CN102508341A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN102508341A CN102508341A CN2011103743962A CN201110374396A CN102508341A CN 102508341 A CN102508341 A CN 102508341A CN 2011103743962 A CN2011103743962 A CN 2011103743962A CN 201110374396 A CN201110374396 A CN 201110374396A CN 102508341 A CN102508341 A CN 102508341A
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- optical module
- heat
- laser instrument
- conducting medium
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Abstract
The invention discloses an optical module and relates to the field of communication. The optical module has a simple structure and good heat dissipation effect, has high reliability and can be used for ensuring the optical communication to be normally carried out. The optimal module disclosed by the invention comprises a laser and an optical module shell for fixing the laser. The optical module shell comprises an optical module shell upper cover and an optical module shell lower cover. The laser is embedded in a heat-conducting medium. The heat-conducting medium is of a rightwards falling U shape and is attached to the optical module shell upper cover and the optical module shell lower cover. The optical module disclosed by the invention is used for an optical communication system and is used for improving the reliability of the optical communication system.
Description
Technical field
The present invention relates to the communications field, relate in particular to a kind of optical module.
Background technology
Optical module is a kind of light signal is converted to electric signal and/or electrical signal conversion is become a kind of integration module of light signal, in the optical-fibre communications process, plays an important role.But optical module the time can produce great amount of heat in work, be used in the optical module produce or the laser instrument of receiving optical signals strict relatively to temperature requirement, so, then need the heat that optical module produces is in time distributed in order to guarantee normally carrying out of optical communication.
Laser instrument in the optical module is the topmost power consumption device of optical module, and thermal value is maximum.In the prior art, heat-conducting medium is set at the end face of laser instrument, through heat-conducting medium with heat transferred to the optical module shell.
In realizing process of the present invention, the inventor finds that there is following problem at least in prior art:
Heat-conducting medium is arranged on the end face of laser instrument; So the heat that laser instrument produces mainly upwards transmits through heat-conducting medium, by the shell of optical module, especially the last cap surface of shell distributes; The heat radiation approach is single; Thereby radiating effect is bad, and reliability is low when causing optical module work, can't guarantee normally carrying out of optical communication.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of optical module, and is simple in structure and radiating effect is good, and reliability is high, can guarantee normally carrying out of optical communication.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of optical module; Comprise: laser instrument and the optical module shell that is used for fixing said laser instrument; Said optical module shell comprises: optical module outer casing upper cover and optical module shell lower cover; Said laser instrument is embedded in the heat-conducting medium, and said heat-conducting medium is " ㄈ " shape, fits in said optical module outer casing upper cover and optical module shell lower cover.
The said optical module of the embodiment of the invention is embedded at the laser instrument in the optical module in the heat-conducting medium, and said heat-conducting medium closely contacts with lower cover with the optical module outer casing upper cover; When optical module was worked like this, the heat that laser instrument produces can be delivered to cap surface under optical module outer casing upper cover surface and the optical module shell simultaneously, makes the top of optical module and bottom to dispel the heat simultaneously; Increased the heat radiation approach of optical module; Simultaneously also increased area of dissipation, radiating effect is good, the temperature requirement in the time of can satisfying the laser works in the optical module; Stability and reliability when promoting optical module work guarantee normally carrying out of optical communication.
Description of drawings
Fig. 1 is an optical module STRUCTURE DECOMPOSITION synoptic diagram one in the embodiment of the invention one;
Fig. 2 is the structural representation of heat-conducting medium in the embodiment of the invention one;
Fig. 3 is an optical module STRUCTURE DECOMPOSITION synoptic diagram two in the embodiment of the invention one;
Fig. 4 is a heat-conducting medium and send the structural representation of laser instrument in the embodiment of the invention one;
Fig. 5 is embedded at the structural representation in the heat-conducting medium for sending laser instrument;
Fig. 6 is embedded at another structural representation in the heat-conducting medium for sending laser instrument.
Description of reference numerals
11-sends laser instrument, the 12-heat-conducting medium, and 13-receives laser instrument, the 14-circuit board,
15-optical module shell lower cover, 16-optical module outer casing upper cover, 17-screw;
The cross break part on 121-heat-conducting medium top, the cross break part of 122-heat-conducting medium bottom.
Embodiment
The embodiment of the invention provides a kind of optical module, and is simple in structure and radiating effect is good, and reliability is high, can guarantee normally carrying out of optical communication.
Below in conjunction with accompanying drawing the embodiment of the invention is described in detail.Embodiment described herein is only in order to explaining the present invention, and is not used in qualification the present invention.
Embodiment
The embodiment of the invention provides a kind of optical module; As shown in Figure 1, said optical module comprises: comprising: laser instrument and the optical module shell that is used for fixing said laser instrument, and said optical module shell comprises: optical module outer casing upper cover 16 and optical module shell lower cover 15; Said laser instrument is embedded in the heat-conducting medium 12; Said heat-conducting medium 12 is " ㄈ " shape, fits in said optical module outer casing upper cover 16 and optical module shell lower cover 15, and said optical module also comprises circuit board 14 and screw 17.The said laser instrument of present embodiment is the transmission laser instrument 11 that is used to send light signal among Fig. 1.
The said heat-conducting medium of the embodiment of the invention is that coefficient of heat conductivity is little, and promptly thermal resistance is little, and the material that can conduct heat is fast processed.Alternatively, the material of said heat-conducting medium is metal or heat-conducting glue, for example the metal of good heat conductivity such as copper, aluminium, perhaps the heat conduction plastic cement of good heat conductivity such as silica gel.
As shown in Figure 2; In the embodiment of the invention; Said being, the outside surface of cross break part 121 on heat-conducting medium 12 tops of " ㄈ " shape fitted in said optical module outer casing upper cover 16; The outside surface of the cross break part 122 of bottom fits in said optical module shell lower cover 15, makes the heat that transmits along " ㄈ " shape heat-conducting medium, can be delivered to cap surface under optical module outer casing upper cover surface and the optical module shell simultaneously.
The profile of laser instrument described in the present embodiment is rectangular parallelepiped or cube-shaped, so heat-conducting medium 12 is " ㄈ " shape, is convenient to laser instrument and is embedded in heat-conducting medium 12.In the actual manufacture process, the shape of said heat-conducting medium 12 and thickness can change according to the profile of laser instrument to some extent, as long as said laser instrument is embedded in the heat-conducting medium 12, and heat-conducting medium 12 can be fitted in the surface and the said optical module shell of laser instrument and gets final product.
Laser instrument in the optical module is the topmost power consumption device of optical module, and thermal value is maximum; Laser instrument in the optical module is embedded in the heat-conducting medium that is " ㄈ " shape, and said " ㄈ " shape heat-conducting medium closely contacts with optical module outer casing upper cover and lower cover, like this during optical module work; The heat that laser instrument produces is delivered to cap surface under optical module outer casing upper cover surface and the optical module shell simultaneously along the heat-conducting medium of " ㄈ " shape, makes the top of optical module and bottom to dispel the heat simultaneously; Increased the heat radiation approach of optical module; Simultaneously also increased area of dissipation, radiating effect is good, the temperature requirement in the time of can satisfying laser works in the optical module; Stability when promoting optical module work guarantees normally carrying out of optical communication.
Further, the said laser instrument of the embodiment of the invention is the transmission laser instrument 11 that is used to send light signal.The transmission laser instrument power consumption that is used to send light signal is big, and thermal value is also big, is embedded in the heat-conducting medium 12 so need to send laser instrument, makes to send the heat that laser instrument produces and distribute fast, guarantees the operate as normal of transmission laser instrument.
In addition, as shown in Figure 3, the said optical module of the embodiment of the invention also can comprise: be used for the reception laser instrument 13 of receiving optical signals, and light transceiving integrated, realize that photosignal exchanges.Look the concrete condition needs, receive laser instrument 13 and also can be embedded in the heat-conducting medium 12, improve optical module heat radiating effect.
Preferably, the inside surface of said heat-conducting medium fits in the end face of said laser instrument.
As shown in Figure 4, laser instrument shown in the figure is for sending laser instrument 11, and said heat-conducting medium 12 is " ㄈ " shape, and the inside surface of the cross break part 121 on said " ㄈ " shape heat-conducting medium 12 tops fits in the end face that sends laser instrument 11.
Fig. 5 sends laser instrument to be embedded at the synoptic diagram in the heat-conducting medium.The cross break on heat-conducting medium 12 tops partly fits in the end face that sends laser instrument 11.Fig. 5 is embedded at another synoptic diagram in the heat-conducting medium for sending laser instrument.
Laser instrument in the optical module is the topmost power consumption device of optical module, and thermal value is maximum; And thermal value mainly concentrates on the end face of optical module laser instrument; So the inside surface of heat-conducting medium fits tightly the end face in said laser instrument, the heat of generation is distributed along heat-conducting medium fast, prevent that air from forming heat insulation air blanketing between the end face of heat-conducting medium and said laser instrument; And the coefficient of heat conductivity of air is little, is unfavorable for that heat distributes.
Alternatively, said heat-conducting medium is connected with the end face formation heat conduction of said laser instrument through heat-conductive bonding agent.
Said heat-conductive bonding agent can be the bonding agent of heat conductive silica gel or other good heat conductivity.
The coefficient of heat conductivity of air is little; In order to prevent that air from forming heat insulation air blanketing between the end face of heat-conducting medium and said laser instrument; Be unfavorable for that heat distributes; Be connected so said heat-conducting medium will form heat conduction with the end face of said transmission laser instrument through heat-conductive bonding agent, be convenient to heat and distribute fast along heat-conducting medium.
Alternatively, said heat-conducting medium is connected through heat-conductive bonding agent and said optical module shell formation heat conduction.
In like manner, said heat-conducting medium forms heat conduction through heat-conductive bonding agent and said optical module shell and is connected, and prevents to form heat insulation air blanketing, is convenient to heat and is delivered to the optical module shell along heat-conducting medium, outwards distributes through the optical module shell.During heat radiation, area of dissipation is big more, and heat distributes fast more, so design the time should increase area of dissipation as much as possible.
Said optical module shell mainly plays fixing circuit board and laser instrument, heat radiation and electromagnetic shielding action.So satisfying on the basis of other performance requirement, the optical module shell should be selected the material of good heat conductivity for use as far as possible.
Alternatively, the shell of said heat-conducting medium and said laser instrument is one-body molded.
The shell of said heat-conducting medium and said laser instrument is one-body molded, helps heat and distributes, and manufacturing process is simple simultaneously, is easy to volume production.
Need to prove that under the situation of not conflicting, the characteristic in the embodiment of the invention is combination in any each other.
Optical module in the embodiment of the invention is embedded at the laser instrument in the optical module in the heat-conducting medium, the heat that produces during laser works; From the end face of laser instrument along heat-conducting medium; Can be delivered to cap surface under optical module outer casing upper cover surface and the optical module shell, thereby make the top and the bottom outwards heat radiation simultaneously of optical module, increase the heat radiation approach of optical module; Radiating effect is good; Temperature requirement in the time of can satisfying laser works in the optical module, the stability when promoting optical module work guarantees normally carrying out of optical communication; And radiator structure is simple, in the optical module miniaturization, under the background of high efficiency, under the prerequisite that guarantees radiating effect, can reach the practical purpose of saving the space.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technician who is familiar with the present technique field is in the technical scope that the present invention discloses; Can expect easily changing or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion by said protection domain with claim.
Claims (7)
1. optical module; Comprise: laser instrument and the optical module shell that is used for fixing said laser instrument; Said optical module shell comprises: optical module outer casing upper cover and optical module shell lower cover is characterized in that said laser instrument is embedded in the heat-conducting medium; Said heat-conducting medium is " ㄈ " shape, fits in said optical module outer casing upper cover and optical module shell lower cover.
2. optical module according to claim 1 is characterized in that,
Said laser instrument is the transmission laser instrument that is used to send light signal.
3. optical module according to claim 1 is characterized in that,
The inside surface of said heat-conducting medium fits in the end face of said laser instrument.
4. optical module according to claim 1 is characterized in that,
The material of said heat-conducting medium is metal or heat-conducting glue.
5. optical module according to claim 1 is characterized in that, said heat-conducting medium forms heat conduction through heat-conductive bonding agent with the end face of said laser instrument and is connected.
6. optical module according to claim 1 is characterized in that, said heat-conducting medium forms heat conduction through heat-conductive bonding agent and said optical module shell and is connected.
7. optical module according to claim 1 is characterized in that the shell of said heat-conducting medium and said laser instrument is one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103743962A CN102508341A (en) | 2011-11-22 | 2011-11-22 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103743962A CN102508341A (en) | 2011-11-22 | 2011-11-22 | Optical module |
Publications (1)
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| CN102508341A true CN102508341A (en) | 2012-06-20 |
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| CN2011103743962A Pending CN102508341A (en) | 2011-11-22 | 2011-11-22 | Optical module |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185356A (en) * | 2013-05-24 | 2014-12-03 | 华为技术有限公司 | Optical module heat radiation system |
| CN107247316A (en) * | 2017-07-28 | 2017-10-13 | 安费诺电子装配（厦门）有限公司 | A kind of optic communication transceiver and its application |
| CN109031548A (en) * | 2018-08-22 | 2018-12-18 | 成都优博创通信技术股份有限公司 | Radiator structure and optical module |
| CN113885143A (en) * | 2021-09-24 | 2022-01-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114594555A (en) * | 2020-12-03 | 2022-06-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN2519585Y (en) * | 2001-11-03 | 2002-10-30 | 富士康(昆山)电脑接插件有限公司 | Photoelectric transfer module |
| CN101335421A (en) * | 2008-08-05 | 2008-12-31 | 福州高意通讯有限公司 | Optical element cooling construction and preparing method thereof |
| US7583900B2 (en) * | 2003-07-28 | 2009-09-01 | Emcore Corporation | Modular optical transceiver |
| US7637672B1 (en) * | 2008-11-02 | 2009-12-29 | Broadway Networks, Ltd. | Pluggable optical tranceiver module having effective thermal release function |
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| CN201689195U (en) * | 2010-05-12 | 2010-12-29 | 成都新易盛通信技术有限公司 | Photo-electricity transmitting-receiving device mould |
| CN201742671U (en) * | 2010-07-20 | 2011-02-09 | 上海市共进通信技术有限公司 | Optical module radiator for optical network unit |
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2011
- 2011-11-22 CN CN2011103743962A patent/CN102508341A/en active Pending
Patent Citations (7)
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| CN2519585Y (en) * | 2001-11-03 | 2002-10-30 | 富士康(昆山)电脑接插件有限公司 | Photoelectric transfer module |
| US7583900B2 (en) * | 2003-07-28 | 2009-09-01 | Emcore Corporation | Modular optical transceiver |
| CN101335421A (en) * | 2008-08-05 | 2008-12-31 | 福州高意通讯有限公司 | Optical element cooling construction and preparing method thereof |
| US7637672B1 (en) * | 2008-11-02 | 2009-12-29 | Broadway Networks, Ltd. | Pluggable optical tranceiver module having effective thermal release function |
| CN201689195U (en) * | 2010-05-12 | 2010-12-29 | 成都新易盛通信技术有限公司 | Photo-electricity transmitting-receiving device mould |
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| CN201742671U (en) * | 2010-07-20 | 2011-02-09 | 上海市共进通信技术有限公司 | Optical module radiator for optical network unit |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185356A (en) * | 2013-05-24 | 2014-12-03 | 华为技术有限公司 | Optical module heat radiation system |
| US9660414B2 (en) | 2013-05-24 | 2017-05-23 | Huawei Technologies Co., Ltd. | Heat dissipation system for optical module |
| CN107247316A (en) * | 2017-07-28 | 2017-10-13 | 安费诺电子装配（厦门）有限公司 | A kind of optic communication transceiver and its application |
| CN109031548A (en) * | 2018-08-22 | 2018-12-18 | 成都优博创通信技术股份有限公司 | Radiator structure and optical module |
| CN114594555A (en) * | 2020-12-03 | 2022-06-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113885143A (en) * | 2021-09-24 | 2022-01-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Application publication date: 20120620 |