CN220043742U - Circuit board assembly and electronic equipment - Google Patents

Abstract

The application provides a circuit board assembly and electronic equipment, relates to the technical field of electronic products, and is used for solving the problem of high-density layout of the surface of a circuit board. Specifically, the circuit board assembly includes a circuit board, a first shield and a second shield. The first shielding cover comprises a first top wall and a first side frame arranged around the periphery of the first top wall, the surface of the first side frame, deviating from the first top wall, is connected to the first surface, and the first side frame comprises a first side wall. The second shielding cover comprises a second top wall and a second side frame arranged around the periphery of the second top wall, the surface of the second side frame, which is away from the second top wall, is connected to the first surface, and the second side frame comprises a second side wall facing the first side wall. The second side wall is provided with an avoidance through hole, the avoidance through hole penetrates through the surface of the second side wall deviating from the second top wall in the direction perpendicular to the first surface, and the first side wall is accommodated in the avoidance through hole. The use area of the surface of the circuit board is saved, and the miniaturization development of the circuit board assembly is facilitated.

Description

Circuit board assembly and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a circuit board assembly and an electronic device.

Background

In electronic products, radio frequency devices, charging devices, main chips and the like on a circuit board have strong high-frequency noise and interference signals, and shielding is required to be performed by using a shielding cover. As electronic products are developed in a multifunctional direction, the area of the circuit board inside the electronic products is more and more tensioned, and the distance between electronic components on the circuit board also reaches the processing capacity limit. Due to the limitation of the processing technology, the spacing between the shielding covers covered on the electronic components is as low as 0.25mm. This results in insufficient spacing between adjacent shields to allow for additional electronic components to be mounted, thereby wasting a certain area of the circuit board and not facilitating a high density placement of electronic components on the circuit board.

Disclosure of Invention

The embodiment of the utility model provides a circuit board assembly and electronic equipment, which are used for solving the problem of high-density layout of the surface of a circuit board.

In order to achieve the above purpose, the embodiment of the present utility model adopts the following technical scheme:

in a first aspect, the present utility model provides a circuit board assembly including a circuit board, a first shield, and a second shield. The first shielding cover comprises a first top wall and a first side frame arranged around the periphery of the first top wall, the surface of the first side frame, deviating from the first top wall, is connected to the first surface, and the first side frame comprises a first side wall. The second shielding cover comprises a second top wall and a second side frame arranged around the periphery of the second top wall, the surface of the second side frame, which is away from the second top wall, is connected to the first surface, and the second side frame comprises a second side wall facing the first side wall. The second side wall is provided with an avoidance through hole, the avoidance through hole penetrates through the surface of the second side wall deviating from the second top wall in the direction perpendicular to the first surface, and the first side wall is accommodated in the avoidance through hole.

Only one row of bonding pads is arranged between the adjacent first shielding cover and the second shielding cover, and the bonding pads are used for welding the first side wall. The second side wall is not contacted with the first surface, and the first surface is not provided with a bonding pad for welding the second side wall, so that the use area of the surface of the circuit board is saved, and the miniaturization development of the circuit board assembly is facilitated. Further, the first shielding cover and the second shielding cover are two independent shielding covers, so that the problem that the shielding covers are too long is avoided, and the flatness of the shielding covers is guaranteed. And further avoids the problems of cold joint, off-joint and the like during welding of the shielding case.

In one possible implementation, the outer surface of the first sidewall includes a first side surface and a first step surface. The first side is connected with the first top wall, the first step surface is connected to the first side, the orientation of the first step surface is the same as the orientation of the outer surface of the first top wall, and the inner wall avoiding the through hole is positioned on one side towards which the first step surface faces and is connected to the first step surface.

The first side wall is provided with a first step surface protruding towards the second side wall, and the first step surface is accommodated in the avoidance through hole. So that the first shield can be more closely attached to the second shield can. And when the first shielding cover and the second shielding cover are installed, the first step surface plays a good limiting role in the installation of the second shielding cover. After the first shielding cover and the second shielding cover are mounted on the first surface, the first step surface can also provide support for the second side wall, the original first surface is provided for the support of the second side wall, and the first surface is transferred to the first step surface to provide support for the second side wall. On the premise of saving the bonding pads and ensuring the high-density layout of the circuit board, the connection strength of the shielding cover can be ensured.

In one possible implementation, the first side frame further includes a third side wall and a fourth side wall, and the third side wall and the fourth side wall are respectively connected to two sides of the first side wall. The second side frame further comprises a fifth side wall and a sixth side wall, and the fifth side wall and the sixth side wall are respectively connected to two sides of the second side wall. The surface of the third side wall facing away from the fourth side wall is flush with the surface of the fifth side wall facing away from the sixth side wall. The surface of the fourth side wall facing away from the third side wall is flush with the surface of the sixth side wall facing away from the fifth side wall. The junction of the third side wall and the fifth side wall is flat, and the junction of the fourth side wall and the sixth side wall is also flat. The whole of the shielding cover is more attractive, and the accommodating spaces of the first shielding cover and the second shielding cover are smoother. And the first shielding cover and the second shielding cover are more convenient to install. The first shielding cover and the second shielding cover can be better attached, and the shielding effect of the shielding cover is further improved.

In one possible implementation, the outer surface of the third sidewall includes a second side surface and a second step surface; the second step surface is connected with the first side wall, the second side surface is connected with the second step surface, the direction of the second step surface is the same as the direction of the outer surface of the third side wall, and the inner wall avoiding the through hole is positioned on one side of the second step surface and connected to the second step surface. The inner wall of the relief through hole may be an inner surface of the second top wall. The inner surface of the second top wall means a surface of the second top wall facing the second shield shell accommodating space. In this embodiment, the first sidewall is accommodated in the avoidance through hole, penetrating through both sides of the second sidewall directly. The internal surface of second roof is connected on the second step face for laminate more between first shield cover and the second shield cover, further improve shielding effect. Further, the second step surface also provides a larger supporting surface for the connection of the second shielding case, and the connection strength between the first shielding case and the second shielding case is further improved.

In one possible implementation, the outer surface of the fourth sidewall includes a third side surface and a third step surface. The third step surface is connected with the first side wall, the third side surface is connected to the third step surface, the direction of the third step surface is the same as the direction of the outer surface of the fourth side wall, and the inner wall avoiding the through hole is positioned on the side, facing the third step surface, and is connected to the third step surface. The third step surface also provides a larger supporting surface for the connection of the second shield, further improving the connection strength between the first shield and the second shield. The first shielding cover is more attached to the second shielding cover, and shielding effect is further improved.

In one possible implementation, the first side, the second side, and the third side are in the same plane. The appearance of the first shielding cover is smoother and more attractive. And the first side surface, the second side surface and the third side surface can be respectively and better attached to the second top wall, the fifth side wall and the sixth side wall, so that the shielding effect of the shielding cover is further improved.

In one possible implementation, one of the second step surface and the fifth side wall is provided with a first projection, and the other of the second step surface and the fifth side wall is provided with a first recess, the first projection being accommodated in the first recess. The first convex block is matched with the first groove, so that the connection between the first shielding cover and the second shielding cover is more compact. The gap between the second step surface and the fifth side wall can be closed by the further first protruding blocks, so that the shielding effect of the shielding cover is improved. And moreover, the first lug and the first groove are matched to play a limiting role in the installation of the first shielding cover and the second shielding cover, so that the installation of the first shielding cover and the second shielding cover is quicker and more efficient.

In one possible implementation, one of the third step surface and the sixth side wall is provided with a second projection, and the other of the third step surface and the sixth side wall is provided with a second recess, the second projection being accommodated in the second recess. The shielding effect of the first shielding case and the second shielding case can be further improved.

In one possible implementation, the surface of the first top wall facing away from the first side frame is flush with the surface of the second top wall facing away from the second side frame. The flatness of the joint of the first shielding cover and the second shielding cover is guaranteed, and the appearance is attractive.

In one possible implementation, the first connection part is further included. The first connecting part is positioned on one side of the outer surface of the first top wall, and is connected with at least partial area of the outer surface of the first top wall and at least partial area of the outer surface of the second top wall so as to close a gap between the first top wall and the second top wall. The first connecting portion covers the outer surfaces of the first top wall and the second top wall, and further closes a gap between the first shielding cover and the second shielding cover, so that the shielding effect of the shielding cover is improved.

In one possible implementation, the second connection part is further included. The second connecting part is positioned on one side of the outer surface of the third side wall, and is connected with at least part of the area of the outer surface of the third side wall and at least part of the area of the outer surface of the fifth side wall so as to close the gap between the third side wall and the fifth side wall. The second connecting part covers the outer surfaces of the third side wall and the fifth side wall, so that a gap between the first shielding cover and the second shielding cover is further closed, and the shielding effect of the shielding cover is further improved.

In one possible implementation, a third connection portion is further included. The third connecting part is positioned on one side of the outer surface of the fourth side wall, and is connected with at least part of the area of the outer surface of the fourth side wall and at least part of the area of the outer surface of the sixth side wall so as to close the gap between the fourth side wall and the sixth side wall. The third connecting portion covers the outer surfaces of the fourth side wall and the sixth side wall, gaps between the first shielding cover and the second shielding cover are further closed, and therefore shielding effect of the shielding cover is improved.

In one possible implementation, the first connection is a conductive cloth or copper foil. The cost of the conductive cloth and the copper foil is lower, and the conductive cloth and the copper foil can play a good shielding effect when being arranged in a gap between the first shielding cover and the second shielding cover.

In one possible implementation, the width of the first step surface is greater than or equal to 0.5mm and less than or equal to 20mm. The first step surface can provide bigger supporting surface for the connection of the second top wall when meeting the width, and then can improve the connection strength between the first shielding cover and the second shielding cover, so that the whole shielding cover is firmer. However, the width cannot be increased infinitely, and when the width of the first step surface is 20mm or less, the connection strength can be balanced and the shield can be miniaturized.

In one possible implementation, the circuit board assembly further includes a first set of pads disposed on the first surface and a second set of pads disposed along the first annular shape, the first set of pads for soldering to the first shield, the first set of pads including a first pad for soldering to the first sidewall. The second group of bonding pads are arranged on the first surface, the second group of bonding pads and the first bonding pads are distributed along a second ring shape, and the second group of bonding pads are used for welding the second shielding cover. The first shielding case is welded to the first surface through a first group of bonding pads, the second shielding case is welded to the first surface through a second group of bonding pads, and the first shielding case and the second shielding case share the first bonding pads. The use area of the circuit board is further saved, and the circuit board assembly can be designed to be more miniaturized.

In one possible implementation, the circuit board assembly further includes a first electronic component and a second electronic component, the first electronic component and the second electronic component are connected to the first surface, and the first electronic component is located in the first shield, and the second electronic component is located in the second shield. The interference signals of the first electronic component and the second electronic component are shielded by the shielding cover.

In a second aspect, an electronic device is provided, including a housing, and the circuit board assembly described above, where the circuit board assembly is disposed in the housing.

The electronic equipment provided by the embodiment of the application comprises the circuit board assembly according to any technical scheme, so that the electronic equipment and the circuit board assembly can solve the same technical problems and achieve the same effects.

Drawings

Fig. 1 is a perspective view of an electronic device provided in some embodiments of the present application;

FIG. 2 is an exploded view of the electronic device shown in FIG. 1;

FIG. 3 is a schematic cross-sectional view of the back shell of FIG. 2 taken along line A-A;

fig. 4 is a schematic structural diagram of a circuit board assembly according to some embodiments of the present application;

fig. 5 is a schematic structural diagram of a circuit board assembly according to some embodiments of the present application;

FIG. 6 is a schematic cross-sectional view of the circuit board assembly of FIG. 5 taken along line B-B;

FIG. 7 is a schematic diagram illustrating a circuit board assembly during a manufacturing process according to some embodiments of the present application;

fig. 8 is a schematic structural diagram of a circuit board assembly according to some embodiments of the present application;

FIG. 9 is a schematic cross-sectional view of the circuit board assembly of FIG. 8 along line B-B

FIG. 10 is a schematic cross-sectional view of the circuit board assembly of FIG. 8 taken along line B-B;

FIG. 11 is a schematic cross-sectional view of the circuit board assembly of FIG. 8 taken along line B-B;

fig. 12 is a schematic view of the shield from fig. 11 with the first top wall and the second top wall removed from view C;

FIG. 13 is a schematic cross-sectional view of the circuit board assembly 30 of FIG. 8 taken along line B-B;

FIG. 14 is an enlarged view of area D of FIG. 13;

FIG. 15 is another enlarged view of area D of FIG. 13;

FIG. 16 is a schematic view of the shield from FIG. 13 with the first top wall and the second top wall removed from view E;

fig. 17 is a schematic view of another construction of the shield from fig. 13 with the first top wall and the second top wall removed from view E;

fig. 18 is a schematic view of still another construction of the shield from fig. 13 with the first top wall and the second top wall removed from view E;

FIG. 19 is a schematic cross-sectional view of the circuit board assembly of FIG. 8 taken along line B-B;

fig. 20 is a schematic view of still another construction of the shield from fig. 13 with the first top wall and the second top wall removed from view E;

fig. 21 is a schematic structural diagram of a first surface of a circuit board according to some embodiments of the present application.

Detailed Description

In some embodiments, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third", and "a fourth" may explicitly or implicitly include one or more such feature.

In some embodiments, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

It is to be understood that the above orientation or positional relationship as indicated by the terms "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and to simplify the description, and are not indicative or implying that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

The utility model provides an electronic device, which is a type of electronic device with a circuit board assembly. The electronic device may be a User Equipment (UE) or a terminal device (terminal) or the like. For example, the electronic device may be a personal digital processing (personal digital assistant, PDA), a handheld device with wireless communication functionality, a computing device, an in-vehicle device, a wearable device, a Virtual Reality (VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a terminal in industrial control (industrial control), a terminal in unmanned driving (self driving), a terminal in remote medical (remote medium), a terminal in smart grid (smart grid), a terminal in transportation security (transportation safety), a terminal in smart city (smart city), a terminal in smart home (smart home). The large-screen display terminal comprises, but is not limited to, a smart screen, a tablet personal computer (portable android device, PAD), a notebook computer, a desktop computer, a television, a projector and other devices.

Referring to fig. 1, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present application. The present embodiment and the following embodiments are exemplary illustrations using the electronic device 100 as a mobile phone. The electronic device 100 is approximately rectangular plate-like. On this basis, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, the width direction of the electronic apparatus 100 is defined as the Z-axis direction, the length direction of the electronic apparatus 100 is defined as the X-axis direction, and the thickness direction of the electronic apparatus 100 is defined as the Y-axis direction. It is to be understood that the coordinate system of the electronic device 100 may be flexibly set according to actual needs, which is not specifically limited herein. In other embodiments, the shape of the electronic device 100 may be a square flat plate, a round flat plate, an oval flat plate, or the like, which is not particularly limited herein.

Referring to fig. 1 and fig. 2 together, fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. In the present embodiment, the electronic device 100 includes a display screen 10 and a back case 20.

It is to be understood that fig. 1 and 2 only schematically illustrate some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual configuration of these components are not limited by fig. 1 and 2.

Referring to fig. 2, a display screen 10 is used for displaying images, videos, and the like. The display screen 10 includes a light-transmitting cover plate 12 and a display module 11. The light-transmitting cover plate 12 is laminated with the display module 11. The light-transmitting cover plate 12 is mainly used for protecting and preventing dust of the display module 11. The material of the transparent cover plate 12 includes, but is not limited to, glass. The light-transmissive cover plate 12 faces the user when the user uses the electronic device 100. The light-transmitting cover plate 12 has the functions of impact resistance, scratch resistance, oil stain resistance, fingerprint resistance, light transmittance enhancement and the like.

The display module 11 may be a flexible display module or a rigid display module. For example, the display module 11 includes a display panel, which may be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a mini-led (mini organic light-emitting diode) display panel, a micro-led (micro organic light-emitting diode) display panel, a micro-organic light-emitting diode (micro organic light-emitting diode) display panel, a quantum dot led (quantum dot light emitting diodes, QLED) display panel, and a liquid crystal display panel (liquid crystal display, LCD).

With continued reference to fig. 2, the back shell 20 forms a housing of the electronic device 100 for protecting the internal electronics of the electronic device 100. The back shell 20 may include a back cover 21 and a bezel 22. The back cover 21 is located at one side of the display module 11 far away from the transparent cover plate 12, and is stacked with the transparent cover plate 12 and the display module 11 at intervals. The frame 22 is located between the back cover 21 and the light-transmitting cover plate 12. The frame 22 is fixed on the back cover 21, and the frame 22 may be fixedly connected to the back cover 21 by an adhesive, or the frame 22 and the back cover 21 may be integrally formed, i.e. the frame 22 and the back cover 21 are integrally formed. The light-transmitting cover plate 12 is fixed to the rim 22 by gluing. The light-transmitting cover plate 12, the back cover 21 and the frame 22 enclose a housing cavity 23 of the electronic device 100. The accommodation chamber 23 accommodates components such as the display module 11, the circuit board, the camera, and the flash lamp.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the back shell 20 of fig. 2 along line A-A. In some embodiments, back shell 20 also includes midplane 24. The middle plate 24 is disposed in the accommodating cavity 23, and the middle plate 24 is located at a side of the display module 11 away from the transparent cover plate 12. The edge of the middle plate 24 is fixed to the rim 22. In some embodiments, the edge of the middle plate 24 is fixed to the frame 22 by gluing, and the middle plate 24 and the frame 22 may be integrally formed, i.e. the middle plate 24 and the frame 22 are integrally formed. The middle plate 24 divides the accommodating cavity into a first accommodating groove 231 and a second accommodating groove 232, and the display module 11 is located in the first accommodating groove 231. Other electronic components, such as a battery, a circuit board assembly, etc., are disposed in the second receiving groove 232.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a circuit board assembly 30 according to some embodiments of the present application. The circuit board assembly 30 is disposed within the second receiving slot 232. The circuit board assembly 30 includes an electronic component 31 and a circuit board 32, the electronic component 31 being connected to the circuit board 32. The circuit board 32 is used for realizing electrical connection among various electronic components 31, and the circuit board 32 is used for performing operations such as signal control, data signal processing, data signal storage and the like on the electronic components 31.

In some embodiments, electronic component 31 is configured to implement one or more functions of electronic device 100. The electronic components 31 include, but are not limited to, chips, resistors, capacitors, inductors, potentiometers, tubes, heat sinks, electromechanical elements, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro-motors, electronic transformers, relays, and the like. The electronic components 31 are provided with a plurality of spaced pin terminals, and it should be noted that the number and arrangement of the electronic components 31 in the embodiment of the present application may be set according to actual needs, and the embodiment of the present application does not limit the number and arrangement of the electronic components 31.

Circuit board 32 includes, but is not limited to, a printed circuit board (printed circuit board, PCB) and a flexible circuit (flexible printed circuit, FPC) board. This embodiment and the following embodiments are exemplified by using the circuit board 32 as a PCB board. The shape of the circuit board 32 includes, but is not limited to, rectangular, square, polygonal, circular, etc., and in the embodiment shown in fig. 4, the shape of the circuit board 32 is rectangular.

The circuit board 32 is composed of metal layers and insulating medium layers alternately arranged in sequence, wherein the metal layers comprise signal lines and/or metal reference surfaces. In the circuit board 32, the signal lines in different metal layers are connected by using metallized vias. The circuit board 32 is used for carrying the electronic component 31 and is electrically connected with the electronic component 31. Specifically, a plurality of pads are formed on the metal layer of the circuit board 32 and are used for being soldered with a plurality of pin terminals, so as to connect the electronic component 31 to the circuit board 32. The shape of the pads includes, but is not limited to, rectangular, square, polygonal, circular, oval, or profiled, etc. The plurality of pads may be arranged in an array. Of course, the plurality of pads may also be irregularly arranged.

The soldering material, such as solder paste, is provided on the pads of the circuit board 32, the lead terminals of the electronic component 31 are soldered to the pads by the soldering material, and the soldering material is heated and melted, so that the pads and the lead terminals are soldered as a whole, and the electronic component 31 is soldered to the circuit board 32.

During use of the electronic device 100, the electronic components 31 on the circuit board 32 may be disturbed, for example: the electronic components 31 such as radio frequency devices, charging devices, main chips, etc. have strong high-frequency noise and interference signals. If the interference is too strong, the normal operation of the electronic component 31 is affected, and thus the normal operation of the electronic device 100 is affected.

In order to solve the above-mentioned problems, please refer to fig. 5 and fig. 6 together, fig. 5 is a schematic structural diagram of a circuit board assembly 30 according to some embodiments of the present application, fig. 6 is a schematic structural diagram of a cross-section of the circuit board assembly 30 along line B-B in fig. 5, and a shielding cover 33 is disposed on a circuit board 32, where the shielding cover 33 is used for accommodating an electronic component 31. The shield 33 is connected to the surface of the circuit board 32 through pads 34. Solder material, such as solder paste, is disposed on the pads 34. The shield case 33 is soldered to the pad 34 by the soldering material, and the soldering material is heated and melted, thereby soldering the shield case 33 to the circuit board 32.

In operation of the circuit board assembly 30, the electronic component 31 emits a disturbance signal around, and when the disturbance signal encounters the shield 33, part of the disturbance signal is reflected back, and part of the disturbance signal is absorbed by the shield 33, so that the disturbance signal ends up on the surface of the shield 33. Similarly, when the interference signal emitted from the external electronic component 31 reaches the shield case 33, the interference signal is shielded, and thus the electronic components 31 do not interfere with each other.

With continued reference to fig. 6, in some embodiments, the number of electronic components 31 is at least two. In some embodiments, the electronic components 31 may include a first electronic component 311 and a second electronic component 312 disposed adjacent to each other. Correspondingly, the number of the shields 33 is also at least two. Specifically, the shield 33 may include a first shield 331 and a second shield 332. The first shielding cover 331 is used for accommodating the first electronic component 311, the first shielding cover 331 shields the interference signal sent by the first electronic component 311 in the first shielding cover 331, and shields the external interference signal outside the first shielding cover 331, so as to ensure that the first electronic component 311 is not affected by the interference signal.

Similarly, the second shielding cover 332 is configured to accommodate the second electronic component 312, where the second shielding cover 332 shields the interference signal sent by the second electronic component 312 in the second shielding cover 332, and shields the external interference signal outside the second shielding cover 332, so as to realize that the second electronic component 312 is not affected by the interference signal.

As the electronic device 100 tends to be ultra-thin and miniaturized, in order to avoid the problem of space waste caused by excessive surface whiteout of the circuit board 32 when the circuit board assembly 30 is produced, the electronic components 31 are compactly arranged on the surface of the circuit board 32. The shield case 33 is also compactly arranged on the circuit board 32 along with the electronic components 31. Thereby, the pitch of the adjacent shields 33 is correspondingly reduced. The spacing between adjacent pads 34 for soldering the shield 33 is correspondingly reduced on the surface of the circuit board 32.

However, due to limitations in the manufacturing process, the distance between adjacent pads 34 can be only 0.25mm at a minimum. The gaps between adjacent pads 34 waste space on the surface of the circuit board 32. Therefore, it is necessary to break through the limit of 0.25mm to make the pitch between adjacent pads 34 smaller.

With continued reference to fig. 7, fig. 7 is a schematic diagram illustrating a circuit board assembly 30 during a manufacturing process according to some embodiments of the application. The limitation regarding the manufacturing process is that in the solder paste printing process of the circuit board assembly 30, the surface of the pads 34 is brushed with solder paste through the steel mesh 40, and the openings 41 of the steel mesh 40 limit the distance between the adjacent pads 34.

Specifically, the surface of the steel mesh 40 is provided with a plurality of openings 41 at intervals. The openings 41 are through holes penetrating the body of the steel mesh 40, and the plurality of openings 41 are distributed along a ring shape, for example, a circular ring shape, a square ring shape. The ring shape conforms to the shape of the shield 33. When the surface of the land 34 is soldered, first, the steel mesh 40 is attached to the surface of the circuit board 32, and the land 34 is accommodated in the opening 41 of the steel mesh 40. The surface of the steel mesh 40 is covered with molten solder, and the molten solder flows into the surface of the pad 34 through the opening 41 of the steel mesh 40. Excess molten solder on the surface of the steel mesh 40 is scraped off by a scraper. The scraping process can remove the redundant solder on the one hand; alternatively, molten solder may be extruded into the unfilled openings 41 to ensure the formation of solder paste on the surface of the pads 34 at the openings 41. Finally, the electronic component 31 is soldered to the surface of the circuit board 32 by solder paste.

In the above process, the steel mesh 40 needs to have a certain structural strength to ensure the formation of the solder in the openings 41. The steel mesh 40 between the openings 41 forms the connecting ribs 42, and if the space between the adjacent openings 41 is smaller, the width of the connecting ribs 42 is narrower, and the risk of bending deformation of the connecting ribs 42 is larger, which affects the forming effect of the solder. Therefore, in order to secure the structural strength of the connecting rib 42, the distance between the adjacent openings 41 can be only 0.25mm at a minimum.

Referring to fig. 8 and fig. 9 together, fig. 8 is a schematic structural diagram of a circuit board assembly 30 according to some embodiments of the present application, and fig. 9 is a schematic sectional structural diagram of the circuit board assembly 30 along line B-B in fig. 8. In order to solve the above-mentioned problems, the present application proposes a circuit board assembly 30, wherein a first shield 331 and a second shield 332 are provided as an integral shield, and a partition plate 333 is provided on an inner wall of the integral shield, wherein the partition plate 333 divides an inner cavity of the integral shield into two. The first electronic component 311 and the second electronic component 312 are respectively located at two sides of the partition 333. In this way, the surface of the circuit board 32 saves the area of a group of pads and the area generated by the space between adjacent pads, which is beneficial to the miniaturization development of the circuit board. However, the integral shield needs to accommodate two or more electronic components 31, and thus the area of the integral shield is excessively large. When the length of the shield 33 exceeds 300mm, the existing manufacturing process cannot satisfy the flatness of the surface of the shield 33. The poor flatness of the shielding case 33 may result in the failure of complete adhesion between the shielding case 33 and the surface of the circuit board 32, and thus cause problems such as cold joint and solder joint.

Referring to fig. 10, fig. 10 is a schematic cross-sectional view of the circuit board assembly 30 of fig. 8 along line B-B. In order to solve the above-mentioned problem, the present application also proposes a circuit board assembly 30. The circuit board assembly 30 includes a circuit board 32, a first shield 331, and a second shield 332. Specifically, the circuit board 32 includes a first surface 321. The first surface 321, i.e., the XY plane in the illustration, the first surface 321 may be the upper or lower surface of the circuit board 32. The first and second shields 331 and 332 may be disposed on an upper surface or a lower surface of the circuit board 32.

The first shield 331 includes a first top wall 3311 and a first side frame 3312 disposed around a circumference of the first top wall 3311, a surface of the first side frame 3312 facing away from the first top wall 3311 being connected to the first surface 321, the first side frame 3312 including a first side wall 3312a. The second shielding cover 332 includes a second top wall 3321 and a second side frame 3322 disposed around a circumference of the second top wall 3321, where a surface of the second side frame 3322 facing away from the second top wall 3321 is connected to the first surface 321, and the second side frame 3322 includes a second side wall 3322a facing the first side wall 3312a. The second side wall 3322a is provided with a avoidance through hole 3322b, and in the direction perpendicular to the first surface 321, the avoidance through hole 3322b penetrates to the surface of the second side wall 3322a facing away from the second top wall 3321, and the first side wall 3312a is accommodated in the avoidance through hole 3322 b.

The shapes of the first shield 331 and the second shield 332 may be rectangular, cylindrical, elliptical, or irregular, and the present application is described by taking the shape of the first shield 331 and the second shield 332 as rectangular, but this is not a particular limitation of the application. The first top wall 3311 may be rectangular in shape, and the first side wall 3312a is one of four side walls of the first side frame 3312. The second top wall 3321 may have the same shape as the first top wall 3311, and the second top wall 3321 may have the same size as the first top wall 3311 or may be different from the first top wall 3311, and the second top wall 3321 and the first top wall 3311 are illustrated as having the same shape and size.

The bottom of the second sidewall 3322a does not need to be connected to the first surface 321, and the first surface 321 can save space of a row of pads. And, the first sidewall 3312a may block the escape opening 41, ensuring the shielding effect of the second shielding case 332.

Therefore, under the above embodiment, only one row of pads for soldering the first sidewall 3312a is provided between the adjacent first and second shields 331 and 332. The second side wall 3322a is not in contact with the first surface 321, and the first surface 321 may not be provided with a pad for soldering the second side wall 3322a, so as to save the usage area of the surface of the circuit board 32, and facilitate the miniaturization development of the circuit board assembly 30. Further, the first shielding case 331 and the second shielding case 332 are two separate shielding cases 33, so that the problem of overlong integrated shielding cases is avoided, and the flatness of the shielding cases 33 is ensured. And further, the problems of cold joint, off-joint, etc. during welding of the shield case 33 are avoided.

Referring to fig. 11, fig. 11 is a schematic cross-sectional view of the circuit board assembly 30 of fig. 8 along line B-B. On the premise of the above embodiment, in the direction perpendicular to the first surface 321, the avoidance through hole 3322b penetrates to the surface of the second side wall 3322a facing away from the first surface 321, that is, the avoidance through hole 3322b penetrates to the outer surface of the second side wall 3322a. The first sidewall 3312a is connected to the second top wall 3321, and the first sidewall 3312a closes off the avoiding through hole 3322b. In this way, the avoidance holes 3322b on the second side wall 3322a penetrate the upper and lower sides of the second side wall 3322a in the Y-axis direction. The structure of the second shield 332 is simpler, thereby reducing the manufacturing cost of the second shield 332.

Referring to fig. 12, fig. 12 is a schematic view of the shielding case 33 in fig. 11, in which the first top wall 3311 and the second top wall 3321 are removed from view C. The avoidance holes 3322b may penetrate to both front and rear sides of the second sidewall 3322a in a direction parallel to the first surface 321, i.e., in the X-axis direction in the drawing. In this way, the second sidewall 3322a may be omitted. The first side wall 3312a is connected to the side wall of the second side frame 3322 to block the avoidance hole 3322b. The structure of the second shielding case 332 is simpler because the second side wall 3322a is not provided, which is also beneficial to the adhesion of the first side wall 3312a and the second shielding case 332, and the shielding effect of the shielding case 33 is further improved.

Referring to fig. 13 and 14, fig. 13 is a schematic cross-sectional view of the circuit board assembly 30 of fig. 8 along line B-B, and fig. 14 is an enlarged view of area D of fig. 13. In some embodiments, the outer surface of the first sidewall 3312a includes a first side 3312b and a first step surface 3312c. The first side frame 3312 and the first top wall 3311 define a cavity, and the outer surface of the first side wall 3312a refers to a surface of the first side wall 3312a facing away from the cavity, that is, a surface of the first side wall 3312a facing the second side wall 3322 a. The first side surface 3312b is connected to the first top wall 3311, the first step surface 3312c is connected to the first side surface 3312b, and a first included angle α is formed between the first side surface 3312b and the first step surface 3312c.

The orientation of the first step surface 3312c is the same as the orientation of the outer surface of the first top wall 3311, that is, the positive direction of the Y axis in the drawing. The inner wall of the escape through hole 3322b is positioned on the side facing the first step surface 3312c and is connected to the first step surface 3312c. In one embodiment, the relief through hole 3322b is a through hole on the second sidewall 3322a, and the inner wall of the relief through hole 3322b is the inner wall of the through hole on the second sidewall 3322 a.

In comparison with the above-described embodiment, the first side wall 3312a of the present embodiment is provided to have the first step surface 3312c facing the second side wall 3322a, the first step surface 3312c being accommodated within the escape through hole 3322 b. So that the first shield 331 is more closely adhered to the second shield 332. When the first and second shields 331 and 332 are mounted, the first stepped surface 3312c plays a good role in limiting the mounting of the second shield 332. After the first and second shields 331, 332 are mounted to the first surface 321, the first step surface 3312c may also provide support to the second side wall 3322a, transferring the original support provided by the first surface 321 to the second side wall 3322a to the first step surface 3312c provides support to the second side wall 3322 a. The land area is saved, the high-density layout of the circuit board 32 is ensured, and the connection strength of the shield case 33 is also ensured.

Referring to fig. 15, fig. 15 is another enlarged view of the area D in fig. 13. In other embodiments, the second side frame 3322 may not include the second side wall 3322a, and the second side frame 3322 directly leaves the avoiding through holes 3322b in the region of the second side wall 3322 a. The first side wall 3312a is accommodated in the escape through hole 3322b, and specifically, an inner surface of the second top wall 3321 is connected to the first step surface 3312c, and a side surface of the second top wall 3321 is connected to the first side surface 3312 b. In this embodiment, the second side wall 3322a is omitted, so that a larger space is reserved for avoiding the arrangement of the through hole 3322b, and the structure of the second side frame 3322 is simpler and the manufacturing cost is lower. The first step surface 3312c is used for limiting the installation of the second side frame 3322, so that the second side frame 3322 is matched with the first side wall 3312a to be more fit, and a better shielding effect is achieved.

Referring back to fig. 12, in some embodiments, the first side frame 3312 further includes a third sidewall 3312d and a fourth sidewall 3312e, and the third sidewall 3312d and the fourth sidewall 3312e are respectively connected to two sides of the first sidewall 3312 a. The second side frame 3322 further includes a fifth side wall 3322c and a sixth side wall 3322d, and the fifth side wall 3322c and the sixth side wall 3322d are respectively connected to two sides of the second side wall 3322 a. The surface of the third sidewall 3312d facing away from the fourth sidewall 3312e is flush with the surface of the fifth sidewall 3322c facing away from the sixth sidewall 3322 d.

The surface of the fourth sidewall 3312e facing away from the third sidewall 3312d is flush with the surface of the sixth sidewall 3322d facing away from the fifth sidewall 3322 c. In this way, the interface between the third sidewall 3312d and the fifth sidewall 3322c is flat, and the interface between the fourth sidewall 3312e and the sixth sidewall 3322d is also flat. The whole of the shielding case 33 is more beautiful, and the respective accommodating spaces of the first shielding case 331 and the second shielding case 332 are also flatter. And, the installation of the first and second shields 331 and 332 is more facilitated. The first shield 331 and the second shield 332 can be better bonded, and the shielding effect of the shield 33 can be further improved.

Referring to fig. 16, fig. 16 is a schematic structural view of the shielding case 33 in fig. 13, in which the first top wall 3311 and the second top wall 3321 are removed from the view point E. In some embodiments, the outer surface of third sidewall 3312d includes a second side surface 3312f and a second step surface 3312g. The outer surface of the third sidewall 3312d refers to the surface of the third sidewall 3312d which connects to the first sidewall 3312 a. The second step surface 3312g is connected to the first side wall 3312a, and the second side surface 3312f is connected to the second step surface 3312g, and the second step surface 3312g is oriented in the same direction as the outer surface of the third side wall 3312d, that is, in the negative direction of the X-axis in the drawing. The inner wall of the escape through hole 3322b is positioned on the side toward which the second step surface 3312g faces and is connected to the second step surface 3312g. The second side surface 3312f forms a second angle β with the second step surface 3312g. In one embodiment, the inner wall of the relief through hole 3322b may be an end surface of the second side wall 3322a facing away from the second top wall 3321.

Referring to fig. 17, fig. 17 is a schematic diagram of another structure of the shielding case 33 in fig. 13, in which the first top wall 3311 and the second top wall 3321 are removed from the view point E. In other embodiments, the inner wall of the relief through hole 3322b may be an inner surface of the second top wall 3321. The inner surface of the second top wall 3321 refers to the surface of the second top wall 3321 facing the accommodating space of the second shield case 332. In this embodiment, the avoidance hole 3322b directly penetrates through both sides of the second sidewall 3322a, and the first sidewall 3312a is accommodated in the avoidance hole 3322 b. A third included angle θ is formed between the third side surface 3312h and the third step surface 3312i, and the inner surface of the second top wall 3321 is connected to the second step surface 3312g, so that the first shielding cover 331 and the second shielding cover 332 are more attached to each other, and the shielding effect is further improved. Further, the second step surface 3312g also provides a larger support surface for the connection of the second shield shell 332, further improving the strength of the connection between the first shield shell 331 and the second shield shell 332.

With continued reference to fig. 17, the outer surface of the fourth sidewall 3312e includes a third side surface 3312h and a third step surface 3312i, and the outer surface of the fourth sidewall 3312e refers to a surface of the fourth sidewall 3312e facing away from the accommodation space enclosed by the second shielding case 332. The third step surface 3312i is connected to the first side wall 3312a, the third side surface 3312h is connected to the third step surface 3312i, the orientation of the third step surface 3312i is the same as the orientation of the outer surface of the fourth side wall 3312e, that is, the positive direction of the X axis in the drawing, the inner wall of the avoidance through hole 3322b is located at the side toward which the third step surface 3312i faces, and the inner wall of the avoidance through hole 3322b is connected to the third step surface 3312 i. The third step surface 3312i also provides a larger support surface for the connection of the second shield 332, further improving the strength of the connection between the first shield 331 and the second shield 332. The first shielding cover 331 is more attached to the second shielding cover 332, so that the shielding effect is further improved.

With continued reference to fig. 17, in some embodiments, the first side 3312b, the second side 3312f, and the third side 3312h are in the same plane. The height of the first step surface 3312c protruding from the first side surface 3312b, the height of the second step surface 3312g protruding from the second side surface 3312f, and the height of the third step surface 3312i protruding from the third side surface 3312h are equal. As a result, the surface of the first side wall 3312a facing the second side wall 3322a protrudes by a rectangular housing, and the frame 22 of the rectangular housing is composed of the first step surface 3312c, the second step surface 3312g and the third step surface 3312 i. So that the appearance of the first shield 331 is smoother and more beautiful. The first side surface 3312b, the second side surface 3312f, and the third side surface P3312 h may be bonded to the second top wall 3321, the fifth side wall 3322c, and the sixth side wall 3322d, respectively, to further enhance the shielding effect of the shield case 33.

Referring to fig. 18, fig. 18 is a schematic view of fig. 13, in which the first top wall 3311 and the second top wall 3321 are removed from the view point E to see the shielding case 33. In some embodiments, one of the second step surface 3312g and the fifth side wall 3322c is provided with a first projection 3313, and the other of the second step surface 3312g and the fifth side wall 3322c is provided with a first recess 3314, the first projection 3313 being received within the first recess 3314. The connection of the first shield 331 to the second shield 332 is made more solid by the mating of the first tab 3313 with the first recess 3314. The further first protrusion 3313 may also close the gap between the second step surface 3312g and the fifth sidewall 3322c, thereby enhancing the shielding effect of the shielding case 33. Moreover, the cooperation of the first protrusion 3313 and the first groove 3314 plays a limiting role for the installation of the first shielding case 331 and the second shielding case 332, so that the installation of the first shielding case 331 and the second shielding case 332 is more rapid and efficient.

With continued reference to fig. 18, in some embodiments, one of the third step surface 3312i and the sixth sidewall 3322d is provided with a second protrusion 3315, and the other of the third step surface 3312i and the sixth sidewall 3322d is provided with a second recess 3316, the second protrusion 3315 being received within the second recess 3316. The second projection 3315 mates with the second recess 3316 in a similar manner to the first projection 3313 mates with the first recess 3314. The shielding effect of the first and second shields 331 and 332 can be further improved.

In some embodiments, the surface of the first top wall 3311 facing away from the first side frame 3312 is flush with the surface of the second top wall 3321 facing away from the second side frame 3322. I.e., the first and second shields 331, 332 are equal in height. The flatness of the connection part of the first shielding cover 331 and the second shielding cover 332 is ensured, and the appearance is more attractive.

Referring to fig. 19, fig. 19 is a schematic cross-sectional view of the circuit board assembly 30 of fig. 8 along line B-B. In some embodiments, the circuit board assembly 30 further includes a first connection portion 3323. The first connection portion 3323 is located at a side toward which the outer surface of the first top wall 3311 faces, and the first connection portion 3323 is connected to at least a portion of the outer surface of the first top wall 3311 and at least a portion of the outer surface of the second top wall 3321 to close a gap between the first top wall 3311 and the second top wall 3321. The first connecting portion 3323 covers the outer surfaces of the first top wall 3311 and the second top wall 3321 to further close the gap between the first shielding case 331 and the second shielding case 332, thereby improving the shielding effect of the shielding case 33.

Referring to fig. 20, fig. 20 is a schematic view of fig. 13, in which the first top wall 3311 and the second top wall 3321 are removed from the view point E to see the shielding case 33. The circuit board assembly 30 further includes a second connection portion 3324. The second connection portion 3324 is located at a side of the outer surface of the third sidewall 3312d facing thereto, and the second connection portion 3324 is connected to at least a portion of the outer surface of the third sidewall 3312d and at least a portion of the outer surface of the fifth sidewall 3322c to close the gap between the third sidewall 3312d and the fifth sidewall 3322 c. The second connection portion 3324 covers the outer surfaces of the third and fifth sidewalls 3312d and 3322c to further close the gap between the first and second shields 331 and 332, thereby improving the shielding effect of the shield 33.

With continued reference to fig. 20, the circuit board assembly 30 further includes a third connection portion 3325. The third connection portion 3325 is located at a side toward which the outer surface of the fourth sidewall 3312e faces, and the third connection portion 3325 is connected to at least a portion of the outer surface of the fourth sidewall 3312e and at least a portion of the outer surface of the sixth sidewall 3322d to close a gap between the fourth sidewall 3312e and the sixth sidewall 3322 d. The third connecting portion 3325 covers the outer surfaces of the fourth and sixth sidewalls 3312e and 3322d to further close the gap between the first and second shields 331 and 332, thereby improving the shielding effect of the shield 33.

In some embodiments, the first connection portion 3323 is a conductive cloth or copper foil. The conductive cloth and the copper foil have lower cost, and can play a good shielding effect when being arranged in the gap between the first shielding cover 331 and the second shielding cover 332.

In some embodiments, the width of the first step surface 3312c is 0.5mm or more and less than or equal to 20mm. The first step surface 3312c may provide a larger supporting surface for the connection of the second top wall 3321 when the width is satisfied, so as to improve the connection strength between the first shielding case 331 and the second shielding case 332, and make the whole shielding case 33 more stable. However, the width cannot be increased infinitely, and when the width of the first step surface 3312c is 20mm or less, the connection strength of the shield case 33 and the miniaturization of the shield case 33 can be balanced.

Referring to fig. 21, fig. 21 is a schematic structural diagram of a first surface 321 of a circuit board 32 according to some embodiments of the application. In some embodiments, the circuit board assembly 30 further includes a first set of pads 322 and a second set of pads 323, the first set of pads 322 disposed on the first surface 321, the first set of pads 322 distributed along the first loop shape L2, the first set of pads 322 for soldering to the first shield 331, the first set of pads 322 including a first pad 3221, the first pad 3221 for soldering to the first sidewall 3312a. The second set of bonding pads 323 is disposed on the first surface 321, the second set of bonding pads 323 and the first bonding pads 3221 are distributed along the second ring shape L3, and the second set of bonding pads 323 is used for soldering the second shielding case 332. The first shield 331 is soldered to the first surface 321 by a first set of pads 322, the second shield 332 is soldered to the first surface 321 by a second set of pads 323, and the first shield 331 and the second shield 332 share a first pad 3221. Further saving on the area of use of the circuit board 32 and further enabling the circuit board assembly 30 to be designed for greater miniaturization.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims (17)

1. A circuit board assembly, comprising:

a circuit board, the circuit board comprising a first surface;

a first shield cover, which comprises a first top wall and a first side frame arranged around the circumference of the first top wall, wherein the surface of the first side frame, which faces away from the first top wall, is connected to the first surface, and the first side frame comprises a first side wall;

a second shield cover including a second top wall and a second side frame disposed around a circumference of the second top wall, a surface of the second side frame facing away from the second top wall being connected to the first surface, the second side frame including a second side wall facing the first side wall;

The second side wall is provided with an avoidance through hole, in the direction perpendicular to the first surface, the avoidance through hole penetrates to the surface of the second side wall deviating from the second top wall, and the first side wall is accommodated in the avoidance through hole.

2. The circuit board assembly of claim 1, wherein,

the outer surface of the first sidewall includes: a first side surface and a first step surface;

the first side face is connected with the first top wall, the first step face is connected with the first side face, the orientation of the first step face is the same as the orientation of the outer surface of the first top wall, and the inner wall of the avoidance through hole is located on one side, facing the first step face, and is connected to the first step face.

3. The circuit board assembly of claim 2, wherein,

the first side frame further includes: a third side wall and a fourth side wall, which are respectively connected to two sides of the first side wall;

the second side frame further includes: a fifth side wall and a sixth side wall, wherein the fifth side wall and the sixth side wall are respectively connected to two sides of the second side wall;

the surface of the third side wall facing away from the fourth side wall is flush with the surface of the fifth side wall facing away from the sixth side wall;

The surface of the fourth side wall facing away from the third side wall is flush with the surface of the sixth side wall facing away from the fifth side wall.

4. The circuit board assembly of claim 3 wherein,

the outer surface of the third sidewall includes: a second side surface and a second step surface;

the second step surface is connected with the first side wall, the second side surface is connected with the second step surface, the direction of the second step surface is the same as the direction of the outer surface of the third side wall, and the inner wall of the avoidance through hole is positioned on one side of the second step surface and connected to the second step surface.

5. The circuit board assembly of claim 4, wherein,

the outer surface of the fourth sidewall includes: a third side surface and a third step surface;

the third step surface is connected with the first side wall, the third side surface is connected with the third step surface, the direction of the third step surface is the same as the direction of the outer surface of the fourth side wall, and the inner wall of the avoidance through hole is positioned on one side of the direction of the third step surface and is connected to the third step surface.

6. The circuit board assembly of claim 5, wherein the first side, the second side, and the third side are in a same plane.

7. The circuit board assembly of claim 4, wherein,

one of the second step surface and the fifth side wall is provided with a first bump, the other of the second step surface and the fifth side wall is provided with a first groove, and the first bump is accommodated in the first groove.

8. The circuit board assembly of claim 5, wherein,

one of the third step surface and the sixth side wall is provided with a second bump, the other of the third step surface and the sixth side wall is provided with a second groove, and the second bump is accommodated in the second groove.

9. The circuit board assembly of claim 1, wherein a surface of the first top wall facing away from the first side frame is flush with a surface of the second top wall facing away from the second side frame.

10. The circuit board assembly of claim 1, further comprising: a first connection portion;

the first connecting part is positioned on one side of the outer surface of the first top wall, and is connected with at least partial area of the outer surface of the first top wall and at least partial area of the outer surface of the second top wall so as to close a gap between the first top wall and the second top wall.

11. The circuit board assembly of claim 3, further comprising: a second connecting portion;

the second connecting part is positioned on one side of the outer surface of the third side wall, and is connected with at least part of the area of the outer surface of the third side wall and at least part of the area of the outer surface of the fifth side wall so as to close a gap between the third side wall and the fifth side wall.

12. The circuit board assembly of claim 3, further comprising: a third connecting portion;

the third connecting portion is located on a side, facing the outer surface of the fourth side wall, of the third connecting portion, and the third connecting portion is connected to at least a partial area of the outer surface of the fourth side wall and at least a partial area of the outer surface of the sixth side wall, so as to close a gap between the fourth side wall and the sixth side wall.

13. The circuit board assembly of claim 10, wherein the first connection portion is a conductive portion or a copper foil.

14. The circuit board assembly of claim 2, wherein the width of the first step surface is 0.5mm or more and 20mm or less.

15. The circuit board assembly of claim 1, further comprising:

the first group of bonding pads are arranged on the first surface, the first group of bonding pads are distributed along a first ring shape, the first group of bonding pads are used for welding the first shielding cover, the first group of bonding pads comprise first bonding pads, and the first bonding pads are used for welding the first side wall;

the second group of bonding pads are arranged on the first surface, the second group of bonding pads and the first bonding pads are distributed along a second ring shape, and the second group of bonding pads are used for welding the second shielding cover.

16. The circuit board assembly of claim 1, further comprising:

the first electronic component and the second electronic component are connected to the first surface, the first electronic component is located in the first shielding cover, and the second electronic component is located in the second shielding cover.

17. An electronic device, comprising:

a housing;

the circuit board assembly of any one of claims 1-16, disposed within the housing.