CN217428419U - Electronic device and circuit board assembly - Google Patents

Abstract

The application discloses electronic equipment and circuit board assembly relates to electronic equipment technical field, and this electronic equipment can improve the connection reliability between two adjacent circuit boards. The electronic equipment comprises a circuit board assembly, wherein the circuit board assembly comprises a circuit board stacking structure and a device, the circuit board stacking structure at least comprises a first circuit board and a second circuit board which are arranged in a stacked mode, the second circuit board is electrically connected to the first circuit board, a first plug hole is formed in the first circuit board, a second plug hole is formed in the second circuit board, and the second plug hole is communicated with the first plug hole; the device comprises a device body and a plug pin, wherein the plug pin is connected to the device body, the device body is fixed on the surface of one side of the second circuit board, which is far away from the first circuit board, and the plug pin is plugged and fixed in the second plug hole and the first plug hole.

Description

Electronic device and circuit board assembly

Technical Field

The present application relates to the field of electronic product technology, and more particularly, to an electronic device and a circuit board assembly.

Background

With the advent of the 5G era, more and more electronic devices need to be carried on a circuit board (PCB) of an electronic device such as a smart phone and a tablet computer, and the area of the circuit board is not enough in a limited space. For this reason, some products attempt to adopt a 3D stacking manner, that is, a plurality of circuit boards are arranged in a stacked manner in a thickness direction to enlarge a usable area of the circuit boards by enlarging a space in the thickness direction.

However, in the circuit board with the above stacked structure, the connection reliability between two adjacent circuit boards is poor, and when a product is subjected to stress impact such as dropping and collision, a welding point between two adjacent circuit boards is prone to crack.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an electronic device and a circuit board assembly, which are used for improving the connection reliability between two adjacent circuit boards.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, the present application provides an electronic device, which includes a circuit board assembly, the circuit board assembly includes a circuit board stacking structure and a device, the circuit board stacking structure at least includes a first circuit board and a second circuit board which are stacked, the second circuit board is electrically connected to the first circuit board, the first circuit board is provided with a first plugging hole, the second circuit board is provided with a second plugging hole, and the second plugging hole is communicated with the first plugging hole; the device comprises a device body and a plug pin, wherein the plug pin is connected to the device body, the device body is fixed on the surface of one side of the second circuit board, which is far away from the first circuit board, and the plug pin is plugged and fixed in the second plug hole and the first plug hole.

The electronic equipment of the embodiment of the application improves the device arranged on the circuit board, the plug pins are arranged on the device body, and the plug pins are arranged on the device body and are plugged and fixed in the second plug holes of the second circuit board and the first plug holes of the first circuit board, so that the purpose of improving the connection strength between the first circuit board and the second circuit board is realized, the cost can be saved, and the available area of the circuit board is increased.

In one possible embodiment of the first aspect, the component is a shielding can. That is, the shield case includes a shield case body and a pin provided on the shield case body. Therefore, the connection strength between the first circuit board and the second circuit board can be improved through the plug pins arranged on the shielding case body, the structure is simple, and the processing is easy.

In a possible design of the first aspect, the device body includes a shielding cover and a shielding frame, and the shielding frame is connected to the shielding cover. The shielding frame is provided with a first end and a second end which are opposite, and the shielding frame is enclosed into a cavity which penetrates through the end face of the first end and the end face of the second end. The first end refers to an end of the shielding frame close to the shielding cover, and the second end refers to an end of the shielding frame far away from the shielding cover. The shielding case body is fixed on one side surface of the second circuit board, which is far away from the first circuit board, by means of the end surface of the second end of the shielding frame. Therefore, the shielding case body can be covered outside the electronic components, the electromagnetic waves are prevented from being radiated outwards by the circuit inside the shielding case body, the electromagnetic waves outside the shielding case body can be prevented from entering the shielding case body, and the electromagnetic interference of the electronic components inside the shielding case body outside the shielding case body can be avoided.

In a possible embodiment of the first aspect, the shielding cover is formed in one piece with the shielding frame. That is, the shield body is a unitary piece. Therefore, the connection strength between the shielding frame and the shielding cover can be improved, the processing technology of the shielding cover body can be simplified, and the processing cost is reduced.

In a possible embodiment of the first aspect, the plug pins are provided at an end of the shielding frame remote from the shielding cover. Therefore, the plug pins are conveniently in plug-in fit with the second plug holes in the second circuit board and the first plug holes in the first circuit board, and the structure of the shielding case can be simplified.

In a possible embodiment of the first aspect, one end of the plug pin is connected to an end face of the shield frame remote from the shield cover, and the other end extends in a direction remote from the shield cover. Because the terminal surface of shielding frame needs to be connected with the second circuit board and occupies the area of second circuit board, with the back on the terminal surface of the one end of shielding frame of keeping away from the shielding lid of plug pin setting, the second spliced eye can set up the region relative with the terminal surface of shielding frame on the second circuit board, like this, the second spliced eye need not to occupy the area of other regions outside the region relative with the terminal surface of shielding frame on the second circuit board to can reach the purpose of practicing thrift the layout area of second circuit board.

In a possible design of the first aspect, the shielding frame is provided with a flange which is turned outwards, one end of the plug pin is connected with the flange, and the other end of the plug pin extends towards a direction away from the shielding cover. Because be equipped with the turn-ups of turning over outward on the shielding frame, in actual assembling process, can adjust turn-ups length according to actual need, and then can adjust the position of plug pin, avoid plug pin and the electronic components on the circuit board stacked structure to take place to interfere for plug pin set up the position more nimble, eliminated the shape of shielding frame and set up the restraint of position to plug pin.

In a possible design of the first aspect, the plurality of pins are provided, a part of the plurality of pins is directly disposed on the end surface of the second end of the shielding frame, and another part of the plurality of pins may be disposed on the end surface of the second end of the shielding frame by a flange.

In a possible embodiment of the first aspect, the width of the plug foot decreases in the direction away from the component body. Like this, can reduce the cooperation degree of difficulty of bayonet joint foot and second spliced eye, first spliced eye, be favorable to improving assembly efficiency.

In a possible embodiment of the first aspect, the width of the plug foot remains constant in the direction away from the component body. Therefore, the structure of the shielding cover can be simplified, the processing efficiency is improved, and the processing cost is reduced.

In one possible embodiment of the first aspect, an end face of the plug pin facing away from the shield frame is formed as a curved surface. Therefore, the circuit board stacking structure can be prevented from being scratched by the plug pins, and the reliability of the circuit board assembly can be improved.

In a possible design manner of the first aspect, the second circuit board is provided with a first pad and a second pad, the second circuit board is electrically connected with the first circuit board by the first pad, the second circuit board is electrically connected with the first electronic component by the second pad, and the first pad and/or the second pad are/is located on one side of the second plugging hole close to the center of the second circuit board. That is, the second inserting hole is closer to the outer edge of the second circuit board than the first pad and the second pad. Therefore, after the plug pins are plugged and fixed in the second plugging holes, the strength of the welding points of the first bonding pad and/or the second bonding pad can be protected.

In a possible design manner of the first aspect, a third pad is further disposed on the second circuit board, the third pad includes a non-functional pad and/or a ground pad, and the first pad and/or the second pad are located on a side of the third pad close to a center of the second circuit board. In this way, the solder joint strength of the first pad and/or the second pad can be protected by the third pad.

In a possible design of the first aspect, an end of the third land away from the center of the second circuit board is flush with an end of the second plugging hole away from the center of the second circuit board. Therefore, a second plug hole does not need to be additionally arranged in the area outside the third bonding pad, the available area of the second circuit board is ensured, and the number of electronic components arranged on the second circuit board is increased.

In a possible design manner of the first aspect, the third pad is located on a side of the second plugging hole close to the center of the second circuit board.

In a possible design manner of the first aspect, the electronic device includes a housing, the housing includes a back cover, the circuit board assembly is disposed in the housing, and the second circuit board is located on a side of the first circuit board away from the back cover; a dodging hole is formed in the first circuit board, and a second electronic component is arranged in the dodging hole; the orthographic projection of the second circuit board on the first circuit board covers the avoidance hole. Like this, set up through dodging the hole on first circuit board, can reduce second electronic components's occupation space, be favorable to reducing electronic equipment's thickness, can realize electronic equipment's frivolous design.

In one possible embodiment of the first aspect, the second electronic component is spaced apart from the second circuit board. Like this, electronic equipment is falling or when bumping, and second electronic components can not direct action on the second circuit board to circuit board stacked structure's impact force, is favorable to avoiding the solder joint fracture between first circuit board and the second circuit board.

In a possible design of the first aspect, the second electronic component is a camera module. Specifically, the second electronic component is a rear camera module. Like this, dodge the hole through setting up on first circuit board, can reduce the size of rear camera module protrusion in first circuit board to can reduce the size of rear camera module protrusion in back of the body lid body, be favorable to reducing electronic equipment's thickness, can realize electronic equipment's frivolous design.

In a possible design manner of the first aspect, one end of the rear camera module, which is close to the second circuit board, may penetrate out of the avoiding hole. Like this, can further reduce the size of rear camera module protrusion in first circuit board to can reduce the size of rear camera module protrusion in back of the body lid, be favorable to reducing electronic equipment's thickness, can realize electronic equipment's frivolous design.

In a possible design manner of the first aspect, an end of the rear camera module, which is close to the second circuit board, may also be located between two side surfaces in the thickness direction of the first circuit board.

In a possible design manner of the first aspect, the circuit board stack structure further includes: the connecting frame is arranged between the first circuit board and the second circuit board, a third inserting hole is formed in the connecting frame, the third inserting hole is located between the first inserting hole and the second inserting hole and communicated with the first inserting hole and the second inserting hole, and the inserting pins are inserted and fixed in the third inserting hole. Like this, can realize the electric connection between first circuit board and the second circuit board through the connecting frame, and can separate first circuit board and second circuit board through the connecting frame for electronic components all can be used to arrange to the both sides surface of first circuit board and the both sides surface of second circuit board, has expanded circuit board stacked structure's area.

In a possible embodiment of the first aspect, the component body is formed in one piece with the plug pins. Therefore, the connection strength between the device body and the plug pins can be improved, the processing technology of the device can be simplified, and the processing cost is reduced.

In a possible embodiment of the first aspect, the shield body and the plug pins are formed as a single piece. Therefore, the connection strength between the shielding frame and the plug pins can be improved, the processing technology of the shielding case can be simplified, and the processing cost is reduced.

In a possible design of the first aspect, the plurality of pins are provided at intervals in a circumferential direction of the device body. Thus, the connection strength between the first circuit board and the second circuit board can be further improved.

In one possible embodiment of the first aspect, the shielding frame is formed as a rectangular ring. The shielding frame is provided with a first long edge and a second long edge which are oppositely arranged, and a first short edge and a second short edge which are oppositely arranged. Two plug pins are arranged on the first long edge at intervals, two plug pins are arranged on the second long edge at intervals, and one plug pin is arranged on each of the first short edge and the second short edge.

In one possible embodiment of the first aspect, the plug pins are welded in the first plug hole and the second plug hole. Therefore, the plug pins can be firmly and fixedly connected in the first plug hole and the second plug hole, and the process is simple and the processing is convenient. In addition, because the bayonet joint welding is in first spliced eye and second spliced eye, when meetting the condition that needs to reprocess, carry out heat treatment to the solder point position, make the solder melt the back, can separate second circuit board and first circuit board, the difficulty of reprocessing and the cost of reprocessing can both obviously reduce.

In one possible embodiment of the first aspect, the plug pins are adhesively bonded in the first plug hole and the second plug hole.

In a possible embodiment of the first aspect, the pins on the first long side are arranged symmetrically to the pins on the second long side. Therefore, the stress of the first circuit board and the second circuit board can be more uniform, and the connection strength between the first circuit board and the second circuit board can be further improved.

In one possible embodiment of the first aspect, the plug feet on the first short side are arranged symmetrically to the plug feet on the second short side. Therefore, the stress of the first circuit board and the second circuit board can be more uniform, and the connection strength between the first circuit board and the second circuit board can be further improved.

In a possible design manner of the first aspect, the circuit board stacking structure includes N stacked circuit boards, the total thickness of the circuit board stacking structure is W1, the thickness of N-1 circuit boards closest to the device in the circuit board stacking structure is W2, and the length of the pin is greater than W2 and less than or equal to W1, where N is a positive integer greater than or equal to 2. Therefore, the connection strength among all circuit boards in the circuit board stacking structure can be improved, and the plug pins can be prevented from penetrating out of the circuit board stacking structure, so that the plug pins can be prevented from interfering with other components in the electronic equipment.

In one possible embodiment of the first aspect, the length of the plug foot is greater than or equal to 0.9mm and less than or equal to 1.1 mm. Like this, set up to be greater than or equal to 0.9mm through the length L with the bayonet joint, can guarantee that the bayonet joint can wear out in the second jack to insert in the first jack and cooperate with first jack, thereby can reach the purpose that strengthens joint strength between first circuit board and the second circuit board. Meanwhile, the length L of the plug pin is set to be less than or equal to 1.1mm, so that the plug pin can be prevented from penetrating out of one end of the first plug hole, which is far away from the second circuit board, and the plug pin can be prevented from interfering with other components in the electronic equipment.

In a second aspect, the present application provides a circuit board assembly, which includes a circuit board stacking structure and a device, wherein the circuit board stacking structure at least includes a first circuit board and a second circuit board which are stacked, the second circuit board is electrically connected to the first circuit board, the first circuit board is provided with a first plugging hole, the second circuit board is provided with a second plugging hole, and the second plugging hole is communicated with the first plugging hole; the device comprises a device body and a plug pin, the plug pin is connected to the device body, the device body is fixed on the surface of one side, away from the first circuit board, of the second circuit board, and the plug pin is plugged and fixed in the second plug hole and the first plug hole.

The circuit board assembly of the embodiment of the application improves the device arranged on the circuit board, the plug pins are arranged on the device body, and the plug pins are arranged on the device body and are plugged and fixed in the second plug holes of the second circuit board and the first plug holes of the first circuit board.

In one possible embodiment of the second aspect, the component is a shielding. That is, the shield case includes a shield case body and a pin provided on the shield case body. Therefore, the connection strength between the first circuit board and the second circuit board can be improved through the plug pins arranged on the shielding case body, the structure is simple, and the processing is easy.

In a possible design manner of the second aspect, the device body includes a shielding cover and a shielding frame, and the shielding frame is connected to the shielding cover. The shielding frame is provided with a first end and a second end which are opposite, and the shielding frame is enclosed into a cavity which penetrates through the end face of the first end and the end face of the second end. The first end refers to an end of the shielding frame close to the shielding cover, and the second end refers to an end of the shielding frame far away from the shielding cover. The shielding case body is fixed on one side surface of the second circuit board, which is far away from the first circuit board, by means of the end surface of the second end of the shielding frame. Therefore, the shielding case body can be covered outside the electronic component, the electromagnetic wave is prevented from radiating outwards by the circuit inside the shielding case body, the electromagnetic wave outside the shielding case body can be prevented from entering the shielding case body, and the electromagnetic interference caused by the electronic component inside the shielding case body to the electronic component outside the shielding case body can be avoided.

In one possible embodiment of the second aspect, the shielding cover is formed in one piece with the shielding frame. That is, the shield body is a unitary piece. Therefore, the connection strength between the shielding frame and the shielding cover can be improved, the processing technology of the shielding cover body can be simplified, and the processing cost is reduced.

In a possible embodiment of the second aspect, the plug pins are provided at an end of the shielding frame remote from the shielding cover. Therefore, the plug pins are conveniently in plug-in fit with the second plug holes in the second circuit board and the first plug holes in the first circuit board, and the structure of the shielding case can be simplified.

In one possible embodiment of the second aspect, one end of the plug pin is connected to an end face of the shield frame remote from the shield cover, and the other end extends in a direction away from the shield cover. Because the terminal surface of shielding frame needs to be connected with the second circuit board and occupies the area of second circuit board, set up bayonet socket back on the terminal surface of the one end of shielding cover is kept away from to shielding frame, the second spliced eye can set up the region relative with the terminal surface of shielding frame on the second circuit board, like this, the second spliced eye need not to occupy the area of other regions outside the region relative with the terminal surface of shielding frame on the second circuit board to can reach the purpose of practicing thrift the layout area of second circuit board.

In a possible design of the second aspect, a flange that is turned over outward is provided on the shielding frame, one end of the insertion pin is connected to the flange, and the other end extends toward a direction away from the shielding cover. Because the shielding frame is provided with the flanging which is turned outwards, in the actual assembly process, the length of the flanging can be adjusted according to actual needs, and then the position of the plug pin can be adjusted, so that the plug pin is prevented from interfering with electronic components on the circuit board stacking structure, the setting position of the plug pin is more flexible, and the constraint of the shape of the shielding frame on the setting position of the plug pin is eliminated.

In a possible design of the second aspect, the plurality of pins are provided, a part of the plurality of pins is directly disposed on the end face of the second end of the shielding frame, and another part of the plurality of pins may be disposed on the end face of the second end of the shielding frame by a flange.

In a possible embodiment of the second aspect, the width of the plug foot decreases in the direction away from the component body. Therefore, the matching difficulty of the plug pins, the second plug holes and the first plug holes can be reduced, and the assembly efficiency is improved.

In a possible embodiment of the second aspect, the width of the plug foot remains constant in the direction away from the component body. Therefore, the structure of the shielding cover can be simplified, the processing efficiency is improved, and the processing cost is reduced.

In one possible embodiment of the second aspect, an end face of the plug pin facing away from the shielding frame is formed as a curved surface. Thus, the circuit board stacking structure can be prevented from being scratched by the plug pins, and the reliability of the circuit board assembly can be improved.

In a possible design manner of the second aspect, the second circuit board is provided with a first pad and a second pad, the second circuit board is electrically connected with the first circuit board by the first pad, the second circuit board is electrically connected with the first electronic component by the second pad, and the first pad and/or the second pad are/is located on one side of the second plugging hole close to the center of the second circuit board. That is, the second inserting hole is closer to the outer edge of the second circuit board than the first pad and the second pad. Therefore, after the plug pins are plugged and fixed in the second plugging holes, the strength of the welding points of the first bonding pad and/or the second bonding pad can be protected.

In a possible design manner of the second aspect, the second circuit board is further provided with a third pad, the third pad includes a non-functional pad and/or a ground pad, and the first pad and/or the second pad are located on a side of the third pad close to a center of the second circuit board. In this way, the solder joint strength of the first pad and/or the second pad can be protected by the third pad.

In one possible design of the second aspect, an end of the third land away from the center of the second circuit board is flush with an end of the second plugging hole away from the center of the second circuit board. Therefore, a second plug hole does not need to be additionally arranged in the area outside the third bonding pad, the available area of the second circuit board is ensured, and the number of electronic components arranged on the second circuit board is increased.

In one possible embodiment of the second aspect, the third land is located on a side of the second mating hole near a center of the second circuit board.

In a possible design manner of the second aspect, the electronic device includes a housing, the housing includes a back cover, the circuit board assembly is disposed in the housing, and the second circuit board is located on a side of the first circuit board facing away from the back cover; the first circuit board is provided with a avoidance hole, and a second electronic component is arranged in the avoidance hole; the orthographic projection of the second circuit board on the first circuit board covers the avoidance hole. Like this, set up through dodging the hole on first circuit board, can reduce second electronic components's occupation space, be favorable to reducing electronic equipment's thickness, can realize electronic equipment's frivolous design.

In one possible embodiment of the second aspect, the second electronic component is spaced apart from the second circuit board. Like this, electronic equipment is falling or when bumping, and second electronic components can not direct action on the second circuit board to circuit board stacked structure's impact force, is favorable to avoiding the solder joint fracture between first circuit board and the second circuit board.

In a possible design of the second aspect, the second electronic component is a camera module. Specifically, the second electronic component is a rear camera module. Like this, dodge the hole through setting up on first circuit board, can reduce the size of rear camera module protrusion in first circuit board to can reduce the size of rear camera module protrusion in back of the body lid, be favorable to reducing electronic equipment's thickness, can realize electronic equipment's frivolous design.

In a possible design manner of the second aspect, one end of the rear camera module, which is close to the second circuit board, may penetrate out of the avoiding hole. Like this, can further reduce the size of rear camera module protrusion in first circuit board to can reduce the size of rear camera module protrusion in back of the body lid, be favorable to reducing electronic equipment's thickness, can realize electronic equipment's frivolous design.

In a possible design manner of the second aspect, an end of the rear camera module close to the second circuit board may also be located between two side surfaces in the thickness direction of the first circuit board.

In a possible design manner of the second aspect, the circuit board stack structure further includes: the connecting frame is arranged between the first circuit board and the second circuit board, a third inserting hole is formed in the connecting frame, the third inserting hole is located between the first inserting hole and the second inserting hole and communicated with the first inserting hole and the second inserting hole, and the inserting pins are inserted and fixed in the third inserting hole. Like this, can realize the electric connection between first circuit board and the second circuit board through the connecting frame, and can separate first circuit board and second circuit board through the connecting frame for electronic components all can be used to arrange to the both sides surface of first circuit board and the both sides surface of second circuit board, has expanded circuit board stacked structure's area.

In a possible embodiment of the second aspect, the component body is formed in one piece with the plug pins. Therefore, the connection strength between the device body and the plug pins can be improved, the processing technology of the device can be simplified, and the processing cost is reduced.

In a possible embodiment of the second aspect, the shield body and the plug pins are one piece. Therefore, the connection strength between the shielding frame and the plug pins can be improved, the processing technology of the shielding case can be simplified, and the processing cost is reduced.

In one possible embodiment of the second aspect, the plurality of pins are spaced apart from each other in the circumferential direction of the device body. Thus, the connection strength between the first circuit board and the second circuit board can be further improved.

In one possible embodiment of the second aspect, the shielding frame is formed as a rectangular ring. The shielding frame is provided with a first long edge and a second long edge which are oppositely arranged, and a first short edge and a second short edge which are oppositely arranged. Two plug pins are arranged on the first long edge at intervals, two plug pins are arranged on the second long edge at intervals, and one plug pin is arranged on each of the first short edge and the second short edge.

In one possible embodiment of the second aspect, the plug pins are welded in the first plug hole and the second plug hole. Therefore, the plug pins can be firmly and fixedly connected in the first plug hole and the second plug hole, and the process is simple and the processing is convenient. In addition, because the bayonet joint welding is in first spliced eye and second spliced eye, when meetting the condition that needs to reprocess, carry out heat treatment to the solder point position, make the solder melt the back, can separate second circuit board and first circuit board, the difficulty of reprocessing and the cost of reprocessing can both obviously reduce.

In one possible embodiment of the second aspect, the plug pins are glued into the first plug hole and the second plug hole.

In a possible embodiment of the second aspect, the pins on the first long side are arranged symmetrically to the pins on the second long side. Therefore, the stress of the first circuit board and the second circuit board is more uniform, and the connection strength between the first circuit board and the second circuit board can be further improved.

In one possible embodiment of the second aspect, the plug feet on the first short side are arranged symmetrically to the plug feet on the second short side. Therefore, the stress of the first circuit board and the second circuit board is more uniform, and the connection strength between the first circuit board and the second circuit board can be further improved.

In a possible design manner of the second aspect, the circuit board stack structure includes N circuit boards stacked in layers, the total thickness of the circuit board stack structure is W1, the thickness of N-1 circuit boards closest to the device in the circuit board stack structure is W2, and the length of the pin is greater than W2 and less than or equal to W1, where N is a positive integer greater than or equal to 2. Therefore, the connection strength among all circuit boards in the circuit board stacking structure can be improved, and the plug pins can be prevented from penetrating out of the circuit board stacking structure, so that the plug pins can be prevented from interfering with other components in the electronic equipment.

In one possible embodiment of the second aspect, the length of the plug foot is greater than or equal to 0.9mm and less than or equal to 1.1 mm. Like this, set up to be greater than or equal to 0.9mm through the length L with the bayonet joint, can guarantee that the bayonet joint can wear out in the second jack to insert in the first jack and cooperate with first jack, thereby can reach the purpose that strengthens joint strength between first circuit board and the second circuit board. Meanwhile, the length L of the plug pin is set to be less than or equal to 1.1mm, so that the plug pin can be prevented from penetrating out of one end of the first plug hole, which is far away from the second circuit board, and interference between the plug pin and other components in the electronic equipment can be avoided.

Drawings

Fig. 1 is a perspective view of an electronic device provided by some embodiments of the present application;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

fig. 3 is a cross-sectional view of a circuit board assembly provided by some embodiments of the present application;

FIG. 4 is an enlarged view of the area A of FIG. 3;

FIG. 5 is a cross-sectional view of a circuit board assembly according to other embodiments of the present application;

FIG. 6 is a cross-sectional view of a circuit board stack in the circuit board assembly of FIG. 5;

FIG. 7 is a top view of a second circuit board in the circuit board stack of FIG. 6;

fig. 8 is a perspective view of a shield can in the circuit board assembly of fig. 5;

FIG. 9 is a top view of the shield of FIG. 8;

FIG. 10 is a side view of the shield of FIG. 8;

FIG. 11 is an enlarged view of the area B in FIG. 5;

FIG. 12 is a top view of a first circuit board in the circuit board assembly of FIG. 5;

FIG. 13 is a top view of a shield according to other embodiments of the present application;

FIG. 14 is a side view of the shield of FIG. 13;

FIG. 15 is a schematic view of the assembly of the shield and circuit board stack of FIG. 13;

FIG. 16 is a top view of the second circuit board in the assembled view of FIG. 15;

fig. 17 is a cross-sectional view of a circuit board assembly according to still other embodiments of the present application.

Reference numerals:

an electronic device 100;

a screen 10; a light-transmitting cover plate 11; a display screen 12;

a back shell 20; a back cover 21; a back cover main body 211; the mounting opening 211 a; a camera hole 212 b; a camera trim 212; a frame 22; a middle plate 23;

a rear camera module 30;

a circuit board assembly 40;

a circuit board stack structure 41;

a first circuit board 411; relief holes 4111; a first connection pad 4112; a first insertion hole 4113; a sixth pad 4114;

a second circuit board 412; a functional pad 4120; a first pad 4121; a second pad 4122; a second insertion hole 4123; the third pad 4124; a fifth pad 4125;

a connection frame 413; a third insertion hole 4131;

a shield case 42; a shield case body 421; a shield cover 4211; a shield frame 4212; first end 4212 a; a second end 4212 b; the first long side 4212 c; the second long side 4212 d; a first short side 4212 e; a second short side 4212 f; a plug-in pin 422; a flange 423;

a battery 50;

the first electronic component 61.

Detailed Description

In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, features defined as "first", "second", "third", "fourth" may explicitly or implicitly include one or more of the features.

In the embodiments of the present application, the terms "include", "include" or any other variations are intended to cover non-exclusive inclusions, so that a process, a method, an article, or an apparatus including a series of elements includes not only those elements but also other elements not explicitly listed, or further includes elements inherent to such a process, a method, an article, or an apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is only one kind of association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.

With the development of technologies, the functions of electronic devices such as smart phones and tablet computers are more and more abundant, and the requirements of users on the performance of the electronic devices are also more and more high. As a result, the electronic devices have more and more electronic components to be carried on the circuit board, and the area of the circuit board is not enough in the limited space of the electronic devices. The electronic components include, but are not limited to, chips, resistors, capacitors, inductors, potentiometers, valves, heat sinks, electromechanical components, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro-motors, electronic transformers, relays, SIM card holders, and the like.

In order to arrange more electronic components in a limited space of an electronic device, at present, a plurality of circuit boards are generally stacked to expand the available area of the circuit boards. That is, a plurality of circuit boards are arranged in a stacked manner in the thickness direction, forming a circuit board stacked structure to enlarge the usable area of the circuit board by enlarging the space in the thickness direction, so that more electronic components are arranged on the circuit board. The term "plurality" as used herein means two or more.

However, in the circuit board stacking structure, because the soldering area between two adjacent circuit boards is limited, when the electronic device is subjected to stress impact such as drop and collision, the solder joints between two adjacent circuit boards are prone to crack, which causes problems such as pit crack and wire break, and reduces the reliability of the circuit board stacking structure and the electronic device.

On the basis, besides the electronic components electrically connected with the circuit board, the circuit board is also provided with functional accessories such as a shielding cover and a reinforcing plate which are mechanically connected with the circuit board, wherein the shielding cover is used for reducing electromagnetic interference between the electronic components. The reinforcing plate is used for improving the structural strength of the circuit board.

In order to improve the joint strength between two adjacent circuit boards in the circuit board stack structure under the prerequisite of guaranteeing circuit board assembly's layout area, the improvement thinking of this application is: the device arranged on the circuit board is improved, the device body is provided with plug pins, at least two circuit boards of the circuit board stacking structure are provided with plug holes matched with the plug pins, and the plug pins are plugged and fixed in the plug holes. Therefore, the connecting strength between the circuit boards can be improved by means of the devices originally arranged on the circuit boards, the cost can be saved, and the available area of the circuit boards can be increased.

It should be noted that the "device" described in this application may be any component disposed on a circuit board. Specifically, the device may be an electronic component electrically connected to the circuit board, or may be a functional component mechanically connected to the circuit board.

Based on the above improved idea, the following describes an embodiment of the present application in detail by taking a device as a shielding case as an example with reference to the accompanying drawings. It is understood that in other embodiments, the device may also be a SIM card holder, a stiffener, or the like.

In a first aspect, the present application provides an electronic device that is of a type having a circuit board assembly. Specifically, the electronic device includes, but is not limited to, a mobile phone, a tablet personal computer (tablet personal computer), a laptop computer (laptop computer), a Personal Digital Assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, a walkman, a radio, and the like.

Referring to fig. 1 and fig. 2, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present disclosure, and fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 includes a screen 10, a back case 20, a rear camera module 30, a circuit board assembly 40, and a battery 50.

It is to be understood that fig. 1 and fig. 2 only schematically show some components included in the electronic device 100, and the actual shape, the actual size, the actual position, and the actual configuration of the components are not limited by fig. 1 and fig. 2. In other examples, the electronic device 100 may not include the screen 10.

The screen 10 is used to display images, videos, and the like. The screen 10 includes a light-transmissive cover 11 and a display screen 12 (english name: panel, also called display panel). The transparent cover plate 11 is stacked with the display screen 12. The light-transmitting cover plate 11 is mainly used for protecting and preventing dust of the display screen 12. The material of the transparent cover plate 11 includes, but is not limited to, glass. The display 12 may be a flexible display or a rigid display. For example, the display 12 may be an organic light-emitting diode (OLED) display, an active-matrix or active-matrix organic light-emitting diode (AMOLED) display, a mini-led display, a micro-organic light-emitting diode (QLED) display, a Liquid Crystal Display (LCD).

The back case 20 serves to protect components within the electronic device 100. The back case 20 includes a back cover 21 and a bezel 22. The back cover 21 is located on one side of the display 12 away from the transparent cover plate 11, and is stacked with the transparent cover plate 11 and the display 12. The frame 22 is located between the back cover 21 and the transparent cover plate 11. The frame 22 is fixed on the back cover 21, for example, the frame 22 may be fixedly connected to the back cover 21 by glue, and the frame 22 may also be integrated with the back cover 21, that is, the frame 22 and the back cover 21 are an integral structural component. The light-transmitting cover plate 11 is fixed to the frame 22 by gluing. The light-transmitting cover plate 11, the back cover 21 and the frame 22 enclose an internal accommodating space of the electronic device 100. The internal receiving space receives the display screen 12, the rear camera module 30, the circuit board assembly 40, and the battery 50 therein.

The back cover 21 includes a back cover main body 211 and a camera decoration 212. The back cover body 211 is provided with a mounting opening 211 a. The mounting opening 211a may be a circular opening, a square opening, an oval opening, or a shaped opening. The camera garnish 212 is attached to the mounting opening 211 a. The camera ornament 212 has the same shape as the mounting opening 211 a. Specifically, the shape of the camera decoration 212 may be circular, square, oval, or the like.

The camera decoration piece 212 is provided with a camera hole 212 b. The number of the camera holes 212b is equal to the number of the rear camera modules 30.

For convenience of the following description, an XYZ coordinate system is established, and the width direction of the electronic apparatus 100 is defined as an X-axis direction, the length direction of the electronic apparatus 100 is defined as a Y-axis direction, and the thickness direction of the electronic apparatus 100 is defined as a Z-axis direction. It is understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs.

The rear camera module 30 is used to take pictures/videos. As the user demands the shooting performance of the electronic device 100 to be higher, the electronic device 100 is moving toward a multi-camera module. For example, in the embodiment shown in fig. 2, the number of the rear camera modules 30 is three, and the three rear camera modules 30 may be a main camera module, a wide camera module and a telephoto camera module, respectively.

Referring to fig. 2, the three rear camera modules 30 may be spaced in the Y-axis direction, so as to improve the appearance of the electronic device 100.

In other embodiments, the number of the rear camera modules 30 may also be one, two, or more than three. The rear camera module 30 may be integrated with an Auto Focus (AF) function and/or an Optical Image Stabilization (OIS) function. The rear camera module 30 is fixed to the internal receiving cavity of the electronic device 100. The light-entering end of the rear camera module 30 is fittingly accommodated in the camera hole 212 a.

In some embodiments, referring to fig. 2, the electronic device 100 further includes a midplane 23. The middle plate 23 is fixed to the inner surface of the frame 22 by welding or integral molding. The middle plate 23 serves as a structural "skeleton" of the electronic apparatus 100, and the battery 50 and the like may be fixed to a surface of the middle plate 23 near the back cover 21. In other embodiments, electronic device 100 may not include midplane 23.

A circuit board assembly 40 is disposed in the housing 10, and the circuit board assembly 40 is used for integrating electronic components such as a control chip, an antenna (e.g., a 5G antenna) radio frequency front end, a Universal Serial Bus (USB) device, and the like.

Referring to fig. 3, fig. 3 is a cross-sectional view of a circuit board assembly 40 according to an embodiment of the present disclosure. The circuit board assembly 40 includes a circuit board stack structure 41. It should be noted that fig. 3 only schematically shows some components included in the circuit board assembly 40, and the actual shape, the actual size, the actual position and the actual configuration of the components are not limited by fig. 3. The coordinate system in fig. 3 is represented by the same coordinate system as the coordinate system in fig. 1. That is, the orientation relationship of each component of the circuit board assembly 40 in fig. 3 in the coordinate system shown in fig. 3 is the same as the orientation relationship of each component of the circuit board assembly 40 in the coordinate system shown in fig. 1 when the circuit board assembly 40 is applied to the electronic device 100 shown in fig. 1.

The circuit board stack structure 41 includes at least a first circuit board 411 and a second circuit board 412 stacked together. That is, the circuit board stacked structure 41 may include only two circuit boards, namely the first circuit board 411 and the second circuit board 412, or the circuit board stacked structure 41 may include one or more other circuit boards in addition to the first circuit board 411 and the second circuit board 412. The one or more other circuit boards may be located between the first circuit board 411 and the second circuit board 412, may be located on a side of the first circuit board 411 away from the second circuit board 412, and may be located on a side of the second circuit board 412 away from the first circuit board 411. The first circuit board 411 and the second circuit board 412 may be hard circuit boards, flexible circuit boards, or rigid-flex circuit boards.

Referring to fig. 3, the thickness direction of the first circuit board 411 is parallel to the Z-axis direction, and the second circuit board 412 is stacked on the first circuit board 411 in the Z-axis direction. The second circuit board 412 may be located on a side of the first circuit board 411 away from the back cover 21. Referring to fig. 4, fig. 4 is an enlarged view of a portion a of fig. 3. A side of the first circuit board 411 facing the second circuit board 412 is provided with a first connection pad 4112.

Referring to fig. 3, in some embodiments, the first circuit board 411 is provided with an avoiding hole 4111, and the avoiding hole 4111 may be formed as a through hole. The avoiding hole 4111 may be used to avoid a second electronic component such as the rear camera module 30. Like this, through set up dodging hole 4111 on first circuit board 411, can reduce the occupation space of second electronic components such as rear camera module 30, be favorable to reducing electronic equipment 100's thickness, can realize electronic equipment 100's frivolous design.

It is understood that, in other embodiments, the avoiding hole 4111 may also be used for avoiding a speaker module, etc. Alternatively, in other embodiments, the avoiding hole 4111 may not be formed in the first circuit board 411.

Referring to fig. 3, the rear camera module 30 is disposed in the avoiding hole 4111, and one end of the rear camera module 30 close to the second circuit board 412 can pass through the avoiding hole 4111. In this way, by providing the avoiding hole 4111 on the first circuit board 411, the protruding size h of the rear camera module 30 from the first circuit board 411 can be reduced, so that the protruding size of the rear camera module 30 from the back cover 21 can be reduced, the thickness of the electronic device 100 can be reduced, and the light and thin design of the electronic device 100 can be realized. In other embodiments, one end of the rear camera module 30 close to the second circuit board 412 may also be located between the two side surfaces 411a, 411b of the first circuit board 411 in the thickness direction.

The second circuit board 412 is electrically connected to the first circuit board 411. Specifically, referring to fig. 3 in combination with fig. 4, the second circuit board 412 is provided with a functional pad 4120. The "functional pads 4120" are pads electrically connected to the second circuit board 412. In some embodiments, the functional pads 4120 include first pads 4121 and second pads 4122, the second circuit board 412 is electrically connected to the first circuit board 411 via the first pads 4121, and the second circuit board 412 is electrically connected to the first electronic component 61 via the second pads 4122. That is, the first electronic component 61 is soldered on the second solder pad 4122 to achieve electrical connection between the first electronic component 61 and the second circuit board 412.

In some embodiments, with continuing reference to fig. 3 and with reference to fig. 4, the first pads 4121 are disposed on a side surface of the second circuit board 412 facing the first circuit board 411, and the second pads 4122 are disposed on a side surface of the second circuit board 412 facing away from the first circuit board 411. Specifically, referring to fig. 4, the first bonding pads 4121 are soldered to the first connection bonding pads 4112, so as to electrically connect the second circuit board 412 to the first circuit board 411. The first electronic component 61 may be electrically connected to the second circuit board 412 via the second pads 4122.

In the embodiment shown in fig. 3, the second circuit board 412 is directly connected to the first connection pads 4112 on the first circuit board 411 by soldering via the first pads 4121, so that the first circuit board 411 and the second circuit board 412 are electrically connected. In other embodiments, the second circuit board 412 and the first circuit board 411 may also be indirectly connected through an electrical connector (e.g., a later-mentioned connection frame 413), so as to achieve electrical connection between the first circuit board 411 and the second circuit board 412.

In some embodiments, referring to fig. 3, the edge of the second circuit board 412 surrounds the periphery of the avoiding hole 4111. That is, the orthographic projection of the second circuit board 412 on the first circuit board 411 covers the avoiding hole 4111. Like this, through setting up second circuit board 412, can integrate part electronic components (for example first electronic components 61) on the side surface that deviates from first circuit board 411 of second circuit board 412, in order to compensate first circuit board 411 because of setting up the area that dodges hole 4111 and reduce, can be on the basis that does not increase the plane area that circuit board assembly 40 occupies, increase circuit board assembly 40's area, and then can integrate more electronic components on circuit board stack structure 41, make electronic equipment 100's function abundanter, and be favorable to improving electronic equipment 100's performance.

In the above embodiment, since the rear camera module 30 protrudes from the outer surface of the back cover 21, when the electronic device 100 falls or is collided, the stress on the first circuit board 411 is large in the area near the rear camera module 30, and meanwhile, since the welding area between the second circuit board 412 and the first circuit board 411 is limited, the welding point between the second circuit board 412 and the first circuit board 411 is prone to crack, and the problems of crater cracking, wire breakage and the like occur, so that the reliability of the circuit board assembly 40 is reduced.

In some embodiments, in order to reduce the stress impact of the rear camera module 30 on the second circuit board 412, the rear camera module 30 is spaced apart from the second circuit board 412. Thus, when the electronic device 100 falls or collides, the impact force of the rear camera module 30 on the circuit board stacking structure 41 does not directly act on the second circuit board 412, which is beneficial to avoiding the solder joint crack between the first circuit board 411 and the second circuit board 412.

In some embodiments, in order to improve the connection strength between the first circuit board 411 and the second circuit board 412, the bonding force between the first circuit board 411 and the second circuit board 412 is strengthened through a dispensing process when the first circuit board 411 and the second circuit board 412 are assembled. However, the above process needs to increase the strength of the solder joint through the tin pre-fabrication process, the process is complicated, the cost is increased, the repair difficulty is high, and the service cost is increased correspondingly.

To solve the above technical problem, please refer to fig. 5, wherein fig. 5 is a cross-sectional view of a circuit board assembly 40 according to another embodiment of the present application. In the present embodiment, the circuit board assembly 40 includes a shield cover 42 in addition to the circuit board stacking structure 41 in the circuit board assembly 40 shown in fig. 3. It is understood that in other embodiments, the shielding case 42 in the circuit board assembly 40 may also be a SIM card socket, a stiffener, or the like.

Referring to fig. 5-6, fig. 6 is a cross-sectional view of a circuit board stacking structure 41 in the circuit board assembly 40 shown in fig. 5. In this embodiment, a first plugging hole 4113 is disposed on the first circuit board 411, a second plugging hole 4123 is disposed on the second circuit board 412 opposite to the first plugging hole 4113, and the second plugging hole 4123 is communicated with the first plugging hole 4113. The first inserting hole 4113 and the second inserting hole 4123 are through holes. Alternatively, the shapes of the first insertion hole 4113 and the second insertion hole 4123 may be rectangular, circular, oval, and the like.

In some embodiments, referring to fig. 6 in combination with fig. 7, fig. 7 is a top view of the second circuit board 412 in the circuit board stack structure 41 shown in fig. 6. Specifically, the top view of the second circuit board 412 is a schematic view of the side of the second circuit board 412 close to the first circuit board 411 when viewed from the side of the second circuit board 412 away from the first circuit board 411. The first and second pads 4121 and 4122 are located at one side of the second socket hole 4123 near the center of the second circuit board 412. That is, the second socket hole 4123 is closer to the outer edge of the second circuit board 412 than the first and second pads 4121, 4122. In this way, the strength of the solder joint of the first pad 4121 and the second pad 4122 can be protected.

In some embodiments, the second socket holes 4123 are plural, and the plural second socket holes 4123 surround the outer circumferences of the first and second pads 4121, 4122.

It is understood that, in other embodiments, one of the first and second pads 4121 and 4122 may be located at a side of the second socket 4123 near the center of the second circuit board 412.

Referring to fig. 7, the second circuit board 412 is further provided with a third pad 4124, and the third pad 4124 includes a non-functional pad and a ground pad. The non-functional pads refer to pads that are not electrically connected to the second circuit board 412. The third pads 4124 may be provided on a side surface of the second circuit board 412 facing away from the first circuit board 411. The first pad 4121 and the second pad 4122 are both located inside the third pad 4124. That is, the first and second pads 4121 and 4122 are located on one side of the third pad 4124 near the center of the second circuit board 412. In this way, the solder joint strength of the first and second pads 4121, 4122 can be protected by the third pad 4124.

It is understood that in other embodiments, the third pads 4124 may include only non-functional pads or ground pads.

On this basis, in order to increase the usable area of the second circuit board 412, referring to fig. 7, the outer end of the second plugging hole 4123 is flush with the outer end of the third pad 4124. The "outer end of the second plug hole 4123" refers to an end of the second plug hole 4123 away from the center of the second circuit board 412. "the outer end of the third pad 4124" refers to an end of the third pad 4124 away from the center of the second circuit board 412. A dotted line in fig. 7 is a connection line between the outer end of the second socket 4123 and the outer end of the third pad 4124. Thus, the outer end of the second inserting hole 4123 and the outer end of the third pad 4124 are arranged to be flush, and the second inserting hole 4123 does not need to be additionally arranged in the region outside the third pad 4124, so that the available area of the second circuit board 412 is ensured, and the number of electronic components arranged on the second circuit board 412 is increased.

Referring to fig. 8-10, fig. 8 is a perspective view of the shield 42 of the circuit board assembly 40 shown in fig. 5, fig. 9 is a top view of the shield 42 shown in fig. 8, and fig. 10 is a side view of the shield 42 shown in fig. 8. In this embodiment, the shield can 42 includes a shield can body 421 (i.e., a device body) and a pin 422.

The shield case body 421 includes a shield cover 4211 and a shield frame 4212. The shield cover 4211 is connected to the shield frame 4212. Specifically, the shield 4212 has opposing first and second ends 4212a, 4212b, and the shield 4212 defines a cavity extending through an end surface of the first end 4212a and an end surface of the second end 4212 b. Here, the "first end 4212 a" refers to an end of the shield frame 4212 close to the shield cover 4211, and the "second end 4212 b" refers to an end of the shield frame 4212 far from the shield cover 4211.

The shield case body 421 is fixed to a surface of the second circuit board 412 facing away from the first circuit board 411 by an end surface of the second end 4212b of the shield frame 4212. Specifically, a fourth bonding pad (not shown) may be disposed on an end surface of the second end 4212b, and the shield case body 421 is connected to the third bonding pad 4124 on the second circuit board 412 by soldering. The shield cover 4211 covers an end surface of the first end 4212a of the shield frame 4212. Thus, referring back to fig. 5, the shielding case body 421 can be covered outside the first electronic component 61 to prevent the circuit inside the shielding case body 421 from radiating electromagnetic waves outwards, and prevent the electromagnetic waves outside the shielding case body 421 from entering the shielding case body 421, so as to prevent the first electronic component 61 inside the shielding case body 421 from causing electromagnetic interference to the electronic component outside the shielding case body 421.

In the above embodiments, the shield frame 4212 is a frame structure having a shielding function, and in order to provide the shielding function to the shield frame 4212, the shield frame 4212 should be partially or entirely made of a conductive material such as metal or graphite. The shield cover 4211 is a cover structure having a shielding function, and in order to provide the shielding function to the shield cover 4211, the shield cover 4211 is partially or entirely made of a conductive material such as metal or graphite.

In some embodiments, shield frame 4212 is integral with shield cap 4211. That is, the shield case body 421 is an integral piece. Thus, the coupling strength between the shield frame 4212 and the shield cover 4211 can be improved, the process for manufacturing the shield case body 421 can be simplified, and the manufacturing cost can be reduced.

The plug pins 422 are fixed to an end surface of the shield frame 4212 at an end remote from the shield cover 4211. That is, the plug pins 422 are fixed to the end surface of the second end 4212b of the shield frame 4212. Specifically, one end of the plug pin 422 is connected to an end surface of the shield 4212 at an end far from the shield 4211, and the other end of the plug pin 422 extends toward a direction far from the shield 4212. Optionally, a direction from one end of the pin 422 to the other end of the pin 422 is parallel to the Z-axis direction.

Referring to fig. 11, fig. 11 is an enlarged view of a portion B in fig. 5. The plug pin 422 is inserted and fixed in the second insertion hole 4123 and the first insertion hole 4113. From this, can fix in second spliced eye 4123 of second circuit board 412 and first spliced eye 4113 of first circuit board 411 through setting up spliced foot 422 on shield cover body 421, realize improving the purpose of the joint strength between first circuit board 411 and second circuit board 412, and can practice thrift the area occupied by spliced foot 422 when practicing thrift the cost, and then can increase circuit board stack structure 41's area. Simple structure and ingenious design.

In addition, since the end surface of the shield frame 4212 needs to be connected with the second circuit board 412 to occupy the area of the second circuit board 412, after the plug pins 422 are disposed on the end surface of the end of the shield frame 4212 far away from the shield cover 4211, the second plug hole 4123 may be disposed in a region of the second circuit board 412 opposite to the end surface of the shield frame 4212, and thus, the second plug hole 4123 does not need to occupy the area of other regions of the second circuit board 412 except the region opposite to the end surface of the shield frame 4212, so that the purpose of saving the layout area of the second circuit board 412 can be achieved.

Referring to table 1, table 1 shows the reliability test results of the samples 1, 2 and 3 under the same test conditions. Sample 1 is the circuit board assembly 40 shown in fig. 3, sample 2 is the circuit board assembly 40 shown in fig. 5, and sample 3 is the circuit board assembly obtained by increasing the soldering area between the first circuit board 411 and the second circuit board 412 based on the circuit board assembly 40 shown in fig. 3.

TABLE 1 Fall Drum test results for samples 1-3

Test sample	Drop drum test results
		Sample 1	The second circuit board falls off from the first circuit board when failing to pass the test
Sample 2	Through the test, the test result is that,and the slice display welding spot has no crack
		Sample 3	By testing, but corner welds cracked

The above test results show that the solution of adding the pin 422 to the shield case 42 and inserting and fixing the pin 422 into the first insertion hole 4113 and the second insertion hole 4123 in the present application has better reliability than the solution of increasing the soldering area between the first circuit board 411 and the second circuit board 412.

In some embodiments, the plug pins 422 are multiple, and the multiple plug pins 422 are spaced apart in the circumferential direction of the shield frame 4212. Thus, the connection strength between the first circuit board 411 and the second circuit board 412 can be further improved. Referring to fig. 8, the shield frame 4212 is formed in a rectangular ring shape. The shield frame 4212 has a first long side 4212c and a second long side 4212d which are arranged oppositely, and a first short side 4212e and a second short side 4212f which are arranged oppositely. Two plug pins 422 are arranged on the first long edge 4212c at intervals, two plug pins 422 are arranged on the second long edge 4212d at intervals, and one plug pin 422 is arranged on each of the first short edge 4212e and the second short edge 4212 f.

Optionally, the plug-in pin 422 of the first long side 4212c is symmetrically arranged with the plug-in pin 422 of the second long side 4212d, and the plug-in pin 422 of the first short side 4212e is symmetrically arranged with the plug-in pin 422 of the second short side 4212 f. Thus, the stress on the first circuit board 411 and the second circuit board 412 can be more uniform, and the connection strength between the first circuit board 411 and the second circuit board 412 can be further improved.

On the basis of the above embodiments, please refer to fig. 10, in order to reduce the difficulty in matching the plug pins 422 with the second plug holes 4123 and the first plug holes 4113, and improve the assembling efficiency. The width of the plug pins 422 decreases in a direction away from the shield frame 4212. Of course, the present application is not limited thereto. In other embodiments, the width of the pin 422 may also remain constant in a direction away from the shield 4212.

Further, as shown in fig. 10, the end surface of the plug pin 422 away from the shield frame 4212 is formed as a curved surface. Thus, the socket pins 422 can be prevented from scratching the circuit board stack structure 41, thereby improving the reliability of the circuit board assembly 40.

In some embodiments, the pins 422 are integral with the shield 4212. In this way, the connection strength between the shield frame 4212 and the plug pins 422 can be improved, the processing process of the shield cover 42 can be simplified, and the processing cost can be reduced.

In some embodiments, pin 422 is welded within first plug aperture 4113 and second plug aperture 4123. Therefore, the pin 422 can be firmly and fixedly connected in the first inserting hole 4113 and the second inserting hole 4123, and the process is simple and the processing is convenient. In addition, because the plug pins 422 are welded in the first plug hole 4113 and the second plug hole 4123, when the situation of repair is met, the positions of the welding points are heated, so that after the solder is melted, the second circuit board 412 can be separated from the first circuit board 411, and the repair difficulty and the repair cost can be obviously reduced.

Specifically, referring back to fig. 7, a fifth pad 4125 is further disposed on a side surface of the second circuit board 412 facing away from the first circuit board 411, and the fifth pad 4125 is annular and surrounds an outer periphery of the second inserting hole 4123.

Referring to fig. 12, fig. 12 is a top view of the first circuit board 411 in the circuit board assembly 40 shown in fig. 5. The top view of the first circuit board 411 is a schematic view of a side of the first circuit board 411 facing the second circuit board 412 and facing away from the second circuit board 412. A sixth land 4114 is disposed on a side surface of the first circuit board 411 facing the second circuit board 412, and the sixth land 4114 is annular and surrounds the first inserting hole 4113.

In the assembling process, the plug pins 422 may be first plugged into the second plugging holes 4123, and the shield case body 421 may be soldered to the second circuit board 412 by Surface Mount Technology (SMT) and the plug pins 422 may be soldered to the first plugging holes 4113 at the same time. Then, the pins 422 are inserted into the first insertion holes 4113, and the second circuit board 412 with the shielding cover 42 mounted thereon is soldered to the first circuit board 411 by surface mount technology, and the pins 422 are soldered to the second insertion holes 4123. The process is simple and the cost is low.

The surface mount technology is a circuit mounting technology in which a surface mount device (SMC/SMD, chip component in chinese) having no leads or short leads is mounted on a surface of a circuit board or a surface of another substrate, and is soldered and mounted by a method such as reflow soldering or dip soldering.

In other embodiments, the pin 422 may be adhered to the first and second insertion holes 4113 and 4123.

It is understood that when the circuit board stack structure 41 includes N circuit boards arranged in a stacked manner, N is a positive integer greater than or equal to 2. If the total thickness of the circuit board stacking structure 41 is W1 and the thickness of N-1 circuit boards closer to the shielding case 42 in the circuit board stacking structure 41 is W2, the length of the pin 422 may be greater than W2 and less than or equal to W1. In this way, the connection strength between all the circuit boards in the circuit board stacking structure 41 can be improved, and the pin 422 can be prevented from penetrating out of the circuit board stacking structure 41, so that the pin 422 can be prevented from interfering with other components in the electronic device 100.

For example, referring to fig. 11, in this embodiment, the circuit board stack structure 41 includes 2 circuit boards stacked one on another, W1 is the total thickness of the circuit board stack structure 41, and W2 is the thickness of the second circuit board 412.

In some embodiments, the length L of pin 422 is greater than or equal to 0.9mm and less than or equal to 1.1 mm. That is, the length of the pin 422 ranges from 0.9mm to 1.1 mm. The length L of the peg 422 may be 0.95mm, 1mm, 1.05mm, 1.1mm, etc. Like this, set up length L through pegging graft 422 to be more than or equal to 0.9mm, can guarantee that pegging graft 422 can wear out in second spliced eye 4123 to insert in first spliced eye 4113 with first spliced eye 4113 cooperation, thereby can reach the purpose that strengthens joint strength between first circuit board 411 and the second circuit board 412. Meanwhile, by setting the length L of the plug pin 422 to be less than or equal to 1.1mm, the plug pin 422 can be prevented from penetrating out of the end of the first plug hole 4113 away from the second circuit board 412, so that the plug pin 422 can be prevented from interfering with other components in the electronic device 100.

In other embodiments, referring to fig. 13-14, fig. 13 is a top view of a shield 42 according to other embodiments of the present application, and fig. 14 is a side view of the shield 42 shown in fig. 13. The shield case 42 in the present embodiment is different from the shield case 42 shown in fig. 8 in that: the shield case body 421 of the shield case 42 in the present embodiment includes a flange 423 in addition to the shield cover 4211 and the shield frame 4212 in the shield case body 421 shown in fig. 8.

Specifically, the flange 423 is disposed at an end of the shield frame 4212 away from the shield cover 4211 and is folded outward. That is, the flange 423 is provided at the second end 4212b of the shield frame 4212. The flange 423 is connected to the shield 4212 at one end and extends away from the interior cavity of the shield 4212 at the other end. Optionally, the flange 423 is perpendicular to the shield 4212. One end of the plug pin 422 is connected to the flange 423, and the other end of the plug pin 422 extends away from the shield cover 4211. Illustratively, peg 422 is perpendicular to flange 423.

Referring to fig. 15, fig. 15 is an assembly diagram of the shield 42 and the circuit board stack structure 41 shown in fig. 13, and fig. 16 is a top view of the second circuit board 412 shown in the assembly diagram of fig. 15. In fig. 15, the broken line represents the outer contour of the shield case 42. In this embodiment, since the outward folded flange 423 is disposed on the shielding frame 4212, in an actual assembling process, the length of the flange 423 can be adjusted according to actual requirements, so as to adjust the position of the plug pin 422, and avoid the interference between the plug pin 422 and an electronic component on the circuit board stacking structure 41, so that the setting position of the plug pin 422 is more flexible, and the constraint of the shape of the shielding frame 4212 on the setting position of the plug pin 422 is eliminated.

In this embodiment, referring to fig. 16, the third pads 4124 are located at a side of the second plug hole 4123 close to the center of the second circuit board 412.

In some other embodiments, the plurality of pins 422 may be provided, some of the plurality of pins 422 may be directly disposed on the end surface of the second end 4212b of the shield frame 4212, and another portion of the plurality of pins 422 may be disposed on the end surface of the second end 4212b of the shield frame 4212 through the turned edge 423.

In still other embodiments, referring to fig. 17, fig. 17 is a cross-sectional view of a circuit board assembly 40 provided in accordance with still other embodiments of the present application. The circuit board assembly 40 in the present embodiment is different from the circuit board assembly 40 shown in fig. 5 in that the circuit board stacking structure 41 of the circuit board assembly 40 in the present embodiment is different from the circuit board stacking structure 41 of the circuit board assembly 40 shown in fig. 5.

Specifically, the circuit board stacking structure 41 in the present embodiment includes a connection frame 413 in addition to the first circuit board 411 and the second circuit board 412. The connection frame 413 is disposed between the first circuit board 411 and the second circuit board 412. The first circuit board 411 and the second circuit board 412 are electrically connected by a connecting frame 413. Specifically, the connection frame 413 is formed as a frame structure. Optionally, the connection frame 413 is a circuit board.

One end of the connection frame 413 is connected to the first circuit board 411, and the other end of the connection frame 413 is connected to the second circuit board 412. Illustratively, the one end of the connection frame 413 is soldered to the first circuit board 411, and the other end of the connection frame 413 is soldered to the second circuit board 412. Specifically, the other end of the connection frame 413 may be solder-connected to the first pad 4121. Thus, the first circuit board 411 and the second circuit board 412 can be electrically connected through the connection frame 413, and the first circuit board 411 and the second circuit board 412 can be spaced apart through the connection frame 413, so that the two side surfaces 411a and 411b of the first circuit board 411 and the two side surfaces 412a and 412b of the second circuit board 412 can be used for arranging electronic components, and the area of the circuit board stacking structure 41 is expanded.

On the basis, in order to increase the connection strength between the first circuit board 411 and the connection frame 413 and the connection strength between the second circuit board 412 and the connection frame 413, please refer to fig. 17, a third insertion hole 4131 is disposed on the connection frame 413, the third insertion hole 4131 is located between the first insertion hole 4113 and the second insertion hole 4123, the third insertion hole 4131 is communicated with both the first insertion hole 4113 and the second insertion hole 4123, and the insertion pin 422 is inserted and fixed in the third insertion hole 4131. Optionally, the plug pins 422 are welded within the third plug holes 4131.

The battery 50 is located in a central region of the internal receiving space of the electronic device 100. The battery 50 is used to provide power to the electronic device 100, such as the display 12, the circuit board assembly 40, and the like.

In a second aspect, the present application also provides a circuit board assembly 40. The circuit board assembly 40 is the circuit board assembly 40 in the electronic device 100 of the first aspect described above. It is understood that the beneficial effects achieved by the circuit board assembly 40 according to the second aspect can refer to the beneficial effects of the first aspect and any possible design thereof, and are not described herein again.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims (26)

1. An electronic device comprising a circuit board assembly, the circuit board assembly comprising:

the circuit board stacking structure at least comprises a first circuit board and a second circuit board which are arranged in a stacked mode, the second circuit board is electrically connected to the first circuit board, a first plug hole is formed in the first circuit board, a second plug hole is formed in the second circuit board, and the second plug hole is communicated with the first plug hole;

the device comprises a device body and a plug pin, wherein the plug pin is connected to the device body, the device body is fixed on one side surface of the second circuit board, which is far away from the first circuit board, and the plug pin is plugged and fixed in the second plug hole and the first plug hole.

2. The electronic device of claim 1, wherein the component is a shield.

3. The electronic device according to claim 2, wherein the device body includes a shielding cover and a shielding frame, the shielding frame is connected to the shielding cover, and the plug pins are disposed at an end of the shielding frame away from the shielding cover.

4. The electronic device of claim 3, wherein one end of the plug pin is connected to an end surface of the shielding frame away from the shielding cover, and the other end extends toward a direction away from the shielding cover.

5. The electronic device of claim 3, wherein the shielding frame is provided with a flange turned outwards, one end of the pin is connected to the flange, and the other end of the pin extends in a direction away from the shielding cover.

6. An electronic device according to claim 1, wherein the width of the pin is gradually reduced or kept constant in a direction away from the device body.

7. The electronic device according to claim 1, wherein a first pad and a second pad are provided on the second circuit board, the second circuit board is electrically connected to the first circuit board by the first pad, the second circuit board is electrically connected to the first electronic component by the second pad, and the first pad and/or the second pad are/is located on one side of the second plugging hole close to the center of the second circuit board.

8. The electronic device according to claim 7, wherein a third land is further provided on the second circuit board, the third land includes a non-functional land and/or a ground land, an end of the third land away from the center of the second circuit board is flush with an end of the second plug hole away from the center of the second circuit board, or the third land is located on a side of the second plug hole close to the center of the second circuit board.

9. The electronic device of any of claims 1-8, wherein the electronic device comprises a housing, the housing comprises a back cover, the circuit board assembly is disposed within the housing, and the second circuit board is located on a side of the first circuit board facing away from the back cover;

a dodging hole is formed in the first circuit board, and a second electronic component is arranged in the dodging hole;

the orthographic projection of the second circuit board on the first circuit board covers the avoidance hole.

10. The electronic device of claim 9, wherein the second electronic component is spaced apart from the second circuit board.

11. The electronic device of claim 10, wherein the second electronic component is a camera module.

12. The electronic device of any of claims 1-8, wherein the circuit board stack structure further comprises:

the connecting frame is arranged between the first circuit board and the second circuit board, a third inserting hole is formed in the connecting frame, the third inserting hole is located between the first inserting hole and the second inserting hole and communicated with the first inserting hole and the second inserting hole, and the inserting pins are inserted and fixed in the third inserting hole.

13. The electronic device of any of claims 1-8, wherein the device body and the pin are a unitary piece.

14. The electronic device according to any one of claims 1 to 8, wherein the plurality of pins are provided at intervals in a circumferential direction of the device body.

15. The electronic device of any of claims 1-8, wherein the plug pin is soldered within the first plug hole and the second plug hole.

16. The electronic device of any of claims 1-8, wherein the circuit board stack structure comprises N circuit boards stacked one on top of another, the total thickness of the circuit board stack structure is W1, the thickness of N-1 circuit boards closest to the device in the circuit board stack structure is W2, the length of the pin is greater than W2 and less than or equal to W1, where N is a positive integer greater than or equal to 2.

17. The electronic device of any of claims 1-8, wherein a length of the pin is greater than or equal to 0.9mm and less than or equal to 1.1 mm.

18. A circuit board assembly, comprising:

the circuit board stacking structure at least comprises a first circuit board and a second circuit board which are arranged in a stacking mode, the second circuit board is electrically connected with the first circuit board, a first plug hole is formed in the first circuit board, a second plug hole is formed in the second circuit board, and the second plug hole is communicated with the first plug hole;

the device comprises a device body and a plug pin, the plug pin is connected to the device body, the device body is fixed on the surface of one side, away from the first circuit board, of the second circuit board, and the plug pin is plugged and fixed in the second plug hole and the first plug hole.

19. The circuit board assembly of claim 18, wherein the device is a shield.

20. The circuit board assembly of claim 19, wherein the device body comprises a shielding cover and a shielding frame, the shielding frame is connected to the shielding cover, and the plug pins are disposed at an end of the shielding frame away from the shielding cover.

21. The circuit board assembly of claim 20, wherein the pins have one end connected to an end surface of the shield frame away from the shield cover and another end extending away from the shield cover.

22. The circuit board assembly of claim 20, wherein the shielding frame has a flange folded outwardly, and the plug pins have one end connected to the flange and the other end extending away from the shielding cover.

23. The circuit board assembly of claim 18, wherein the width of the pins decreases or remains constant in a direction away from the device body.

24. The circuit board assembly according to claim 18, wherein the second circuit board has a first pad and a second pad, the second circuit board is electrically connected to the first circuit board via the first pad, the second circuit board is electrically connected to the first electronic component via the second pad, and the first pad and/or the second pad are located on a side of the second plugging hole close to a center of the second circuit board.

25. The circuit board assembly of claim 24, wherein the second circuit board further comprises a third land, the third land comprises a non-functional land and/or a ground land, an end of the third land away from the center of the second circuit board is flush with an end of the second via hole away from the center of the second circuit board, or the third land is located on a side of the second via hole near the center of the second circuit board.

26. The circuit board assembly of any one of claims 18-25, wherein the plug pins are integral with the device body.

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