WO2021185237A1

WO2021185237A1 - Circuit board assembly and electronic device

Info

Publication number: WO2021185237A1
Application number: PCT/CN2021/081029
Authority: WO
Inventors: 叶润清; 曲林; 洪伟强; 丁海幸
Original assignee: 华为技术有限公司
Priority date: 2020-03-20
Filing date: 2021-03-16
Publication date: 2021-09-23
Also published as: CN113498247A

Abstract

Disclosed is a circuit board assembly (13). The circuit board assembly (13) comprises a first circuit board (132), a second circuit board (134), a first shielding frame (133) and a conductive member (135), wherein the first circuit board (132) and the second circuit board (134) are stacked at an interval; the first shielding frame (133) is connected to the first circuit board (132) and the second circuit board (134); the periphery of the first shielding frame (133) comes into contact with the periphery of the first circuit board (132), or the periphery of the first shielding frame (133) is retracted into the periphery of the first circuit board (132) by a certain distance; the first circuit board (132), the second circuit board (134), and the first shielding frame (133) enclose to form a cavity (13a); and the conductive member (135) is arranged inside the cavity (13a) and is electrically connected to the first circuit board (132) and the second circuit board (134).

Description

Circuit board components and electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on March 20, 2020, the application number is 202010203169.2, and the application name is "Circuit Board Assembly and Electronic Equipment", the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the technical field of circuit board stacking, and in particular to a circuit board assembly and electronic equipment.

Background technique

With the gradual enrichment of functions and performance of mobile phones, more devices are required to be integrated on the circuit boards of mobile phones. In conventional mobile phones, there is only one layer of circuit boards, and devices can only be arranged in a plane direction. When the size of the structure is limited, it is difficult to increase the layout area of a single-layer circuit board, which restricts the improvement of device integration.

Summary of the invention

The present application provides a circuit board assembly and electronic equipment, which can improve the device integration of the circuit board.

In a first aspect, a circuit board assembly is provided, and the circuit board assembly can be installed in an electronic device. The circuit board assembly includes a first circuit board, a second circuit board, a first shielding frame and a conductive element; the first circuit board and the second circuit board are laminated at intervals, and the first shielding frame connects the first circuit board and the second circuit board , The periphery of the first shielding frame is in contact with the periphery of the first circuit board, or the periphery of the first shielding frame is retracted within a certain distance from the periphery of the first circuit board, the first circuit board, the second circuit board and the first shielding frame Enclosed into a cavity; the conductive element is arranged in the cavity and is electrically connected with the first circuit board and the second circuit board.

In this solution, the first circuit board and the second circuit board can be parallel or approximately parallel (the thickness directions of the two are the same or substantially the same), and the two overlap each other and have a gap. The shape of the first circuit board and the second circuit board And the relative size is not limited. Various devices can be arranged on the opposite sides of the first circuit board and the second circuit board.

The first shielding frame can be formed by connecting several segments of frame bodies end to end. The first shielding frame can also be a cylindrical structure with two ends open, and the two openings are respectively facing the first circuit board and the second circuit board. The periphery of the first shield frame may be substantially aligned with and contact the periphery of the first circuit board; or the periphery of the first shield frame may be located at a certain distance within the periphery (ie, contour boundary) of the first circuit board. The first shield frame is close to the end of the second circuit board, and the position on the second circuit board is not limited. For example, the periphery of this end is substantially aligned with and in contact with the periphery of the second circuit board; or the periphery of this end may be located on the second circuit board. A certain distance within the periphery of the circuit board.

The first circuit board, the second circuit board and the first shielding frame enclose a closed cavity (closed means that the cavity has no openings, and does not mean that it is airtight), and devices and conductive parts are arranged in the cavity. It can be used as a shielding cavity to electromagnetically shield the devices and conductive parts in it.

The conductive element is spaced apart from the first screen shield frame. There are a number of conductive channels (specific structures such as conductive lines, conductive pins, etc.) inside the conductive member, and the first circuit board and the second circuit board are conducted through the conductive channels to realize signal conduction of the entire circuit board assembly. The specific structure of the conductive element is not limited, as long as it can be electrically connected. The conductive element has a certain supporting effect on the first circuit board.

The circuit board assembly of the present application uses conductive elements to realize the stacking interval and electrical connection between the first circuit board and the second circuit board, which can utilize the thickness space of electronic equipment to increase the number of circuit boards, thereby increasing device layout area and improving device integration Spend. By arranging the first shielding frame near the edge of the first circuit board, the first shielding frame with greater structural strength can be used to support the first circuit board, avoiding stress failure at the edge of the first circuit board, and improving the mechanical performance of the circuit board assembly. reliability. Arranging the first shielding frame close to the edge of the first circuit board can not only ensure the electromagnetic shielding performance, but also improve the area utilization rate of the first circuit board and ensure the integration of devices. In addition, the thickness of the first shield frame is small (usually only 0.15 mm), and the area occupied by the first circuit board and the second circuit board is also small.

According to a possible implementation of the first aspect, the conductive member is a bumper plate, and the conductive member has a first surface facing the first circuit board and a second surface facing the second circuit board. Both surfaces have only one closed boundary, the first surface is welded to the first circuit board, and the second surface is welded to the second circuit board.

The bumper board may be a printed circuit board (Printed circuit board, PCB), which has the same or substantially the same structure as a conventional printed circuit board, and has internal wiring for electrical connection. Only one closed boundary means that the contour boundary of the elevated slab is a closed curve instead of containing two or more closed curves, that is, the elevated slab is a solid slab without holes. The shape of the pad can be designed as required, such as rectangular, cross-shaped, T-shaped or other irregular shapes.

The pad can be made by cutting the whole circuit substrate. Because it is a solid board, there is no need to remove unnecessary circuit substrate materials during cutting, so the waste of circuit substrate materials is small, and the area utilization rate of the circuit substrate is large. In addition, the solid pad occupies a small area of the first circuit board and the second circuit board, which can save area to arrange more devices. In addition, since the edge stress of the first circuit board is relatively large, the internal stress is relatively small. By placing the elevated board inside the first circuit board, the stress of the elevated board can be reduced, and the reliable operation of the elevated board can be ensured.

In other implementations, the conductive member may also be other block-shaped or plate-shaped components with electrical connection properties, for example, a ceramic substrate manufactured by a low-temperature co-fired ceramic (LTCC) process. The ceramic substrate It has conductive circuits; or punches holes in plastic or glass materials, and fills the holes with plate-shaped or block-shaped parts made of metal materials, where the metal materials are used to realize electrical connections. Alternatively, the conductive member may also be a non-plate-shaped conductive member such as a conductive post and a connector.

According to the first aspect, or any one of the implementations of the first aspect above, the conductive member includes a base, a first elastic leg, and a second elastic leg, and the first elastic leg is protrudingly provided on a surface of the base facing the first circuit board , The second spring leg is protrudingly provided on the surface of the base facing the second circuit board, the first spring leg and the second spring leg are electrically connected through the base, the first spring leg is electrically connected with the first circuit board, and the second spring leg is electrically connected with The second circuit board is electrically connected.

In this implementation, the conductive member can be referred to as a shrapnel plate. The base may be in a block shape or a plate shape, and has a circuit for signal conduction inside it; or, the base itself has no electrical connection performance, and it is only used to hold the first elastic leg and the second elastic leg. For a base with electrical connection performance, the first spring leg is electrically connected to the second spring leg through the base; for a base that only has a holding function, the first spring leg and the second spring leg can be opposite to the same spring leg Both ends. The first elastic leg and the second elastic leg can be welded or directly abutted with the corresponding circuit board to realize the conduction with the corresponding circuit board. There may be several first elastic feet and second elastic feet. The shape of the first elastic foot and the second elastic foot can be designed according to requirements, for example, a sheet shape.

In this implementation manner, a shrapnel board is used to realize the stacked interconnection of the first circuit board and the second circuit board, which provides another alternative solution for increasing the device layout area and improving the device integration. The electrical connection performance of the shrapnel board is reliable, and the signal stability of the entire circuit board assembly can be ensured. The structure and manufacturing process of the shrapnel plate are relatively simple, which is convenient for mass production and saves costs.

According to the first aspect, or any one of the implementations of the first aspect above, the surface of the first circuit board facing the base is recessed to form a first limiting groove, and the base partially extends into the first limiting groove; and/or A surface area of the second circuit board facing the base is recessed to form a second limiting groove, and the base part extends into the second limiting groove.

In this implementation manner, the specific shape of the first limiting slot and the specific position on the first circuit board can be designed as required, and are not limited. The base part protruding into the first limiting slot forms a fit with the first limiting slot to realize the limiting of the elastic plate and ensure that the first elastic leg can be reliably connected to the first circuit board. According to the position of the first limiting slot, the first elastic leg may be in the first limiting slot or outside the first limiting slot. The specific shape of the second limiting slot and the specific position on the second circuit board can be designed according to requirements, and are not limited. The base part that extends into the second limiting slot forms a fit with the second limiting slot to realize the limiting of the elastic plate and ensure that the second elastic leg can be reliably connected to the second circuit board. According to the position of the second limiting slot, the second elastic foot may be in the second limiting slot or outside the second limiting slot.

In this implementation manner, only any one of the first limiting slot and the second limiting slot needs to be opened, so that the base and the corresponding limiting slot form a limiting fit, and the purpose of stably corresponding to the spring foot can be achieved. This implementation mode can make the shrapnel plate more stably assembled, and ensure the reliability of the electrical connection.

According to the first aspect, or any one of the implementations of the first aspect above, the first spring leg is received in the first limiting slot and contacts the bottom wall of the first limiting slot; and/or, the second spring leg is received in Inside the second limiting groove and contacting the bottom wall of the second limiting groove. The first elastic leg and/or the second elastic leg are housed in the corresponding limit slot, which can ensure that the elastic leg is more stably connected with the corresponding circuit board, and the reliability of the electrical connection is improved.

According to the first aspect, or any one of the implementations of the first aspect above, the first shield frame is located between the first circuit board and the second circuit board, that is, the first shield frame is all located on the first circuit board and the second circuit board. Between the boards, it plays a role of supporting the first circuit board. Such a first shielding frame has a simple structure, good mechanical reliability and electromagnetic shielding performance, and can improve the mass production of circuit board components.

According to the first aspect, or any one of the implementations of the first aspect above, the first shield frame includes a first wall, a second wall, and a third wall, and the first wall, the second wall, and the third wall are formed by bending and connecting in sequence Step, the first wall surrounds the outside of the first circuit board, the second wall is supported on the periphery of the surface of the first circuit board facing the second circuit board, and the third wall is located between the first circuit board and the second circuit board.

In this implementation, the second wall is located between the first wall and the third wall, the first wall and the second wall can be bent and connected substantially perpendicularly, and the second wall and the third wall can be bent and connected substantially perpendicularly, thereby forming Steps. The first wall, the second wall and the third wall all surround a circle, and the opening enclosed by the first wall is larger than the opening enclosed by the third wall. This type of first shielding frame uses the first wall to limit the first circuit board, the second wall to carry the first circuit board, and the third wall to support the first circuit board, so that the first circuit board It is firmly installed without deviation, and the assembly strength of the first shield frame and the first circuit board is increased. Moreover, this kind of first shielding frame is convenient for arranging the connecting material (adhesive or solder) on the side of the first circuit board, which can reduce the occupation of the device layout area of the first circuit board, so that the saved area can be more arranged. Multiple devices, thus further improving the device integration of the first circuit board.

According to the first aspect, or any one of the implementations of the first aspect above, an end of the first wall away from the second wall protrudes from the surface of the first circuit board facing away from the second circuit board; the circuit board assembly includes a first shielding film, The first shielding film covers an end of the first wall away from the second wall and the first circuit board, and the first shielding film is opposite to the first circuit board at intervals.

The convex direction of the end of the first wall away from the second wall can be substantially perpendicular to the first circuit board, or form a suitable obtuse angle with the first circuit board, which facilitates the processing of the first shield frame and the installation of the first shielding film on the The end of the first wall away from the second wall. The first shielding film is thin and can be bent. The first shielding film is used for electromagnetic shielding. Since the first shielding film is suspended above the first circuit board, the area occupied on the surface of the first circuit board is reduced, so that more devices can be arranged in the saved area, thus further improving the device integration of the first circuit board. Spend.

According to the first aspect, or any implementation of the first aspect above, a positioning notch is provided on the first wall, and the positioning notch penetrates the first wall along the thickness direction of the first circuit board, and a positioning protrusion is formed on the side of the first circuit board. , The positioning protrusion is inserted into the positioning notch.

The positioning gap makes the first wall form a gap structure similar to a city wall. The shape, size, and number of the positioning gap are designed according to requirements, and the implementation manner is not limited. The side surface of the first circuit board refers to the surface connected between the device placement surfaces. The protrusion direction of the positioning protrusion on the side surface may be substantially perpendicular to the side surface, and the shape, size and number of the positioning protrusion are adapted to the shape, size and number of the positioning notch. A positioning protrusion is correspondingly inserted into a positioning notch.

When the first circuit board is installed on the step of the first shielding frame, the positioning notch can position the first circuit board, so that the first circuit board can be accurately placed in place. The matching structure of the positioning notch and the positioning protrusion can also increase assembly reliability and structural strength.

According to the first aspect, or any one of the implementations of the first aspect above, the first wall is provided with positioning protrusions protruding toward the surface of the first circuit board, the side surface of the first circuit board is recessed to form positioning grooves, and the positioning protrusions Insert the positioning groove.

In this implementation manner, the positioning protrusions can be substantially perpendicular to the surface of the first wall facing the first circuit board, and the shape, size and number of the positioning protrusions can be designed according to requirements and are not limited. The positioning protrusions can be evenly distributed and circle around. The shape, size and number of the positioning grooves are adapted to the shape, size and number of the positioning protrusions. A positioning protrusion is correspondingly inserted into a positioning notch. When the first circuit board is installed on the step of the first shielding frame, the positioning protrusion can position the first circuit board, so that the first circuit board can be accurately placed in place. The matching structure of the positioning protrusion and the positioning recess can also increase assembly reliability and structural strength. In addition, since there is no need to open a gap on the first shielding frame, the continuous airtightness of the first shielding frame can be maintained, and the electromagnetic shielding effect can be ensured.

According to the first aspect, or any one of the implementations of the first aspect above, the first shield frame includes a fourth wall and a fifth wall, the fourth wall and the fifth wall are bent and connected, and the fourth wall covers the first circuit board away from The peripheral edge of the surface of the second circuit board, and the fifth wall surrounds the outer periphery of the first circuit board.

In this implementation, the fourth wall and the fifth wall are bent and connected substantially perpendicularly. The fourth wall contacts the peripheral edge of the surface of the first circuit board away from the second circuit board and surrounds it. The fifth wall is located outside the first circuit board and surrounds the first circuit board. The opening enclosed by the fourth wall is smaller than that of the fifth wall. The enclosed opening. Thus, the first shield frame forms an inverted structure that is crimped on the first circuit board. Such a first shielding frame can better limit the first circuit board and increase the assembly strength of the first shielding frame and the first circuit board. And because the fifth wall is located outside the first circuit board, the position of the fifth wall on the second circuit board is also moved to the outside of the second circuit board, so that the first circuit board, the first shielding frame and the second circuit board are enclosed. The resulting cavity is larger, and more devices can be arranged in the cavity, thus improving the integration of devices in the cavity.

According to the first aspect, or any implementation of the first aspect above, the first shield frame includes a sixth wall, the sixth wall, the fourth wall, and the fifth wall are sequentially bent and connected to form a step, and the sixth wall protrudes from The surface of the first circuit board facing away from the second circuit board; the circuit board assembly includes a second shielding film, the second shielding film covers the end of the sixth wall away from the fourth wall and the first circuit board, the second shielding film and the first circuit board With intervals.

In this implementation manner, the sixth wall and the fifth wall are respectively located on opposite sides of the fourth wall, and the sixth wall and the fourth wall may be bent and connected substantially perpendicularly, or form a suitable obtuse angle. The sixth wall is located on the periphery of the surface. The second shielding film is thin and can be bent. The second shielding film is used for electromagnetic shielding. Since the second shielding film is suspended above the first circuit board, the area occupied by the surface of the first circuit board is reduced, so that more devices can be arranged in the saved area, thus further improving the device integration of the first circuit board Spend.

According to the first aspect, or any one of the implementations of the first aspect above, the first shield frame includes a connecting wall, the connecting wall and the fifth wall are connected by bending, the fifth wall is located between the connecting wall and the fourth wall, and the connecting wall It is laid on the second circuit board and fixedly connected with the second circuit board.

In this implementation, the connecting wall and the fifth wall can be bent and connected substantially perpendicularly, and contact the surface of the second circuit board facing the first circuit board. A number of connecting holes can be opened on the connecting wall, and a connecting piece (such as screws, bolts, rivets, etc.) can be installed in each connecting hole, and the connecting piece fixedly connects the connecting wall with the second circuit board. Through the locking of the connecting piece, the rebound force of the first elastic foot and the second elastic foot can be overcome, and the stable assembly of the first circuit board and the second circuit board can be ensured. Alternatively, a connecting material (such as glue or solder) may be used instead of the connecting piece to realize the connection between the second circuit board and the connecting wall, which can also ensure the stable assembly of the first circuit board and the second circuit board.

According to the first aspect or any one of the implementations of the first aspect above, the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and connected to the first shielding frame as a whole, and the second shielding frame is connected to the first shielding frame. A circuit board and a second circuit board are both connected, the second shielding frame separates the cavity into different sub-cavities, and the conductive element is arranged in one of the sub-cavities.

In this implementation, the second shielding frame is an open wall structure formed by successively connecting several sections of frame bodies, and the open end of the second shielding frame is connected to the first shielding frame (for example, to the third wall), so that the second shielding The frame and the first shield frame form an integrated shield frame. The addition of the second shielding frame can strengthen the electromagnetic shielding of the conductive parts in the cavity, and the integrated shielding frame has higher structural strength, can improve the assembly strength of the circuit board assembly, and can simplify the assembly difficulty of the circuit board assembly.

According to the first aspect, or any one of the implementations of the first aspect above, the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and spaced apart from the first shielding frame, and the second shielding frame is connected to the first shielding frame. The circuit board and the second circuit board are both connected, and the second shield frame surrounds the outer circumference of the conductive element.

In this implementation, the second shielding frame may be formed by connecting several frame bodies end to end, and the second shielding frame may be approximately a square cylindrical structure with open ends, and the two openings respectively face the first circuit board and the second circuit board. The second shielding frame encloses the conductive element to electromagnetically shield the conductive element and avoid mutual interference between the conductive element and other devices in the cavity. The split-type second shielding frame has good versatility and can be used in combination with the first shielding frame of any structure to ensure the mass production of circuit board components.

According to the first aspect, or any implementation manner of the first aspect above, the first shield frame is located between the first circuit board and the second circuit board, and the periphery of the first shield frame is in contact with the periphery of the first circuit board.

In this implementation manner, the first shield frame is all located between the first circuit board and the second circuit board, and plays a role of supporting the first circuit board. Such a first shielding frame has a simple structure, good mechanical reliability and electromagnetic shielding performance, and can improve the mass production of circuit board components. The periphery of the first shielding frame is in contact with the periphery of the first circuit board, that is, the periphery of the first shielding frame can be substantially aligned with and in contact with the periphery of the first circuit board, which can make the first circuit board facing the second circuit board more More area is used. Under the circumstance that the distance between the first circuit board and the second circuit board is unchanged, the space of the cavity is enlarged, so that more devices can be placed on the first circuit board and the cavity can be accommodated. More devices increase the integration level of devices. In addition, all the components on the first circuit board facing the second circuit board can be electromagnetically shielded by the first shielding frame, which ensures the electromagnetic shielding performance.

In a second aspect, an electronic device is provided. The electronic device includes a housing and a circuit board assembly, and the circuit board assembly is installed in the housing. The circuit board assembly includes a first circuit board, a second circuit board, a first shielding frame and a conductive element; the first circuit board and the second circuit board are laminated at intervals, and the first shielding frame connects the first circuit board and the second circuit board , The periphery of the first shielding frame is in contact with the periphery of the first circuit board, or the periphery of the first shielding frame is retracted within a certain distance from the periphery of the first circuit board, the first circuit board, the second circuit board and the first shielding frame Enclosed into a cavity; the conductive element is arranged in the cavity and is electrically connected with the first circuit board and the second circuit board.

In this solution, the first circuit board and the second circuit board are parallel or approximately parallel (the thickness directions of the two are the same or substantially the same), and the two overlap each other and have a gap. The shape and shape of the first circuit board and the second circuit board The relative size is not limited. Various devices can be arranged on the opposite sides of the first circuit board and the second circuit board.

The first shielding frame may be formed by connecting several sections of frame bodies end to end. The first shielding frame may be a cylindrical structure with openings at both ends, and the two openings respectively face the first circuit board and the second circuit board. The periphery of the first shield frame may be substantially aligned with and contact the periphery of the first circuit board; or the periphery of the first shield frame may be located at a certain distance within the periphery (ie, contour boundary) of the first circuit board. The first shield frame is close to the end of the second circuit board, and the position on the second circuit board is not limited. For example, the periphery of this end is substantially aligned with and in contact with the periphery of the second circuit board; or the periphery of this end may be located on the second circuit board. A certain distance within the periphery of the circuit board.

The circuit board assembly in the electronic device uses conductive parts to realize the stacking interval and electrical connection between the first circuit board and the second circuit board, which can use the thickness space of the electronic device to increase the number of circuit boards, thereby increasing the device layout area and improving the device Degree of integration. By arranging the first shielding frame near the edge of the first circuit board, the first shielding frame with greater structural strength can be used to support the first circuit board, avoiding stress failure at the edge of the first circuit board, and improving the mechanical performance of the circuit board assembly. reliability. Arranging the first shielding frame close to the edge of the first circuit board can not only ensure the electromagnetic shielding performance, but also improve the area utilization rate of the first circuit board and ensure the integration of devices. In addition, the thickness of the first shield frame is small (usually only 0.15 mm), and the area occupied by the first circuit board and the second circuit board is also small.

According to a possible implementation of the second aspect, the conductive member is a bumper plate, and the conductive member has a first surface facing the first circuit board and a second surface facing the second circuit board. Both surfaces have only one closed boundary, the first surface is welded to the first circuit board, and the second surface is welded to the second circuit board.

The pad can be made by cutting the whole circuit substrate. Because it is a solid board, there is no need to remove unnecessary circuit substrate materials during cutting, so the waste of circuit substrate materials is small, and the area utilization rate of the circuit substrate is large. In addition, the solid pad occupies a small area of the first circuit board and the second circuit board, which can save area to arrange more devices. In addition, since the edge stress of the first circuit board is relatively large, the internal stress is relatively small. By placing the elevated board inside the first circuit board, the stress in the elevated board can be reduced, and the reliable operation of the elevated board can be ensured.

According to the second aspect, or any implementation of the second aspect above, the conductive member includes a base, a first spring leg and a second spring leg, and the first spring leg is protrudingly provided on a surface of the base facing the first circuit board , The second spring leg is protrudingly provided on the surface of the base facing the second circuit board, the first spring leg and the second spring leg are electrically connected through the base, the first spring leg is electrically connected with the first circuit board, and the second spring leg is electrically connected with The second circuit board is electrically connected.

According to the second aspect, or any one of the implementations of the second aspect above, the first circuit board is recessed to form a first limiting groove on the surface of the first circuit board facing the base, and the base part extends into the first limiting groove; and/or A surface area of the second circuit board facing the base is recessed to form a second limiting groove, and the base part extends into the second limiting groove.

In this implementation manner, the specific shape of the first limiting slot and the specific position on the first circuit board can be designed as required, and are not limited. The base part protruding into the first limiting slot forms a fit with the first limiting slot to realize the limiting of the elastic plate and ensure that the first elastic leg can be reliably connected to the first circuit board. According to the position of the first limiting slot, the first elastic leg may be in the first limiting slot or outside the first limiting slot. The specific shape of the second limiting slot and the specific position on the second circuit board can be designed according to requirements, and are not limited. The base part that extends into the second limiting groove forms a fit with the second limiting groove to realize the limiting of the elastic plate and ensure that the second elastic leg can be reliably connected to the second circuit board. According to the position of the second limiting slot, the second elastic foot may be in the second limiting slot or outside the second limiting slot.

According to the second aspect, or any one of the implementations of the second aspect above, the first spring leg is received in the first limiting slot and contacts the bottom wall of the first limiting slot; and/or, the second spring leg is received in Inside the second limiting groove and contacting the bottom wall of the second limiting groove. The first elastic leg and/or the second elastic leg are housed in the corresponding limit slot, which can ensure that the elastic leg is more stably connected with the corresponding circuit board, and the reliability of the electrical connection is improved.

According to the second aspect, or any one of the implementations of the second aspect above, the first shield frame is located between the first circuit board and the second circuit board, that is, the first shield frame is all located between the first circuit board and the second circuit board. Between the boards, it plays a role of supporting the first circuit board. Such a first shielding frame has a simple structure, good mechanical reliability and electromagnetic shielding performance, and can improve the mass production of circuit board components.

According to the second aspect, or any one of the implementations of the second aspect above, the first shielding frame includes a first wall, a second wall, and a third wall, and the first wall, the second wall, and the third wall are sequentially bent and connected to form Step, the first wall surrounds the outside of the first circuit board, the second wall is supported on the periphery of the surface of the first circuit board facing the second circuit board, and the third wall is located between the first circuit board and the second circuit board.

According to the second aspect, or any one of the implementations of the second aspect above, an end of the first wall away from the second wall protrudes from the surface of the first circuit board facing away from the second circuit board; the circuit board assembly includes a first shielding film, The first shielding film covers an end of the first wall away from the second wall and the first circuit board, and the first shielding film is opposite to the first circuit board at intervals.

According to the second aspect, or any one of the implementations of the second aspect above, the first wall is provided with a positioning notch, the positioning notch penetrates the first wall along the thickness direction of the first circuit board, and a positioning protrusion is formed on the side of the first circuit board. , The positioning protrusion is inserted into the positioning notch.

The positioning gap makes the first wall form a gap structure similar to a city wall. The shape, size, and number of the positioning gap are designed according to requirements, and the implementation manner is not limited. The side surface of the first circuit board refers to the surface connected between the device placement surfaces. The protrusion direction of the positioning protrusion on the side surface may be substantially perpendicular to the side surface, and the shape, size and number of the positioning protrusion are adapted to the shape, size and number of the positioning notch. A positioning protrusion is correspondingly inserted into a positioning notch. When the first circuit board is installed on the step of the first shielding frame, the positioning notch can position the first circuit board, so that the first circuit board can be accurately placed in place. The matching structure of the positioning notch and the positioning protrusion can also increase assembly reliability and structural strength.

According to the second aspect, or any one of the implementations of the second aspect above, the first wall is convexly provided with positioning protrusions facing the surface of the first circuit board, the side surface of the first circuit board is recessed to form positioning grooves, and the positioning protrusions Insert the positioning groove.

According to the second aspect, or any implementation of the second aspect above, the first shield frame includes a fourth wall and a fifth wall, the fourth wall and the fifth wall are bent and connected, and the fourth wall covers the first circuit board away from The peripheral edge of the surface of the second circuit board, and the fifth wall surrounds the outer periphery of the first circuit board.

According to the second aspect, or any one of the implementations of the second aspect above, the first shield frame includes a sixth wall, the sixth wall, the fourth wall, and the fifth wall are sequentially bent and connected to form a step, and the sixth wall protrudes from The surface of the first circuit board facing away from the second circuit board; the circuit board assembly includes a second shielding film, the second shielding film covers the end of the sixth wall away from the fourth wall and the first circuit board, the second shielding film and the first circuit board With intervals.

According to the second aspect, or any implementation of the second aspect above, the first shield frame includes a connecting wall, the connecting wall and the fifth wall are connected by bending, the fifth wall is located between the connecting wall and the fourth wall, and the connecting wall It is laid on the second circuit board and fixedly connected with the second circuit board.

According to the second aspect, or any implementation of the second aspect above, the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and connected to the first shielding frame as a whole, and the second shielding frame is connected to the first shielding frame. A circuit board and a second circuit board are both connected, the second shielding frame separates the cavity into different sub-cavities, and the conductive element is arranged in one of the sub-cavities.

According to the second aspect, or any one of the implementations of the second aspect above, the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and spaced apart from the first shielding frame, and the second shielding frame is connected to the first shielding frame. The circuit board and the second circuit board are both connected, and the second shield frame surrounds the outer circumference of the conductive element.

According to the second aspect, or any implementation manner of the above second aspect, the first shield frame is located between the first circuit board and the second circuit board, and the periphery of the first shield frame is in contact with the periphery of the first circuit board.

In a third aspect, an electronic device is provided, including a housing and a circuit board assembly in any one of the implementation manners of the first aspect, the circuit board assembly being installed in the housing.

Description of the drawings

FIG. 1 is a schematic diagram of the overall structure of the electronic device of the first embodiment;

FIG. 2 is a schematic diagram of an exploded structure of the electronic device of FIG. 1;

3 is a schematic diagram of the overall structure of an electronic device in another embodiment;

4 is a schematic diagram of an exploded structure of the electronic device of FIG. 3;

5 is a schematic diagram of the assembly structure of the circuit board assembly in the electronic device of FIG. 2;

Fig. 6 is a schematic diagram of the A-A cross-sectional structure of the circuit board assembly in Fig. 5;

FIG. 7 is a schematic top view of the circuit board assembly in FIG. 6 after removing the outer shielding cover and the first circuit board;

FIG. 8 is a schematic top view of the structure of the conductive circuit board in another embodiment;

9-12 are schematic top views of the conductive circuit boards of other embodiments;

FIG. 13 is a schematic sectional view of a circuit board assembly in another solution;

14 is a schematic top view of the circuit board assembly in FIG. 13 after removing the outer shielding cover and the first circuit board;

15 is a schematic diagram of the three-dimensional structure of the first shielding frame in the second embodiment;

Fig. 16 is a partial enlarged schematic diagram of the structure at B in Fig. 15;

17 is a schematic diagram of the assembly structure of the circuit board assembly in the second embodiment;

Fig. 18 is a C-C cross-sectional structural diagram of the circuit board assembly of Fig. 17;

19 is a schematic diagram of the comparison of the connection design between the first circuit board and the first shielding frame in the first embodiment and the second embodiment;

20 is a schematic cross-sectional structure diagram of the circuit board assembly in the third embodiment;

21 is a schematic diagram of the three-dimensional structure of the first shield frame and the first circuit board in the circuit board assembly of the fourth embodiment;

22 is a top view assembly structure diagram of the first shield frame and the first circuit board in FIG. 21;

23 is a three-dimensional schematic diagram of the first shield frame and the first circuit board in the circuit board assembly of the fifth embodiment;

24 is a schematic diagram of a three-dimensional assembly structure of the first shield frame and the first circuit board in FIG. 23;

25 is a schematic diagram of the exploded structure of the circuit board assembly of the sixth embodiment;

26 is a schematic diagram of the assembly structure of the circuit board assembly of the sixth embodiment;

Fig. 27 is a D-D sectional structural diagram of the circuit board assembly of Fig. 26;

28 is a schematic diagram of the assembly structure of the circuit board assembly of the seventh embodiment;

Fig. 29 is an E-E sectional structure diagram of the circuit board assembly of Fig. 28;

30 is a schematic sectional view of the circuit board assembly of the eighth embodiment;

31 is a schematic top view of the circuit board assembly of FIG. 30 after removing the second shielding film and the first circuit board;

32 is a schematic diagram showing a cross-sectional structure of the circuit board assembly including an integrated shield frame in the third embodiment;

33 is a schematic top view of the circuit board assembly of FIG. 32 after removing the first shielding film and the first circuit board;

34 is a schematic sectional view of the circuit board assembly of the ninth embodiment;

35 is a schematic sectional view of the circuit board assembly of the tenth embodiment;

Fig. 36 is a schematic cross-sectional view of the circuit board assembly of the eleventh embodiment.

Detailed ways

The following embodiments of this application provide an electronic device, which includes but is not limited to mobile phones, tablets, wearable devices (including but not limited to smart watches, smart bracelets, wireless headsets, virtual reality glasses, virtual reality helmets, Smart clothing), e-readers, set-top boxes, routers, switches, etc. The electronic device may include a display screen (for example, a mobile phone, a tablet computer, etc.), or it may not have a display screen (for example, a wireless headset, a set-top box, etc.). In the following, the electronic device is a mobile phone as an example for description.

As shown in FIGS. 1 and 2, the electronic device 10 of the first embodiment may include a display screen 11, a middle frame 12, a circuit board assembly 13 and a rear case 14.

The middle frame 12 serves as the main structural bearing member of the electronic device 10 and is used to bear the above-mentioned other components. Mounting slots can be formed on opposite sides of the middle frame 12, the display screen 11 is installed in the mounting slot on one side of the middle frame 12, and the circuit board assembly 13 is installed in the mounting slot on the other side of the middle frame 12. The rear shell 14 covers the middle frame 12 and is located on the side of the middle frame 12 away from the display screen 11. The specific structure of the middle frame 12 and the rear shell 14 can be designed according to product requirements, which is not limited in the first embodiment. The middle frame 12 and the rear shell 14 constitute the housing of the electronic device. It should be understood that this is only an example. In other embodiments, the housing of the electronic device may also include other structural components.

The display screen 11 can be a flat 2D screen, or a curved screen such as a 2.5D screen (the display screen 11 has a flat middle part and curved parts connected to opposite sides of the middle part) or a 3D screen (in 2.5D On the basis of the screen, the middle part is also made into a curved surface). The display screen 11 may include a cover plate and a display panel, and the cover plate and the display panel are laminated. The cover is used to protect the display panel, and the display panel is used to display images. The display panel includes, but is not limited to, a liquid crystal display panel or an organic light emitting diode display panel. A touch unit can be integrated in the cover, that is, the cover has a touch function; or the display panel can have a built-in touch unit, that is, the display panel has both display and touch functions.

The electronic device 10 in the first embodiment is a non-folding mobile phone, and its display screen 11 is an unbendable hard screen. As shown in FIGS. 3 and 4, the difference from the first embodiment is that in other embodiments, the electronic device 20 may be a foldable mobile phone, and the display screen 24 thereof is a flexible screen that can be bent.

Exemplarily, as shown in FIGS. 3 and 4, the first housing 21 and the second housing 23 of the electronic device 20 are rotatably connected by a hinge 22. The hinge 22 may be a mechanism composed of several parts, capable of generating mechanism movement. Through the mechanism movement of the hinge 22, the first housing 21 and the second housing 23 can be moved closer or separated, so as to realize the folding or unfolding of the foldable mobile phone. The display screen 24 is installed on the first housing 21 and the second housing 23. When the foldable mobile phone is in the folded state, the display screen 24 can be housed between the first housing 21 and the second housing 23, that is, the foldable mobile phone is an inner folding screen mobile phone. In other embodiments, when the foldable mobile phone is in the folded state, the display screen 24 is located on the outside, and the first housing 21 and the second housing 23 are located on the inside, that is, the foldable mobile phone may be an outer folding screen mobile phone. For the foldable mobile phone, the circuit board assembly can be installed in the first housing 21 or the second housing 23, or both the first housing 21 and the second housing 23 are equipped with the circuit board assembly.

The following will take the electronic device 10 of the first embodiment as an example to continue to describe the solution of the embodiment of the present application.

As shown in FIGS. 5 and 6 (FIG. 6 is a cross-sectional view of AA in FIG. 5), the circuit board assembly 13 may include an outer shield 131, a first circuit board 132, a first shield frame 133, a second circuit board 134, and a guide The circuit board 135 is connected, the second circuit board 134 is close to the rear shell 14, and the outer shielding cover 131 is close to the middle frame 12. In other embodiments, according to the specific structure of the circuit board assembly 13, the circuit board assembly 13 can be assembled upside down in the casing, that is, the second circuit board 134 is close to the middle frame 12 and the outer shield 131 is close to the rear casing 14.

As shown in FIG. 6, the first circuit board 132 and the second circuit board 134 are stacked at intervals, that is, the first circuit board 132 and the second circuit board 134 are parallel or approximately parallel (the thickness directions of the two are the same or substantially the same). Overlap each other and have gaps. The first circuit board 132 and the second circuit board 134 may have the same or similar shapes, for example, both of them are rectangular. The outline boundary of the first circuit board 132 may completely fall within the outline boundary of the second circuit board 134, and the area of the first circuit board 132 may be smaller than the area of the second circuit board 134. Various components can be arranged on the first circuit board 132 and the second circuit board 134 as required. For example, the first circuit board 132 can be welded with chip a1 and device b1 on one side, and chip a2 and device b2 can be welded on the other side; the second circuit One side of the board 134 can be soldered with the chip a3, the device b3, and the device b4. Among them, the chip a1, chip a2, and chip a3 in FIG. 6 have relatively large volumes, and the circles between them and the corresponding circuit board represent solder ball s1, solder ball s2, and solder ball s3, respectively; device b1, device b2, and device b2. The device b3 and the device b4 are small in size, and the solder balls between them and the corresponding circuit board are not shown. It should be understood that this is only an illustration, in fact, devices can be arranged on two opposite sides of the first circuit board 132 and two opposite sides of the second circuit board 134.

In other embodiments, the shapes and relative sizes of the first circuit board 132 and the second circuit board 134 can be designed according to product requirements, and are not limited to the above. For example, the outline boundary of the first circuit board 132 may substantially coincide with the outline boundary of the second circuit board 134, and the areas of the two may be approximately equal; or, the outline boundary of the second circuit board 134 may completely fall on the first circuit board 132. Within the outline boundary of, the area of the first circuit board 132 may be larger than the area of the second circuit board 134. The first circuit board 132 and/or the second circuit board 134 may have an irregular shape. In addition, the circuit board assembly 13 may also include a larger number of circuit boards (for example, at least three), all the circuit boards are stacked in sequence at intervals, and every two adjacent circuit boards are connected by the first shield frame 133, the uppermost layer An external shield 131 is installed on the circuit board.

As shown in FIGS. 5 and 6, the outer shielding cover 131 may be a cover-like structure with an open inner cavity, and the inner cavity has an opening. The outer shielding cover 131 is mounted on the first circuit board 132, and the opening faces the first circuit board. 132. The outer shield 131 and the first circuit board 132 can be welded or bonded. The outer shield 131 is used to electromagnetically shield the devices on the first circuit board 132. The boundary of the opening of the outer shielding cover 131 can be as close as possible to the outline boundary of the first circuit board 132 to enclose more devices that need to be shielded in the outer shielding cover 131. For example, the boundary of the opening of the outer shielding cover 131 may also be substantially aligned with the outline boundary of the first circuit board 132. The specific shape of the outer shield 131 is not limited, for example, it may be square. The outer shielding cover 131 may be made of metallic materials, or may be made of non-metallic materials with a conductive plating layer added on the surface to have electromagnetic shielding performance. According to product requirements, the external shielding cover 131 may not be provided.

As shown in FIGS. 5-7, the first shield frame 133 is supported between the first circuit board 132 and the second circuit board 134, and is connected to both the first circuit board 132 and the second circuit board 134. The connection between the first shield frame 133 and the first circuit board 132 and the second circuit board 134 may be welding or bonding. The first shield frame 133 may be formed by connecting several sections of frame bodies (for example, four sections of frame bodies) end to end. The first shield frame 133 may be approximately a square cylindrical structure with open ends, and the two openings face the first circuit board 132 and The second circuit board 134. One end (the upper end in the viewing angle of FIG. 6) of the first shield frame 133 may be located on the periphery of the first circuit board 132, and the contour boundary of this end is close to the contour boundary of the first circuit board 132. The other end (the lower end in the viewing angle of FIG. 6) of the first shield frame 133 can be retracted within the contour boundary of the second circuit board 134, and the contour boundary of the other end has a certain distance from the contour boundary of the second circuit board 134.

As shown in FIGS. 6 and 7, the first shielding frame 133, the first circuit board 132 and the second circuit board 134 enclose a cavity 13a, and all the devices on the side of the first circuit board 132 facing the second circuit board 134 are connected. Parts of the circuit board 135 and the second circuit board 134 facing the first circuit board 132 are all arranged in the cavity 13a (the second circuit board 134 facing the first circuit board 132 can also be arranged with devices, and these devices can be placed in the cavity 13a. Body 13a outside). The first shield frame 133 is used to electromagnetically shield the devices in the cavity 13a. The first shielding frame 133 may be made of metallic materials, or may be made of non-metallic materials with conductive plating added on the surface to achieve electromagnetic shielding. Since the wall of the first shielding frame 133 is continuous and airtight, it can better shield the electromagnetic wave energy inside and outside the cavity 13a, and thus has better electromagnetic shielding performance.

As shown in FIGS. 6 and 7, the upper end of the first shield frame 133 may be disposed at the periphery of the first circuit board 132 so that more area on the first circuit board 132 facing the second circuit board 134 can be used. Under the condition that the distance between the first circuit board 132 and the second circuit board 134 remains unchanged, the space of the cavity 13a is enlarged, so that more devices can be arranged on the first circuit board 132, and the cavity 13a can accommodate More devices increase the integration level of devices. Exemplarily, as shown in FIG. 6, the outer edge of the first shielding frame 133 is substantially aligned with the outer edge of the first circuit board 132. In this case, all the devices on the first circuit board 132 facing the second circuit board 134 can be electromagnetically shielded by the first shield frame 133.

Optionally, the upper end of the first shielding frame 133 may also be retracted within the outline boundary of the first circuit board 132, that is, the upper end of the first shielding frame 133 may be at a distance from the periphery of the first circuit board 132. A certain distance, the value of the distance can be selected according to specific conditions (for example, it can be 0.1mm-0.5mm), which is not limited in this application. Devices can also be arranged on the side of the first circuit board 132 facing the second circuit board 134 and located outside the cavity 13a as required.

In other embodiments, the first shield frame 133 may have other suitable shapes. The lower end of the first shield frame 133 may also be located on the periphery of the second circuit board 134, and at this time, all the devices on the side of the second circuit board 134 facing the first circuit board 132 are located in the cavity 13a.

As shown in FIGS. 6 and 7, the conductive circuit board 135 is disposed in the cavity 13a. The conductive circuit board 135 can be a raised board, and the raised board can be a printed circuit board (Printed circuit board, PCB), which has the same or basically the same structure as a conventional printed circuit board, and has internal components for electrical connection.的线。 The routing. Alternatively, the conductive circuit board 135 may also be other block-shaped or plate-shaped components with electrical connection properties, such as a ceramic substrate manufactured by using a low-temperature co-fired ceramic (LTCC) process, and the ceramic substrate has Conductive circuit; or punch a hole in a plastic or glass material, and fill the hole with a plate-shaped or block-shaped component made of metal material, where the metal material is used to realize electrical connection. The conductive circuit board 135 has a first surface 135 a and a second surface 135 b. The first surface 135 a faces the first circuit board 132, and the second surface 135 b faces the second circuit board 134. Both the first surface 135a and the second surface 135b are provided with a number of pads. The pads on the first surface 135a are soldered to the first circuit board 132, and the pads on the second surface 135b are soldered to the second circuit board 134. Wherein, the circle between the first surface 135a and the first circuit board 132 in FIG. 6 represents the solder ball s5, and the circle between the second surface 135b and the second circuit board 134 represents the solder ball s4. As a result, the first circuit board 132 and the second circuit board 134 are electrically connected through the conductive circuit board 135 to realize signal conduction of the entire circuit board assembly 13.

In other embodiments, other conductive elements can also be used instead of the conductive circuit board 135. The conductive element has an electrical connection function to conduct the circuit board 135, and its shape is not limited. For example, the conductive member may be a conductive post, a connector, or the like.

In the first embodiment, the conductive circuit board 135 is a solid board without holes, and both the first surface 135a and the second surface 135b have only one closed boundary, and the closed boundary means that the contour boundary is a closed curve. For a conductive circuit board containing a hole, the edge of the hole and the boundary of the conductive circuit board outline are both closed curves, so the number of closed boundaries of the conductive circuit board is at least two.

For example, the conductive circuit board 135 shown in FIG. 7 may be a rectangular solid board, and its first surface 135a has only one closed boundary, and the closed boundary encloses a rectangle (the blocked second surface 135b also has only one closed boundary, and the closed boundary Enclose the same rectangle).

Or as shown in FIG. 8, the conductive circuit board 135 may be a cross-shaped solid board, and the widths of the upper, lower, left, and right parts of the cross-shaped solid board are substantially the same. The first surface 135a of the conductive circuit board 135 has only one closed boundary, which encloses a cross-shaped area (the blocked second surface 135b also has only one closed boundary that encloses the cross-shaped area). Or as shown in FIG. 9, the conductive circuit board 135 may also be a cross-shaped solid board. However, the difference from FIG. 8 is that the left and right parts of the conductive circuit board 135 are basically the same width and the smallest, the upper part has a larger width, and the lower part has the largest width. Or as shown in FIG. 10, the conductive circuit board 135 may also be a cross-shaped solid board. However, the difference from FIG. 8 is that the left and right parts of the conductive circuit board 135 are basically the same width and smaller, and the width of the upper and lower parts is basically the same and larger.

Or as shown in FIG. 11, the conductive circuit board 135 can be a T-shaped solid board, and the first surface 135a of the conductive circuit board 135 has only one closed boundary, which encloses a T-shaped area (the second surface 135b that is blocked) There is also only one closed boundary, which also encloses a T-shaped area).

Or as shown in FIG. 12, the conductive circuit board 135 can be an irregularly shaped solid board, and the first surface 135a of the conductive circuit board 135 has only one closed boundary, and the closed boundary encloses an irregularly shaped area (the blocked first surface). The two surfaces 135b also have only one closed boundary, and the closed boundary also encloses the irregularly shaped area).

It should be understood that the shape of the conductive circuit board 135 shown in FIGS. 7 to 12 is only an example, and the specific shape of the conductive circuit board 135 can be designed according to requirements, and is not limited to the above.

The conduction circuit board 135 can be made by cutting a whole circuit substrate. In the process design, a pattern of the connection mode of the conduction circuit board 135 can be drawn on the pattern of the whole circuit substrate. The splicing mode pattern can be called a conduction circuit. The imposition style of board 135. The design shape and imposition style of the conductive circuit board 135 will affect the number of cuts of the conductive circuit board 135 and the effective utilization area of the circuit substrate. For example, consider the cutting process of a conductive circuit board with holes: first cut out a solid prefabricated board from the circuit substrate, and then remove the internal area of the prefabricated board to obtain the conductive circuit board with holes. It can be seen that the conductive circuit board with holes wastes a large area of the circuit substrate, resulting in a smaller effective area of the circuit substrate. On the contrary, the solid conductive circuit board 135 of the first embodiment does not need to remove the internal area when cutting, so that the effective use area of the circuit board is larger. After comprehensively considering the design shape of the conductive circuit board 135 and the imposition style of the conductive circuit board 135, the solution of the first embodiment can cut the largest number of conductive circuit boards 135 on the circuit board, so that the circuit board can be effectively used Maximize the area and save costs.

Figures 13 and 14 respectively show a cross-sectional structure and a top view structure of the circuit board assembly 13' in other solutions. As shown in Figs. 13 and 14, the first circuit board 132 and the second circuit board 134 of the circuit board assembly 13' are laminated and spaced apart, and the conductive circuit board 135' is supported between the two. There is a conductive material (for example, copper wire) in the conductive circuit board 135', through which the first circuit board 132 and the second circuit board 134 can be electrically connected. An insulating material (for example, resin) is filled between the conductive material, and the insulating material allows electromagnetic waves to pass through. The conduction circuit board 135' is not a solid board, and there are through holes h1 and h2 opened thereon. The through holes h1 and the through holes h2 are both located inside the conduction circuit board 135', so that the periphery of the conduction circuit board 135' is connected to The first circuit board 132 and the second circuit board 134 are connected, and the inside of the conductive circuit board 135 ′ is also connected to the first circuit board 132 and the second circuit board 134. Such a conductive circuit board 135' is also called a frame board. The devices (such as chip a2, chip a3, device b2, device b3, and device b4) in the circuit board assembly 13' can be respectively arranged in the area where the through hole h1 is located and the area where the through hole h2 is located.

The disadvantages of the solutions shown in Figures 13 and 14 are as follows: 1. Due to the structure of the conductive circuit board 135', electromagnetic waves will leak, resulting in the conductive circuit board 135' being unable to be distributed on the first circuit board 132 and the second circuit board The components between 134 are effectively electromagnetic shielded, which affects the performance of the circuit board assembly 13'. 2. Generally, the edge stress of the first circuit board 132 is relatively large, and the internal stress is relatively small. However, in this solution, the peripheral edge of the conductive circuit board 135' is connected to the edge of the first circuit board 132, so that the stress of the conductive circuit board 135' is relatively large, which easily causes the conductive circuit board 135' to fail and affect the electrical connection performance. The structural strength of the conductive circuit board 135' is relatively weak. Using only the conductive circuit board 135' to support the first circuit board 132 and the second circuit board 134 will cause excessive stress on the circuit board assembly 13' and poor mechanical reliability. . 3. The width of the connecting portion between the conductive circuit board 135' and the first circuit board 132 and the second circuit board 134 (in the viewing angles of FIG. 13 and FIG. 14, the width is the dimension in the left and right directions) is usually larger (for example, up to 2mm) ), which greatly occupies the area of the first circuit board 132 and the second circuit board 134, causing no more devices to be arranged on the first circuit board 132 and the second circuit board 134. 4. Since the conductive circuit board 135' has holes, it is necessary to waste a portion of the circuit substrate area when cutting the conductive circuit board 135' from the circuit substrate, resulting in a smaller effective area of the circuit substrate and increasing costs.

The solution of the first embodiment realizes the stacked spacing arrangement of the first circuit board 132 and the second circuit board 134 by conducting the circuit board 135, which can use the thickness space of the electronic device 10 to increase the number of circuit boards, thereby increasing the device layout area and improving the device Degree of integration. And compared with the solutions shown in FIG. 13 and FIG. 14, the solution of the first embodiment has the following advantages: 1. The first shielding frame 133 is used to connect the first circuit board 132 and the second circuit board 134, because the first shielding frame 133 The continuous and closed wall structure can well shield the electromagnetic wave energy inside and outside the cavity 13a without electromagnetic wave leakage. Therefore, electromagnetic shielding can be better realized and the electrical performance of the circuit board assembly 13 can be ensured. 2. By arranging the first shield frame 133 on the edge of the first circuit board 132, the first shield frame 133 with greater structural strength can be used to support the first circuit board 132 to avoid stress failure on the edge of the first circuit board 132. The mechanical reliability of the circuit board assembly 13 is improved; by arranging the conductive circuit board 135 inside the first circuit board 132, the stress in the conductive circuit board 135 can be reduced, and the reliable operation of the conductive circuit board 135 can be ensured. Moreover, as described above, arranging the first shield frame 133 on the edge of the first circuit board 132 can not only ensure the electromagnetic shielding performance, but also improve the area utilization rate of the first circuit board 132 and ensure the integration of devices. 3. The thickness of the first shielding frame 133 (in the view of FIG. 6 and FIG. 7, the thickness is the size in the left and right direction) is small (usually only 0.15 mm), which affects the first circuit board 132 and the second circuit board 134 The area occupancy is also smaller; compared to the solutions in Figures 13 and 14, after the conduction circuit board 135 changes its shape, the area occupied by the first circuit board 132 and the second circuit board 134 is also reduced, which can save area for more layout. Multiple devices. 4. When the solid conductive circuit board 135 is cut out on the circuit board, the area waste of the circuit board is reduced, the effective area of the circuit board can be improved, and the cost can be saved.

In the second embodiment, different from the above-mentioned first embodiment, the first shielding frame can form a bearing platform structure, which is partly located between the first circuit board and the second circuit board, and partly surrounds the outer periphery of the first circuit board. To support the first circuit board. This will be described in detail below.

As shown in FIGS. 15-18 (FIG. 16 is a partial enlarged schematic view at B in FIG. 15, and FIG. 18 is a CC cross-sectional view of the circuit board assembly 23 in FIG. 17), the first shield frame 233 in the second embodiment can be It includes a first wall 234, a second wall 235, and a third wall 236. The second wall 235 is located between the first wall 234 and the third wall 236. The first wall 234 and the second wall 235 are substantially vertically bent and connected. The wall 235 and the third wall 236 are bent and connected substantially perpendicularly, thereby forming a step. The first wall 234, the second wall 235 and the third wall 236 all surround a circle, and the opening enclosed by the first wall 234 is larger than the opening enclosed by the third wall 236. In other embodiments, the bending angle between the first wall 234 and the second wall 235, and the second wall 235 and the third wall 236 can be designed as required, and is not limited to a right angle, such as 135 degrees or 120 degrees, etc. .

As shown in FIG. 17 and FIG. 18, the first wall 234 surrounds the outer circumference of the first circuit board 132, and the end of the first wall 234 away from the second wall 235 can be substantially flush with the upper surface of the first circuit board 132; second The wall 235 carries the first circuit board 132, the second wall 235 is in contact with the surface of the first circuit board 132 facing the second circuit board 134; the third wall 236 is located between the first circuit board 132 and the second circuit board 134, It supports the first circuit board 132 and the outer shield 131. This design of the first shield frame 233 can better limit the first circuit board 132, and the limit refers to limiting the freedom of movement of the first circuit board 132, so that it can be installed stably without deviation. The limit does not specifically refer to the size of the gap between the first shield frame 233 and the first circuit board 132. The gap between the first shield frame 233 and the first circuit board 132 may be substantially zero or a certain value. The limit design of the first shield frame 233 to the first circuit board 132 can increase the assembly strength of the first shield frame 233 and the first circuit board 132.

19 shows the connection design of the first circuit board 132 and the first shielding frame 133 in the first embodiment and the connection design of the first circuit board 132 and the first shielding frame 233 in the second embodiment respectively in a comparative form. The upper diagram of 17 shows the scheme of the first embodiment, and the lower diagram of FIG. 17 shows the scheme of the second embodiment.

In the first embodiment, the lower surface 132a of the first circuit board 132 (the surface facing the second circuit board 134) and the first shield frame 133 are connected by glue or solder (hereinafter referred to as the connecting material L). For the requirement of reliable assembly, the width of the connecting material L should be greater than the width of the first shield frame 133, and both ends of the connecting material L need to exceed the first shield frame 133 by a certain distance. Therefore, the first shield frame 133 needs to fall on the first shield frame 133. Within the outline boundary of the circuit board 132.

In the second embodiment, since the first shield frame 233 has a platform structure, the side surface of the first circuit board 132 can be expanded into a connection position, so both the side surface and the lower surface 132a of the first circuit board 132 can be connected to the first circuit board 132 through the connecting material L. A shield frame 233 is connected to ensure reliable assembly. Based on this, the connection position of the first shield frame 233 on the lower surface 132a of the first circuit board 132 can move a certain distance t to the outside of the first circuit board 132, which will not affect the assembly strength, but can reduce the The area of the lower surface 132a of a circuit board 132 is occupied. The saved area can be used to arrange more devices. Therefore, the solution of the second embodiment can further improve the device integration of the first circuit board 132. Of course, the connecting material L in the second embodiment can only be provided on the side surface of the first circuit board 132, and the first shield frame 233 is only connected to the side surface of the first circuit board 132.

As shown in FIG. 20, different from the solution of the second embodiment, in the circuit board assembly 33 in the third embodiment, the end of the first wall 334 of the first shield frame 333 away from the second wall 235 can protrude from the first wall 235. On the upper surface of a circuit board 132 (that is, the surface of the first circuit board 132 facing away from the second circuit board 134), the circuit board assembly 33 uses the first shielding film 331 instead of the outer shielding cover. Wherein, the first shielding film 331 is connected to the protruding end of the first wall 334, and the first shielding film 331 covers the first circuit board 132 and is spaced and opposed to the first circuit board 132. The first shielding film 331 is thin and can be bent. The first shielding film 331 is used for electromagnetic shielding, and the structure of the first shielding film 331 can be, for example, copper as a substrate, and an insulating plating layer is made on the surface of the copper substrate. Of course, other materials and processes that meet electromagnetic shielding requirements can also be used to manufacture the first shielding film 331. Since the first shielding film 331 is suspended above the first circuit board 132, the area occupied by the upper surface of the first circuit board 132 is reduced, so that more devices can be arranged in the saved area, thereby further improving the first circuit The device integration of the board 132.

As shown in FIG. 21 and FIG. 18, in the fourth embodiment, the structure of the first shield frame 433 is the same as the main structure of the first shield frame 233 in the second embodiment. The first wall 434 of the first shield frame 433 corresponds to the first wall 234 of the first shield frame 233, and the second wall 435 of the first shield frame 433 corresponds to the second wall 235 of the first shield frame 233. The first wall 434 and the second wall 435 are bent and connected substantially perpendicularly, and both the first wall 434 and the second wall 435 surround a circle. As shown in FIG. 21 and FIG. 22, the first wall 434 surrounds the outer circumference of the first circuit board 132, and the end of the first wall 434 away from the second wall 435 can be substantially flush with the upper surface 432b of the first circuit board 432; The second wall 435 carries the first circuit board 432, and the second wall 435 is in contact with the lower surface 432 c of the first circuit board 432 facing the second circuit board 134. In other embodiments, the bending angle between the first wall 434 and the second wall 435 can be designed as required, and is not limited to a right angle, for example, it can be 135 degrees or 120 degrees.

As shown in FIG. 21 and FIG. 22, different from the above-mentioned second embodiment, the first wall 434 of the first shield frame 433 can be provided with a number of positioning notches 434a, and the shape (for example, rectangular) and size of the positioning notches 434a can be Consistently, the positioning notches 434a can be evenly distributed and circle around. The positioning notch 434a may penetrate through the end of the first wall 434 connected to the second wall 435, and the end of the first wall 434 away from the second wall 435, that is, the positioning notch 434a may be along the thickness direction of the first circuit board 432 (the viewing angle of FIG. 19 The vertical direction) penetrates the first wall 434. A plurality of positioning protrusions 432a are formed on the side of the first circuit board 432, and the shape, size and interval of the positioning protrusions 432a are adapted to the positioning notches 434a, and one positioning protrusion 432a is correspondingly inserted into a positioning notch 434a. When the first circuit board 432 is installed on the step of the first shielding frame 433, the positioning notch 434a can position the first circuit board 432, so that the first circuit board 432 can be accurately placed in place. The mating structure of the positioning notch 434a and the positioning protrusion 432a can also increase assembly reliability and structural strength. It can be understood that the number of positioning notches 434a and positioning protrusions 432a can be designed according to assembly requirements, and is not limited to multiple, for example, it can be at least one.

In the fourth embodiment, the connecting material may be distributed at the mating place of the first circuit board 432 and the first shield frame 433. For example, as shown in FIGS. 21 and 22, the connecting material (such as glue or solder, represented by black shading) can be distributed on the surface of the positioning notch 434a, and the surface of the positioning notch 434a is connected to the corresponding surface of the positioning protrusion 432a; and /Or, the connecting material may be distributed on the top surface 434b of the first wall 434 and the upper surface 432b of the first circuit board 432 to connect the top surface 434b with the upper surface 432b. The above list is just an example. In fact, according to product requirements, the connecting material can be distributed on the upper surface 432b, the lower surface 432c and the side surface 432d of the first circuit board 432 (the side surface 432d refers to the connection between the upper surface 432b and the lower surface 432c). The upper surface 432b, the side surface 432d, and the lower surface 432c all include the corresponding surfaces of the positioning protrusions 432a. In the fourth embodiment, since the connection position is on the side of the first circuit board 432, the device layout area of the first circuit board 432 is not occupied or less occupied, and the device integration of the first circuit board 432 can be ensured.

In the fourth embodiment, the first shielding film may also be used to replace the external shielding cover, thereby reducing the area occupied by the upper surface 432b of the first circuit board 432, and further improving the device integration of the first circuit board 432. That is, similar to the third embodiment, the end of the first wall 434 of the first shielding frame 433 in the fourth embodiment can also protrude from the upper surface 432b of the first circuit board 432, and the first shielding film and the first wall 434 The protruding end is connected, and the first shielding film covers the first circuit board 432 and is spaced and opposed to the first circuit board 432. Of course, the design using the first shielding film is not necessary.

As shown in FIGS. 23 and 24, in the fifth embodiment, the difference from the fourth embodiment above is that the first wall 534 of the first shield frame 533 does not form a positioning gap, but the inner surface of the first wall 534 is convexly spaced. There are a number of positioning protrusions 534a, the shape and size of the positioning protrusions 534a can be consistent, and the positioning protrusions 534a can be evenly distributed and circle around. Correspondingly, a number of positioning grooves 532 a are provided on the side of the first circuit board 532, and each positioning groove 532 a penetrates the first circuit board 532 along the thickness direction of the first circuit board 532. The shape, size and interval of the positioning groove 532a are adapted to the positioning protrusion 534a, and a positioning protrusion 534a is correspondingly inserted into a positioning groove 532a. When the first circuit board 532 is mounted on the step of the first shielding frame 533, the positioning protrusion 534a can position the first circuit board 532 so that the first circuit board 532 can be accurately placed in place. The mating structure of the positioning protrusion 534a and the positioning groove 532a can also increase assembly reliability and structural strength. It can be understood that the number of positioning protrusions 534a and positioning grooves 532a can be designed according to assembly requirements, and is not limited to multiple, for example, it can be at least one. Since the solution of the fifth embodiment does not need to open a gap on the first shield frame 533, the continuous airtightness of the first shield frame 533 can be maintained, and the electromagnetic shielding effect is better.

In the fifth embodiment, the connecting material may be distributed on the side of the first circuit board 532. According to product requirements, the connecting material can be distributed on at least one of the upper surface 532b, the lower surface 532c, and the side surface 532d of the first circuit board 532 (the side surface 532d refers to the surface connected between the upper surface 532b and the lower surface 532c), wherein The side surface 532d includes the surface of the positioning groove 532a. This design does not occupy or occupy less of the device layout area of the first circuit board 532, and can ensure the device integration of the first circuit board 532.

In the fifth embodiment, the first shielding film can also be used to replace the external shielding cover, thereby reducing the area occupied by the upper surface of the first circuit board 532 and further improving the device integration of the first circuit board 532. That is, similar to the third embodiment, the end of the first wall 534 of the first shielding frame 533 in the fifth embodiment can also protrude from the upper surface of the first circuit board 532, and the first shielding film and the first wall 534 protrude. The one end is connected, and the first shielding film covers the first circuit board 532 and is opposed to the first circuit board 532 at intervals. Of course, the design using the first shielding film is not necessary.

In the sixth embodiment, different from the above-mentioned second embodiment, the first shielding frame forms an inverted structure and is buckled on the periphery of the first circuit board. This will be described in detail below.

As shown in FIGS. 25, 26 and 27, in the circuit board assembly 63 of the sixth embodiment, the first shielding frame 633 may include a fourth wall 634 and a fifth wall 635, and the fourth wall 634 and the fifth wall 635 are substantially perpendicular Bend connection. The fourth wall 634 contacts and surrounds the periphery of the upper surface of the first circuit board 132 (the surface of the first circuit board 132 away from the second circuit board 134), and the fifth wall 635 is located outside the first circuit board 132 and surrounds the first circuit board 132. The circuit board 132 is round, and the opening enclosed by the fourth wall 634 is smaller than the opening enclosed by the fifth wall 635. As a result, the first shield frame 633 forms an inverted structure that is crimped on the first circuit board 132. In other embodiments, the bending angle of the fourth wall 634 and the fifth wall 635 can be designed as required, and is not limited to a right angle, for example, it can be 135 degrees or 120 degrees.

The first shield frame 633 of the sixth embodiment can better limit the first circuit board 132 and increase the assembly strength of the first shield frame 633 and the first circuit board 132. And compared to the second embodiment, the fifth wall 635 in the sixth embodiment is located outside the first circuit board 132, and the position of the fifth wall 635 on the second circuit board 134 is also moved to the outside of the second circuit board 134, so that The cavity 63a enclosed by the first circuit board 132, the first shielding frame 633, and the second circuit board 134 is larger, and more devices can be arranged in the cavity 63a, thereby improving the integration of devices in the cavity 63a.

As shown in FIGS. 28 and 29, based on the solution of the sixth embodiment, in the circuit board assembly 73 of the seventh embodiment, the first shielding frame 733 may further include a sixth wall 734, and the sixth wall 734 and the fifth wall 635 are respectively Located on opposite sides of the fourth wall 634, the sixth wall 734 and the fourth wall 634 are bent and connected substantially perpendicularly. The sixth wall 734 protrudes from the upper surface of the first circuit board 132 and is located at the periphery of the upper surface. As shown in FIG. 27, the circuit board assembly 73 uses a second shielding film 735 instead of an external shielding cover. The second shielding film 735 covers the top end of the sixth wall 734 (that is, the end of the sixth wall 734 away from the fourth wall 634), and Cover the first circuit board 132. The second shielding film 735 is opposed to the first circuit board 132 at intervals. The second shielding film 735 is thin and can be bent. The second shielding film 735 is used for electromagnetic shielding. The structure of the second shielding film 735 can be, for example, using copper as a substrate and an insulating coating on the surface of the copper substrate. Of course, other materials and processes that meet the requirements of electromagnetic shielding can be used to manufacture the second shielding film 735, which is not limited in this application. Since the second shielding film 735 is suspended above the first circuit board 132, the area occupied by the upper surface of the first circuit board 132 is reduced, so that more devices can be arranged in the saved area, thereby further improving the first circuit The device integration of the board 132.

As shown in Figs. 30 and 31 (Fig. 31 is a top view of the circuit board assembly 83 of Fig. 30 after removing the second shielding film 735 and the first circuit board 132), based on the scheme of the seventh embodiment above, the circuit in the eighth embodiment The board assembly 83 may further include a second shield frame 831. The second shield frame 831 is located in the cavity 83a and is spaced apart from the first shield frame 733. The second shield frame 831 is supported between the first circuit board 132 and the second circuit board 134, and the second shield frame 831 can be welded or adhered to the first circuit board 132 and the second circuit board 134. The second shield frame 831 may be formed by connecting several sections of frame bodies (for example, four sections of frame bodies) end to end. The second shield frame 831 may be approximately a square cylindrical structure with open ends, and the two openings respectively face the first circuit board 132 and The second circuit board 134. The second shielding frame 831 encloses the conductive circuit board 135 to electromagnetically shield the conductive circuit board 135 to prevent the conductive circuit board 135 from interfering with other devices in the cavity. When assembling the circuit board assembly 83, first install the conductive circuit board 135 on the second circuit board 134, and then install the second shield frame 831 on the second circuit board 134 and surround the conductive circuit board 135, and then attach the first The circuit board 132 is positioned on the second shield frame 831, and finally the first shield frame 733 is buckled on the periphery of the first circuit board 132.

It should be understood that the design of adding the second shield frame 831 can also be applied to the first to sixth embodiments. For example, referring to FIG. 6, a second shielding frame 831 can be added to the circuit board assembly 13 of the first embodiment, and the second shielding frame 831 is provided in the cavity 13 a and separated from the first shielding frame 133. The second shield frame 831 and the first circuit board 132 and the second circuit board 134 can be welded or adhered. Optionally, the second shielding frame 831 may enclose the conductive circuit board 135. Or referring to FIG. 18, a second shielding frame 831 can be added to the circuit board assembly 23 of the first embodiment. The second shielding frame 831 is connected to the first circuit board 132, the second circuit board 134, the first shielding frame 233, and the guide The position and connection relationship of the communication circuit board 135 are the same as described above. Or referring to FIG. 20, a second shielding frame 831 can be added to the circuit board assembly 33 of the third embodiment. The second shielding frame 831 is connected to the first circuit board 132, the second circuit board 134, the first shielding frame 333, and the guide The position and connection relationship of the communication circuit board 135 are the same as above. Or referring to FIG. 27, a second shielding frame 831 can be added to the circuit board assembly 63 of the sixth embodiment. The second shielding frame 831 is connected to the first circuit board 132, the second circuit board 134, the first shielding frame 633, and the guide. The position and connection relationship of the communication circuit board 135 are the same as described above.

In addition, according to the specific structure and assembly method of the circuit board assembly, the second shielding frame and the first shielding frame 333 can be connected as a whole, simplifying the structure of the shielding frame and the assembly of the circuit board assembly. Take the circuit board assembly 33 of the third embodiment as an example, as shown in FIGS. 32 and 33 (FIG. 33 is a top view of the circuit board assembly 33 of FIG. 32 with the first shielding film 331 and the first circuit board 132 removed), the circuit board The assembly 33 may further include a second shield frame 336, which is located in the cavity 33a. The second shield frame 336 is an open wall structure formed by successively connecting several segments of frame bodies (for example, three segments of frame bodies), and the open end of the second shield frame 336 is connected to the first shield frame 333 (for example, connected to the third wall 236). ), so that the second shield frame 336 and the first shield frame 333 form an integrated shield frame. The second shield frame 336 divides the cavity 33a into two sub-cavities, and the conductive circuit board 135 can be located in one of the sub-cavities. According to product requirements, the size of the second shield frame 336 can be flexibly adjusted, thereby adjusting the relative size of the two sub-cavities. When assembling the circuit board assembly 33, first install the conductive circuit board 135 on the second circuit board 134, then install the integrated shielding frame on the second circuit board 134, and then position the first circuit board 132 on the integrated circuit board 134. Finally, the first shielding film 331 is installed on the shielding frame.

As shown in FIG. 34, in the ninth embodiment, the difference from the eighth embodiment above is that the circuit board assembly 93 can use an elastic plate 935 instead of the conductive circuit board. The elastic plate 935 may include a base 937, a plurality of first elastic feet 938 and a plurality of second elastic feet 936. The base 937 may be block-shaped or plate-shaped, and has a circuit (similar to a circuit board) for signal conduction; The second spring foot 936 (equivalent to the bracket). The shapes of the first elastic foot 938 and the second elastic foot 936 can be designed as required, for example, in a sheet shape. The first elastic leg 938 is protruding from the surface of the base 937 facing the first circuit board 132, and the second elastic leg 936 is protruding from the surface of the base 937 facing the second circuit board. For the base 937 with electrical connection performance, the first spring leg 938 is electrically connected to the second spring leg 936 through the base 937; for the base 937 that only plays a role of holding, the first spring leg 938 and the second spring leg 936 can be They are opposite ends of the same spring foot. The first spring leg 938 is electrically connected to the first circuit board 132. For example, the first spring leg 938 can be abutted or welded to the first circuit board 132 to achieve electrical connection. The second spring leg 936 is electrically connected to the second circuit board 134. For example, the second spring leg 936 can be welded to the second circuit board 134 to achieve electrical connection. Both the first elastic foot 938 and the second elastic foot 936 can be elastically deformed. Both the first spring leg 938 and the second spring leg 936 in the circuit board assembly 93 can be pressed tightly to maintain reliable contact with the first circuit board 132 and the second circuit board 134.

As shown in FIG. 34, the rebound force of the first elastic foot 938 and the second elastic foot 936 will push the first circuit board 132 and the second circuit board 134 in opposite directions, which is not conducive to the first circuit board 132 and the second circuit board. Stable assembly of 134. Therefore, the first shield frame 933 in the ninth embodiment may further include a connecting wall 934, and the connecting wall 934 and the fourth wall 634 are located on opposite sides of the fifth wall 635, respectively. The connecting wall 934 and the fifth wall 635 are bent and connected substantially perpendicularly, and are in contact with the upper surface of the second circuit board 134 (that is, the surface facing the first circuit board 132 ). A number of connecting holes can be opened on the connecting wall 934, and a connecting piece 939 (such as screws, bolts, rivets, etc.) can be installed in each connecting hole. The connecting piece 939 fixedly connects the connecting wall 934 with the second circuit board 134. The locking of the connecting member 939 can overcome the rebound force of the first elastic leg 938 and the second elastic leg 936, ensuring the stable assembly of the first circuit board 132 and the second circuit board 134.

The ninth embodiment realizes the stacking and interconnection of the first circuit board 132 and the second circuit board 134 through the shrapnel plate 935, which provides another solution for increasing the device layout area and improving the device integration. In addition, the ninth embodiment can also avoid stress failure on the edge of the first circuit board 132 and improve the mechanical reliability of the circuit board assembly; it can strengthen the electromagnetic shielding of the shrapnel plate 935 and avoid the shrapnel plate 935 and other devices in the cavity 93a. Interfere with each other.

In other embodiments, the second shield frame 831 can be eliminated; the connection material can be used to replace the connector to realize the connection between the second circuit board 134 and the connection wall 934; on the premise of ensuring the stable assembly of the first circuit board and the second circuit board Next, the elastic plate 935 can also replace the conductive circuit board in the first to seventh embodiments.

As shown in FIG. 35, based on the ninth embodiment described above, in the circuit board assembly 103 of the tenth embodiment, the surface of the first circuit board 1032 facing the base 937 (the lower surface in the viewing angle of FIG. 35) can be partially recessed to form a first limit. Bit slot. The first limiting slot may penetrate through the side surface of the first circuit board 1032, or may be completely located within the contour boundary of the lower surface of the first circuit board 1032 (the latter solution is not shown in the figure). One side of the base 937 extends into the first limiting groove and is matched with the inner wall of the first limiting groove. The first spring legs 938 are all received in the first limiting groove and are in contact with the bottom surface of the first limiting groove. The surface of the second circuit board 1034 facing the base 937 may be partially recessed to form a second limiting groove. The other side of the base 937 extends into the second limiting groove and is matched with the inner wall of the second limiting groove. The second spring legs 936 are all received in the second limiting groove and are in contact with the bottom surface of the second limiting groove. As a result, the base 937 can be restricted by the first limiting slot and the second limiting slot, so that the first elastic leg 938 and the second elastic leg 936 can be stably connected to the first circuit board 1032 and the second circuit board 1034, respectively. touch.

As shown in FIG. 36, the difference from the tenth embodiment above is that in the circuit board assembly 113 of the eleventh embodiment, the base 1136 may include a main body 1137, a first limiting portion 1139, and a second limiting portion 1138. Both the elastic leg 938 and the first limiting portion 1139 are protrudingly provided on the surface of the main body 1137 facing the first circuit board 1032, and the second elastic leg 936 and the second limiting portion 1138 are both protrudingly provided on the main body 1137 facing the second circuit board 1034. surface. A first limiting slot is provided on the first circuit board 1032 in an area corresponding to the first limiting portion 1139. The first limiting portion 1139 extends into the first limiting slot to form a fit. The first spring leg 938 is in the first limiting slot. outside. A second limiting slot is provided on the second circuit board 1034 in an area corresponding to the second limiting portion 1138. The second limiting portion 1138 extends into the second limiting slot to form a fit. The second spring foot 936 is in the second limiting slot. outside. This structure can also achieve the limit of the base 1136, and ensure that the first elastic leg 938 and the second elastic leg 936 can stably contact the first circuit board 1032 and the second circuit board 1034, respectively. In addition, less material is removed from the first circuit board 1032 and the second circuit board 1034 (more materials are removed in the tenth embodiment), so that the first circuit board 1032 and the second circuit board 1034 have greater structural strength and can Ensure the structural strength of the entire circuit board assembly.

Based on the base limit design of the tenth embodiment or the eleventh embodiment, in other embodiments, only one of the first limit slot and the second limit slot needs to be opened, so that the base and the corresponding limit slot The groove forms a limit fit to achieve the purpose of stably corresponding to the spring foot.

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A circuit board assembly, which is characterized in that it comprises a first circuit board, a second circuit board, a first shielding frame and a conductive element; the first circuit board and the second circuit board are laminated at intervals, and the first The shielding frame is connected to the first circuit board and the second circuit board; the periphery of the first shielding frame is in contact with the periphery of the first circuit board, or the periphery of the first shielding frame is retracted from the periphery of the first circuit board. A certain distance within the periphery of the first circuit board; the first circuit board, the second circuit board and the first shielding frame enclose a cavity; the conductive member is arranged in the cavity and is connected to the Both the first circuit board and the second circuit board are electrically connected.
The circuit board assembly according to claim 1, wherein the conductive member is a raised board, and the conductive member has a first surface facing the first circuit board and a first surface facing the second circuit board. There is only one closed boundary between the first surface and the second surface, the first surface is welded to the first circuit board, and the second surface is welded to the second circuit board.
The circuit board assembly according to claim 1, wherein the conductive member comprises a base, a first elastic leg, and a second elastic leg, and the first elastic leg is protruding from the base toward the The surface of the first circuit board, the second spring leg is protrudingly provided on the surface of the base facing the second circuit board, and the first spring leg and the second spring leg are electrically connected through the base , The first spring leg is electrically connected with the first circuit board, and the second spring leg is electrically connected with the second circuit board.
The circuit board assembly according to claim 3, wherein the surface of the first circuit board facing the base is recessed to form a first limiting groove, and the base portion extends into the first limiting groove In the slot; and/or,

A second limiting groove is recessed in the surface area of the second circuit board facing the base, and the base part extends into the second limiting groove.
The circuit board assembly according to claim 4, wherein the first spring foot is received in the first limiting groove and is in contact with the bottom wall of the first limiting groove; and/or,

The second elastic foot is received in the second limiting groove and contacts the bottom wall of the second limiting groove.
5. The circuit board assembly according to any one of claims 1 to 5, wherein the first shield frame is located between the first circuit board and the second circuit board.
The circuit board assembly according to any one of claims 1-5, wherein the first shielding frame comprises a first wall, a second wall, and a third wall, and the first wall and the second wall And the third wall are sequentially bent and connected to form a step, the first wall surrounds the outer side of the first circuit board, and the second wall is supported on the surface of the first circuit board facing the second circuit board The third wall is located between the first circuit board and the second circuit board.
8. The circuit board assembly of claim 7, wherein an end of the first wall away from the second wall protrudes from a surface of the first circuit board that faces away from the second circuit board; the circuit The board assembly includes a first shielding film covering an end of the first wall away from the second wall and the first circuit board, the first shielding film being spaced from the first circuit board relatively.
The circuit board assembly according to claim 7 or 8, wherein the first wall is provided with a positioning notch, and the positioning notch penetrates the first wall along the thickness direction of the first circuit board, so A positioning protrusion is formed on the side of the first circuit board, and the positioning protrusion is inserted into the positioning notch.
The circuit board assembly according to claim 7 or 8, wherein the first wall is provided with positioning protrusions protruding toward the surface of the first circuit board, and the side surface of the first circuit board is recessed to form positioning A groove, and the positioning protrusion is inserted into the positioning groove.
5. The circuit board assembly according to any one of claims 1-5, wherein the first shielding frame comprises a fourth wall and a fifth wall, and the fourth wall and the fifth wall are bent and connected, The fourth wall covers the periphery of the surface of the first circuit board facing away from the second circuit board, and the fifth wall surrounds the outer periphery of the first circuit board.
11. The circuit board assembly of claim 11, wherein the first shielding frame comprises a sixth wall, and the sixth wall, the fourth wall, and the fifth wall are sequentially bent and connected to form a step, The sixth wall protrudes from the surface of the first circuit board facing away from the second circuit board; the circuit board assembly includes a second shielding film, and the second shielding film covers the sixth wall away from the One end of the fourth wall and the first circuit board, and the second shielding film is spaced from the first circuit board.
The circuit board assembly according to claim 11 or 12, wherein the first shielding frame comprises a connecting wall, the connecting wall is bent and connected to the fifth wall, and the fifth wall is located at the connecting wall. Between the wall and the fourth wall, the connecting wall is laid on the second circuit board and is fixedly connected to the second circuit board.
The circuit board assembly according to any one of claims 1-10, wherein the circuit board assembly comprises a second shielding frame, and the second shielding frame is provided in the cavity and is shielded from the first The frame is connected as a whole, the second shielding frame is connected to the first circuit board and the second circuit board, the second shielding frame separates the cavity into different sub-cavities, and the guide The through piece is arranged in one of the sub-cavities.
The circuit board assembly according to any one of claims 1-13, wherein the circuit board assembly comprises a second shielding frame, and the second shielding frame is provided in the cavity and is shielded from the first The frames are spaced apart, the second shielding frame is connected to both the first circuit board and the second circuit board, and the second shielding frame surrounds the outer circumference of the conductive element.
The circuit board assembly of claim 2, wherein the first shielding frame is located between the first circuit board and the second circuit board, and the periphery of the first shielding frame is connected to the first circuit board. The peripheral edge of a circuit board contacts.
An electronic device, characterized by comprising a housing and the circuit board assembly according to any one of claims 1-16, the circuit board assembly being installed in the housing.