CN202435711U - PCB (printed circuit board) and electronic component comprising same - Google Patents
PCB (printed circuit board) and electronic component comprising same Download PDFInfo
- Publication number
- CN202435711U CN202435711U CN2011205668285U CN201120566828U CN202435711U CN 202435711 U CN202435711 U CN 202435711U CN 2011205668285 U CN2011205668285 U CN 2011205668285U CN 201120566828 U CN201120566828 U CN 201120566828U CN 202435711 U CN202435711 U CN 202435711U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- circuit
- circuit layer
- layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model is applicable to the field of electronic components and provides a PCB (printed circuit board) and an electronic component comprising the same. The PCB comprises a substrate layer capable of radiating and a plurality of circuit layers stacked onto the substrate layer, an insulating dielectric layer capable of radiating is arranged between each two adjacent circuit layers, and each circuit layer is electrically connected with other circuit layers through connectors capable of conducting electricity and heat. In the PCB, the dielectric layers have the insulation, heat conduction and radiating functions, the connectors have the electric conduction and heat conduction functions, and each circuit layer is electrically connected with other circuit layers through the connectors, so that intricate radiating channels are formed, heat generated by a chip and the circuit layers can be partially radiated through the dielectric layers, and most heat can be smoothly conducted to the substrate layer through the numerous radiating channels to be radiated. Compared with a traditional PCB, the PCB is high in integration degree, excellent in radiating effect and beneficial to miniature design of electronic products.
Description
Technical field
The utility model belongs to the electronic devices and components field, relates in particular to a kind of pcb board and comprises the electronic devices and components of this pcb board.
Background technology
The development trend of electronic product is high-performance and miniaturization, and this has just proposed corresponding requirement to the pcb board as the electronic devices and components supporter, requires the size of pcb board as far as possible little, integrated level is higher.Load the more functions of chip simultaneously along with electronic devices and components; The power of chip is increasing; The heat that on pcb board, is produced is more and more; If these heats can not in time be discharged, can cause semiconductor chip Yin Wendu too high and lost efficacy even damage, so pcb board should have good heat conduction and heat radiation performance again.Prior art is for realizing the miniaturization demand, and common way is to adopt organic material that pcb board is made sandwich construction, but traditional multi-layer PCB board non-refractory, and radiating effect is not good; For realizing good heat-resisting heat dispersion, common way is to select aluminum oxide substrate manufacturing PCB plate for use, but such pcb board can only plane routing, can't make sandwich construction, can not satisfy the requirement of high integration.
The utility model content
The purpose of the utility model is to provide a kind of pcb board, and existing higher integrated level can have good performance of heat dissipation again.
The utility model is to realize like this; A kind of pcb board; Comprise that the basalis and the lamination that can dispel the heat be located at a plurality of circuit layers on the said basalis; The dielectric layer that is provided with insulation between the adjacent circuit layer and can dispels the heat, but each circuit layer all is electrically connected through each circuit layer of connector and other of conductive and heat-conductive.
Another purpose of the utility model is to provide a kind of electronic devices and components, comprises pcb board and is arranged at the semiconductor chip on the said pcb board, and said pcb board adopts above-mentioned pcb board.
In the described pcb board of the utility model; Dielectric layer has the function of insulation and heat radiation simultaneously; Connector has the function of conduction and heat conduction simultaneously, and each circuit layer all is connected through each circuit layer of connector and other, and then has formed complicated heat dissipation channel; The heat that chip and circuit layer produce can distribute a part through dielectric layer, and most of heat can conduct to basalis smoothly through numerous heat dissipation channels and distribute.Therefore, the pcb board that the utility model provides is compared with traditional multi-layer PCB board, and its better heat-radiation effect is compared with traditional aluminum oxide substrate, and its integrated degree is high, more helps the miniaturization Design of electronic product.
Description of drawings
Fig. 1 is the cross-sectional view of the pcb board that provides of the utility model embodiment.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 1 shows the structural representation of the pcb board that present embodiment provides; This pcb board comprises that the basalis and the lamination that can dispel the heat be located at a plurality of circuit layers on the said basalis; The dielectric layer that is provided with insulation between the adjacent circuit layer and can dispels the heat, but each circuit layer all is electrically connected through each circuit layer of connector and other of conductive and heat-conductive.The circuit layer that is appreciated that top layer can be provided with the several semiconductor chip.Specifically with reference to figure 1, on basalis 101, be disposed with first circuit layer 102, first dielectric layer 103, second circuit layer 104, second dielectric layer 105, tertiary circuit layer 106, the 3rd dielectric layer 107 and the 4th circuit layer 108.Wherein, first circuit layer 102 with second and third, four circuit layers are electrically connected through one first connector 109 respectively; Second circuit layer 104 is electrically connected through one second connector 110 respectively with third and fourth circuit layer; Tertiary circuit layer 106 is electrically connected with the 4th circuit layer 108 through one the 3rd connector 111; Like this, any two circuit layers all are electrically connected through connector.In this pcb board structure, but since all heat conduction of each dielectric layer and each connector, heat radiation, the heat that the chip on the 4th circuit layer 108 produces; A part distributes through the 3rd dielectric layer 107 of below; The heat that does not distribute can continue to conduct to second dielectric layer 105 downwards, and another part heat can conduct to second dielectric layer 105 downwards through the 3rd connector 111, continues then to conduct downwards through second dielectric layer 105 and second connector 110; Equally; The heat that the circuit of every layer of circuit layer produces also distributes through dielectric layer and connector or conducts, and the most most of heat conducts to basalis, is dispersed into the external world by basalis.
In the described pcb board of present embodiment, dielectric layer not only plays the effect of insulation, also has the heat conduction and heat radiation function; Connector not only can make the line conduction of two circuit layers; But also heat conduction, and each circuit layer all is connected through each circuit layer of connector and other, has formed complicated heat dissipation channel; The heat that chip and circuit layer produce can distribute a part through dielectric layer, and most of heat can conduct to basalis smoothly through numerous heat dissipation channels and distribute.Therefore, the pcb board that present embodiment provides is compared with traditional multi-layer PCB board, and its radiating effect is better, compares with traditional aluminum oxide substrate, and its integrated degree is higher, more helps miniaturization Design.Therefore this pcb board has had excellent radiation performance and the high advantage of integrated degree simultaneously.
The quantity that is appreciated that circuit layer and the dielectric layer of this pcb board does not have strict restriction, specifically appropriate design according to actual needs.
In the present embodiment, can also pad 112 be set in the bottom of basalis 101, be used for pcb board is fixedly welded on the position of setting.This pad 112 specifically can adopt easy welding and good palladium, the ag material of thermal conductivity to process.Further, the thickness of pad 112 can be 10～40 μ m, specifically can be 25 μ m.
In the present embodiment, each circuit layer all can be provided with a plurality of circuit junction (not shown)s, be used for being connected with other circuit layers, the two ends of each connector all with two different circuit layers on circuit junction link to each other, make the line conduction of these two circuit layers.Present embodiment can also be through changing circuit junction size to reach the different radiating effect.
Further; Present embodiment can carry out appropriate design to the thickness of circuit layer and dielectric layer, makes the radiating effect of pcb board better, changes its resistance value through the thickness that changes circuit layer; And then the change caloric value, change its radiating effect through the thickness that changes dielectric layer.Concrete, the thickness of each circuit layer can be 10～40 μ m, the thickness of each dielectric layer can be 50～300 μ m.Further, when the thickness of each circuit layer is 25 μ m, when the thickness of each dielectric layer was 240 μ m, the radiating effect of whole pcb board was preferable.
Further, the thickness of basalis 101 can be 400～1000 μ m, specifically can be 600 μ m, better heat-radiation effect and can waste material.
The design of above-mentioned thickness about dielectric layer, circuit layer and basalis is fit to have the pcb board of any amount circuit layer and dielectric layer, but is particularly suitable for having the pcb board of four layers of circuit layer and three layers of dielectric layer.
In the present embodiment, better for the radiating effect that makes pcb board, basalis 101 can be processed through casting technique by the ceramic material than low-k.
It should be noted that: Fig. 1 only shows the PCB structure with four layers of circuit layer; And should be appreciated that the pcb board that common electronic product uses all is extremely small, when making, make bulk PCB substrate usually earlier; Then bulk PCB substrate is cut into the small-sized pcb board that several can directly use; Therefore only be a PCB unit of bulk PCB substrate shown in Fig. 1, i.e. the profile of a small-sized pcb board, and monoblock PCB substrate includes a plurality of PCB unit.Therefore the bulk PCB substrate that also should be appreciated that not process cutting is also in protection scope of the present invention.
The pcb board that the utility model provides has good heat dispersion and higher integrated level, is particularly suitable in the various electronic products.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.
Claims (10)
1. pcb board; It is characterized in that; Comprise that the basalis and the lamination that can dispel the heat be located at a plurality of circuit layers on the said basalis; The dielectric layer that is provided with insulation between each adjacent circuit layer and can dispels the heat, but each circuit layer all is electrically connected through each circuit layer of connector and other of conductive and heat-conductive.
2. pcb board as claimed in claim 1 is characterized in that, said circuit layer comprises first circuit layer, second circuit layer, tertiary circuit layer and the 4th circuit layer; Be provided with first dielectric layer between said first circuit layer and the second circuit layer, be provided with second dielectric layer between said second circuit layer and the tertiary circuit layer, be provided with the 3rd dielectric layer between said tertiary circuit layer and the 4th circuit layer.
3. pcb board as claimed in claim 1 is characterized in that, said each circuit layer is equipped with a plurality of circuit junctions, and the two ends of said each connector are connected with the circuit junction of different two circuit layers respectively.
4. like each described pcb board of claim 1 to 3, it is characterized in that the thickness of said each circuit layer is 10～40 μ m; The thickness of said each dielectric layer is 50～300 μ m.
5. pcb board as claimed in claim 4 is characterized in that, the thickness of said each circuit layer is 25 μ m; The thickness of said each dielectric layer is 240 μ m.
6. like each described pcb board of claim 1 to 3, it is characterized in that the thickness of said basalis is 400～1000 μ m.
7. pcb board as claimed in claim 6 is characterized in that, the thickness of said basalis is 600 μ m.
8. like each described pcb board of claim 1 to 3, it is characterized in that the lower surface of said basalis is provided with pad, the thickness of said pad is 10～40 μ m.
9. pcb board as claimed in claim 8 is characterized in that, the thickness of said pad is 25 μ m.
10. electronic devices and components comprise pcb board and are arranged at the semiconductor chip on the said pcb board, it is characterized in that, said pcb board adopts each described pcb board of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205668285U CN202435711U (en) | 2011-12-30 | 2011-12-30 | PCB (printed circuit board) and electronic component comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205668285U CN202435711U (en) | 2011-12-30 | 2011-12-30 | PCB (printed circuit board) and electronic component comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202435711U true CN202435711U (en) | 2012-09-12 |
Family
ID=46785112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205668285U Expired - Lifetime CN202435711U (en) | 2011-12-30 | 2011-12-30 | PCB (printed circuit board) and electronic component comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202435711U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188862A (en) * | 2011-12-30 | 2013-07-03 | 深圳振华富电子有限公司 | Printed circuit board (PCB) and manufacturing method thereof and electronic component |
-
2011
- 2011-12-30 CN CN2011205668285U patent/CN202435711U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188862A (en) * | 2011-12-30 | 2013-07-03 | 深圳振华富电子有限公司 | Printed circuit board (PCB) and manufacturing method thereof and electronic component |
| CN103188862B (en) * | 2011-12-30 | 2015-11-04 | 深圳振华富电子有限公司 | A kind of pcb board and preparation method thereof and electronic devices and components |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7808788B2 (en) | Multi-layer electrically isolated thermal conduction structure for a circuit board assembly | |
| CN204859861U (en) | Module power source | |
| WO2008123766A3 (en) | High thermal-efficient metal core printed circuit board with selective electrical and thermal circuitry connectivity | |
| CN105723508B (en) | Semiconductor module | |
| KR102253473B1 (en) | Circuit board | |
| CN201263276Y (en) | Heat conducting pad and electronic device containing the same | |
| CN204243028U (en) | Electronic system | |
| WO2014121878A1 (en) | Circuit board | |
| CN104135816B (en) | Aluminum-based copper-clad plate and preparation method thereof, circuit electronic circuit board | |
| CN104854965B (en) | Component carrier and component carrier device | |
| CN202444696U (en) | High-thermal conductivity combined circuit board | |
| CN103188862B (en) | A kind of pcb board and preparation method thereof and electronic devices and components | |
| CN202435711U (en) | PCB (printed circuit board) and electronic component comprising same | |
| US9257358B2 (en) | Chip stacking packaging structure | |
| KR102194720B1 (en) | Circuit Board including the heat dissipation structure | |
| CN203618217U (en) | Radiating printed circuit board and circuit board | |
| TW200618726A (en) | Power module and electric transportation apparatus incorporating the same | |
| CN202524652U (en) | Combined circuit board with high heat conductivity | |
| CN202385400U (en) | Novel high-efficiency automatic-radiating PCB (printed circuit board) | |
| CN207283915U (en) | A kind of wiring board of perfect heat-dissipating | |
| CN208434206U (en) | Multilayer power device stack structure | |
| CN207692149U (en) | A kind of multi-layer PCB board with conductive structure | |
| CN202889772U (en) | Heat radiation structure of circuit component | |
| CN202034362U (en) | Composite substrate for high-power element | |
| CN210075681U (en) | Copper-clad aluminum substrate with double copper layers and high-efficiency heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120912 |
|
| CX01 | Expiry of patent term |