CN2519585Y - Photoelectric transfer module - Google Patents
Photoelectric transfer module Download PDFInfo
- Publication number
- CN2519585Y CN2519585Y CN 01265471 CN01265471U CN2519585Y CN 2519585 Y CN2519585 Y CN 2519585Y CN 01265471 CN01265471 CN 01265471 CN 01265471 U CN01265471 U CN 01265471U CN 2519585 Y CN2519585 Y CN 2519585Y
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- photoelectricity
- pcb
- passes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A photoelectric transmission model group comprises a conductive shell, an optical transceiver device, a socket, a printed circuit board and a shielding cap. The optical transceiver device is arranged in the socket and is welded with the printed circuit board by a circuit lead; the printed circuit board is encapsulated in the conductive shell; the shielding cap is arranged at a main electromagnetic radiation component or a sensing assembly of the printed circuit and is provided with heat dissipation holes; and the conductive shell is of a non-complete airtight structure, which is beneficial to dissipate heat. With the interaction of the shielding cap and the conductive shell, better effects of electromagnetic shielding and electrostatic protection are realized.
Description
[technical field]
The utility model is to pass about a kind of photoelectricity to connect module, especially refer to the magnetic screen of a kind of tool better electrical, electrostatic defending can avoid radiating circuit and receiving circuit mutually the miniaturization photo-electricity biography of mutual interference connect module.
[background technology]
Photoelectricity passes and connects module is a kind of light communication system that is applied to, and the device of bidirectional data transfers is provided between optical interface and electric interface.For adapting to the demand that network transfer speeds promotes, external connection port density improves, industry is devoted to provide at a high speed always, the photoelectricity of miniaturization passes and connects module, along with development of science and technology, how the optical fiber backbone speed of network has surpassed 10Gbps, how the speed that is connected with the electric communication of traditional copper wire transmission has surpassed 1Gbps, institute thinks that reaching photosignal changes mutually, and photoelectricity passes the circuit that connects in the module and mostly is very high frequency(VHF).Again, connect more crypto set of the more small-sized and structure of module development along with photoelectricity passes, make printed circuit board (PCB) must print more dense high-frequency circuit, and each electronic building brick distance to be more approaching, electronic building brick will be easier to accumulate electrostatic charge and then cause damage, or form electromagnetic interference mutually.
General photoelectricity biography connects module can comprise optical signal transmitter and optical signal receiver two partly, the high-frequency circuit of normal light signal projector partly comprises drive circuit, signal generating circuit and signal modulation circuit, the high-frequency circuit of optical signal receiver then comprises amplification and rectification circuit, drive circuit and signal demodulating circuit, and the electromagnetic wave that high-frequency circuit produced of optical signal transmitter and optical signal receiver tends to the phase mutual interference, as: the high-frequency circuit of optical signal transmitter promptly can produce the small-signal electric current by electromagnetic interference inspection optical diode, signal code is not entered before the amplification and rectification circuit as yet, promptly produce distortion.Therefore, between the high-frequency circuit of optical signal transmitter and optical signal receiver, must be shielded, be taken place to prevent mutual electromagnetic interference.
As United States Patent (USP) the 6th, 201, No. 704 a kind of photoelectricity that discloses passes and connects module, its shell is a rectangle conduction closed shell, printed circuit board (PCB) is positioned in this housing, be fixed in the housing by encapsulants such as injecting resins, therefore, though this housing is complete closed shell, pass and connect the heat that high-frequency current produced on the printed circuit board (PCB) in the module but be difficult to discharge photoelectricity, and then influence electric appliance component operate as normal and life-span, and and minimizing optical signal transmitter not yet in effect and optical signal receiver between the interference of circuit mutual electromagnetic, and, this mode moulding cost height with the injecting resin encapsulation, yield is low.
And for example United States Patent (USP) the 5th, 047, No. 835 the another kind of photoelectricity that discloses passes and connects module, it adopts, lower house is positioned over printed circuit board (PCB) wherein, shroud whole printed circuit board (PCB) to realize electromagnetic shielding and electrostatic defending by a crown cap that is positioned at the upper shell downside, adopt a partition wall to pass the circuit that transmits and receives that connects module in this crown cap in order to separate photoelectricity, to reduce electromagnetic radiation that radiating circuit produces influence to receiving circuit, this partition wall contacts with printed circuit board (PCB) with heat radiation, this crown cap only is connected on the printed circuit board (PCB) by a plurality of shell fragments in both sides, and by the pressure of loam cake this crown cap is fixed.Even constituting with printed circuit by the both sides shell fragment, this metal contacts, have sealing and contact but still form between the separation wall energy that can not guarantee this crown cap and printed circuit board (PCB), even still can between partition wall and printed circuit board (PCB), produce the slit, therefore still be difficult to effectively prevent electromagnetic interference mutual between radiating circuit and receiving circuit.
[summary of the invention]
The purpose of this utility model is to provide a kind of electromagnetic isolation that can form between optical signal transmitter and optical signal receiver high-frequency circuit to connect module with the novel photoelectric biography that produces better electrical magnetic screen, electrostatic defending.
The purpose of this utility model is achieved in that providing a photoelectricity to pass connects module, comprises a conductive shell, light R-T unit, socket, printed circuit board (PCB) and screening cover.This light R-T unit is installed in the socket and by circuit lead and printed circuit board (PCB) welding, this printed circuit board (PCB) is contained in the conductive shell, and this screening cover is installed on printed circuit and covers the light signal radiating circuit partly, offers louvre on it.
Compared with the prior art, the utlity model has following advantage: the acting in conjunction by screening cover and conductive shell is to realize preferable electromagnetic shielding and electrostatic protection effect.
[description of drawings]
Fig. 1 is that the utility model photoelectricity passes the three-dimensional exploded view that connects module.
Fig. 2 is that the utility model photoelectricity passes the three-dimensional exploded view that connects another angle of module.
Fig. 3 is that the utility model photoelectricity passes the three-dimensional exploded view that connects the another angle of module.
Fig. 4 is that the utility model photoelectricity passes the stereogram that connects the module screening cover.
Fig. 5 is that the utility model photoelectricity passes the constitutional diagram that connects module.
[embodiment]
Please refer to Fig. 1 and Fig. 3, the utility model photoelectricity biography connects module 99 and mainly comprises a conductive shell, light R-T unit 6, socket 4, printed circuit board (PCB) 5 and screening cover 9.This conductive shell further comprises a upper shell 1, lower house 2 and pedestal 3, and the utility model photoelectricity passes the conductive shell that connects module 99 and is not limited only to this structure, connects module casing as upper and lower separate type photoelectricity biography and also can use.This conductive shell can be metal material, also can be attached with conductive metal layer by the plastic casing surface.
This socket 4 is roughly a cuboid, comprises fore-end 43 and rear end part 44.This front end partly 43 overall dimensions is bigger slightly than rear end part 44, therefore forms a cascaded surface in the junction of two parts, in order to restriction location upper shell 1.This fore-end 43 offers two openings 41 and 42 that run through whole socket 4, these socket 4 rear ends partly offer a T type groove 441 (with reference to Fig. 2) on 44 lower surfaces, cooperate (detailed aftermentioned) in order to ad hoc structure, and its upper surface is provided with a pair of rectangular preiection 442 with upper shell 1.
This light R-T unit 6 is accommodated in two openings 41,42 of socket 4, it comprises light emitting devices 61 and optical pickup apparatus 62, wherein this light emitting devices 61 is generally laser diode or light-emitting diode, optical pickup apparatus 62 is generally the inspection optical diode, and a plurality of circuit leads 605 (detailed aftermentioned) are all stretched out at the rear portion of this light emission and receiving system 61,62.
See also Fig. 2, this printed circuit board (PCB) 5 is made up of wide 51 and narrow 52 of back before one, and its preceding wide 51 is provided with three location holes 511.The circuit lead 605 of this light R-T unit 6 presss from both sides preceding wide 51 that is welded in printed circuit board (PCB) 5 up and down, and in order to Primary Location printed circuit board (PCB) 5, in addition, the signal transmission between light R-T unit 6 and the printed circuit board (PCB) 5 also can realize by this lead-in wire 605.Back narrow 52 of printed circuit board (PCB) 5 is provided with row's electric terminal (golden finger) 520, electrically connects by this electric terminal 520 and an electric connector (figure does not show).
In addition, this printed circuit board (PCB) 5 comprises a radiating circuit (figure does not show), receiving circuit (figure does not show) and earth connection (figure does not show) simultaneously.The light emitting devices 61 of this radiating circuit and light R-T unit 6 electrically connects mutually, and the optical pickup apparatus 62 of this receiving circuit and light R-T unit 6 electrically connects mutually, and this earth connection can pass the earthing device (figure does not show) that connect outside the module 99 with photoelectricity and electrically connect.This light emitting devices 61 is used for the teletransmission of light signal, and its power is greater than the power of optical pickup apparatus 62, so the radiating circuit electric current is obviously greater than the receiving circuit electric current, and this radiating circuit is the main electromagnetic radiation assembly of printed circuit board (PCB) 5.
See also Fig. 4, a screening cover 9 is arranged on the radiating circuit of printed circuit board (PCB) 5.This screening cover 9 roughly is a rectangle, comprises a loam cake 94, a bonnet 93 and two screening cover sidewalls 91,92.Have a plurality of louvres 941 on this screening cover 9 to discharge the heat that is produced by the radiating circuit high-frequency current, its bonnet 93, two screening cover sidewalls 91,92 also extend a plurality of pins 931 respectively downwards.Screening cover 9 directly is welded on the printed circuit board (PCB) 5 by pin 931, also can see through conducting foam (figure does not show) and be installed on the printed circuit board (PCB) 5, and this pin 931 can form with the earth connection of printed circuit board (PCB) 5 and electrically connect, to realize ground connection effect preferably.In addition, this screening cover 9 can pass through metallic plate punching press, bending and be integrally formed, to reduce manufacturing cost.Decay through screening cover 9 when the electromagnetic wave that main electromagnetic radiation assembly is launched, decay once more through conductive shell again, to realize pass effective shielding of the electromagnetic interference that connects the module generation by photoelectricity.Be appreciated that the utility model also the outer bound pair photoelectricity of maskable pass the electromagnetic interference that connects module 99, and photoelectricity passes and connects in the module 99 the electromagnetic radiation assemblies to the interference of sensing assembly, and radiating circuit and receiving circuit form mutual electromagnetic interference.And the utility model can prevent effectively that entering the photoelectricity biography by conductive shell slit and the external electric terminal 520 that is connected connects the damage of the electrostatic charge of module 99 inside to sensing assembly on the printed circuit board (PCB) 5.Again, this screening cover 9 can only cover the primary clustering on the printed circuit board (PCB) 5, volume is less, and the utility model by with the double action of conductive shell to realize good electromagnetic shielding, electrostatic protection effect, so airtight performance, mechanical dimension's required precision that this screening cover 9 need not be very high, thereby cost is lower, has heat dispersion preferably.
Please refer to Fig. 1 to Fig. 3; this pedestal 3 is roughly a rectangle housing; in order to settle protection printed circuit board (PCB) 5; its upper surface 31 is roughly a rectangular flat plate structure; offer three screws 312 on it; corresponding with three location holes 511 on the printed circuit board (PCB) 5 respectively, double-screw bolt 313 is extended in the lower end of each screw 312, and this screw 312 connects whole double-screw bolt 313.Pedestal 3 rear ends are a container 33, the rectangular channel 331 of its internal placement one and external communications, and a guide rail 330 is extended in the bottom.During assembling, in the rectangular channel 331 of back narrow 52 insertion container 33 of printed circuit board (PCB) 5, and double-screw bolt 313 is pressed against on the printed circuit board (PCB) 5, printed circuit board (PCB) 5 is supported in guide rail 330 holders simultaneously, with fixed printed circuit board 5, and there are certain interval in back narrow 52 of printed circuit board (PCB) 5 and 331 of rectangular channels, are beneficial to circulation of air and heat radiation.Three fastening assemblies, as screw 8 (only showing one among the figure) respectively the location hole 511 corresponding snap closes by printed circuit board (PCB) 5 in the screw 312 of pedestal 3 and printed circuit board (PCB) 5 is immobilizated on the pedestal 3, be appreciated that ground, this fastening assembly also can be one-body molded with pedestal 3, and join with location hole 511 cards on the printed circuit board (PCB) 5.In addition, when pedestal during by tool thermal conductive resin made, can cooperate with location hole 511 and pedestal 3 by these three fastening assemblies, the multiple spot of realization printed circuit board (PCB) 5 and pedestal contacts with the realization good heat radiating.Further offer two-screw counterbore 311 on these pedestal 3 upper surfaces 31, and on two pedestal sidewalls 32 of pedestal 3, offer two ladder platforms 320 of each interval respectively again.
The end face 11 of upper shell 1 is the cover plate of shallow slot for the most area, and two location holes 111 are arranged in the shallow slot, and is corresponding with the screw counterbore 311 on the pedestal 3 respectively.These end face 11 front ends dash and are provided with a pair of ground strip that is parallel to each other 113, have two mutual parallel rectangular apertures 112 between ground strip 113 and shallow slot, these upper shell 1 both sides are extended a pair of front side wall 14, a pair of rear wall 12 and two pairs of elastic collets 13 respectively downwards.Each front side wall 14 bottom bends respectively extends T shape folding hook 142 in opposite directions.Simultaneously, further dash on each front side wall and be provided with a ground strip 113.Each rear wall 12 bends respectively near upper shell 1 tail end and extends one folding piece 121 in opposite directions.This elastic collet 13 is a rectangle laminated structure, and make peace the greatly slit 213 of lower house 2 of its overall dimensions is suitable, and each elastic collet 13 centre dashes and be provided with a shell fragment 131, and the one end links to each other with elastic collet 13, and the other end is given prominence to outwardly obliquely.
See also Fig. 5, during assembling, printed circuit board (PCB) 5, socket 4 and pedestal 3 by screw 8 and location hole 511, screw 312 cooperates and is connected is a black box, earlier upper shell 1 is immobilizated on the black box of this printed circuit board (PCB) 5, socket 4 and pedestal 3, cooperates with lower house 2 by upper shell 1 again and finish assembling.Wherein, 1 liang of rectangular aperture 112 of this upper shell matches with the projection 442 of socket 4, its tail end two tabs 121 also be snapped in these pedestal 3 tail ends in order to Primary Location upper shell 1 on this assembly, then two-screw 7 by location hole 111 and corresponding snap close in pedestal 3 screws 311, so that upper shell 1 is immobilizated on the pedestal 3, and the folding hook 142 of upper shell 1 is snapped in the T connected in star 441 of socket 4 bottoms with further reinforcing socket 4 and upper shell 1.The lug 212 of lower house 2 snaps on the pedestal 3 ladder platforms 320 and combines with pedestal 3, the elastic collet 13 of upper shell 1 also joins shell fragment 131 and rectangular opening 211 cards by the slit 213 of lower house 2 simultaneously, and then, printed circuit board (PCB) 5, socket 4 and pedestal 3 are packaged in wherein in conjunction with last lower house 1,2.
Claims (10)
1. a photoelectricity passes and connects module and comprise: a light emitting devices, one optical pickup apparatus, one printed circuit board (PCB) and a housing, this light emitting devices can be light signal with electrical signal conversion and be transmitted into the module outside, this light-receiving module receives external optical signal and is converted into the corresponding signal of telecommunication, have radiating circuit and receiving circuit on this printed circuit board (PCB), radiating circuit and light emitting devices electrically connect, receiving circuit and optical pickup apparatus electrically connect, this housing is in order to the encapsulation printed circuit board (PCB), it is characterized in that: this photoelectricity biography connects module and also comprises at least one screening cover, and this screening cover is installed on the printed circuit board (PCB) and hides this radiating circuit.
2. photoelectricity as claimed in claim 1 passes and connects module, it is characterized in that this printed circuit board (PCB) comprises at least one earth connection.
3. photoelectricity as claimed in claim 2 passes and connects module, it is characterized in that this screening cover comprises that at least one pin and earth connection electrically connect.
4. photoelectricity as claimed in claim 1 passes and connects module, it is characterized in that this screening cover comprises at least one pin, and this pin is plugged in this printed circuit board (PCB) and fixes with welding manner.
5. photoelectricity as claimed in claim 1 passes and connects module, it is characterized in that this screening cover directly is soldered on the printed circuit board (PCB).
6. photoelectricity as claimed in claim 1 passes and connects module, it is characterized in that this screening cover sees through conducting foam and installs.
7. photoelectricity as claimed in claim 1 passes and connects module, it is characterized in that this screening cover is a metal shell.
8. photoelectricity as claimed in claim 1 passes and connects module, it is characterized in that this screening cover has at least one louvre.
9. photoelectricity as claimed in claim 1 passes and connects module, it is characterized in that this conductive shell comprises that at least one supporting component is supported on the printed circuit board (PCB).
10. photoelectricity as claimed in claim 9 passes and connects module, it is characterized in that this supporting component is by the thermal conductive resin made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01265471 CN2519585Y (en) | 2001-11-03 | 2001-11-03 | Photoelectric transfer module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01265471 CN2519585Y (en) | 2001-11-03 | 2001-11-03 | Photoelectric transfer module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2519585Y true CN2519585Y (en) | 2002-10-30 |
Family
ID=33672359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01265471 Expired - Fee Related CN2519585Y (en) | 2001-11-03 | 2001-11-03 | Photoelectric transfer module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2519585Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| CN102387657A (en) * | 2010-08-31 | 2012-03-21 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN102508341A (en) * | 2011-11-22 | 2012-06-20 | 华为技术有限公司 | Optical module |
| CN104025729A (en) * | 2012-11-01 | 2014-09-03 | 住友电气工业株式会社 | Cable-attached electronic apparatus and method for assembling same |
| WO2015144006A1 (en) * | 2014-03-27 | 2015-10-01 | 特富特科技(深圳)有限公司 | Electromagnetic device mounting apparatus |
| CN111381330A (en) * | 2020-04-27 | 2020-07-07 | 东南大学 | Optical module packaging structure applying improved cut-off waveguide heat dissipation hole array |
-
2001
- 2001-11-03 CN CN 01265471 patent/CN2519585Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| WO2011147208A1 (en) * | 2010-05-27 | 2011-12-01 | 华为技术有限公司 | Optical module and optical communication system |
| CN101872042B (en) * | 2010-05-27 | 2012-07-04 | 华为技术有限公司 | Optical module and optical communication system |
| US8509622B2 (en) | 2010-05-27 | 2013-08-13 | Huawei Technologies Co., Ltd. | Optical module and optical communication system |
| CN102387657A (en) * | 2010-08-31 | 2012-03-21 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN102508341A (en) * | 2011-11-22 | 2012-06-20 | 华为技术有限公司 | Optical module |
| CN104025729A (en) * | 2012-11-01 | 2014-09-03 | 住友电气工业株式会社 | Cable-attached electronic apparatus and method for assembling same |
| US9235016B2 (en) | 2012-11-01 | 2016-01-12 | Sumitomo Electric Industries, Ltd. | Electronic device with cable and method of assembling the same |
| CN104025729B (en) * | 2012-11-01 | 2016-10-12 | 住友电气工业株式会社 | Band cable electronic equipment and assemble method thereof |
| WO2015144006A1 (en) * | 2014-03-27 | 2015-10-01 | 特富特科技(深圳)有限公司 | Electromagnetic device mounting apparatus |
| CN111381330A (en) * | 2020-04-27 | 2020-07-07 | 东南大学 | Optical module packaging structure applying improved cut-off waveguide heat dissipation hole array |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20021030 Termination date: 20091203 |