CN203884123U - Radiator characterized by seamless splicing of heat conduction tubes - Google Patents
Radiator characterized by seamless splicing of heat conduction tubes Download PDFInfo
- Publication number
- CN203884123U CN203884123U CN201420249924.0U CN201420249924U CN203884123U CN 203884123 U CN203884123 U CN 203884123U CN 201420249924 U CN201420249924 U CN 201420249924U CN 203884123 U CN203884123 U CN 203884123U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat conduction
- dissipation base
- heat pipe
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims description 34
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 4
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of radiators, specifically to a radiator characterized by seamless splicing of heat conduction tubes. The radiator comprises a radiating pedestal and a plurality of heat conduction tubes. The bottom face of the radiating pedestal is provided with a plurality of grooves corresponding to the heat conduction tubes. The heat conduction tubes are pressed and fitted in the corresponding grooves. The height of a connecting part between two grooves of the radiating pedestal is less than the height of the bottom face of the radiating pedestal, so that seamless splicing is formed between every two heat conduction tubes after the press fit of the heat conduction tubes. After press fit of the heat conduction tubes, seamless splicing is formed between the heat conduction tubes and the heat conduction tubes form a whole, so that the heat conduction speed is increased and the heat conduction efficiency is increased. The radiator characterized by seamless splicing of the heat conduction tubes is characterized by higher heat conduction speed and higher heat conduction efficiency.
Description
Technical field
The utility model relates to heat sink technology field, relates in particular to the seamless spliced radiator of a kind of heat pipe.
Background technology
At present, some electronic devices and components, because power is large, heat dissipation capacity is large, thus need radiator to dispel the heat in time, as: CPU, video card etc. in desk computer, all need special radiator.
The heat pipe radiator of prior art, mainly comprise heat dissipation base, heat pipe, radiating fin, the radiating fin of multi-disc is arranged in a side of heat pipe, and the opposite side of heat pipe is pressed on heat dissipation base, in use, heat dissipation base and heat pipe are close to electronic devices and components, the heat producing while making electronic devices and components work, pass to heat dissipation base and heat pipe, and heat pipe can transfer heat to radiating fin, in time dissipation of heat is gone out by heat dissipation base and radiating fin, reach the object of cooling.
Wherein, the heat pipe radiator of prior art, as shown in Figure 1, the way of pressing heat pipe 102, normally offer multiple grooves in the bottom surface of heat dissipation base 101, more heat pipes 102 are pressure bonded in corresponding groove, make heat pipe 102 concordant with the bottom surface of heat dissipation base 101.The weak point of this way is: between the heat pipe of pressing, have gap 103, cause many heat pipes 102 can not form overall heat conduction, cause that heat-transfer rate is slow, heat transfer efficiency is not high.
Utility model content
The purpose of this utility model is to provide for the deficiencies in the prior art the seamless spliced radiator of heat pipe that a kind of heat-transfer rate is very fast, heat transfer efficiency is higher.
To achieve these goals, the utility model provides a kind of heat pipe seamless spliced radiator, comprise heat dissipation base, many heat pipes, the bottom surface of described heat dissipation base offers groove corresponding to multiple and described many heat pipes, described heat pipe is pressed in its corresponding groove, the height of the connecting portion between two grooves of described heat dissipation base, lower than the height of the bottom surface of described heat dissipation base, makes described many heat pipes after pressing, forms seamless spliced between two heat pipes.
Wherein, described heat dissipation base is aluminium alloy heat dissipation base.
Wherein, described heat pipe is copper heat pipe.
Wherein, described many heat pipes are by the disposable corresponding multiple grooves that are pressed on described heat dissipation base of riveting process.
Wherein, described heat pipe is 8, and the groove of described heat dissipation base is 8.
The utility model beneficial effect is: many heat pipes of the utility model are after pressing, between heat pipe, form seamless spliced, make many heat pipes form an entirety, thereby accelerate heat-transfer rate, improve heat transfer efficiency, therefore, the seamless spliced radiator of heat pipe of the present utility model, heat-transfer rate is very fast, heat transfer efficiency is higher.
Brief description of the drawings
Fig. 1 is the structural representation of the heat pipe radiator of prior art.
Fig. 2 is the structural representation of the seamless spliced radiator of heat pipe of the present utility model.
Fig. 3 is the end view of the seamless spliced radiator of heat pipe of the present utility model.
Fig. 4 is the A-A cutaway view of Fig. 3.
Fig. 5 is the schematic diagram that Fig. 4 conceals heat pipe.
Embodiment
In order to describe the technical solution of the utility model in detail, below in conjunction with the accompanying drawing of the utility model embodiment, the technical scheme of the utility model embodiment is carried out to clear, complete description.Obviously, described embodiment is a part of embodiment of the present utility model, instead of whole embodiment.Based on described embodiment of the present utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite without creative work, belongs to the scope that the utility model is protected.
Please refer to Fig. 2～5, the seamless spliced radiator of heat pipe of the present utility model, comprises heat dissipation base 1, many heat pipes 2.The bottom surface 13 of heat dissipation base 1 offers multiple grooves 11 corresponding with many heat pipes 2, and for example: in the present embodiment, heat pipe 2 is 8, the groove 11 of heat dissipation base 1 is 8.Heat pipe 2 is pressed in the groove 11 that it is corresponding.Wherein, the height of the connecting portion 12 between two grooves 11 of heat dissipation base 1, lower than the height of the bottom surface 13 of heat dissipation base 1, makes many heat pipes 2 after pressing, forms seamless spliced between two heat pipes 2.Specifically, as shown in Figure 4,5, the connecting portion 12 between two grooves 11, its top is lower than the bottom surface 13 of heat dissipation base 1, and like this, heat pipe 2 is in the time of pressing, heat pipe 2 is expanded to both sides owing to being squeezed, thereby makes between two heat pipes 2 together seamless spliced.In the present embodiment, preferably, many heat pipes 2 are by the disposable corresponding multiple grooves 11 that are pressed on heat dissipation base 1 of riveting process, 8 heat pipes 2 that are the present embodiment are riveted on heat dissipation base 1 simultaneously, make splicing mutually between heat pipe 2, can not have gap, form an entirety, and many heat pipes 2 are larger with the contact area of electronic devices and components, thereby accelerate heat-transfer rate, raising heat transfer efficiency.
Preferably, heat dissipation base 1 is aluminium alloy heat dissipation base, to have good radiating effect; Heat pipe 2 is copper heat pipe, to have good radiating effect.
In sum, the utility model many heat pipes 2 are after pressing, between heat pipe 2, form seamless spliced, make many heat pipes 2 form an entirety, thereby accelerate heat-transfer rate, improve heat transfer efficiency, therefore, the seamless spliced radiator of heat pipe of the present utility model, heat-transfer rate is very fast, heat transfer efficiency is higher.
Finally should be noted that; above embodiment is only in order to illustrate the technical solution of the utility model; but not restriction to the utility model protection range; although the utility model has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; the technical solution of the utility model is modified or is equal to replacement, all belong to protection range of the present utility model.
Claims (5)
1. the seamless spliced radiator of heat pipe, comprise heat dissipation base, many heat pipes, the bottom surface of described heat dissipation base offers groove corresponding to multiple and described many heat pipes, described heat pipe is pressed in its corresponding groove, it is characterized in that: the height of the connecting portion between two grooves of described heat dissipation base is lower than the height of the bottom surface of described heat dissipation base, make described many heat pipes after pressing, between two heat pipes, form seamless spliced.
2. the seamless spliced radiator of heat pipe according to claim 1, is characterized in that: described heat dissipation base is aluminium alloy heat dissipation base.
3. the seamless spliced radiator of heat pipe according to claim 1, is characterized in that: described heat pipe is copper heat pipe.
4. the seamless spliced radiator of heat pipe according to claim 1, is characterized in that: described many heat pipes are by the disposable corresponding multiple grooves that are pressed on described heat dissipation base of riveting process.
5. according to the seamless spliced radiator of heat pipe described in claim 1 to 4 any one, it is characterized in that: described heat pipe is 8, the groove of described heat dissipation base is 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420249924.0U CN203884123U (en) | 2014-05-15 | 2014-05-15 | Radiator characterized by seamless splicing of heat conduction tubes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420249924.0U CN203884123U (en) | 2014-05-15 | 2014-05-15 | Radiator characterized by seamless splicing of heat conduction tubes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203884123U true CN203884123U (en) | 2014-10-15 |
Family
ID=51684580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420249924.0U Expired - Fee Related CN203884123U (en) | 2014-05-15 | 2014-05-15 | Radiator characterized by seamless splicing of heat conduction tubes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203884123U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107861593A (en) * | 2017-12-13 | 2018-03-30 | 成都强思科技有限公司 | A kind of heat abstractor for computer heating element |
| CN112588993A (en) * | 2020-12-10 | 2021-04-02 | 昆山联德电子科技有限公司 | Seamless rolling riveting process for heat conduction pipe of radiator and corresponding assembly structure |
-
2014
- 2014-05-15 CN CN201420249924.0U patent/CN203884123U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107861593A (en) * | 2017-12-13 | 2018-03-30 | 成都强思科技有限公司 | A kind of heat abstractor for computer heating element |
| CN112588993A (en) * | 2020-12-10 | 2021-04-02 | 昆山联德电子科技有限公司 | Seamless rolling riveting process for heat conduction pipe of radiator and corresponding assembly structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGGUAN ZHENPIN PRECISION HARDWARE CO., LTD. Free format text: FORMER OWNER: SHENG BAOHUA Effective date: 20150416 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150416 Address after: 523000, No. two, No. five road, Tai Ping Community, Changan Town, Dongguan Town, Guangdong Patentee after: Dongguan Zhenpin Precision Hardware Co., Ltd. Address before: 523000 No. 79 North Xingang Road, new bay, Humen Town, Guangdong, Dongguan Patentee before: Sheng Baohua |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 523000, No. two, 5, Tai Ping Road, Changan Town, Dongguan Town, Guangdong, China Patentee after: DONGGUAN ZHENPIN HARDWARE COOLING TECHNOLOGY CO., LTD. Address before: 523000, No. two, No. five road, Tai Ping Community, Changan Town, Dongguan Town, Guangdong Patentee before: Dongguan Zhenpin Precision Hardware Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20200515 |