CN113225913A - PCB (printed circuit board) arrangement method for 5G wireless communication base station - Google Patents

PCB (printed circuit board) arrangement method for 5G wireless communication base station Download PDF

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Publication number
CN113225913A
CN113225913A CN202010069164.5A CN202010069164A CN113225913A CN 113225913 A CN113225913 A CN 113225913A CN 202010069164 A CN202010069164 A CN 202010069164A CN 113225913 A CN113225913 A CN 113225913A
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CN
China
Prior art keywords
pcb
base station
wireless communication
heat dissipation
communication base
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Granted
Application number
CN202010069164.5A
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Chinese (zh)
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CN113225913B (en
Inventor
童恩东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Tatfook Technology Co Ltd
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Shenzhen Tatfook Technology Co Ltd
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Priority to CN202010069164.5A priority Critical patent/CN113225913B/en
Publication of CN113225913A publication Critical patent/CN113225913A/en
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Publication of CN113225913B publication Critical patent/CN113225913B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08—Access point devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a PCB (printed circuit board) arrangement method for a 5G wireless communication base station, which is characterized in that a PCB is arranged in a single layer and is attached to the smooth surface of a heat dissipation plate, and high-power devices and electronic components with basically consistent thickness are arranged on the surface, attached to the heat dissipation plate, of the PCB. The invention can make the heat dissipation plate be the thinnest, and simultaneously has the technical effects of good heat dissipation effect, miniaturization and light weight of the 5G wireless communication base station.

Description

PCB (printed circuit board) arrangement method for 5G wireless communication base station
Technical Field
The invention relates to the technical field of communication, in particular to a technology of a 5G wireless communication base station.
Background
The wireless communication base station refers to a radio transceiver station for information transmission between a wireless terminal and a wireless communication switching center in a certain radio coverage area. The receiving mode of the base station is that an antenna receives signals, the signals are transmitted to a PCB through a filter, and specifically, the signals are transmitted to a core network through a low-noise discharge circuit, a digital intermediate frequency module and an optical module in sequence and then through optical fibers. The transmission mode of the base station is that data of a core network is transmitted to a PCB board through optical fibers, and specifically, the data is transmitted to an antenna end through an optical module, a digital intermediate frequency module and a power amplifier circuit in sequence and then is transmitted to the antenna end through a filter for transmission.
With the development of 5G edge computing and local caching, small base stations hanging on utility poles will perform more and more data storage and computing functions in the future. With the increase of the cost of the 5G transmission rate, the 5G base station can process mass data to greatly increase the calculation power consumption, so that great heat dissipation requirements are brought. Meanwhile, for small base stations, miniaturization and light weight are required. PCB board among the prior art is reasons such as multilayer arrangement, and in order to guarantee the radiating effect, preceding, the back of whole basic station, lower extreme and side all are provided with the heat dissipation tooth, have increased the volume and the weight of whole basic station.
Disclosure of Invention
The invention aims to provide a PCB (printed circuit board) arrangement method for a 5G wireless communication base station, which has a good heat dissipation effect and can realize miniaturization and light weight.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the PCB is arranged in a single layer and is attached to the smooth surface of a heat dissipation plate, and the high-power devices and the electronic components with basically consistent thickness are arranged on the surface, attached to the heat dissipation plate, of the PCB.
Further:
the chip on the PCB and the electronic component close to the thickness of the chip are arranged on one surface of the PCB, which is attached to the heating panel, and the electronic component with the large difference in the thickness of the chip is arranged on the other surface of the PCB.
The PCB cover is arranged in a space enclosed by the shielding cover and the heat dissipation plate, the shielding cover is provided with a filter, and a contact pin of the filter passes through the shielding cover and is electrically connected with the PCB.
And the arrangement of the electronic components with large thickness on the other surface of the PCB is staggered with the arrangement of the filter on the surface of the PCB.
And the power module and the optical module on the PCB are arranged at the edge below the PCB and are arranged outwards.
The PCB 5 comprises a power amplifier circuit, a digital intermediate frequency circuit, an optical module and a power module, and is formed by bonding a whole board with a heat dissipation plate or bonding a plurality of small boards with the heat dissipation plate respectively.
The arrangement of the connectors of the PCB is staggered with the arrangement of the filters on the board surface.
In the invention, the PCB is arranged in a single layer and is attached to the heat dissipation plate, and the heat dissipated by the electronic components and the chips arranged on the PCB is dissipated through the heat dissipation plate arranged on the back of the base station and the heat dissipation teeth extending from the heat dissipation plate. The high-power device and the electronic component with basically consistent thickness are arranged on the surface, which is attached to the PCB, of the heating panel, so that the heating panel is thinnest, and the technical effects of good heat dissipation effect, miniaturization and light weight of the 5G wireless communication base station are achieved.
Drawings
FIG. 1 is a schematic isometric view of a 5G wireless communication base station embodiment of the present invention;
FIG. 2 is an exploded view of an embodiment of a 5G wireless communication base station of the present invention;
fig. 3 is a schematic cross-sectional view of a 5G wireless communication base station according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 3, a 5G wireless communication base station is a square body, and includes an outer cover 1, an antenna 2, a filter 3, a shielding cover 4, a PCB 5 and a heat sink 6, which are vertically arranged in sequence. The radiator 6 comprises a radiating plate 61 and radiating teeth 62 extending from one surface of the radiating plate, and the outer cover 1 is covered on the radiating plate or the shielding cover of the radiator; the PCB 5 is arranged in a single layer and is attached to the other surface of the heat dissipation plate 6 (namely the smooth surface of the heat dissipation plate and the surface without the heat dissipation teeth), and the shield cover 4 covers the PCB 5 on the heat dissipation plate. The PCB board 5 may be a whole board or a combination of a plurality of small boards, and includes a power amplifier circuit, a digital intermediate frequency circuit, an optical module, a power module, and the like. The shield case 4 covers the PCB board 5 over the heat radiating plate 6. The PCB 5 comprises a power amplifier circuit, a digital intermediate frequency circuit, an optical module, a power module and the like, and can be a whole board and a heating panel which are jointed, or the whole board is divided into a plurality of small boards which are respectively jointed with the heating panel.
In the invention, because the PCB is arranged in a single layer and is attached to the heat dissipation plate, heat dissipated by the electronic components and the chips arranged on the PCB is dissipated through the heat dissipation plate and the heat dissipation teeth arranged on the back of the base station.
As shown in fig. 2 and 3, the PCB 5 is attached to the heat dissipating plate 61 of the heat sink 6, and the shield case 4 covers the PCB 5. The PCB 5 is provided with a plurality of electronic components and chips. The principle of the layout of the electronic components and the chips on the PCB 5 is as follows: on the premise that the thickness of the heat dissipation plate is as small as possible, the high-power device with large heat dissipation requirement can be attached to the heat dissipation plate. According to this principle, when the components and chips are arranged on the PCB 5, the high-power devices and electronic components having substantially the same thickness are arranged on the surface to be bonded to the heat dissipation plate. Generally, a chip and a component having a small thickness are arranged on one surface of a PCB to be bonded to a heat sink, and a component having a large thickness is arranged on the other surface of the PCB. Otherwise, if the chip and the component with large thickness difference are arranged on the surface attached with the heat dissipation plate, in order to ensure that each chip and component are attached with the heat dissipation plate for conduction and heat dissipation, the thickness of the heat dissipation plate needs to be locally increased, which can result in the increase of the volume and the weight of the whole base station.
The filter 3 is arranged on the shielding case 4, one end of each filter 3 is connected with the antenna 2 through a pin 32, and the other end of each filter 3 penetrates through the shielding case through another pin 33 to be connected with the PCB.
In some embodiments, the shielding case 4 may be formed by one-time die-casting with the filter 3, which is lighter in weight and smaller in size. And the layout of components with large thickness on the other surface of the PCB is staggered with the layout of the filter on the surface of the PCB. For example, in the case of two filters, the two filters are arranged on both sides, the middle part of the filter is raised to be equal to the height of the filter, and the component with a large thickness on the other surface of the PCB is accommodated in the cavity on the back of the raised part. In other embodiments, in the case that the shielding case 4 is not die-cast with the filter 3 at one time, the shielding case 4 may be made into a shape with a concave portion, a convex portion, or an alternating concave and convex portion, the concave portion is used for arranging the filter, and the convex portion is used for accommodating a component with a large thickness. Therefore, the thickness of the components on the other surface of the PCB is not overlapped with the thickness of the filter, so that the thickness of the whole base station is not increased.
The positions of the power module and the optical module are arranged on the edge below the PCB 5 and are arranged outwards, so that an air duct is not blocked, and heat dissipation is facilitated. In addition, the arrangement of the connectors such as the optical fiber plug 51 and the power plug 52 is shifted from the filter on the plate surface, so that the height of the connectors does not overlap with the height of the filter to increase the thickness of the entire base station. Connectors such as optical fiber sockets 51 and power sockets 52 are disposed at the lowermost portion of the base station, which facilitates installation and rain protection.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and such modifications and substitutions are intended to be included within the scope of the appended claims.

Claims (7)

1. A PCB layout method for a 5G wireless communication base station is characterized in that: based on the single-layer arrangement of the PCB and the bonding with the smooth surface of the heat dissipation plate, the high-power device and the electronic component with basically consistent thickness are arranged on the bonding surface of the PCB and the heat dissipation plate.
2. The PCB board arrangement method for a 5G wireless communication base station according to claim 1, wherein: the chip on the PCB and the electronic component close to the thickness of the chip are arranged on one surface of the PCB, which is attached to the heating panel, and the electronic component with the large difference in the thickness of the chip is arranged on the other surface of the PCB.
3. The PCB board arrangement method for a 5G wireless communication base station according to claim 2, wherein: the PCB cover is arranged in a space enclosed by the shielding cover and the heat dissipation plate, the shielding cover is provided with a filter, and a contact pin of the filter passes through the shielding cover and is electrically connected with the PCB.
4. The PCB board arrangement method for a 5G wireless communication base station according to claim 3, wherein: and the arrangement of the electronic components with large thickness on the other surface of the PCB is staggered with the arrangement of the filter on the surface of the PCB.
5. The PCB board arrangement method for a 5G wireless communication base station according to claim 3 or 4, wherein: the arrangement of the connectors of the PCB is staggered with the arrangement of the filters on the board surface.
6. The PCB board arrangement method for a 5G wireless communication base station according to claim 1, wherein: and the power module and the optical module on the PCB are arranged at the edge below the PCB and are arranged outwards.
7. The PCB board arrangement method for a 5G wireless communication base station according to claim 1, wherein: the PCB comprises a power amplifier circuit, a digital intermediate frequency circuit, an optical module and a power module, and is formed by bonding a whole board with a heat dissipation plate or bonding a plurality of small boards with the heat dissipation plate respectively.
CN202010069164.5A 2020-01-21 2020-01-21 PCB (printed circuit board) arrangement method for 5G wireless communication base station Active CN113225913B (en)

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CN202010069164.5A CN113225913B (en) 2020-01-21 2020-01-21 PCB (printed circuit board) arrangement method for 5G wireless communication base station

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Application Number Priority Date Filing Date Title
CN202010069164.5A CN113225913B (en) 2020-01-21 2020-01-21 PCB (printed circuit board) arrangement method for 5G wireless communication base station

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114096062A (en) * 2021-11-08 2022-02-25 信丰福昌发电子有限公司 PCB manufacturing process for 5G base station communication

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201797512U (en) * 2010-08-25 2011-04-13 福建三元达通讯股份有限公司 Wireless signal shielding device
CN102709262A (en) * 2012-06-06 2012-10-03 华为技术有限公司 Heat radiator shared by multiple chips and circuit board provided with same
CN202840556U (en) * 2012-07-30 2013-03-27 杨志军 Electrombile charger having heat radiation structure
CN105744654A (en) * 2016-01-04 2016-07-06 武汉虹信通信技术有限责任公司 Backpack mobile communication integrated base station structure
CN207732489U (en) * 2017-12-29 2018-08-14 深圳硕日新能源科技有限公司 A kind of solar controller with heat dissipation effect
CN109643705A (en) * 2018-10-31 2019-04-16 北京比特大陆科技有限公司 Circuit board and chip layout method calculate equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201797512U (en) * 2010-08-25 2011-04-13 福建三元达通讯股份有限公司 Wireless signal shielding device
CN102709262A (en) * 2012-06-06 2012-10-03 华为技术有限公司 Heat radiator shared by multiple chips and circuit board provided with same
CN202840556U (en) * 2012-07-30 2013-03-27 杨志军 Electrombile charger having heat radiation structure
CN105744654A (en) * 2016-01-04 2016-07-06 武汉虹信通信技术有限责任公司 Backpack mobile communication integrated base station structure
CN207732489U (en) * 2017-12-29 2018-08-14 深圳硕日新能源科技有限公司 A kind of solar controller with heat dissipation effect
CN109643705A (en) * 2018-10-31 2019-04-16 北京比特大陆科技有限公司 Circuit board and chip layout method calculate equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114096062A (en) * 2021-11-08 2022-02-25 信丰福昌发电子有限公司 PCB manufacturing process for 5G base station communication

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