment of the many power devices of the utility model, as shown in Figure 1, comprise printed circuit board (PCB) 3, power device 4, metallic heat radiating plate 6 and for fastening holding screw 1, printed circuit board (PCB) 3 and power device 4 be arranged in parallel, between power device 4 and metallic heat radiating plate 6, be provided with insulating heat-conductive pad 5, the upper and lower surface of power device 4 is smooth on printed circuit board (PCB) 3 and insulating heat-conductive pad 5.The pin of power device 4 is L word shape, vertical with the body of power device 4, Fig. 2 is the structural representation of power device 4 in the simple heat radiation structure embodiment of the many power devices of the utility model, like this when power device 4 is welded on printed circuit board (PCB) 3, power device 4 can be close to the surface of printed circuit board (PCB) 3, surface at printed circuit board (PCB) 3 forms plane distribution, make printed circuit board (PCB) 3, power device 4 and metallic heat radiating plate 6 be arranged in parallel, so just improved the plane utilance of metallic heat radiating plate 6, when using a plurality of power device, save as much as possible the device space, improve radiating efficiency simultaneously, 2 power devices in Fig. 1, have only been drawn, in the present embodiment, metallic heat radiating plate 6 is semi-shaped.
When the mechanical strength of printed circuit board (PCB) 3 is inadequate, printed circuit board (PCB) 3 upper surfaces are also provided with pressing plate 2.Under the effect of holding screw 1, printed circuit board (PCB) 3 is pressed on power device 4, with the heat-sink unit of power device 4 and a compact conformation of metallic heat radiating plate 6 formation, if the words of adjacent two power device close together, can omit pressing plate 4, directly with printed circuit board (PCB) 3, power device 4 be press-fited.
For increasing area of dissipation, the present embodiment also arranges louvre on metallic heat radiating plate 6.
In actual working environment, can metallic heat radiating plate 6 be processed into other shape according to device space design feature, as shown in Figure 3 plate.
Therefore, the utility model adopts the simple heat radiation structure of many power devices of said structure, can be in the situation that do not affect the volume of existing equipment, the radiating efficiency of raising equipment.
Finally it should be noted that: above embodiment is only in order to the technical solution of the utility model to be described but not be limited, although the utility model is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that: it still can be modified or be equal to replacement the technical solution of the utility model, and these modifications or be equal to replacement and also can not make amended technical scheme depart from the spirit and scope of technical solutions of the utility model.
Claims (6)
1. the simple heat radiation structure of power device more than a kind, comprise printed circuit board (PCB), power device, metallic heat radiating plate and for fastening holding screw, it is characterized in that: described printed circuit board (PCB) and described power device be arranged in parallel, between described power device and described metallic heat radiating plate, be provided with insulating heat-conductive pad, the upper and lower surface of described power device is smooth on described printed circuit board (PCB) and described insulating heat-conductive pad.
2. the simple heat radiation structure of many power devices according to claim 1, is characterized in that: the pin of described power device is L word shape.
3. the simple heat radiation structure of many power devices according to claim 2, is characterized in that: on described printed circuit board (PCB), be also provided with pressing plate.
4. the simple heat radiation structure of many power devices according to claim 3, is characterized in that: on described metallic heat radiating plate, be also provided with louvre.
5. the simple heat radiation structure of many power devices according to claim 4, is characterized in that: described metallic heat radiating plate is plate.
6. the simple heat radiation structure of many power devices according to claim 4, is characterized in that: described metallic heat radiating plate is semi-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420004852.3U CN203722987U (en) | 2014-01-06 | 2014-01-06 | Simple heat radiation structure of multiple power devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420004852.3U CN203722987U (en) | 2014-01-06 | 2014-01-06 | Simple heat radiation structure of multiple power devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203722987U true CN203722987U (en) | 2014-07-16 |
Family
ID=51162102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420004852.3U Expired - Lifetime CN203722987U (en) | 2014-01-06 | 2014-01-06 | Simple heat radiation structure of multiple power devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203722987U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018210618A1 (en) * | 2018-06-28 | 2020-01-02 | Robert Bosch Gmbh | electronics unit |
| WO2020253126A1 (en) * | 2019-06-21 | 2020-12-24 | 纳恩博（北京）科技有限公司 | Balancing vehicle and controller thereof |
| CN112509994A (en) * | 2020-12-02 | 2021-03-16 | 上海新时达电气股份有限公司 | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device |
-
2014
- 2014-01-06 CN CN201420004852.3U patent/CN203722987U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018210618A1 (en) * | 2018-06-28 | 2020-01-02 | Robert Bosch Gmbh | electronics unit |
| WO2020253126A1 (en) * | 2019-06-21 | 2020-12-24 | 纳恩博（北京）科技有限公司 | Balancing vehicle and controller thereof |
| CN112509994A (en) * | 2020-12-02 | 2021-03-16 | 上海新时达电气股份有限公司 | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140716 |