CN206365138U - A high-frequency printed circuit board with a ceramic radiator - Google Patents

Abstract

The utility model relates to the technical field of printed circuit boards, in particular to a high-frequency printed circuit board with a ceramic radiator, which comprises a circuit board body, wherein the peripheral surface of the circuit board body is provided with a plurality of first grooves, the first grooves are internally provided with a radiating ring, the radiating of surface components of the circuit board is realized through the radiating ring, the third grooves are arranged inside the circuit board body, a plurality of radiating plates are arranged inside the third grooves, heat transfer blocks connected with the radiating ring are arranged above and below the radiating plates, the internal heat is transferred to the radiating ring, the internal heat radiation is accelerated, the heat transfer blocks are connected between the radiating plates, heat conductive copper sheets which are connected with the two sides of the radiating plates and are in contact with the outside are used for further realizing the radiation of the internal heat, and the radiating ring, the radiating plates and the, the circuit board is efficiently cooled.

Description

A high-frequency printed circuit board with a ceramic radiator

technical field

The utility model relates to the technical field of printed circuit boards, in particular to a high-frequency printed circuit board with a ceramic radiator.

Background technique

As a kind of printed circuit board, high-frequency printed circuit board is a widely used printed circuit board. When this kind of circuit board is working, various electrical components mounted on the surface of the circuit board will emit a lot of heat. The circuit board is generally installed inside the electrical device, so it is difficult to dissipate the heat emitted by the circuit board when it is working. The heat accumulation will have a great impact on the working efficiency and service life of the circuit board. In view of this, we propose a High frequency printed circuit board with ceramic heat sink.

Utility model content

The purpose of this utility model is to provide a high-frequency printed circuit board with a ceramic heat sink to solve the problems raised in the above-mentioned background technology. The high-frequency printed circuit board with a ceramic heat sink has the characteristics of high-efficiency heat dissipation and the like.

In order to achieve the above object, the utility model provides the following technical solutions:

A high-frequency printed circuit board with a ceramic heat sink, including a circuit board body, a plurality of grooves 1 are provided on the peripheral surface of the circuit board body, and heat dissipation rings are arranged in the grooves 1, and the circuit board The left and right sides of the body are provided with two grooves, the two grooves communicate with the three grooves, the three grooves are arranged inside the circuit board body, and a number of cooling plates are arranged inside the three grooves. The upper and lower sides of the heat dissipation plate are connected with a heat transfer block 1, the top of the heat transfer block 1 is located in the groove 1, and the heat transfer block 1 is in contact with the heat dissipation ring, and the adjacent two heat dissipation plates are connected. There is heat transfer block 2, and the cooling plates located on both sides are connected to the heat conduction copper block, and the inside of the circuit board body is provided with threading pipes, and the horizontal sections of the threading pipes are all located in grooves 3.

Preferably, the heat dissipation ring has a rectangular cross section, and the height of the heat dissipation ring is equal to the height of the circuit board body.

Preferably, there are at least three grooves arranged linearly and equidistantly, and the grooves are ring-shaped and arranged around the peripheral surface of the circuit board body.

Preferably, there are at least three heat dissipation plates arranged in a linear equidistant manner, and each heat dissipation plate corresponds to each groove.

Preferably, the cross-section of the heat-conducting copper block is T-shaped, the horizontal section of the T-shaped heat-conducting copper block is located in the second groove, and the vertical section is located on the periphery of both sides of the circuit board body.

Compared with the prior art, the beneficial effect of the utility model is that: the high-frequency printed circuit board with a ceramic heat sink is provided with a plurality of grooves one on the peripheral surface of the circuit board body, and a cooling ring is arranged in the groove one, through The heat dissipation ring realizes the heat dissipation of the components on the surface of the circuit board. A groove three is arranged inside the circuit board body, and a plurality of heat dissipation plates are arranged in the groove three. The internal heat is transferred to the heat dissipation ring to speed up the internal heat dissipation. The heat transfer block is connected between the heat dissipation plates, and the heat conduction copper sheets connected to the outside are connected on both sides of the heat dissipation plate to further dissipate the internal heat. The heat dissipation ring and the heat dissipation plate Both the heat dissipation block and the heat transfer block use ceramic heat dissipation materials to achieve efficient heat dissipation for the circuit board.

Description of drawings

Fig. 1 is a front view of the utility model;

Fig. 2 is an internal sectional view of the utility model.

In the figure: 1 circuit board body, 2 groove 1, 3 heat dissipation ring, 4 groove 2, 5 groove 3, 6 heat dissipation plate, 7 heat transfer block 1, 8 heat transfer block 2, 9 heat conduction copper block, 10 threading Tube.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Figure 1-2, the utility model provides a technical solution:

A high-frequency printed circuit board with a ceramic heat sink, comprising a circuit board body 1, a plurality of grooves 1 and 2 are provided on the peripheral surface of the circuit board body 1, and at least three grooves 1 and 2 are arranged linearly and equidistantly. And the groove one 2 is ring-shaped, surrounds and is arranged on the peripheral surface of the circuit board body 1, and the heat dissipation ring 3 is arranged in the groove one 2, and the cross section of the heat dissipation ring 3 is rectangular, and the height of the heat dissipation ring 3 is the same as that of the circuit board body. The heights of 1 are equal, and the heat dissipation ring 3 is made of insulating ceramic material. The heat dissipation ring 3 can realize the heat dissipation of the electric components on the surface of the circuit board body 1. The left and right sides of the circuit board body 1 are provided with grooves 24, Groove 2 4 and groove 3 5 are connected. Groove 3 5 is arranged inside the circuit board body 1. There are several heat dissipation plates 6 in groove 3 5. At least three heat dissipation plates 6 are arranged linearly and equidistantly. And each cooling plate 6 corresponds to each groove-2, the cooling plate 6 is made of insulating ceramic material, the upper and lower sides of the cooling plate 6 are connected with a heat transfer block-7, and the heat transfer block-7 The top ends are located in the groove 2, and the heat transfer block 7 is in contact with the heat dissipation ring 3, and the heat inside the circuit board body 1 is transferred to the heat dissipation ring 3 through the heat transfer block 7 to realize the dissipation of internal heat , heat transfer block 2 8 is connected between two adjacent heat sink plates 6, heat transfer block 1 7 and heat transfer block 2 8 are made of insulating ceramic materials, and the heat sink plates 6 located on the most two sides are both The heat-conducting copper blocks 9 are connected, and the cross-section of the heat-conducting copper blocks 9 is T-shaped. The horizontal section of the T-shaped heat-conducting copper block 9 is located in the groove 2 4, and the vertical section is located on both sides of the circuit board body 1. Block 2 8 connects each cooling plate 6, and conducts the internal heat to the heat-conducting copper block 9, and dissipates heat to the outside air through the heat-conducting copper block 9. The inside of the circuit board body 1 is provided with a threading pipe 10, and the threading pipe The horizontal sections of 10 are all located in the third groove 5, and the heat generated by the line inside the threading pipe 10 is dissipated into the third groove 5, and the heat is dissipated by the cooling plate 6.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (5)

1. A high-frequency printed circuit board with a ceramic heat sink, comprising a circuit board body (1), is characterized in that: the peripheral surface of the circuit board body (1) is provided with some grooves one (2), so A cooling ring (3) is provided in the groove one (2), and a groove two (4) is arranged on the left and right sides of the circuit board body (1), and the groove two (4) and the groove The three (5) are connected, the groove three (5) is arranged inside the circuit board body (1), and the groove three (5) is provided with a plurality of cooling plates (6), and the cooling plate (6) The upper and lower sides of the upper and lower sides are connected with a heat transfer block one (7), the top of the heat transfer block one (7) is located in the groove one (2), and the heat transfer block one (7) is connected with the heat dissipation ring (3) In contact with each other, two heat transfer blocks (8) are connected between adjacent two heat sink plates (6), and the heat sink plates (6) located on the most two sides are all connected with heat conduction copper blocks (9), and the circuit A threading pipe (10) is arranged inside the board body (1), and the horizontal sections of the threading pipe (10) are all located in the groove three (5). 2. A kind of high-frequency printed circuit board with ceramic radiator according to claim 1, characterized in that: the cross section of the heat dissipation ring (3) is rectangular, and the height of the heat dissipation ring (3) and the circuit The plate bodies (1) are equal in height. 3. A high-frequency printed circuit board with a ceramic heat sink according to claim 1, characterized in that: said groove one (2) is provided with at least three, arranged in a linear equidistant manner, and groove one (2) (2) is in the shape of a ring, surrounding the peripheral surface of the circuit board body (1). 4. A kind of high-frequency printed circuit board with a ceramic heat sink according to claim 1, characterized in that: said heat dissipation plate (6) is provided with at least three, arranged in a linear equidistant manner, and each heat dissipation plate Correspond between (6) and each groove one (2). 5. A high-frequency printed circuit board with a ceramic heat sink according to claim 1, characterized in that: the cross-section of the heat-conducting copper block (9) is T-shaped, and the T-shaped heat-conducting copper block (9) The horizontal section is located in the groove two (4), and the vertical section is located on both sides of the circuit board body (1).