CN106096596A - Fingerprint module, fingerprint module manufacture method and mobile terminal - Google Patents
Fingerprint module, fingerprint module manufacture method and mobile terminal Download PDFInfo
- Publication number
- CN106096596A CN106096596A CN201610675359.8A CN201610675359A CN106096596A CN 106096596 A CN106096596 A CN 106096596A CN 201610675359 A CN201610675359 A CN 201610675359A CN 106096596 A CN106096596 A CN 106096596A
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- CN
- China
- Prior art keywords
- keyset
- fingerprint
- circuit board
- fingerprint chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
Abstract
A kind of fingerprint module, fingerprint module manufacture method and mobile terminal, described fingerprint module includes cover plate, fingerprint chip, keyset and circuit board, described cover plate is provided with installing zone, described fingerprint chip is fixed on described installing zone, described keyset fits in described fingerprint chip and the opposing side of described cover plate, to provide oppressive force to described fingerprint chip, described circuit board electrically connects described fingerprint chip through described keyset.The gravity utilizing described keyset produces pressure force to described fingerprint chip, to increase the adhesive force of described fingerprint chip and described cover plate, so that described fingerprint chip is more firm with the combination of described cover plate, described fingerprint chip is susceptible to the impact of described circuit board and departs from described cover plate, thus improves the quality of described fingerprint module.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of fingerprint module, fingerprint module manufacture method and move eventually
End.
Background technology
Along with fingerprint recognition is increasingly widely used in mobile phone, thus more and more tighter to the prescription of fingerprint module
Lattice.Generally fingerprint module includes fixing fingerprint chip on the cover board, yet with the lighter in weight of fingerprint chip, causes fingerprint
Chip, during being fixed on cover plate, is easily affected by miscellaneous part and is departed from cover plate, thus causes fingerprint module quality to go out
Existing defect, the quality of production causing fingerprint module is the highest.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, it is provided that one carries high-quality fingerprint module, fingerprint mould
Group manufacture method and mobile terminal.
The present invention provides a kind of fingerprint module, and wherein, described fingerprint module includes cover plate, fingerprint chip, keyset and electricity
Road plate, described cover plate is provided with installing zone, and described fingerprint chip is fixed on described installing zone, and described keyset fits in described fingerprint
Chip and the opposing side of described cover plate, to provide oppressive force to described fingerprint chip, described circuit board is electrically connected through described keyset
Connect described fingerprint chip
Wherein, described keyset is printed circuit board (PCB).
Wherein, described keyset includes fitting the first contact surface of described fingerprint chip and relative described first contact surface
Second contact surface, described first contact surface is provided with the first pin electrically connecting described fingerprint chip, and described second contact surface is provided with
With the second pin of described first pin conducting, described circuit board fits in described second contact surface, and electrically connects described second
Pin.
Wherein, described keyset is flexible PCB.
Wherein, described keyset include the first connection end the most described first connect end second connection end, described second
Connecting after end the most described first connects end bending and by viscose glue phase stacking, described first connects end electrically connects described fingerprint core
Sheet, described second connects end electrically connects described circuit board.
Wherein, described fingerprint module also includes that stiffening plate, described stiffening plate are laminated in described keyset and described fingerprint core
The opposing side of sheet, described circuit board electrically connects described keyset through described stiffening plate.
Wherein, led mutually by scolding tin or board to board connector or conducting resinl between described keyset with described circuit board
Logical.
Wherein, led mutually by scolding tin or board to board connector or conducting resinl between described keyset with described fingerprint chip
Logical.
Wherein, described circuit board is flexible PCB or printed circuit board (PCB).
Wherein, described cover plate includes the lateral surface of medial surface and relative described medial surface, and described lateral surface is in order to contact use
Family fingerprint, described lateral surface or described medial surface are provided with groove, and described installing zone is positioned at the groove of described medial surface, or is positioned at institute
State the groove corresponding section of medial surface and described lateral surface.
The present invention also provides for a kind of fingerprint module manufacture method, and wherein, described fingerprint module manufacture method includes:
There is provided cover plate, fingerprint chip and keyset, after described keyset is fitted in described fingerprint chip, by described fingerprint
Chip is fixed on described cover plate, and described keyset provides oppressive force to described fingerprint chip；
Circuit board is provided, described circuit board is electrically connected to described fingerprint chip through described keyset.
Wherein, described keyset is printed circuit board (PCB), by conducting resinl phase between described keyset with described fingerprint chip
Laminating.
Wherein, described circuit board is flexible PCB, by scolding tin or plate pair between described keyset and described circuit board
Connector for substrate or conducting resinl are conducted.
Wherein, described fingerprint chip passes through adhesive plaster together in described medial surface.
The present invention also provides for a kind of mobile terminal, and wherein, described mobile terminal includes fingerprint mould described in above-mentioned any one
Group.
Fingerprint module, fingerprint module manufacture method and the mobile terminal that the present invention provides, is fitted in by described keyset
On described fingerprint chip, thus the gravity of described keyset is utilized described fingerprint chip to be produced pressure force, to increase described finger
Stricture of vagina chip and the adhesive force of described cover plate, so that described fingerprint chip is more firm with the combination of described cover plate, described fingerprint
Chip is susceptible to the impact of described circuit board and departs from described cover plate, thus improves the quality of described fingerprint module.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the fingerprint module decomposing schematic representation of the first embodiment that the present invention provides；
Fig. 2 is the assembling schematic diagram of the fingerprint module of Fig. 1；
Fig. 3 is the schematic cross-section of the fingerprint module of Fig. 1；
Fig. 4 is the decomposing schematic representation of the fingerprint module of the second embodiment that the present invention provides；
Fig. 5 is the assembling schematic diagram of the fingerprint module of Fig. 4；
Fig. 6 is the schematic cross-section of the fingerprint module of Fig. 4；
Fig. 7 is the schematic cross-section of the fingerprint module of the 3rd embodiment that the present invention provides；
Fig. 8 is the schematic cross-section of the fingerprint module of the 4th embodiment that the present invention provides；
Fig. 9 is the schematic cross-section of the fingerprint module of the 5th embodiment that the present invention provides；
Figure 10 is the schematic cross-section of the fingerprint module of the sixth embodiment that the present invention provides；
Figure 11 is the schematic cross-section of the fingerprint module of the 7th embodiment that the present invention provides；
Figure 12 is the schematic cross-section of the fingerprint module of the 8th embodiment that the present invention provides；
Figure 13 is the schematic cross-section of the fingerprint module of the 9th embodiment that the present invention provides；
Figure 14 is the schematic diagram of the mobile terminal that the present invention provides；
Figure 15 is the schematic flow sheet of the fingerprint module manufacture method that the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
Referring to Fig. 1～Fig. 3, the present invention provides a kind of mobile terminal 200 (see Figure 14) of embodiment, described mobile terminal
200 include terminal body 201 (see Figure 14), mainboard 202 (see Figure 14) and are fixed on described terminal body 201 and electrically connect institute
State the fingerprint module 100 of mainboard 202.Described fingerprint module 100 receives user fingerprints information, and is transferred to mainboard 202, mainboard
202 control mobile terminal 200 according to user fingerprints information runs.
Described mobile terminal can be the intelligent mobile terminals such as mobile phone, computer, flat board, handheld device or media player.
In the present embodiment, illustrate as a example by described mobile terminal is as mobile phone.
As shown in Figures 1 to 3, described fingerprint module 100 includes cover plate 10, fingerprint chip 20, keyset 30 and circuit board 40.
Described cover plate 10 is provided with installing zone 11, and described fingerprint chip 20 is fixed on described installing zone 11.Described keyset 30 fits in institute
State fingerprint chip 20 and the described opposing side of cover plate 10, to push down described fingerprint chip 20.Described circuit board 40 is through described switching
Plate 30 electrically connects described fingerprint chip 20.
Fitted on described fingerprint chip 20 by described keyset 30, thus utilize the gravity of described keyset 30 to institute
State fingerprint chip 20 and produce pressure force, to increase the adhesive force of described fingerprint chip 20 and described cover plate 10, so that described
Fingerprint chip 20 is more firm with the combination of described cover plate 10, and described fingerprint chip 20 is susceptible to the impact of described circuit board 40 and takes off
From described cover plate 10, thus improve the quality of described fingerprint module 100.
Described cover plate 10 can be mobile phone protecgulum, it is also possible to be cell phone rear cover.There is provided first embodiment, described cover plate 10 with
Illustrate as a example by mobile phone protecgulum.Concrete, described cover plate 10 is in order to hide the display screen 203 of mobile terminal 200.Described cover plate
10 include the medial surface 13 that lateral surface 12 is arranged with relative described lateral surface 12.Described lateral surface 12 towards user, described inner side
Face 13 is in order to described mainboard 203 of fitting.Described medial surface 13 is by transparent area 131 with adjacent to the shading region of transparent area 131 lower end
132.Described transparent area 131 is through the light of described display screen 203 (see Figure 14).It is coated with ink layer on described shading region 132
133, described ink layer 133 hides the light of described display screen 203 non-display area, thus prevents display screen 203 light leak.Described peace
Dress district 11 is positioned at described shading region 132, to facilitate user to touch the fingerprint chip 20 on described installing zone 11.More specifically,
Described medial surface 13 is provided with groove 134 in described shading region 132.Described groove 134 includes the bottom surface near described lateral surface 12
135.Described installing zone 11 coincides with described bottom surface 135.The most described fingerprint chip 20 fits on described bottom surface 135.Thus
Described fingerprint chip 20 is reduced with the distance of described lateral surface 12.So that when user's correspondence on described lateral surface 12
The position of described groove 134 touches, and described fingerprint chip 20 can receive the finger print information of user.Described bottom surface 135 is to described
Distance L of lateral surface 12 is less than or equal to 0.3mm.By described fingerprint chip 20 being hidden in the inner side of described cover plate 10, from
And make described fingerprint film group 100 reach water-proof function, but also the appearance property of mobile terminal 200 can be improved.And can
Effectively to reduce the integral thickness of described mobile terminal 200.Certainly, in other embodiments, by strengthening described fingerprint core
The signal receiving performance of sheet 20, such that it is able to described fingerprint chip 20 of directly fitting on described medial surface 13, thus reduce institute
State the production cost of cover plate 10.
In the present embodiment, described fingerprint chip 20 is in elliptical plate members.The profile of described fingerprint chip 20 is by two semicircles
Constitute with a rectangle.Described fingerprint chip 20 includes encapsulated layer 21, chip 22 and substrate 23.Described chip 22 is fixed on described
On substrate 23, described encapsulated layer 21 is laminated on described substrate on 23, and is coated with described chip 22.Concrete, described fingerprint core
Sheet 20 includes the identification face 24 being arranged on described encapsulated layer 21 and the joint face 25 being arranged on described substrate 23.It is appreciated that
, described identification face 24 is towards user, and described identification face 24 fits on described bottom surface 135.Described identification face 24 is through institute
State cover plate 10 and receive the finger print information of user.Described joint face 25 user dorsad, described joint face 25 can arrange pad
251, thus facilitate described fingerprint chip 20 to utilize pad 251 to be electrically connected to described keyset 30.In other embodiments, institute
Stating fingerprint chip 20 can be with rounded tabular.
Described keyset 30 can be hard plate or the plate that can provide gravity contention effect.Described keyset
30 fit on described fingerprint chip 20 so that described fingerprint chip 20 is when fitting in the bottom surface 135 of described cover plate 10, permissible
Oppressed by the gravity of described keyset 30, thus increase the described fingerprint chip 20 conflict power to described cover plate 10 so that institute
State fingerprint chip 20 to combine closely with described cover plate 10.After described fingerprint chip 20 is firmly combined with described cover plate 10, by institute
State circuit board 40 to electrically connect with described keyset 30.Thus described circuit board 40 to the pull strength of described fingerprint chip 20 less than institute
State the adhesive force between fingerprint chip 20 and described cover plate 10, thus described fingerprint chip 20 is not easily disconnected from described cover plate 10, enters
And ensure that the quality of described fingerprint module 100.Described fingerprint chip 20 is oppressed by the equilibrium of described keyset 30, so that
Between described fingerprint chip 20 and described cover plate 10, laminating is closely, and then is difficult to bubble occur, thus described fingerprint chip 20 is flat
Whole fit in described cover plate 10, improve the quality of described fingerprint module 100.Described keyset 30 is except to described fingerprint chip
20 provide outside oppressive force, and described fingerprint chip 20 can also be conducted electricity by described keyset 30, to transmit described fingerprint core
The fingerprint signal pulse of sheet 20.Described keyset 30 electrically connects described fingerprint chip 20 and described circuit board 40, with by described finger
The signal of telecommunication of stricture of vagina chip 20 is transferred to described circuit board 40, and the signal of telecommunication is transferred to described mobile terminal by described circuit board 40
The mainboard 202 of 200.
Referring to Fig. 1～Fig. 3, in the first embodiment, described keyset 30 is printed circuit board (PCB).Described keyset 30 can
To arrange the circuit of mutual conduction in both sides, thus two lateral circuits are utilized to be electrically connected described fingerprint chip 20 and described circuit
Plate 40, so that described fingerprint chip 20 and described circuit board 40 mutual conduction.And each weldering of described fingerprint chip 20
Dish 251 can be respectively through different connections to described circuit board 40, to ensure that effective signal of telecommunication of described fingerprint chip 20 passes
Pass.Concrete, described keyset 30 include fitting the first contact surface 31 of described fingerprint chip 20 contacts with the most described first
Second contact surface 32 in face 31.Described first contact surface 31 is provided with multiple first pins 311 electrically connecting described fingerprint chip 20.
Described second contact surface 32 is provided with multiple second pins 321 being respectively turned on multiple described first pins 311.Described circuit board
40 fit in described second contact surface 32, and electrically connect multiple described second pin 321.Multiple described first pins 311 are permissible
It is welded in the multiple described pad 251 on described joint face 25 respectively through scolding tin.And multiple described second pin 321 can weld
On described circuit board 40.Thus ensure that the structural soundness of described fingerprint module 100, and ensure that described fingerprint chip 20
Electric conductivity with described circuit board 40.
Described circuit board 40 is provided with the circuit electrically connecting described keyset 30.One end of described circuit board 40 is electrically connected to institute
Stating keyset 30, the other end is electrically connected to the mainboard 202 of described mobile terminal 200.And owing to described fingerprint chip 20 is positioned at shifting
The lower end of dynamic terminal 200, and described mainboard 202 is usually located at the centre position of described mobile terminal 200, thus it is connected to described
One end of circuit board 40 can offset relative to described fingerprint chip 20.So the center of gravity of described circuit board 40 generally the most described fingerprint
Chip 20 offsets, and the length of the most described circuit board 40 is longer, and fingerprint chip 20 described in circuit board 40 weight ratio
, so described circuit board 40 is affected by self gravitation, there is certain pull strength to described fingerprint chip 20 in weight.And due to described
Fingerprint chip 20 is by the contention effect of described keyset 30, and described fingerprint chip 20 there is also attachment with described cover plate 10
Power, thus the impact of described fingerprint chip 20 is reduced by described circuit board 40.The length of the most described circuit board 40 can increase,
Other electronic devices and components can also be set on described circuit board 40, thus improve the service efficiency of described circuit board 40, improve institute
State the Adapter Property of fingerprint module 100.Described circuit board 40 can be connected to described master away from one end of described fingerprint chip 20
The optional position of plate 202, and described circuit board 40 can be in arbitrary structures form in described mobile terminal 200.
In the first embodiment, described circuit board 40 is flexible PCB.Described circuit board 40 can be the most any
Bending.Concrete, described circuit board 40 includes the first end 41 and is oppositely arranged the second end 42 that the first end 41 is arranged.Described first
Hold 41 multiple second pins 321 being welded in described keyset 20 through scolding tin.Described second end 42 is provided with adapter 421, institute
State adapter 421 and with the grafting of described mainboard 202, thus described fingerprint module 100 and the described removable company of mainboard 202 can be facilitated
Connect, conveniently described fingerprint module 100 is safeguarded, and the convenient Adapter Property increasing described fingerprint module 100.Described circuit
Plate 40 can also arrange strengthening course 43 between described first end 41 and described second end 42 and be laminated on described strengthening course 43
Electronic component 44.This strengthening course 43 can be that steel is mended, and described electronic component 44 can be electric capacity, resistance or diode etc..
By arranging described strengthening course 43 and described electronic component 44 between described first end 41 and described second end 42, thus increase
The Electric signal processing performance of described circuit board 40, and effectively transmit the signal of telecommunication of described fingerprint chip 20.So that it is described
Circuit board 40, in the case of increasing self gravitation, still will not produce impact to described fingerprint chip 20, described finger is i.e. effectively ensured
Stricture of vagina chip 20 and the firm combination of described cover plate 10, thus improve the quality of described fingerprint module 100.At other embodiments
In, described circuit board 40 can also be to be laminated on described keyset 30 after bending.
Referring to Fig. 4～Fig. 6, the present invention also provides for the second embodiment, roughly the same with first embodiment, except for the difference that,
Described keyset 30 is flexible PCB.Described keyset 30 can arbitrarily bending, thus convenient set on described keyset 30
Put the described fingerprint chip 20 of convenient electrical connection and the copper foil circuit of described circuit board 40.And effectively reduce described keyset 30
Production cost, and increase the suitability of described keyset 30.Concrete, described keyset 30 includes that the first connection end 33 is relative
Described first the second connection end 34 connecting end 33.Described second connects after end 34 the most described first connects end 33 bending and leads to
Crossing viscose glue phase stacking, described first connects end 33 electrically connects described fingerprint chip 20, and described second connects end 34 electrically connects described
Circuit board 40.More specifically, described keyset 30 includes the second of the first side 35 and relative described first side 35 setting
Side 36.It is provided with on described first side 35 and extends to the described second multiple copper connecting end 34 from described first connection end 33
Tinsel cord road 37.Each described copper foil circuit 37 connects the corresponding pad 251 connecting described fingerprint chip 20 of end 33 described first.
And each described copper foil circuit 37 connects end 34 described second and electrically connects described circuit board 40.Described first connects on end 33
Copper foil circuit 37 is welded on described pad 251 through scolding tin.Thus described first connect end 33 can be stable in described fingerprint core
Sheet 20 combines.Described first profile connecting end 33 is consistent with the profile of described fingerprint chip 20, and described first connects end 33
The geometric center of geometric center and described fingerprint chip 20 coincide.Thus described first connect end 33 can effectively oppress institute
State fingerprint chip 20.After described second connects the most described first connection end 33 bending of end 34, described second connects end 34 and institute
State the first connection end 33 phase stacking.Described second connects end 34 is connected to described circuit board 40, so that described keyset 30
With the described firm combination of circuit board 40.Described second connection end 34 is connected end 33 with described first and coincides, and then makes described
The overall center of gravity of keyset 30 is relative with the center of gravity of described fingerprint chip 20, so that whole described keyset 30 is effectively oppressed
Described fingerprint chip 20 so that described fingerprint chip 20 is combined closely with described cover plate 10.Described first connects end 33 and described
Connected by dowel 38 between second connection end 34.And described first connection end 33 and described second connects end 34 and overlaps
After, bonded together by double faced adhesive tape 39, so that the overall structure of described keyset 30 consolidates, to ensure described switching class 30
Center of gravity can be relative with the geometric center of described fingerprint chip 30.Described copper foil circuit 37 on described first side 35 by institute
State the first connection end 33 and extend to described second connection end 34 through described dowel 38.Thus described keyset 30 electricity is effectively ensured
It is connected to described fingerprint chip 20 and circuit board 40.
In a second embodiment, in order to ensure the intensity of described keyset 30, and increase the gravity of described keyset 30,
To improve the described keyset 30 active force to described fingerprint chip 20, described fingerprint module 100 also includes stiffening plate 50.This reality
Executing in example, described fingerprint module 100 includes two described stiffening plates 50.Two described stiffening plates 50 fit in described first respectively
Connect end 33 and described second to connect on end 34, and be positioned on described second side 36.The center of gravity of two described stiffening plates 50 with
The center of gravity of described fingerprint chip 20 is relative.Described stiffening plate 50 can be steel reinforcement, it is also possible to be resin reinforcement.Two described benefits
Bonded together by described double faced adhesive tape 39 between strong plate 50, thus prevent the centre-of gravity shift of two described stiffening plates 50.
In a second embodiment, led by board to board connector 60 phase between described keyset 30 with described circuit board 40
Logical.Concrete, described board to board connector 60 includes socket 61 and plug 62.Described socket 61 is welded in described keyset 30
On first side 35, and it is positioned at described second connection end 34.Described socket 61 electrically connects described copper foil circuit 37.Described plug 62
It is welded on circuit board 40, and is positioned at described first end 41.Described circuit board 40 is at described first end 41, with described plug 62
Opposing side is provided with reinforcement 45, to strengthen the bond strength of described plug 62 and described socket 61.By at described keyset
Described board to board connector 60 is set between 30 and described circuit board 40, so that the weight penalty of described keyset 30, with
Strengthen the steadiness to described fingerprint chip 20.And facilitate described circuit board 40 to be connected with described keyset 30, facilitate institute
State circuit board 40 and the demolition and maintenance of described keyset 30.
Referring to Fig. 7, the present invention also provides for the 3rd embodiment, roughly the same with first embodiment, except for the difference that described turn
It is conducted by board to board connector 60a between fishplate bar 30 and described circuit board 40.Described board to board connector 60a and described plate
To the connector for substrate 60 identical setting of structure, do not repeat them here.Concrete, in described keyset 30 and described fingerprint chip 20 phase
After laminating, described board to board connector 60a is utilized to be conducted with described circuit board 40 by described keyset 30, so that described
Utilize described board to board connector 60a to be connected between described keyset 30 and described circuit board 40, thus increase described switching
The weight of plate 30, to increase the described keyset 39 oppressive force to described fingerprint chip 20 so that described fingerprint chip 20 and institute
State the firm combination of cover plate 10.
Referring to Fig. 8, the present invention also provides for the 4th embodiment, roughly the same with first embodiment, except for the difference that, and described turn
It is conducted by conducting resinl 70 between fishplate bar 30 and described circuit board 40.Concrete, fit in described finger at described keyset 30
After stricture of vagina chip 20, described conducting resinl 70 is coated on the second contact surface 32 of described keyset 30.Then by described circuit board 40
The first end 41 be adhered on described second contact surface 32 through described conducting resinl 70.By the heating of described conducting resinl 70 is pressurizeed,
Thus the internal metallic carried of described conducting resinl 70 realize on the direction of the most described second contact surface 32 after flattening right
Described second pin 321 turns on described circuit board 40.So that described circuit board 40 is electrically connected with described keyset 30,
And make described circuit board 40 and the described firm combination of keyset 30.
Referring to Fig. 9, the present invention also provides for the 5th embodiment, roughly the same with first embodiment, except for the difference that, and described finger
It is conducted by board to board connector 60b between stricture of vagina chip 20 and described keyset 30.Described board to board connector 60b is with described
Board to board connector 60a structure is identical, does not repeats them here.Described plate connects machine 60b near described fingerprint chip 20 to plate
One end is welded on the substrate 23 of described fingerprint chip 20, and electrically connects the pad 251 of described joint face 25.Described plate is to plate even
The other end of machine 60b is welded on the first contact surface 31 of described keyset 30, and electrically connects on described first contact surface 31
First pin 311.
Referring to Figure 10, the present invention also provides for sixth embodiment, roughly the same with described first embodiment, except for the difference that,
It is conducted by conducting resinl 70a between described fingerprint chip 20 and described keyset 30.Concrete, at described fingerprint chip 20
It is coated with described conducting resinl 70a on joint face 25, described keyset 30 is adhered to described joint face 25 by described conducting resinl 70a
On, and the first pin 311 on described first contact surface 31 is electrically connected on described joint face 25 through described conducting resinl 70a
Pad 251.
Certainly, fingerprint module protection domain provided by the present invention is not excluded for replacing the simplest of above-described embodiment,
Or combination in any, to constitute new embodiment.
Referring to Figure 11, the present invention also provides for the 7th embodiment, roughly the same with first embodiment, except for the difference that, described
Circuit board 40 is printed circuit board (PCB).Described circuit board 40 can be the mainboard of mobile terminal 200, it is also possible to be independently of described shifting
The mainboard 202 of dynamic terminal 200, the both sides of the most described circuit board 40 are respectively welded the mainboard 202 in described mobile terminal 200 and institute
State keyset 30.The rigid utilizing described circuit board 40 increases so that described circuit board 40 is firm carries described fingerprint core
Sheet 20, so that described fingerprint module 100 Quality advance.Certainly, in a second embodiment, described circuit board 40 can also be adopted
Replace with printed circuit board (PCB).
Referring to Figure 12, the present invention also provides for the 8th embodiment, roughly the same with first embodiment, except for the difference that, described
The lateral surface 12 of cover plate 10 offers described groove 121.It is relative with described groove 121 that described installing zone 11 is positioned at described medial surface 13
Should locate.The most described fingerprint chip 20 fits in described medial surface 13 and described groove 121 corresponding section.Described groove 121 includes
Bottom surface 122, the spacing 1 of described bottom surface 122 to the identification face 21 of described fingerprint chip 20 is less than or equal to 0.3mm.With convenient
When user touches on the bottom surface 122 of described groove 121, described fingerprint chip 20 obtains user fingerprints letter through described cover plate 10
Breath.
Referring to Figure 13, the present invention also provides for the 9th embodiment, roughly the same with first embodiment, except for the difference that, described
Cover plate 10 is provided through the installing hole 14 of described lateral surface 12 and described medial surface 13.Described installing zone 11 is positioned at described installing hole
In 14.I.e. fingerprint chip 20 is positioned at described installing hole 14.Described fingerprint chip 20 is utilized to be installed in described installing hole 14, from
And facilitate user directly to touch the identification face 21 of described fingerprint chip 20 through described installing hole 14, thus improve described fingerprint core
The fingerprint collecting accuracy of sheet 20.
Referring to Figure 15, the present invention also provides for a kind of fingerprint module manufacture method, is used for making described fingerprint module 100.
Described fingerprint module making side includes:
S01: cover plate 10, fingerprint chip 20 and keyset 30 are provided, described keyset 30 is fitted in described fingerprint chip
After 20, being fixed on described cover plate 10 by described fingerprint chip 20, described keyset 30 provides compressing to described fingerprint chip 20
Power.
In the first embodiment, first, it is provided that described cover plate 10, described cover plate 10 has medial surface 13.Described medial surface
Described groove 134 is offered on 13.
Then, described keyset 30 is fitted in described fingerprint chip 20.Described keyset 30 is printed circuit board (PCB).Described
Fingerprint chip 20 has the joint face 25 that the identification face 24 towards user is arranged with relative described identification face 24.Described keyset 30
Fit on described joint face 25 through conducting resinl.Described keyset 30 and described fingerprint chip 20 overall structure are consolidated.
Finally, described identification face 24 arranges viscose glue, utilize viscose glue that described fingerprint chip 20 is adhered to described groove
In 134.Described fingerprint chip 20, by the action of gravity of described keyset 30, closely contacts at the bottom surface 135 of described groove 134.
Combine so that described fingerprint chip 20 is firm with described cover plate 10.
Certainly, in other embodiments, it is also possible to be first described keyset 30 to be fitted in described fingerprint chip 20
Joint face 25, then the identification face 24 at described fingerprint chip 20 is coated with viscose glue, finally provides described cover plate 10, by described fingerprint
Chip 20 is adhered on described cover plate 10 through described viscose glue.
In a second embodiment, roughly the same with described first embodiment, except for the difference that, described keyset 30 is flexible electrical
Road plate.First, it is provided that described keyset 30, described keyset 30 has the first connection end 33 and relative described first connection end 33
The the second connection end 34 arranged.
Then, connect end 33 by described first and be welded on the joint face 25 of described fingerprint chip 20, and described first
Connect end 33 and be coated with double faced adhesive tape 39 with the described opposing side of fingerprint chip 20.
After again, connect end 34 by described second and connect end 33 bending to described first so that described second connect end 34 with
Described first connects end 33 phase stacking, and described second connects end 34 connects end 33 by described double faced adhesive tape 39 bonding described first,
So that the overall center of gravity of described keyset 30 with the center of gravity of described fingerprint chip 10 in the direction of vertical described joint face 25
It is oppositely arranged.Thus described keyset 30 and described fingerprint chip 20 overall structure consolidate.
Finally, described identification face 24 arranges viscose glue, utilize viscose glue that described fingerprint chip 20 is adhered to described groove
In 134.Described fingerprint chip 20, by the action of gravity of described keyset 30, closely contacts at the bottom surface 135 of described groove 134.
Combine so that described fingerprint chip 20 is firm with described cover plate 10.
In the third embodiment, use and carry out described step S01 with described first embodiment same way, the most superfluous at this
State.
In the fourth embodiment, use and carry out described step S01 with described first embodiment same way, the most superfluous at this
State.
In the 5th embodiment, mode roughly the same with described first embodiment carries out described step S01, except for the difference that,
It is conducted by board to board connector 60b between described fingerprint chip 20 and described keyset 30.
First, described plate is connected machine 60b to plate and be welded in described fingerprint chip near one end of described fingerprint chip 20
On the substrate 23 of 20, and electrically connect the pad 251 of described joint face 25.
Then, the other end that plate is connected machine 60b by described plate is welded on the first contact surface 31 of described keyset 30,
And electrically connect the first pin 311 on described first contact surface 31.
After again, the two ends that plate is connected machine 60b by described plate are connected with group, so that described keyset 30 and described fingerprint chip
20 are fixed together so that described fingerprint chip 20 and described keyset 30 stabilized structure.Utilize described keyset 30 and described
The gravity of board to board connector 60b oppresses described fingerprint chip 20.
Finally, described identification face 24 arranges viscose glue, utilize viscose glue that described fingerprint chip 20 is adhered to described groove
In 134.Described fingerprint chip 20, by the action of gravity of described keyset 30, closely contacts at the bottom surface 135 of described groove 134.
Combine so that described fingerprint chip 20 is firm with described cover plate 10.
In the sixth embodiment, mode roughly the same with described first embodiment carries out described step S01, except for the difference that,
It is conducted by conducting resinl 70a between described fingerprint chip 20 and described keyset 30.Specific implementation process is with reference to the above-mentioned 6th
Embodiment illustrates, does not repeats them here.
In the 7th embodiment, mode roughly the same with first embodiment carries out described step S01, except for the difference that, described
Circuit board 40 is printed circuit board (PCB).Specific implementation process, with reference to above-mentioned 7th embodiment explanation, does not repeats them here.
In the 8th embodiment, mode roughly the same with first embodiment carries out described step S01, except for the difference that, described
The lateral surface 12 of cover plate 10 offers described groove 121.It is relative with described groove 121 that described installing zone 11 is positioned at described medial surface 13
Should locate.Specific implementation process, with reference to above-mentioned 8th embodiment explanation, does not repeats them here.
In the 9th embodiment, mode roughly the same with first embodiment carries out described step S01, except for the difference that, described
Cover plate 10 is provided through the installing hole 14 of described lateral surface 12 and described medial surface 13.Described installing zone 11 is positioned at described installing hole
In 14.Specific implementation process, with reference to above-mentioned 9th embodiment explanation, does not repeats them here.
S02: circuit board 40 is provided, described circuit board 40 is electrically connected to described fingerprint chip 20 through described keyset 30.
In the first embodiment, described circuit board 40 is flexible PCB.Described circuit board 40 has the first end 41 and phase
To arranging the second end 42 that the first end 41 is arranged.Described first end 41 is welded in described keyset 20, to realize described circuit
Plate 40 electrically connects described fingerprint chip 20.
In a second embodiment, use and carry out described step S02 with described first embodiment same way, the most superfluous at this
State.
In the third embodiment, mode roughly the same with first embodiment carries out described step S02, except for the difference that described turns
It is conducted by board to board connector 60a between fishplate bar 30 and described circuit board 40.Specific implementation process is real with reference to the above-mentioned 3rd
Execute example explanation, do not repeat them here.
In the fourth embodiment, mode roughly the same with first embodiment carries out described step S02, except for the difference that described turns
It is conducted by conducting resinl 70 between fishplate bar 30 and described circuit board 40.Specific implementation process is said with reference to above-mentioned 4th embodiment
Bright, do not repeat them here.
In the 5th embodiment, use and carry out described step S02 with described first embodiment same way, the most superfluous at this
State.
In the sixth embodiment, use and carry out described step S02 with described first embodiment same way, the most superfluous at this
State.
In the 7th embodiment, mode roughly the same with first embodiment carries out described step S02, except for the difference that, described
Circuit board 40 is printed circuit board (PCB).Specific implementation process, with reference to above-mentioned 7th embodiment explanation, does not repeats them here.
In the 8th embodiment, use and carry out described step S02 with described first embodiment same way, the most superfluous at this
State.
In the 9th embodiment, use and carry out described step S02 with described first embodiment same way, the most superfluous at this
State.
Fingerprint module, fingerprint module manufacture method and the mobile terminal that the present invention provides, is fitted in by described keyset
On described fingerprint chip, thus the gravity of described keyset is utilized described fingerprint chip to be produced pressure force, to increase described finger
Stricture of vagina chip and the adhesive force of described cover plate, so that described fingerprint chip is more firm with the combination of described cover plate, described fingerprint
Chip is susceptible to the impact of described circuit board and departs from described cover plate, thus improves the quality of described fingerprint module.
Embodiments described above, is not intended that the restriction to this technical scheme protection domain.Any in above-mentioned enforcement
Amendment, equivalent and the improvement etc. made within the spirit of mode and principle, should be included in the protection model of this technical scheme
Within enclosing.
Claims (15)
1. a fingerprint module, it is characterised in that described fingerprint module includes cover plate, fingerprint chip, keyset and circuit board, institute
Stating cover plate and be provided with installing zone, described fingerprint chip is fixed on described installing zone, described keyset fit in described fingerprint chip with
The opposing side of described cover plate, to provide oppressive force to described fingerprint chip, described circuit board is described through the electrical connection of described keyset
Fingerprint chip.
2. fingerprint module as claimed in claim 1, it is characterised in that described keyset is printed circuit board (PCB).
3. fingerprint module as claimed in claim 2, it is characterised in that described keyset includes fitting the of described fingerprint chip
Second contact surface of one contact surface and relative described first contact surface, described first contact surface is provided with the described fingerprint chip of electrical connection
The first pin, described second contact surface be provided with and described first pin conducting the second pin, described circuit board fits in institute
State the second contact surface, and electrically connect described second pin.
4. fingerprint module as claimed in claim 1, it is characterised in that described keyset is flexible PCB.
5. fingerprint module as claimed in claim 4, it is characterised in that described keyset includes the first connection end the most described the
One the second connection end connecting end, described second connects after end the most described first connects end bending and by viscose glue phase stacking,
Described first connects end electrically connects described fingerprint chip, and described second connects end electrically connects described circuit board.
6. fingerprint module as claimed in claim 4, it is characterised in that described fingerprint module also includes stiffening plate, described reinforcement
Flaggy is laminated on described keyset and the described opposing side of fingerprint chip, and described circuit board is through described turn of described stiffening plate electrical connection
Fishplate bar.
7. the fingerprint module as described in claim 1～6 any one, it is characterised in that described keyset and described circuit board
Between be conducted by scolding tin or board to board connector or conducting resinl.
8. the fingerprint module as described in claim 1～6 any one, it is characterised in that described keyset and described fingerprint core
It is conducted by scolding tin or board to board connector or conducting resinl between sheet.
9. the fingerprint module as described in claim 1～6 any one, it is characterised in that described circuit board is flexible PCB
Or printed circuit board (PCB).
10. the fingerprint module as described in claim 1～6 any one, it is characterised in that described cover plate includes medial surface and phase
Lateral surface to described medial surface, described lateral surface is in order to contact user fingerprints, and described lateral surface or described medial surface are provided with recessed
Groove, described installing zone is positioned at the groove of described medial surface, or is positioned at the groove corresponding section of described medial surface and described lateral surface.
11. 1 kinds of fingerprint module manufacture methods, it is characterised in that described fingerprint module manufacture method includes:
There is provided cover plate, fingerprint chip and keyset, after described keyset is fitted in described fingerprint chip, by described fingerprint chip
Being fixed on described cover plate, described keyset provides oppressive force to described fingerprint chip；
Circuit board is provided, described circuit board is electrically connected to described fingerprint chip through described keyset.
12. fingerprint module manufacture methods as claimed in claim 11, it is characterised in that described keyset is printed circuit board (PCB),
Fitted by conducting resinl between described keyset and described fingerprint chip.
13. fingerprint module manufacture methods as claimed in claim 12, it is characterised in that described circuit board is flexible PCB,
It is conducted by scolding tin or board to board connector or conducting resinl between described keyset and described circuit board.
14. fingerprint module manufacture methods as claimed in claim 11, it is characterised in that described fingerprint chip is fitted by viscose glue
In described medial surface.
15. 1 kinds of mobile terminals, it is characterised in that described mobile terminal includes fingerprint described in claim 1～10 any one
Module.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675359.8A CN106096596B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module, fingerprint module preparation method and mobile terminal |
| CN201810166216.3A CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
| EP17185937.4A EP3288246A1 (en) | 2016-08-16 | 2017-08-11 | Fingerprint module and method for manufacturing the fingerprint module |
| US15/677,415 US10368444B2 (en) | 2016-08-16 | 2017-08-15 | Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal |
| PCT/CN2017/097706 WO2018033104A1 (en) | 2016-08-16 | 2017-08-16 | Fingerprint module and method for manufacturing the fingerprint module |
| US15/953,823 US10342137B2 (en) | 2016-08-16 | 2018-04-16 | Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675359.8A CN106096596B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module, fingerprint module preparation method and mobile terminal |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810166216.3A Division CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106096596A true CN106096596A (en) | 2016-11-09 |
| CN106096596B CN106096596B (en) | 2018-03-27 |
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|---|---|---|---|
| CN201810166216.3A Active CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
| CN201610675359.8A Active CN106096596B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module, fingerprint module preparation method and mobile terminal |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810166216.3A Active CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
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| CN (2) | CN108462768B (en) |
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| CN107066949A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN107153826A (en) * | 2017-05-26 | 2017-09-12 | 广东欧珀移动通信有限公司 | The preparation method and fingerprint recognition module of fingerprint recognition module |
| CN107273854A (en) * | 2017-06-16 | 2017-10-20 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| WO2018033104A1 (en) * | 2016-08-16 | 2018-02-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module and method for manufacturing the fingerprint module |
| CN113597091A (en) * | 2021-08-03 | 2021-11-02 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method thereof |
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| CN108462768B (en) * | 2016-08-16 | 2019-07-19 | Oppo广东移动通信有限公司 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108462768A (en) | 2018-08-28 |
| CN106096596B (en) | 2018-03-27 |
| CN108462768B (en) | 2019-07-19 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. |