CN203338796U - Transparent conductive film - Google Patents
Transparent conductive film Download PDFInfo
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- CN203338796U CN203338796U CN2013203067358U CN201320306735U CN203338796U CN 203338796 U CN203338796 U CN 203338796U CN 2013203067358 U CN2013203067358 U CN 2013203067358U CN 201320306735 U CN201320306735 U CN 201320306735U CN 203338796 U CN203338796 U CN 203338796U
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Abstract
A transparent conductive film comprises a transparent substrate, a conductive line, a first conducting layer, a first matrix layer and a second conducting layer. The transparent substrate comprises the components as follows: a body and a flexible base plate, wherein the body comprises the component an induction zone and a frame zone positioned at the edge of the induction zone, the first conducting layer is arranged at one side of the induction zone, the first matrix layer is arranged on the surface of the first conducting layer, and the second conducting layer is embedded on the first matrix layer; a first lead wire electrode arranged at one side of the frame zone, wherein the first conducting layer and the conductive line are electrically connected through the first lead wire electrode; and a second lead wire electrode arranged at one side of the first matrix layer, wherein the second conducting layer and the conductive line are electrically connected through the second lead wire electrode. The first conducting layer, the second conducting layer and the conductive line are arranged on the same transparent substrate, thereby the conductive film and the flexible circuit board are formed, compared to the traditional technology that the conductive film and the flexible circuit board require applying process to be bonded, the transparent conductive film provided in the utility model, no applying process is required, and the production efficiency is raised.
Description
Technical field
The utility model relates to the touch-screen field, particularly relates to a kind of nesa coating.
Background technology
Nesa coating is a kind of film that has satisfactory electrical conductivity and have high transmission rate at visible light wave range.Nesa coating has been widely used in the fields such as flat panel display, photovoltaic device, contact panel and electromagnetic shielding at present, has the extremely wide market space.
Flexible PCB is to take polyimides or polyester film a kind ofly to have height reliability, an excellent flexible printed circuit as what base material was made.Be called for short soft board or FPC(Flexible Printed Circuit), have that distribution density is high, lightweight, the characteristics of thin thickness.Nesa coating is connected with external circuits by FPC, thereby the position signalling of nesa coating perception is transferred in processor, is identified, and determines touch location.
Traditional, when nesa coating is connected with external circuits by FPC, first by the laminating of the lead-in wire of FPC and nesa coating zone, then and printed circuit board (Printed Circuit Board, PCB) be connected, cause production efficiency lower.
The utility model content
Based on this, be necessary the nesa coating that provides a kind of production efficiency high.
A kind of nesa coating comprises:
Transparent substrates, described transparent substrates comprises body and the flexible base, board extended to form from described body one end, the width of described flexible base, board is less than the width of described body, the rim area that described body comprises induction zone and is positioned at described induction zone edge;
Be located at the conducting circuit of described flexible and transparent substrate one side;
Be located at latticed first conductive layer of described induction zone one side, described the first conductive layer comprises cross one another the first conductive thread;
Be located at first hypothallus of described the first conductive layer away from the surface of described induction zone, described the first hypothallus is provided with latticed the second conductive layer away from the surface of described the first conductive layer, and described the second conductive layer comprises cross one another the second conductive thread;
Be located at the first lead-in wire electrode of described rim area one side, described the first conductive layer and described conducting link tester are crossed described the first lead-in wire electrode and are electrically connected to; And
Be located at the second lead-in wire electrode of first hypothallus one side corresponding with described rim area, described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and are electrically connected to.
In embodiment, described the first hypothallus offers the first groove away from the surface of described the first conductive layer therein, and described the second conductive layer is contained in described the first groove; A surface of described induction zone offers the second groove, and described the first conductive layer is contained in described the second groove.
In embodiment, described the first lead-in wire electrode is embedded at the surface of described rim area or the surface that described the first lead-in wire electrode directly is located at described rim area therein;
Described the second lead-in wire electrode is embedded at the surface of first hypothallus corresponding with described rim area or the surface that described the second lead-in wire electrode directly is located at described first hypothallus corresponding with described rim area.
Therein in embodiment, also comprise the second hypothallus, described the second hypothallus is located between described transparent substrates and described the first hypothallus, and described the second hypothallus offers the second groove away from a side of described transparent substrates, and described the first conductive layer is contained in described the second groove.
In embodiment, described the first bottom portion of groove is nonplanar structure therein, and described the second bottom portion of groove is nonplanar structure.
In embodiment, the width of described the first groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m therein, and the ratio of height and width is greater than 1;
The width of described the second groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
In embodiment, described the first lead-in wire electrode is embedded at the surface of described the second hypothallus or the surface that described the first lead-in wire electrode directly is located at described the second hypothallus therein.
Therein in embodiment, described the first lead-in wire electrode is latticed or strip, latticed described the first lead-in wire electrode comprises cross one another the first conductive lead wire, and the minimum widith of the described first lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m;
Described the second lead-in wire electrode is latticed or strip, and latticed described the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the minimum widith of the described second lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m.
In embodiment, described conducting circuit is latticed or strip therein, and latticed described conducting circuit is intersected to form by the conducting silk thread.
In embodiment, also comprise protective clear layer therein, described protective clear layer coats described transparent substrates, the first conductive layer, the second conductive layer, the first lead-in wire electrode, the second lead-in wire electrode and conducting circuit at least partly.
In embodiment, the visible light transmissivity of described nesa coating is not less than 86% therein.
The transparent substrates of above-mentioned nesa coating comprises body and flexible base, board, thereby the first conductive layer, the second conductive layer and conducting circuit are arranged on same transparent substrates and form conducting film and flexible PCB, than traditional conducting film and flexible PCB, need attaching process to be fitted, above-mentioned nesa coating does not need attaching process, has improved production efficiency.
The accompanying drawing explanation
The nesa coating that Fig. 1 is an execution mode is along the cross-sectional view of the first conductive layer;
The nesa coating that Fig. 2 is an execution mode is along the cross-sectional view of the second conductive layer;
The cross-sectional view of the nesa coating that Fig. 3 is an embodiment;
The cross-sectional view of the nesa coating that Fig. 4 is another embodiment;
The structural representation of the bottom portion of groove that Fig. 5 is an embodiment;
The structural representation of the conductive grid that Fig. 6 is an embodiment;
The structural representation of the conductive grid that Fig. 7 is another embodiment;
The cross-sectional view of the nesa coating that Fig. 8 is another embodiment;
The cross-sectional view of the nesa coating that Fig. 9 is another embodiment;
The part section structural representation that Figure 10 is the nesa coating shown in Fig. 8.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.Provided preferred embodiment of the present utility model in accompanying drawing.But the utility model can be realized in many different forms, is not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present utility model more comprehensively thorough.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term used in specification of the present utility model herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the utility model.
Please refer to Fig. 1 to Fig. 4, the nesa coating of an execution mode, comprise transparent substrates 10, the first hypothallus 20, the first conductive layer 30, the second conductive layer 40, the first lead-in wire electrode 50, the second lead-in wire electrode 60 and conducting circuit 70.
The material of transparent substrates 10 can be PETG (Polyethylene terephthalate, PET) or thermoplastic.Thermoplastic can be Merlon (Polycarbonate, PC) or polymethyl methacrylate (polymethylmethacrylate, PMMA).
The material of the first hypothallus 20 can be ultraviolet cured adhesive (UV glue), impression glue or Merlon.
The first hypothallus 20 is located at the surface of the first conductive layer 30 away from induction zone, and the first hypothallus 20 offers the first groove away from the surface of the first conductive layer 30.The surface of first hypothallus 20 corresponding with rim area 114 offers the first electrode groove, and the first groove and the first electrode groove are positioned at homonymy.
A surface of induction zone 112 offers the second groove.A surface of rim area 114 offers the second electrode groove.The second groove and the second electrode groove are positioned at homonymy.
Flexible base, board 120 is at least one.When flexible base, board 120 is one, flexible base, board 120 offers the conducting groove.Conducting groove and the second groove homonymy.In the present embodiment, flexible base, board 120 is 2.2 flexible base, boards 120 all offer the conducting groove.2 conducting groove parts and the second groove homonymy.
For convenience of description, in case of no particular description, the first groove, the second groove, the first electrode groove, the second electrode groove and conducting groove are referred to as groove.In conjunction with Fig. 5, bottom portion of groove is non-parallel structure.Bottom portion of groove can be " V " font, " W " font, arc or waveform." V " font of bottom portion of groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m.Trench bottom is arranged to " V " font, " W " font, arc or waveform, after electric conducting material is filled in to groove, during dry solidification, can be reduced the contraction of electric conducting material.Electric conducting material is filled in to groove and solidify to form the first conductive thread, the second conductive thread, the first conductive lead wire, the second conductive lead wire and conducting silk thread, the performance of electric conducting material is had good protective effect and prevents electric conducting material polycondensation in drying course and disconnect.The width of groove can be 0.2 μ m～5 μ m, can be highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
The first conductive layer 30 is contained in the second groove.The first conductive layer 30 is latticed.In conjunction with Fig. 6 to Fig. 7, the grid of the first conductive layer 30 can be regular grid (Fig. 6) or random grid (Fig. 7).The first conductive layer 30 comprises cross one another the first conductive thread.The first conductive layer is solidify to form by the electric conducting material that is filled in the second groove.The material of the first conductive layer can be conducting metal, and conducting metal can be silver or copper.
The second conductive layer 40 is contained in the first groove.The second conductive layer 40 is latticed.In conjunction with Fig. 6 to Fig. 7, the grid of the second conductive layer 40 can be regular grid (Fig. 6) or random grid (Fig. 7).The second conductive layer 40 comprises cross one another the second conductive thread.The second conductive layer is solidify to form by the electric conducting material that is filled in the first groove.The material of the second conductive layer 40 can be conducting metal, and conducting metal can be silver or copper.
The first lead-in wire electrode 50 and the second lead-in wire electrode 60 are contained in respectively the second electrode groove and the first electrode groove.The first lead-in wire electrode 50 and the first conductive layer 30 homonymies.The first conductive layer 30 and conducting circuit 70 are electrically connected to by the first lead-in wire electrode 50.The second lead-in wire electrode 60 and the second conductive layer 40 homonymies.The second conductive layer 40 and the second lead-in wire electrode 60 are electrically connected to.The second lead-in wire electrode 60 can pass the surface of the first hypothallus 20 through the first conductive layer 30 by the mode of perforation, and then is electrically connected to conducting circuit 70.Between the second lead-in wire electrode 60 and the first conductive layer, insulation arranges.
The first conductive layer 30 and conducting circuit 70 are electrically connected to by the first lead-in wire electrode 50, and the second conductive layer 40 and conducting circuit 70 are electrically connected to by the second lead-in wire electrode 60, with the touch signal that induction zone is detected, are passed to conducting circuit 70.
The first lead-in wire electrode 50 can be latticed or strip.The second lead-in wire electrode 60 can be also latticed or strip.
Latticed the first lead-in wire electrode 50 comprises cross one another the first conductive lead wire.In conjunction with Fig. 6 to Fig. 7, the grid of the first lead-in wire electrode 50 can be regular grid (Fig. 6) or random grid (Fig. 7).The first lead-in wire electrode 50 is solidify to form by the electric conducting material that is filled in the second electrode groove.The material of the first lead-in wire electrode 50 can be conducting metal, and conducting metal can be silver or copper.
The minimum widith of the first lead-in wire electrode 50 of strip can be 10 μ m～200 μ m, can be highly 5 μ m～20 μ m.
Latticed the second lead-in wire electrode 60 comprises cross one another the second conductive lead wire.In conjunction with Fig. 6 to Fig. 7, the grid of the second lead-in wire electrode 60 can be regular grid (Fig. 6) or random grid (Fig. 7).The second lead-in wire electrode 60 is solidify to form by the electric conducting material be filled in the first electrode groove.The material of the second lead-in wire electrode 60 can be conducting metal, and conducting metal can be silver or copper.
The minimum widith of the second lead-in wire electrode 60 of strip can be 10 μ m～200 μ m, can be highly 5 μ m～20 μ m.
In the present embodiment, conducting circuit 70 is 2, is contained in respectively 2 conducting grooves.Conducting circuit 70 can be latticed or strip.
Latticed conducting circuit 70 comprises cross one another conducting silk thread.In conjunction with Fig. 6 to Fig. 7, the grid of conducting circuit 70 can be regular grid (Fig. 6) or random grid (Fig. 7).Conducting circuit 70 is solidify to form by the electric conducting material that is filled in the conducting groove.The material of conducting circuit 70 can be conducting metal, and conducting metal can be silver or copper.
Certainly, in other embodiments, the first lead-in wire electrode 50 and the second arranging of electrode 60 of lead-in wire can also be following mode:
(1) first lead-in wire electrode 50 can directly be located at the surface of rim area, the first lead-in wire electrode 50 and the first conductive layer 30 homonymies.Now, the first lead-in wire electrode 50 forms by silk screen printing, exposure imaging or inkjet printing.The second lead-in wire electrode 60 also can directly be located at the surface of first hypothallus 20 corresponding with rim area, the second lead-in wire electrode 60 and the second conductive layer 40 homonymies.Now, the second lead-in wire electrode 60 forms by silk screen printing, exposure imaging or inkjet printing.
(2) first lead-in wire electrodes 50 can directly be located at the surface of rim area, the first lead-in wire electrode 50 and the first conductive layer 30 homonymies.The second lead-in wire electrode 60 is contained in the first electrode groove of the first hypothallus, the second lead-in wire electrode 60 and the second conductive layer 40 homonymies.Now, the first lead-in wire electrode 50 forms by silk screen printing, exposure imaging or inkjet printing.The electric conducting material of the second lead-in wire electrode 60 in being filled in the first electrode groove solidify to form.
(3) first lead-in wire electrodes 50 are contained in the second electrode groove of rim area, the first lead-in wire electrode 50 and the first conductive layer 30 homonymies.The second lead-in wire electrode 60 directly is located at the surface of the first hypothallus, the second lead-in wire electrode 60 and the second conductive layer 40 homonymies.Now, the electric conducting material of the first lead-in wire electrode 50 in being filled in the second electrode groove solidify to form.The second lead-in wire electrode 60 forms by silk screen printing, exposure imaging or inkjet printing.
As shown in Figure 8 and Figure 9, nesa coating also comprises the second hypothallus 80.The second hypothallus 80 is arranged between transparent substrates 10 and the first hypothallus 20.Second hypothallus 80 corresponding with induction zone offers the second groove away from a side of transparent substrates, and the first conductive layer 30 is contained in the second groove.The first lead-in wire electrode 50 directly is located at the surface of second hypothallus 80 corresponding with rim area.The second lead-in wire electrode 60 directly is located at the surface of first hypothallus 20 corresponding with rim area.In conjunction with Figure 10, the second lead-in wire electrode 60 is the surface through the first conductive layer 30 through hole 22, and then is electrically connected to conducting circuit 70.Between the second lead-in wire electrode 60 and the first conductive layer, insulation arranges.Certainly, in other embodiments, the second lead-in wire electrode 60 also can be connected to conducting circuit 70 from the side, thus and conducting circuit 70 electrical connections.
Other structures of Fig. 8 and nesa coating in the embodiment shown in Fig. 9 are similar with the dependency structure of the nesa coating in the embodiment shown in Fig. 3, do not repeat them here.
The material of the second hypothallus 80 can be UV glue, impression glue or Merlon.
For convenience of description, in case of no particular description, the bottom of the second groove can be " V " font, " W " font, arc or waveform." V " font of the bottom of the second groove, " W " font, arc or corrugated amplitude are at 500nm～1 μ m." V " font, " W " font, arc or waveform are arranged to in the bottom of the second groove, after electric conducting material is filled in to groove, during dry solidification, can reduce the contraction of electric conducting material.Electric conducting material is filled in to the second groove and solidify to form the first conductive thread, the performance of electric conducting material is had in good protective effect and drying course, electric conducting material can not open circuit.The width of the second groove can be 0.2 μ m～5 μ m, can be highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
Be appreciated that in other embodiments, the first lead-in wire electrode 50 and the second arranging of electrode 60 of lead-in wire can also be following modes:
(1) first lead-in wire electrode 50 can also be embedded at the surface of second hypothallus 80 corresponding with rim area.The first lead-in wire electrode 50 and the first conductive layer 30 homonymies.The second lead-in wire electrode 60 directly is located at the surface of first hypothallus 20 corresponding with rim area, the second lead-in wire electrode 60 and the second conductive layer 40 homonymies.
(2) first lead-in wire electrodes 50 can directly be located at the surface of second hypothallus 80 corresponding with rim area, the first lead-in wire electrode 50 and the first conductive layer 30 homonymies.The second lead-in wire electrode 60 is embedded at the surface of first hypothallus 20 corresponding with rim area, the second lead-in wire electrode 60 and the second conductive layer 40 homonymies.
(3) first lead-in wire electrode 50 first lead-in wire electrodes 50 can also be embedded at the surface of second hypothallus 80 corresponding with rim area.The first lead-in wire electrode 50 and the first conductive layer 30 homonymies.The second lead-in wire electrode 60 directly is located at the surface of the first hypothallus 20, the second lead-in wire electrode 60 and the second conductive layer 40 homonymies.
Above-mentioned nesa coating can also comprise the protective clear layer (not shown), and protective clear layer coats transparent substrates 10, the first hypothallus 20, the first conductive layer 30, the second conductive layer 40, the first lead-in wire electrode 50, the second lead-in wire electrode 60 and conducting circuit 70 at least partly.The material of protective clear layer can be UV glue, impression glue or Merlon.Nesa coating is provided with the oxidation that protective clear layer can effectively prevent electric conducting material.
The visible light transmissivity of above-mentioned nesa coating is not less than 86%.
The transparent substrates of above-mentioned nesa coating comprises body 110 and flexible base, board 120, thereby the first conductive layer 30, the second conductive layer 40 and conducting circuit 70 are arranged on same transparent substrates and form conducting film and flexible PCB, than traditional conducting film and flexible PCB, need attaching process to be fitted, above-mentioned nesa coating does not need attaching process, improved production efficiency, when the flexible connection parts are connected with external equipment, can adopt laminating, or being provided with male end or female end at the flexible connection ends, direct and external equipment carries out socket connection.Simultaneously, owing to not needing attaching process, save manufacturing cost, improved the generation yield of product.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (11)
1. a nesa coating, is characterized in that, comprising:
Transparent substrates, described transparent substrates comprises body and the flexible base, board extended to form from described body one end, the width of described flexible base, board is less than the width of described body, the rim area that described body comprises induction zone and is positioned at described induction zone edge;
Be located at the conducting circuit of described flexible and transparent substrate one side;
Be located at latticed first conductive layer of described induction zone one side, described the first conductive layer comprises cross one another the first conductive thread;
Be located at first hypothallus of described the first conductive layer away from the surface of described induction zone, described the first hypothallus is provided with latticed the second conductive layer away from the surface of described the first conductive layer, and described the second conductive layer comprises cross one another the second conductive thread;
Be located at the first lead-in wire electrode of described rim area one side, described the first conductive layer and described conducting link tester are crossed described the first lead-in wire electrode and are electrically connected to; And
Be located at the second lead-in wire electrode of first hypothallus one side corresponding with described rim area, described the second conductive layer and described conducting link tester are crossed described the second lead-in wire electrode and are electrically connected to.
2. nesa coating according to claim 1, is characterized in that, described the first hypothallus offers the first groove away from the surface of described the first conductive layer, and described the second conductive layer is contained in described the first groove; A surface of described induction zone offers the second groove, and described the first conductive layer is contained in described the second groove.
3. nesa coating according to claim 2, is characterized in that, described the first lead-in wire electrode is embedded at the surface of described rim area or the surface that described the first lead-in wire electrode directly is located at described rim area;
Described the second lead-in wire electrode is embedded at the surface of first hypothallus corresponding with described rim area or the surface that described the second lead-in wire electrode directly is located at described first hypothallus corresponding with described rim area.
4. nesa coating according to claim 1, it is characterized in that, also comprise the second hypothallus, described the second hypothallus is located between described transparent substrates and described the first hypothallus, described the second hypothallus offers the second groove away from a side of described transparent substrates, and described the first conductive layer is contained in described the second groove.
5. nesa coating according to claim 2, is characterized in that, described the first bottom portion of groove is nonplanar structure, and described the second bottom portion of groove is nonplanar structure.
6. nesa coating according to claim 2, is characterized in that, the width of described the first groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1;
The width of described the second groove is 0.2 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and width is greater than 1.
7. nesa coating according to claim 4, is characterized in that, described the first lead-in wire electrode is embedded at the surface of described the second hypothallus or the surface that described the first lead-in wire electrode directly is located at described the second hypothallus.
8. nesa coating according to claim 1, it is characterized in that, described the first lead-in wire electrode is latticed or strip, latticed described the first lead-in wire electrode comprises cross one another the first conductive lead wire, the minimum widith of the described first lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m;
Described the second lead-in wire electrode is latticed or strip, and latticed described the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the minimum widith of the described second lead-in wire electrode of strip is 10 μ m～200 μ m, is highly 5 μ m～20 μ m.
9. nesa coating according to claim 1, is characterized in that, described conducting circuit is latticed or strip, and latticed described conducting circuit is intersected to form by the conducting silk thread.
10. nesa coating according to claim 1; it is characterized in that; also comprise protective clear layer, described protective clear layer coats described transparent substrates, the first conductive layer, the second conductive layer, the first lead-in wire electrode, the second lead-in wire electrode and conducting circuit at least partly.
11. nesa coating according to claim 1, is characterized in that, the visible light transmissivity of described nesa coating is not less than 86%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203067358U CN203338796U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203067358U CN203338796U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
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| CN203338796U true CN203338796U (en) | 2013-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013203067358U Withdrawn - After Issue CN203338796U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014190592A1 (en) * | 2013-05-30 | 2014-12-04 | 南昌欧菲光科技有限公司 | Transparent conductive film |
| WO2019200908A1 (en) * | 2018-04-18 | 2019-10-24 | 京东方科技集团股份有限公司 | Conductive structure and preparation method thereof, touch screen, and touch display device |
-
2013
- 2013-05-30 CN CN2013203067358U patent/CN203338796U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014190592A1 (en) * | 2013-05-30 | 2014-12-04 | 南昌欧菲光科技有限公司 | Transparent conductive film |
| WO2019200908A1 (en) * | 2018-04-18 | 2019-10-24 | 京东方科技集团股份有限公司 | Conductive structure and preparation method thereof, touch screen, and touch display device |
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