CN202034362U - Composite substrate for high-power element - Google Patents
Composite substrate for high-power element Download PDFInfo
- Publication number
- CN202034362U CN202034362U CN 201120129798 CN201120129798U CN202034362U CN 202034362 U CN202034362 U CN 202034362U CN 201120129798 CN201120129798 CN 201120129798 CN 201120129798 U CN201120129798 U CN 201120129798U CN 202034362 U CN202034362 U CN 202034362U
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- CN
- China
- Prior art keywords
- substrate
- ceramic substrate
- high performance
- performance components
- cavity
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a composite substrate for a high-power element, which comprises a metal substrate and a ceramic substrate. A first cavity is arranged on the metal substrate, the ceramic substrate is mounted in the first cavity, the high-power element is mounted on the ceramic substrate and is directly connected with a circuit of the metal substrate by a metal connecting wire, and current cannot flow through the bottom of the ceramic substrate. The composite substrate for the high-power element has the advantages of fine effect, thermoelectric separation and low cost. The ceramic substrate provided with the high-power element is mounted on the metal substrate, and when the high-power element works, generated heat is transferred to the metal substrate by the ceramic substrate. In addition, under the condition of identical heat transfer efficiency, the ceramic substrate is smaller in size and lower in cost, and accordingly economic benefit is increased to a certain degree.
Description
Technical field
The utility model relates to a kind of metal substrate, is specifically related to a kind of combined type high performance components substrate.
Background technology
In electronics industry, common powerful communication road plate or high-power LED light source carry out can producing a large amount of heat under the operate as normal, if these heats are untimely being discharged in the environment, can cause the rising of electronic devices and components temperature, influence its operate as normal, sometimes in addition the damage.
At present, in order to reach better heat radiating effect, usually the substrate that utilizes is ceramic substrate or metal substrate, metal substrate must be provided with a layer insulating between itself and the wiring board in when utilization, guarantee the isolation of circuit, and the conductive coefficient of this insulating barrier is lower, causes the heat dispersion of whole metal substrate to descend; Yet the employing ceramic substrate, radiating effect is better, but cost is higher, and can not realize thermoelectric the separation.
Therefore, a kind of heat conductivility is better and cost is lower, and the combined type high performance components that has thermoelectric separation advantage is again demanded urgently proposing with substrate.
The utility model content
For solving the problems of the technologies described above, the purpose of this utility model be to provide a kind of heat conductivility better and cost lower, the combined type high performance components substrate that has thermoelectric separation advantage again.
For achieving the above object, the technical solution of the utility model is as follows: a kind of combined type high performance components substrate, comprise metal substrate and ceramic substrate, and offer first cavity on the described metal substrate, described ceramic substrate is installed in described first cavity;
Be equiped with high performance components on the described ceramic substrate, described high performance components directly is connected with the metal substrate circuit by metal connecting line, and electric current can be through the ceramic substrate bottom.
Preferably, the upper surface of described metal substrate is provided with insulating barrier.
Preferably, described insulating barrier is provided with the terminals that connect lead-in wire.
Preferably, described ceramic substrate and described first cavity are complementary.
Preferably, offer second cavity on the described ceramic substrate, described high performance components is installed in described second cavity.
Pass through technique scheme, the beneficial effect of technical solutions of the utility model is: a kind of combined type high performance components substrate, comprise metal substrate and ceramic substrate, offer first cavity on the described metal substrate, described ceramic substrate is installed in described first cavity; Be equiped with high performance components on the described ceramic substrate, described high performance components directly is connected with the metal substrate circuit by metal connecting line, and electric current can be through the ceramic substrate bottom; The combined type high performance components substrate that adopts the utility model to provide had both had effective, thermoelectric advantage of separating, and had advantage cheaply again; To the ceramic substrate of high performance components be housed, be installed on the described metal substrate, when high performance components is worked, the heat that described ceramic substrate will produce is passed to described metal substrate (centre does not have the intervention of insulating barrier), under the condition of identical heat transfer efficiency, the ceramic substrate volume that the utility model adopted is less, and cost is lower, has improved economic benefit to a certain extent.
In addition, adopt described combined type high performance components substrate, components and parts are electrically connected with terminals from the top of ceramic substrate, the heat that produces is dispelled the heat from the below of ceramic substrate, the heat of output is transmitted on the metal substrate again, further dispels the heat, and electricity is drawn from the top of ceramic substrate, heat is drawn from the below of ceramic substrate, thereby has realized thermoelectric separation.
Description of drawings
In order to be illustrated more clearly in the technical scheme among the utility model embodiment, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the profile of a kind of separated type metal substrate of the utility model embodiment 1;
Fig. 2 is the profile of a kind of separated type metal substrate of the utility model embodiment 2.
The represented corresponding component title of numeral among the figure:
1. metal substrate 2. ceramic substrates 3. insulating barriers 4. terminals 5. first cavitys 6. high performance components
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
The utility model provide a kind of heat conductivility better and cost lower, the combined type high performance components substrate that has thermoelectric separation advantage again.
As shown in Figure 1, a kind of combined type high performance components substrate, comprise metal substrate 1 and ceramic substrate 2, offer first cavity 5 on the described metal substrate 1, described ceramic substrate 2 is installed in described first cavity 5, and described ceramic substrate 2 is complementary with described first cavity 5, is equiped with high performance components 6 on the described ceramic substrate 2, described high performance components 6 directly is connected with the metal substrate circuit by metal connecting line, and electric current can be through the ceramic substrate bottom.
Offer the second cavity (not shown) on the described ceramic substrate 2, described high performance components 6 is installed in described second cavity.
Its operation principle is: the ceramic substrate 2 that will be provided with high performance components 6, be installed in first cavity 5 on the described metal substrate 1, when high performance components 6 work, ceramic substrate 2 sheds a large amount of heat that high performance components 6 produces, because ceramic substrate 2 is arranged in described first cavity 5, under the condition of identical heat transfer efficiency, ceramic substrate 2 volumes that the utility model adopted are less, cost is lower, has improved economic benefit to a certain extent; Simultaneously; ceramic substrate 2 increases with described metal substrate 1 contacted area, is then increased by the area of ceramic substrate 2 to metal substrate 1 heat radiation, and ceramic substrate 2 distributes the heat that high performance components 6 produces rapidly by metal substrate 1; thereby improved radiating efficiency, protected components and parts.
The shape of the ceramic substrate 2 in the present embodiment can also be taper for prismatic, cylinder, and concrete execution mode is determined on a case-by-case basis, and to this, the utility model is not done any qualification, can realize the utility model.
Technical scheme by present embodiment, except the combined type high performance components is reached better, the lower-cost purpose of heat conductivility with substrate, high performance components 6 is electrically connected with terminals from the top of ceramic substrate 2, the heat that produces is dispelled the heat from the below of ceramic substrate 2, the heat of output is transmitted on the metal substrate 1 again, further dispels the heat, and electricity is drawn from the top of described ceramic substrate 2, heat is drawn from the below of described ceramic substrate 2, thereby has realized thermoelectric separation.
Adopt the beneficial effect of the foregoing description technical scheme to be: a kind of combined type high performance components substrate, comprise metal substrate 1 and ceramic substrate 2, offer first cavity 5 on the described metal substrate 1, described ceramic substrate 2 is installed in described first cavity 5; Be equiped with high performance components 6 on the described ceramic substrate 2; The combined type high performance components substrate that adopts the utility model to provide had both had effective, thermoelectric advantage of separating, and had advantage cheaply again; To the ceramic substrate 2 of high performance components 6 be housed, be installed on the described metal substrate 1, when high performance components 6 work, the heat that described ceramic substrate 2 will produce is passed to described metal substrate 1, under the condition of identical heat transfer efficiency, ceramic substrate 2 volumes that the utility model adopted are less, and cost is lower, improved economic benefit to a certain extent.
As shown in Figure 2, all the other are same as the previously described embodiments, and difference is that the upper surface of described metal substrate 1 is provided with insulating barrier 3, and described insulating barrier 3 is provided with the terminals 4 that connect lead-in wire.
Adopt the present embodiment technical scheme, can make the combined type high performance components reach better, the lower-cost purpose of heat conductivility equally with substrate, simultaneously, can also be by insulating barrier 3 be set on metal substrate, on described insulating barrier 3, terminals 4 are set, high performance components 6 is electrically connected with described terminals 4 on the insulating barrier 3 from the top of ceramic substrate 2, the heat that produces is dispelled the heat from the below of ceramic substrate 2, the heat of output is transmitted on the metal substrate 1 again, further dispel the heat, thereby realized thermoelectric separation.
Pass through technique scheme, the beneficial effect of technical solutions of the utility model is: a kind of combined type high performance components substrate, comprise metal substrate 1 and ceramic substrate 2, offer first cavity 5 on the described metal substrate 1, described ceramic substrate 2 is installed in described first cavity 5; Be equiped with high performance components 6 on the described ceramic substrate 2, described high performance components 6 directly is connected with the metal substrate circuit by metal connecting line, and electric current can be through the ceramic substrate bottom; The combined type high performance components substrate that adopts the utility model to provide had both had effective, thermoelectric advantage of separating, and had advantage cheaply again; To the ceramic substrate 2 of high performance components be housed, be installed on the described metal substrate 1, when high performance components 6 work, the heat that described ceramic substrate 2 will produce is passed to described metal substrate 1, under the condition of identical heat transfer efficiency, ceramic substrate 2 volumes that the utility model adopted are less, and cost is lower, improved economic benefit to a certain extent.
In addition, adopt described combined type high performance components substrate, components and parts 6 are electrically connected with terminals 4 from the top of ceramic substrate 2, the heat that produces is dispelled the heat from the below of ceramic substrate 2, the heat of output is transmitted on the metal substrate 1 again, further dispels the heat, and electricity is drawn from the top of ceramic substrate 2, heat is drawn from the below of ceramic substrate 2, has realized thermoelectric separation.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (5)
1. a combined type high performance components substrate is characterized in that, comprises metal substrate and ceramic substrate, offers first cavity on the described metal substrate, and described ceramic substrate is installed in described first cavity;
Be equiped with high performance components on the described ceramic substrate, described high performance components directly is connected with the metal substrate circuit by metal connecting line, and electric current can be through the ceramic substrate bottom.
2. combined type high performance components substrate according to claim 1 is characterized in that the upper surface of described metal substrate is provided with insulating barrier.
3. combined type high performance components substrate according to claim 2 is characterized in that, described insulating barrier is provided with the terminals that connect lead-in wire.
4. combined type high performance components substrate according to claim 3 is characterized in that, described ceramic substrate and described first cavity are complementary.
5. according to each described combined type high performance components substrate of claim 1-4, it is characterized in that offer second cavity on the described ceramic substrate, described high performance components is installed in described second cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120129798 CN202034362U (en) | 2011-04-28 | 2011-04-28 | Composite substrate for high-power element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120129798 CN202034362U (en) | 2011-04-28 | 2011-04-28 | Composite substrate for high-power element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202034362U true CN202034362U (en) | 2011-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120129798 Expired - Fee Related CN202034362U (en) | 2011-04-28 | 2011-04-28 | Composite substrate for high-power element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202034362U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760703A (en) * | 2011-04-28 | 2012-10-31 | 苏州科医世凯半导体技术有限责任公司 | Composite substrate for high-power component |
| CN109406904A (en) * | 2018-12-04 | 2019-03-01 | 航天科工防御技术研究试验中心 | Kilowatt large power supply module bilayer test fixture |
-
2011
- 2011-04-28 CN CN 201120129798 patent/CN202034362U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102760703A (en) * | 2011-04-28 | 2012-10-31 | 苏州科医世凯半导体技术有限责任公司 | Composite substrate for high-power component |
| CN109406904A (en) * | 2018-12-04 | 2019-03-01 | 航天科工防御技术研究试验中心 | Kilowatt large power supply module bilayer test fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111109 Termination date: 20150428 |
|
| EXPY | Termination of patent right or utility model |