CN113597091A - Flexible circuit board, display device and preparation method thereof - Google Patents
Flexible circuit board, display device and preparation method thereof Download PDFInfo
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- CN113597091A CN113597091A CN202110884089.2A CN202110884089A CN113597091A CN 113597091 A CN113597091 A CN 113597091A CN 202110884089 A CN202110884089 A CN 202110884089A CN 113597091 A CN113597091 A CN 113597091A
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- circuit board
- fingerprint module
- flexible circuit
- flexible
- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Abstract
The embodiment of the invention discloses a flexible circuit board, a display device and a preparation method of the flexible circuit board. In one embodiment, the flexible circuit board comprises a circuit board body and a fingerprint module; the circuit board body comprises a concave area which is arranged corresponding to the fingerprint module, and at least part of the fingerprint module is combined and fixed in the concave area; the fingerprint module passes through switching circuit board and circuit board body welding to realize the electricity intercommunication. According to the embodiment, the fingerprint module and the circuit board body are welded to realize electric communication, namely, the flexible circuit board and the fingerprint module are integrally designed, so that the unreliability of the traditional ZIF connection or BTB connection is effectively avoided, and the connection reliability of the fingerprint module and the whole system of the display device is improved; meanwhile, the signal transmission quality can be ensured, and the manufacturing cost of the display device can be effectively reduced.
Description
Technical Field
The invention relates to the technical field of display. And more particularly, to a flexible circuit board, a display device and a method of manufacturing the same.
Background
With the increasing development of display technologies, the underscreen fingerprint technology is now the standard configuration of mainstream smart phones due to the advantages of the ultrahigh screen occupation ratio, efficient fingerprint identification and the like, and is widely applied. Usually, in order to better conform to the habit of using the smart device by the user, the fingerprint module is usually disposed at the lower end of the display device.
For the Flexible OLED display device, the lower end of the display device is a wiring region of a Flexible Printed Circuit (FPC) of the display panel. Among the prior art, for satisfying the use of fingerprint module, usual design is for the position department that corresponds with the fingerprint membrane group at flexible circuit board trompil to put into downthehole with the fingerprint module, the fingerprint module is usually that the mode of pegging graft through ZIF (Zero Insertion Force ) is direct to be connected with display device's whole system, or the mode of pegging graft through ZIF is connected with display panel's flexible circuit board, the rethread flexible circuit board is connected with display device's whole system. However, the ZIF connection method in the prior art is high in cost and poor in signal transmission quality, and during a drop test of the whole display device, there is a risk that the ZIF connector is separated from the drop, which affects the reliability of the display device.
Disclosure of Invention
The invention aims to provide a flexible circuit board, a display device and a preparation method thereof, and aims to solve at least one of the problems in the prior art.
In order to achieve at least one of the purposes, the invention adopts the following technical scheme:
a first aspect of the present invention provides a flexible circuit board including:
the circuit board comprises a circuit board body and a fingerprint module;
the circuit board body comprises a concave area which is arranged corresponding to the fingerprint module, and at least part of the fingerprint module is combined and fixed in the concave area;
the fingerprint module pass through the switching circuit board with circuit board body welding to realize electric intercommunication.
According to the flexible circuit board provided by the first aspect of the invention, the fingerprint module is welded with the circuit board body through the bonding pad and the transfer circuit board to realize electric communication, namely, the flexible circuit board and the fingerprint module are integrally designed, so that the unreliability of the traditional ZIF connection or BTB (Board to Board) connection is effectively avoided, the connection between the fingerprint module and a whole system or between the fingerprint module and the flexible circuit board is prevented from dropping off in reliability tests such as falling of the whole display device and the like, the connection reliability between the fingerprint module and the whole system of the display device is increased, and the test yield of the display device loaded with the flexible circuit board is improved; meanwhile, the fingerprint module and the flexible circuit board are connected through the bonding pad, the signal transmission quality can be effectively improved, and meanwhile, the connection cost of the fingerprint module and the flexible circuit board can be reduced.
Optionally, the adapter circuit board is a flexible adapter circuit board.
This optional implementation is through adopting flexible switching circuit board to connect fingerprint module and circuit board body, and applicable in the fingerprint module and the circuit board body of different shapes, height or roughness, improves this flexible circuit board's range of application.
Optionally, the recessed region is a groove or a through hole.
Optionally, the recessed area is a through hole penetrating through the circuit board body;
the circuit board body comprises a first body part and a second body part which are positioned at two opposite sides of the recessed area;
the flexible circuit board includes a bridge circuit board electrically connecting the first body part and the second body part;
the bridge circuit board is welded with the circuit board body to realize electric communication.
This optional embodiment is through setting up the bridging circuit board of being connected first body portion and second body portion electricity and with the welding of circuit board body, namely, under the prerequisite of guaranteeing that display device's thickness satisfies frivolous requirement, increase the bridging circuit board in the space above the fingerprint module (be the depressed area top position department of flexible circuit board promptly) and carry out the bridging and walk the line, greatly increase the line space of flexible circuit board, promote about 20-30% with the line space of walking of flexible circuit board, that is to say, under the condition of the same line data, this embodiment is through setting up the bridging circuit board, can effectively reduce the thick board of flexible circuit board, reduce the size of sheet frame, and then reduce the whole cost of manufacture of product. Moreover, the bridging circuit board of this embodiment can also separate the signal that is easily disturbed and walk the line, reduces the mutual interference between the line signal of walking to increase flexible circuit board's the line continuity, and promote the interference killing feature of signal.
Optionally, an orthographic projection of the bridge circuit board on the circuit board body covers the recessed area.
This optional implementation mode can effectively shelter from the clearance between fingerprint module and the depressed area, improves the assembly yield of fingerprint module.
Optionally, the bridge circuit board is a printed bridge circuit board or a flexible bridge circuit board.
This optional implementation mode sets up the bridging circuit board into printed bridging circuit board or flexible bridging circuit board for the flexible circuit board of this implementation mode is applicable in more different circumstances, promptly, according to different circumstances (like the thickness of fingerprint module is great, or the less condition of flexible circuit board thickness, like the thickness of fingerprint module is less again, the great condition of flexible circuit board thickness), select printed bridging circuit board or flexible bridging circuit board, in order to realize that bridging circuit board walks the line in the top space bridging of fingerprint module, still can avoid bridging circuit board and the fingerprint module that is located the depressed area to produce mutual interference simultaneously.
In a second aspect, the present invention provides a method for preparing a flexible circuit board, which comprises the steps of
Forming a concave area corresponding to the fingerprint module on the circuit board body;
fixing at least part of the fingerprint module in the concave area in a combined manner;
will the fingerprint module with the circuit board body passes through the welding of switching circuit board to realize electric intercommunication.
Compared with the prior art, the preparation method of the flexible circuit board provided by the second aspect of the invention provides enough flatness for the fingerprint module and the circuit board body, can realize the welding of the circuit board body and the fingerprint module, and effectively improves the efficiency of the welding of the fingerprint module.
A third aspect of the present invention provides a display device, comprising a display panel, a heat dissipation layer on the display panel, and the flexible circuit board as provided in the first aspect of the present invention;
an opening region corresponding to the depressed region is arranged in the heat dissipation layer;
the flexible circuit board is attached to one side of the display panel, which is far away from the light-emitting side, through the heat dissipation layer;
the part of fingerprint module is located the open region of heat dissipation layer.
Optionally, the recessed area is a through hole penetrating through the circuit board body;
the circuit board body comprises a first body part and a second body part which are positioned at two opposite sides of the recessed area;
the flexible circuit board includes a bridge circuit board electrically connecting the first body part and the second body part;
the bridge circuit board is welded with the circuit board body to realize electric communication;
the bridge circuit board is positioned on one side of the circuit board body far away from the display panel.
Optionally, an orthographic projection of the bridge circuit board on the circuit board body covers the recessed area;
the fingerprint module is located the open area of heat dissipation layer, the depressed area of circuit board body, the bridging circuit board and the space that display panel formed.
This optional embodiment can effectively shelter from the clearance between fingerprint module and the circuit board body, when improving the assembly yield of fingerprint module, still can avoid among the current display device because the produced light leak phenomenon of the laminating mode of fingerprint module, improves display device's quality, promotes user's use and experiences the sense.
A fourth aspect of the present invention provides a method of manufacturing a display device as provided in the third aspect of the present invention, comprising:
forming a heat dissipation layer on the display panel;
forming an opening region corresponding to the recessed region in the heat dissipation layer;
and attaching the flexible circuit board to one side of the display panel, which is far away from the light-emitting side, through the heat dissipation layer, so that part of the fingerprint module is positioned in the opening area of the heat dissipation layer.
The invention has the following beneficial effects:
aiming at the technical problems in the prior art, the embodiment of the invention provides a flexible circuit board, a display device and a preparation method thereof, wherein the flexible circuit board of the embodiment realizes the electric communication of a fingerprint module by welding a pad and a transfer circuit board with a circuit board body, namely, the flexible circuit board and the fingerprint module are integrally designed, so that the unreliability of the traditional ZIF connection or BTB (Board to Board) connection is effectively avoided, the connection between the fingerprint module and a whole machine system or between the fingerprint module and the flexible circuit board in the reliability tests such as the falling of the whole machine of the display device is prevented from falling off, the connection reliability between the fingerprint module and the whole machine system of the display device is increased, and the test yield of the display device loaded with the flexible circuit board is improved; meanwhile, the fingerprint module and the flexible circuit board are connected through the bonding pad, the signal transmission quality can be effectively improved, and meanwhile, the connection cost of the fingerprint module and the flexible circuit board can be reduced.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 shows a schematic structural diagram of a flexible circuit board in an embodiment of the present invention.
Fig. 2 shows a structural cross-sectional view of a flexible circuit board in one embodiment of the present invention.
Fig. 3 shows a structural cross-sectional view of a flexible circuit board in one embodiment of the present invention.
Fig. 4 shows a structural cross-sectional view of a flexible circuit board in one embodiment of the present invention.
Fig. 5 shows a flow chart for manufacturing a flexible circuit board in an embodiment of the present invention.
Fig. 6 shows a structural back view of a display device in one embodiment of the present invention.
Fig. 7 is a sectional view illustrating a structure in which a flexible circuit board is attached to a display panel in a display device according to an embodiment of the present invention.
Fig. 8 is a sectional view illustrating a structure in which a flexible circuit board is attached to a display panel in a display device according to an embodiment of the present invention.
Fig. 9 is a sectional view showing a structure in which a flexible circuit board is attached to a display panel in a display device according to an embodiment of the present invention.
Fig. 10 shows a flow chart of manufacturing a display device in one embodiment of the present invention.
Detailed Description
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It should be noted that, although the terms "first", "second", etc. may be used herein to describe various elements, components, elements, regions, layers and/or sections, these elements, components, elements, regions, layers and/or sections should not be limited by these terms. Rather, these terms are used to distinguish one element, component, element, region, layer or section from another. Thus, for example, a first component, a first member, a first element, a first region, a first layer, and/or a first portion discussed below could be termed a second component, a second member, a second element, a second region, a second layer, and/or a second portion without departing from the teachings of the present invention.
It is further noted that, in the description of the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In addition, in the prior art, a hole is formed in a position of the flexible circuit board corresponding to the fingerprint module, and the hole forming position is generally located in the center of the flexible circuit board, so that the wiring of the flexible circuit board needs to bypass the hole forming area, the continuity of the wiring of the flexible circuit board is affected, the wiring space of the flexible circuit board is reduced, and the flexible circuit board needs a larger wiring space or more wiring layers.
And, the inventor discovers, among the prior art's the design scheme, the fingerprint module need put into the trompil of flexible circuit board again and attached the fingerprint module on display panel after flexible circuit board passes through the radiator film and display panel laminating is fixed to lead to the planar roughness of fingerprint module place lower, be difficult to operate on the fingerprint module, fingerprint module and flexible circuit board or fingerprint module drop with complete machine system's connector easily simultaneously.
Furthermore, for a Flexible Multi-Layer touch display device (FMLOC), the signal driving electrodes T of the touch unitsxAnd a sensing electrode RxThe wires are connected to the flexible circuit board, and the driving electrode TxAnd a sensing electrode RxFlexible circuit respectively arranged at left and right sides of the flexible circuit boardThe openings in the panel also affect the continuity of the traces of the touch cells.
To solve the technical problems in the prior art, an embodiment of the present invention provides a flexible circuit board 100, where the flexible circuit board 100 includes a circuit board body 110 and a fingerprint module 120, and the circuit board body 110 includes a recessed area 111 corresponding to the fingerprint module 120. As shown in fig. 1, the recessed area 111 is located at the center of the circuit board body 110, and the cross-sectional shape of the recessed area 111 is a diamond shape. In some embodiments, the cross-sectional shape of the concave region 111 may be, for example, a circle or a rectangle, and the shape of the concave region 111 may be adapted according to the shape of the fingerprint module 120. At least a portion of the fingerprint module 120 is fixed in the concave region 111. In one specific example, the size of the fingerprint module 120 is slightly smaller than that of the concave region 111, and the fingerprint module 120 is fixed inside the concave region 111 by bonding or other means known to those skilled in the art to realize the connection and fixation of the fingerprint module 120 and the circuit board body 110, as shown in fig. 2-4.
In this embodiment, the fingerprint module 120 is soldered to the circuit board body 110 through the adapting circuit board 130 to achieve electrical communication. In a specific example, the adapting circuit board 130 is respectively soldered on the fingerprint module 120 and the circuit board body 110 through soldering pads, so as to realize signal transmission between the fingerprint module 120 and the circuit board body 110. This embodiment is through combining fingerprint module 120 in advance to fix in depressed area 111, compares in prior art's design for fingerprint module 120 place plane has higher roughness, makes to pass through switching circuit board 130 and pad with fingerprint module 120, and it becomes possible to realize electric intercommunication with circuit board body 110 welding, thereby improves fingerprint module 120 and circuit board body 110's reliability of being connected.
In a specific example, the fingerprint module 120 includes a fingerprint Sensor (FPS) and other necessary components for implementing a fingerprint recognition function. In another embodiment, the fingerprint module 120 may also include a fingerprint sensor FPS, a connector, and a packaging assembly (including a sealant, a light shielding tape, etc.).
In a specific example, the flexible circuit board 100 may be, for example, a Main FPC (Main FPC, abbreviated as MFPC) for driving a display, and the signal of the fingerprint module 120 may communicate with a Main board of the display device 200 through a connector of the flexible circuit board 100, so as to realize a fingerprint identification function of the fingerprint module 120.
In a specific example, the flexible circuit board 100 is a multi-layer flexible circuit board, that is, the circuit board body 110 also includes multiple layers, so that the traces are distributed in different layers of the flexible circuit board, the trace amount in the flexible circuit board 100 is increased, and the fingerprint module 120 can be soldered in any layer of the circuit board body 110 through the via circuit board 130 and the solder pads. In a specific example, the fingerprint module 120 is electrically connected to the top layer of the circuit board body 110 by soldering the adapting circuit board 130; in another specific example, the fingerprint module 120 may also be electrically connected to the bottom layer of the circuit board body 110 by soldering the adapting circuit board 130.
The flexible circuit board 100 of the embodiment welds the fingerprint module 120 with the circuit board body 110 through the bonding pad and the adapting circuit board 130 to realize electric communication, that is, the flexible circuit board 100 and the fingerprint module 120 are integrally designed, so that the unreliability of the traditional ZIF connection or btb (board to board) connection is effectively avoided, the connection between the fingerprint module and the whole system or between the fingerprint module and the flexible circuit board is prevented from dropping off in the reliability tests such as the complete machine dropping of the display device, the connection reliability of the whole system of the fingerprint module 120 and the display device 200 is increased, and the yield of the display device 200 loaded with the flexible circuit board 100 is improved; meanwhile, the fingerprint module 120 and the circuit board body 110 are connected through the bonding pad, so that the signal transmission quality can be effectively improved, and meanwhile, the connection cost of the fingerprint module 120 and the flexible circuit board 100 can be reduced.
In one possible implementation, the transition circuit board 130 is a flexible transition circuit board. As shown in fig. 2-4, a portion of the fingerprint module 120 is located in the recessed area 111 of the circuit board body 110, and a portion of the fingerprint module 120 protrudes out of the circuit board body 110, i.e. the thickness of the fingerprint module 120 is different from the thickness of the circuit board body 110. This embodiment is through adopting flexible switching circuit board to connect fingerprint module 120 and circuit board body 110, can overcome the difference in shape, height or the roughness between fingerprint module 120 and the circuit board body 110, ensures the effective welding of fingerprint module 120 and circuit board body 110, is applicable to the fingerprint module 120 and the circuit board body 110 of different shapes, height or roughness, improves this flexible circuit board 100's range of application.
In one possible implementation, the recessed region 111 is a groove or a through hole, for example, the recessed region 111 is a groove formed by being recessed inward from one side surface of the circuit board body 110, or the recessed region 111 is a through hole penetrating through the circuit board body 110.
In one possible implementation, the recessed area 111 is a through hole penetrating through the circuit board body 110, as shown in fig. 2 to 3, the circuit board body 110 includes a first body portion 112 and a second body portion 113 located at two opposite sides of the recessed area 111, for example, the first body portion 112 and the second body portion 113 may be located at the left and right sides of the recessed area 111, or at the upper and lower sides of the recessed area 111. The flexible circuit board 100 includes a bridge circuit board 140 electrically connecting the first body portion 112 and the second body portion 113, the bridge circuit board 140 is located above the relay circuit board 130, and the bridge circuit board 140 is soldered to the circuit board body 110 by a solder pad to achieve electrical communication.
This implementation is through combining fingerprint module 120 in advance to fix in depressed area 111, again forms bridging circuit board 140 in fingerprint module 120 top space, compares in prior art's design (behind fingerprint module and display panel are attached fixedly, can't form bridging circuit board above the fingerprint module) for fingerprint module 120 place plane has higher roughness, makes to form switching circuit board 140 in fingerprint module 120 top space, and through the pad with circuit board body 110 welding become possible.
In one embodiment, as shown in fig. 2-3, the bridge circuit board 140 is located in the upper space of the fingerprint module 120, and the orthographic projection of the bridge circuit board 140 on the circuit board body 110 covers the orthographic projection of the adapter circuit board 130 on the circuit board body 110. In another specific example, the orthographic projection of the bridge circuit board on the circuit board body does not overlap the orthographic projection of the relay circuit board on the circuit board body.
This implementation is through setting up bridging circuit board 140 that connects first body portion 112 and second body portion 113 electricity and welding with circuit board body 110, namely, under the prerequisite of guaranteeing that the thickness of display device 200 satisfies frivolousization's requirement, increase bridging circuit board 140 and carry out the bridging and walk the line in the space above fingerprint module 120 (be well above the depressed area 111 of flexible circuit board 100), greatly increase flexible circuit board 100's the line space of walking, promote about 20-30% flexible circuit board 100's the line space, that is to say, under the condition of the same line data, this embodiment is through setting up bridging circuit board 140, can effectively reduce flexible circuit board 100's the board thickness, reduce the size of sheet frame, and then reduce the whole cost of manufacture of product. Moreover, the bridge circuit board 140 of this embodiment can also separate the signals that are susceptible to interference and reduce the mutual interference between the routing signals, thereby increasing the routing continuity of the flexible circuit board 100 and improving the anti-interference capability of the signals.
In a specific example, as shown in fig. 4, the recess region 111 is a groove formed by being recessed inward from one side surface of the circuit board body 110. For example, the flexible circuit board 100 of this embodiment is a multi-layer flexible circuit board, a groove (i.e., a blind hole) is formed in the bottom layer of the circuit board body 110, the fingerprint module 120 is fixed in the groove, and the fingerprint module 120 is still soldered on the circuit board body 110 through the via circuit board 130 and the pad, and can be soldered in any layer of the circuit board body 110 according to actual conditions; meanwhile, the blind hole does not penetrate through the top layer of the circuit board body 110, namely, the top layer of the circuit board body 110 is not perforated, normal wiring can be still conducted, single-layer or double-layer wiring design can be conducted on the top layer of the circuit board body 110 according to actual industrial design requirements, so that the wiring quantity in the flexible circuit board 100 is increased, the wiring space in the flexible circuit board 100 is increased, and the stability of signal transmission is improved. And the additional arrangement of a bridging circuit board and a welding disc for welding the bridging circuit board on the circuit board body is not needed, so that the manufacturing cost is further saved. The thickness that is applicable to fingerprint module 120 in this specific example is less relatively, and the number of layers of flexible circuit board 100 is more, the great condition of thickness.
In one possible implementation, the bridge circuit board 140 is a printed bridge circuit board or a flexible bridge circuit board. In the example shown in fig. 2, the top surface of the fingerprint module 120 is flush with the top surface of the circuit board body 110, i.e. the top surface of the fingerprint module 120 does not protrude from the top surface of the circuit board body 110, and the bridge circuit board 140 is a printed bridge circuit board; in another specific example, as shown in fig. 3, the thickness of the fingerprint module 120 is relatively large, or the thickness of the circuit board body 110 is small, the top surface and the bottom surface of the fingerprint module 120 both protrude out of the surface of the circuit board body 110, and the bridge circuit board 140 above the fingerprint module 120 may be, for example, a flexible bridge circuit board with a certain flexibility, and can cross over the trace from the top of the fingerprint module 120 without causing interference to the fingerprint module 120.
In this implementation, the bridge circuit board 140 is set as a pcb or a flexible bridge circuit board, so that the flexible circuit board 100 of this implementation is applicable to more different situations, that is, the pcb or the flexible bridge circuit board is selected according to different situations, so as to implement bridging and routing of the bridge circuit board 140 over the fingerprint module 120, and simultaneously avoid the bridge circuit board 140 interfering with the fingerprint module 120 located in the recessed area 111.
In one possible implementation, the orthogonal projection of the bridge circuit board 140 on the circuit board body 110 covers the concave region 111, that is, as shown in fig. 1, the bridge circuit board 140 covers the concave region 111 and the fingerprint module 120 located in the concave region 111. It can be understood that, in order to facilitate the attachment of the fingerprint module 120, the size of the concave region 111 is usually larger than the size of the fingerprint module 120, so that the display device 200 with the flexible circuit board 100 is prone to light leakage due to the gap between the fingerprint module 120 and the inner side of the concave region 111. And through this embodiment, the bridge circuit board 140 covers the recessed area 111 and the fingerprint module 120, so that the gap between the fingerprint module 120 and the recessed area 111 can be effectively blocked, thereby preventing the light leakage phenomenon of the display device 200 and improving the assembly yield of the fingerprint module 120.
Another embodiment of the present invention provides a method for manufacturing a flexible circuit board 100 as provided in the above embodiment, as shown in fig. 5, including the following steps:
s110, forming a concave area 111 corresponding to the fingerprint module 120 on the circuit board body 110;
in one embodiment, the recessed area 111 may be a groove or a through hole, which may be designed according to the actual thickness of the fingerprint module 120. In another specific example, the cross-sectional shape of the recessed region 111 may be, for example, a diamond shape, a circular shape, or a rectangular shape.
S120, combining and fixing at least part of the fingerprint module 120 in the concave area 111;
in one specific example, at least a portion of the fingerprint module 120 is fixed in the concave region 111 by bonding or other means known to those skilled in the art, so as to realize the connection and fixation of the fingerprint module 120 and the circuit board body 110.
S130, welding the fingerprint module 120 and the circuit board body 110 through the through circuit board 130 to realize electric communication.
In a specific example, the adapting circuit board 130 is respectively soldered on the fingerprint module 120 and the circuit board body 110 through soldering pads, so as to realize signal transmission between the fingerprint module 120 and the circuit board body 110.
Compared with the prior art, the preparation method of the flexible circuit board of the embodiment can provide enough flatness for the fingerprint module 120 and the circuit board body 110, so that welding between the circuit board body 110 and the fingerprint module 120 is realized, the welding efficiency of the fingerprint module 120 is effectively improved, and the connection reliability of the fingerprint module 120 and the circuit board main body 110 is improved.
In one possible implementation manner, the recessed area 111 is a through hole penetrating through the circuit board body 110, and the circuit board body 110 includes a first body portion 112 and a second body portion 113 located on two opposite sides of the recessed area 111.
After step S130, further comprising:
and S140, welding the bridge circuit board 140 with the circuit board body 110 through a pad to realize electrical communication, wherein the bridge circuit board 140 is used for electrically connecting the first body part 112 and the second body part 113, so as to form the bridge circuit board 140 above the fingerprint module 120.
Yet another embodiment of the present invention provides a display device 200, as shown in fig. 6-9, comprising a display panel 210, a heat dissipation layer 220 on a side of the display panel 210 facing away from a light exit side, and the flexible circuit board 100 as provided in the above embodiments. The direction of the light exit side of the display panel 210 is shown by the arrows in fig. 7-9. An opening region 221 corresponding to the recessed region 111 is arranged in the heat dissipation layer 220; the flexible circuit board 100 is attached to one side of the display panel 210 away from the light emitting side through the heat dissipation layer 220; the fingerprint module 120 is partially located in the opening region 221 of the heat dissipation layer 220.
The display device 200 provided by this embodiment is the display device 200 integrated with the fingerprint module 120 on the back of the display panel 210, and the fingerprint module 120 is arranged on the back of the display panel 210 to realize the fingerprint identification under the screen and the full screen display. Generally, to implement each function of the display device 200, various flexible circuit boards 100 and the display panel 210 may be fixed by a bonding process, and then the flexible circuit board 100 is bent, so that the flexible circuit board 100 is attached to the heat dissipation layer 220 on the back surface of the display panel 210, that is, the side of the display panel 210 away from the light exit side, and the connector of the flexible circuit board 100 may be coupled with the main board of the display panel 210 to implement the corresponding function.
In one specific example, the display device 200 is an OLED (organic light-Emitting Diode) flexible display device. The OLED flexible display device 200 may be, for example, any product or component having a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator, which is not limited in this embodiment. In yet another specific example, the heat dissipation layer 220 may be a Super Clean Foam (SCF) film with an adhesive effect, for example.
In a possible implementation manner, the recessed region 111 is a groove or a through hole, in a specific example, the recessed region 111 is a groove, as shown in fig. 9, the groove is formed by inwardly recessing from a side of the circuit board main body 110 close to the heat dissipation layer 220, and the fingerprint module 120 is located in the groove, that is, the fingerprint module 120 is located in a space surrounded by the circuit board main body 110, the heat dissipation layer 220 and the display panel 210. The recessed area 111 of this implementation does not run through the top layer of the circuit board body 110, that is, the top layer of the circuit board body 110 can still be wired normally, and the top layer of the circuit board body 110 can be designed to be wired in a single layer or double layers according to actual industrial design requirements, so that the wiring amount in the flexible circuit board 100 is increased, the wiring space in the flexible circuit board 100 is increased, and the stability of signal transmission is improved.
In one possible implementation, the recessed region 111 is a through hole penetrating through the circuit board body 110; as shown in fig. 7-8, the thickness of the fingerprint module 120 is larger, the top surface and/or the bottom surface of the fingerprint module 120 protrudes out of the circuit board body 110, and the circuit board body 110 includes a first body portion 112 and a second body portion 113 located at two opposite sides of the recessed area 111; the flexible circuit board 100 includes a bridge circuit board 140 electrically connecting the first body part 112 and the second body part 113; the bridge circuit board 140 is soldered to the circuit board body 110 to achieve electrical communication; the bridge circuit board 140 is located on a side of the circuit board body 110 away from the display panel 210.
In the implementation manner, the bridging circuit board 140 electrically connecting the first body part 112 and the second body part 113 is arranged and welded with the circuit board body 110, and the bridging circuit board 140 is added to the space above the fingerprint module 120 (i.e. the position above the recessed area 111 of the flexible circuit board 100) for bridging and routing, so that the routing space of the flexible circuit board 100 can be greatly increased, the routing space of the flexible circuit board 100 is increased by about 20-30%, and the continuity of the flexible circuit board 100 is improved; in a specific example, the display device 200 is a flexible multi-layer touch display device, and the routing continuity of the touch units can also be improved by the implementation of the bridge circuit board 140.
In one possible implementation, the orthographic projection of the bridge circuit board 140 on the circuit board body 110 covers the recessed area 111; as shown in fig. 6, the bridge circuit board 140 covers the recessed area 111 and the fingerprint module 120 located in the recessed area 111. The fingerprint module 120 is located in the opening region 221 of the heat dissipation layer 220, the recess region 111 of the circuit board body 110, the bridge circuit board 140 and the space formed by the display panel 210.
This implementation mode is through acceping fingerprint module 120 in the open region 221 of heat dissipation layer 220, circuit board body 110's depressed area 111, in the airtight space that bridging circuit board 140 and display panel 210 enclose, bridging circuit board 140 can effectively shelter from the clearance between fingerprint module 120 and the circuit board body 110, when improving fingerprint module 120's assembly yield, still can avoid because the produced light leak phenomenon of the laminating mode of fingerprint module, improve display device 200's quality, promote user's use and experience and feel.
Still another embodiment of the present invention provides a method for manufacturing the display device 200 as provided in the above embodiment, as shown in fig. 10, including:
s210, forming a heat dissipation layer 220 on the display panel 210.
In a specific example, the heat dissipation layer 220 is attached to a surface of the display panel 210 facing away from the light emitting side. The heat dissipation layer 220 may be, for example, a heat dissipation film having an adhesive effect.
S220, forming an opening region 221 corresponding to the recessed region 111 in the heat dissipation layer 220, so as to align with the fingerprint module 120, thereby improving the manufacturing efficiency of the display device 200.
S230, attaching the flexible circuit board 100 to a side of the display panel 210 away from the light emitting side through the heat dissipation layer 220, so that the portion of the fingerprint module 120 is located in the opening region 221 of the heat dissipation layer 220.
In one possible implementation, step S230 further includes:
and S231, connecting the flexible circuit board 100 with the display panel 210 to realize signal conduction.
In one specific example, the bonding portion of the flexible circuit board 100 may be bonded to the display panel 210 by setting a bonding pin, so as to achieve signal conduction.
S232, bending the flexible circuit board 100, attaching the flexible circuit board 100 to the heat dissipation layer 220, and positioning a portion of the fingerprint module 120 in the opening region 221 of the heat dissipation layer 220.
In a specific example, the opening region 221 of the fingerprint module 120 and the heat dissipation layer 220 on the flexible circuit board 100 can be aligned, so that the fingerprint module 120 can be accurately embedded into the opening region 221 of the heat dissipation layer 220 when the flexible circuit board 100 is attached to the heat dissipation layer 220, and then the flexible circuit board 100 is bent, the flexible circuit board 100 and the heat dissipation layer 220 are fixedly attached, and the fingerprint module 120 passes through the opening region 221 of the heat dissipation layer 220 and is attached to the display panel 210 in a bonding and fixing manner.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations and modifications can be made on the basis of the above description, and all embodiments cannot be exhaustive, and all obvious variations and modifications belonging to the technical scheme of the present invention are within the protection scope of the present invention.
Claims (11)
1. A flexible circuit board, comprising:
the circuit board comprises a circuit board body and a fingerprint module;
the circuit board body comprises a concave area which is arranged corresponding to the fingerprint module, and at least part of the fingerprint module is combined and fixed in the concave area;
the fingerprint module pass through the switching circuit board with circuit board body welding to realize electric intercommunication.
2. The flexible circuit board of claim 1, wherein the interposer circuit board is a flexible interposer circuit board.
3. The flexible circuit board of claim 1, wherein the recessed area is a groove or a via.
4. The flexible circuit board of claim 3,
the sunken area is a through hole penetrating through the circuit board body;
the circuit board body comprises a first body part and a second body part which are positioned at two opposite sides of the recessed area;
the flexible circuit board includes a bridge circuit board electrically connecting the first body part and the second body part;
the bridge circuit board is welded with the circuit board body to realize electric communication.
5. The flexible circuit board of claim 4, wherein an orthographic projection of the bridge circuit board on the circuit board body covers the recessed area.
6. The flexible circuit board of claim 4, wherein the bridge circuit board is a printed bridge circuit board or a flexible bridge circuit board.
7. A method for preparing a flexible circuit board according to any one of claims 1 to 6, comprising
Forming a concave area corresponding to the fingerprint module on the circuit board body;
fixing at least part of the fingerprint module in the concave area in a combined manner;
will the fingerprint module with the circuit board body passes through the welding of switching circuit board to realize electric intercommunication.
8. A display device comprising a display panel, a heat dissipation layer on the display panel, and the flexible circuit board according to claim 1;
an opening region corresponding to the depressed region is arranged in the heat dissipation layer;
the flexible circuit board is attached to one side of the display panel, which is far away from the light-emitting side, through the heat dissipation layer;
the part of fingerprint module is located the open region of heat dissipation layer.
9. The display device according to claim 8,
the sunken area is a through hole penetrating through the circuit board body;
the circuit board body comprises a first body part and a second body part which are positioned at two opposite sides of the recessed area;
the flexible circuit board includes a bridge circuit board electrically connecting the first body part and the second body part;
the bridge circuit board is welded with the circuit board body to realize electric communication;
the bridge circuit board is positioned on one side of the circuit board body far away from the display panel.
10. The flexible circuit board of claim 8,
the orthographic projection of the bridge circuit board on the circuit board body covers the concave area;
the fingerprint module is located the open area of heat dissipation layer, the depressed area of circuit board body, the bridging circuit board and the space that display panel formed.
11. A method of manufacturing a display device according to any one of claims 8 to 10, comprising:
forming a heat dissipation layer on the display panel;
forming an opening region corresponding to the recessed region in the heat dissipation layer;
and attaching the flexible circuit board to one side of the display panel, which is far away from the light-emitting side, through the heat dissipation layer, so that part of the fingerprint module is positioned in the opening area of the heat dissipation layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110884089.2A CN113597091A (en) | 2021-08-03 | 2021-08-03 | Flexible circuit board, display device and preparation method thereof |
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| CN202110884089.2A CN113597091A (en) | 2021-08-03 | 2021-08-03 | Flexible circuit board, display device and preparation method thereof |
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