CN206365138U - A kind of high frequency printed circuit board with ceramic heat sink - Google Patents

A kind of high frequency printed circuit board with ceramic heat sink Download PDF

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Publication number
CN206365138U
CN206365138U CN201621486221.5U CN201621486221U CN206365138U CN 206365138 U CN206365138 U CN 206365138U CN 201621486221 U CN201621486221 U CN 201621486221U CN 206365138 U CN206365138 U CN 206365138U
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CN
China
Prior art keywords
circuit board
heat
groove
heat sink
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621486221.5U
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Chinese (zh)
Inventor
张东锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Printed Circuit Board Co Ltd
Original Assignee
Digital Printed Circuit Board Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Printed Circuit Board Co Ltd filed Critical Digital Printed Circuit Board Co Ltd
Priority to CN201621486221.5U priority Critical patent/CN206365138U/en
Application granted granted Critical
Publication of CN206365138U publication Critical patent/CN206365138U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model is related to printed-board technology field, in particular a kind of high frequency printed circuit board with ceramic heat sink, including circuit board body, the peripheral surface of the circuit board body is provided with some grooves one, the high frequency printed circuit board with ceramic heat sink sets multiple grooves one in circuit board body peripheral surface, heat dissipating ring is set in groove one, radiating to circuit board surface component is realized by heat dissipating ring, groove three is set inside circuit board body, multiple heat sinks are set in groove three, the heat transfer block connected with heat dissipating ring is respectively provided with above and below heat sink, internal heat is transferred to heat dissipating ring by realization, accelerate internal heat dissipating, heat transfer block is connected between heat sink, the heat conduction copper sheet contacted with the external world connected by heat sink both sides, further realize and internal heat is distributed, and heat dissipating ring, heat sink and heat transfer block use ceramic heat emission material, realize the high efficiency and heat radiation to circuit board.

Description

A kind of high frequency printed circuit board with ceramic heat sink
Technical field
The utility model is related to printed-board technology field, specially a kind of high frequency printing electricity with ceramic heat sink Road plate.
Background technology
High frequency printed circuit board, as one kind of printed circuit board (PCB), is that one kind meets the tendency of extensive printed circuit board (PCB), this electricity Road plate is when work, and the various electrical components that circuit board surface is installed can give out amount of heat, because circuit board is general All it is arranged on inside electrical part, so the heat that circuit board operationally gives out is difficult to distribute, the savings meeting pair of heat The operating efficiency and service life of circuit board can all produce considerable influence, in consideration of it, it is proposed that a kind of carry ceramic heat sink High frequency printed circuit board.
Utility model content
The purpose of this utility model is to provide a kind of high frequency printed circuit board with ceramic heat sink, above-mentioned to solve The problem of being proposed in background technology.The features such as high frequency printed circuit board with ceramic heat sink has high efficiency and heat radiation.
To achieve the above object, the utility model provides following technical scheme:
Outside a kind of high frequency printed circuit board with ceramic heat sink, including circuit board body, the circuit board body Surface is enclosed provided with some grooves one, is equipped with heat dissipating ring in the groove one, the left and right sides of the circuit board body are all provided with Fluted two, the groove two is connected with groove three, and the groove three is set inside circuit board body in the groove three There are some heat sinks, the upper and lower surface of the heat sink is respectively connected with heat transfer block one, the top of the heat transfer block one is respectively positioned on recessed In groove one, and heat transfer block one is in contact with heat dissipating ring, and heat transfer block two is respectively connected between two neighboring heat sink, and positioned at most The heat sink of both sides is connected with heat conduction copper billet, and penetration pipe, the level of the penetration pipe are provided with inside the circuit board body Section is respectively positioned in groove three.
It is preferred that, the cross section of the heat dissipating ring is rectangular, and the height of heat dissipating ring and the height of circuit board body are equal.
It is preferred that, the groove one is linearly spaced substantially equidistant at least provided with three, and groove one is in a ring, is surround and is set In the peripheral surface of circuit board body.
It is preferred that, the heat sink is linearly spaced substantially equidistant at least provided with three, and each heat sink and each groove It is corresponding between one.
It is preferred that, the heat conduction copper billet cross section is T-shaped, and the horizontal segment of the heat conduction copper billet of T-shaped is located in groove two, vertically Section is located at the both sides periphery of circuit board body.
Compared with prior art, the beneficial effects of the utility model are:This carries the high frequency printed circuit of ceramic heat sink Plate sets multiple grooves one in circuit board body peripheral surface, and heat dissipating ring is set in groove one, is realized by heat dissipating ring to electricity The radiating of road plate surface component, sets groove three inside circuit board body, and multiple heat sinks are set in groove three, is dissipating The heat transfer block connected with heat dissipating ring is respectively provided with above and below hot plate, realizes and internal heat is transferred to heat dissipating ring, accelerates internal heat dissipating, Heat transfer block is connected between heat sink, the heat conduction copper sheet contacted with the external world connected by heat sink both sides is further realized internal Portion's heat is distributed, and heat dissipating ring, heat sink and heat transfer block use ceramic heat emission material, realizes efficiently dissipating to circuit board Heat.
Brief description of the drawings
Fig. 1 is the utility model front view;
Fig. 2 is the utility model internal view.
In figure:1 circuit board body, 2 grooves one, 3 heat dissipating rings, 4 grooves two, 5 grooves three, 6 heat sinks, 7 heat transfer blocks one, 8 Heat transfer block two, 9 heat conduction copper billets, 10 penetration pipes.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme:
A kind of high frequency printed circuit board with ceramic heat sink, including circuit board body 1, the periphery of circuit board body 1 Surface is provided with some grooves 1, and groove 1 is linearly spaced substantially equidistant at least provided with three, and groove 1 is in a ring, surround Located at the peripheral surface of circuit board body 1, heat dissipating ring 3 is equipped with groove 1, the cross section of heat dissipating ring 3 is rectangular, and radiating The height of ring 3 and the height of circuit board body 1 are equal, and heat dissipating ring 3 is made of the ceramic material of insulation, and heat dissipating ring 3 can be realized The electrical component on the surface of circuit board body 1 is radiated, the left and right sides of circuit board body 1 are all provided with fluted 24, groove 24 are connected with groove 35, and groove 35 is provided with some heat sinks 6, heat sink inside circuit board body 1 in groove 35 6, at least provided with three, are linearly spaced substantially equidistant, and corresponding between each heat sink 6 and each groove 1, and heat sink 6 is adopted It is made of the ceramic material of insulation, the upper and lower surface of heat sink 6 is respectively connected with heat transfer block 1, and the top of heat transfer block 1 is respectively positioned on In groove 1, and heat transfer block 1 is in contact with heat dissipating ring 3, is passed the heat inside circuit board body 1 by heat transfer block 1 It is directed on heat dissipating ring 3, realization is distributed to internal heat, and heat transfer block 28 is respectively connected between two neighboring heat sink 6, conducts heat Block 1 and heat transfer block 28 using insulation ceramic material be made, and positioned at most both sides heat sink 6 and the phase of heat conduction copper billet 9 Connection, the cross section of heat conduction copper billet 9 is T-shaped, and the horizontal segment of the heat conduction copper billet 9 of T-shaped is located in groove 24, and vertical section is located at circuit The both sides periphery of plate body 1, is connected each heat sink 6 by heat transfer block 28, and internal heat is conducted to heat conduction Copper billet 9, is distributed heat into extraneous air by heat conduction copper billet 9, and the inside of circuit board body 1 is provided with penetration pipe 10, penetration pipe 10 horizontal segment is respectively positioned in groove 35, and the heat that the circuit inside penetration pipe 10 is produced is distributed to groove 35, by dissipating Hot plate 6 distributes heat.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art, It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of high frequency printed circuit board with ceramic heat sink, including circuit board body (1), it is characterised in that:The electricity The peripheral surface of road plate body (1) is provided with some grooves one (2), the groove one (2) and is equipped with heat dissipating ring (3), the electricity The left and right sides of road plate body (1) are all provided with fluted two (4), and the groove two (4) is connected with groove three (5), described recessed Groove three (5) is internal located at circuit board body (1), and some heat sinks (6) are provided with the groove three (5), the heat sink (6) Upper and lower surface is respectively connected with heat transfer block one (7), and the top of the heat transfer block one (7) is respectively positioned in groove one (2), and heat transfer block one (7) it is in contact with heat dissipating ring (3), heat transfer block two (8) is respectively connected between two neighboring heat sink (6), and positioned at most both sides Heat sink (6) be connected with heat conduction copper billet (9), penetration pipe (10), the threading are provided with inside the circuit board body (1) The horizontal segment of pipe (10) is respectively positioned in groove three (5).
2. a kind of high frequency printed circuit board with ceramic heat sink according to claim 1, it is characterised in that:It is described to dissipate The cross section of hot ring (3) is rectangular, and the height of heat dissipating ring (3) and the height of circuit board body (1) are equal.
3. a kind of high frequency printed circuit board with ceramic heat sink according to claim 1, it is characterised in that:It is described recessed Groove one (2) is linearly spaced substantially equidistant at least provided with three, and groove one (2) is in a ring, around located at circuit board body (1) Peripheral surface.
4. a kind of high frequency printed circuit board with ceramic heat sink according to claim 1, it is characterised in that:It is described to dissipate Hot plate (6) is linearly spaced substantially equidistant at least provided with three, and each relative between heat sink (6) and each groove one (2) Should.
5. a kind of high frequency printed circuit board with ceramic heat sink according to claim 1, it is characterised in that:It is described to lead Hot copper billet (9) cross section is T-shaped, and the horizontal segment of the heat conduction copper billet (9) of T-shaped is located in groove two (4), and vertical section is located at circuit board The both sides periphery of body (1).
CN201621486221.5U 2016-12-31 2016-12-31 A kind of high frequency printed circuit board with ceramic heat sink Expired - Fee Related CN206365138U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621486221.5U CN206365138U (en) 2016-12-31 2016-12-31 A kind of high frequency printed circuit board with ceramic heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621486221.5U CN206365138U (en) 2016-12-31 2016-12-31 A kind of high frequency printed circuit board with ceramic heat sink

Publications (1)

Publication Number Publication Date
CN206365138U true CN206365138U (en) 2017-07-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621486221.5U Expired - Fee Related CN206365138U (en) 2016-12-31 2016-12-31 A kind of high frequency printed circuit board with ceramic heat sink

Country Status (1)

Country Link
CN (1) CN206365138U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111683475A (en) * 2020-06-29 2020-09-18 四川海英电子科技有限公司 Production method of composite high-frequency circuit board
CN113428519A (en) * 2021-08-09 2021-09-24 浙江宝立普自动化设备制造有限公司 Socks finished product strorage device for hosiery machine that dampproofing is effectual

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111683475A (en) * 2020-06-29 2020-09-18 四川海英电子科技有限公司 Production method of composite high-frequency circuit board
CN113428519A (en) * 2021-08-09 2021-09-24 浙江宝立普自动化设备制造有限公司 Socks finished product strorage device for hosiery machine that dampproofing is effectual

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170728

Termination date: 20191231

CF01 Termination of patent right due to non-payment of annual fee