CN103426503A - Monolayer multiple-point touch screen and monolayer multiple-point conductive film thereof - Google Patents
Monolayer multiple-point touch screen and monolayer multiple-point conductive film thereof Download PDFInfo
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- CN103426503A CN103426503A CN2013103251685A CN201310325168A CN103426503A CN 103426503 A CN103426503 A CN 103426503A CN 2013103251685 A CN2013103251685 A CN 2013103251685A CN 201310325168 A CN201310325168 A CN 201310325168A CN 103426503 A CN103426503 A CN 103426503A
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Abstract
A monolayer multiple-point conductive film comprises a transparent substrate, a first conductive layer, an insulating layer, a second conductive layer, a first lead wire electrode and a second lead wire electrode. The transparent substrate comprises a body and at least one flexible connection portion formed by extending one side of the body, wherein the width of the flexible connection portion is smaller than that of one side provided with the flexible connection portion of the body, the flexible connection portion is provided with a breakover circuit, and the body is provided with an induction zone and a frame zone located on the edge of the induction zone. The first conductive layer is arranged in the induction zone. The insulating layer is located above a first lead wire and embedded into a grid groove. The second conductive layer is arranged in an induction zone of the transparent substrate, and the second conductive layer and the first conductive layer are separated through the insulating layer. The monolayer multiple-point conductive film has the advantages of being low in cost. In addition, the invention further provides a monolayer multiple-point touch screen using the monolayer multiple-point conductive film.
Description
Technical field
The present invention relates to a kind of touch-control conducting film, particularly relate to a kind of individual layer multipoint mode conducting film and use the individual layer multipoint mode touch screen of this individual layer multipoint mode conducting film.
Background technology
Nesa coating is to have satisfactory electrical conductivity, and has a kind of film of high transmission rate at visible light wave range.Nesa coating has been widely used in the fields such as flat panel display, photovoltaic device, contact panel and electromagnetic shielding at present, has the extremely wide market space.
Nesa coating is to receive the sensing element of the input signals such as touch in touch-screen.At present, ITO(tin indium oxide) layer is vital part in nesa coating.The develop rapidly at a tremendous pace of the manufacturing technology of touch-screen, but for traditional individual layer multipoint mode conducting film, its in making the process of touch-screen because needs are connected with external device, so need laminating flexible PCB (Flexible Printed Circuit, FPC), and need to carry out attaching process, increase the cost of manpower and materials.Simultaneously, in the corresponding technique of ITO, whole the ITO film plated need be carried out to etching, to form the ITO pattern, in this technique, a large amount of ITO is etched, cause a large amount of noble metal wastes, and then make product cost high, cause the cost of traditional individual layer multipoint mode conducting film higher.
Summary of the invention
Based on this, be necessary to provide a kind of lower-cost individual layer multipoint mode conducting film.
A kind of individual layer multipoint mode conducting film comprises:
Transparent substrates, at least one flexible connection section that comprises body and extended to form by a side of described body, the width of described flexible connection section is less than the width that described body is extended with a side of described flexible connection section, described flexible connection section is provided with the conducting circuit, and described body is provided with induction zone and is positioned at the rim area at described induction zone edge;
The first conductive layer, be latticed, is arranged at described induction zone, and described the first conductive layer comprises cross one another the first conductive thread, and described induction zone offers the grid groove, and described the first conductive layer is contained in described grid groove;
Insulating barrier, be arranged in the first conductive thread top and be embedded at described grid groove;
The second conductive layer, be latticed, is arranged at the induction zone of described transparent substrates, and separate by described insulating barrier with described the first conductive layer, and described the second conductive layer comprises cross one another the second conductive thread;
The first lead-in wire electrode, be arranged at described rim area, and described the first lead-in wire electrode is electrically connected to described the first conductive layer, and described conducting link tester is crossed described the first lead-in wire electrode and is electrically connected to described the first conductive layer; And
The second lead-in wire electrode, be arranged at described rim area, and described the second lead-in wire electrode is electrically connected to described the second conductive layer, and described conducting link tester is crossed described the second lead-in wire electrode and is electrically connected to described the second conductive layer.
Therein in embodiment, also comprise hypothallus, described hypothallus is located at described transparent substrates surface, and described induction zone and described rim area are located at the side of described hypothallus away from transparent substrates, and described the first conductive layer and described the second conductive layer all are arranged at the induction zone of described hypothallus.
In embodiment, described the first lead-in wire electrode and described the second lead-in wire electrode are linear therein.
In embodiment, the material of described insulating barrier is dielectric ink or insulating cement therein.
In embodiment, described the first lead-in wire electrode comprises cross one another the first conductive lead wire therein, and described the second lead-in wire electrode comprises cross one another the second conductive lead wire.
In embodiment, described the first lead-in wire electrode is positioned at the surface of described rim area, or offers the first groove on described rim area therein, and described the first lead-in wire is contained in and is opened in described the first groove.
In embodiment, described the second lead-in wire electrode is positioned at the surface of described rim area, or offers the second groove on described rim area therein, and described the second lead-in wire is contained in and is opened in described the second groove.
In embodiment, the grid of described the first conductive layer and described the second conductive layer is regular grid or random grid therein.
In embodiment, the width of described grid groove is d1 therein, and the degree of depth is h, wherein, and 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1>1.
In embodiment, described grid groove is that bottom is " V " font, " W " font, arc or corrugated micro-groove therein.
In embodiment, the degree of depth of described micro-groove is 500nm～1 μ m therein.
In embodiment, the material of described transparent substrates is thermoplastic or PET therein.
In embodiment, the material of described hypothallus is UV glue, impression glue or Merlon therein.
In embodiment, the material of described the first conductive thread and described the second conductive thread is silver, copper, conducting polymer or ITO therein.
In embodiment, also comprise the protective clear layer that covers described the second conductive layer surface therein.
In embodiment, the material of described protective clear layer is UV glue, impression glue or Merlon therein.
A kind of individual layer multipoint mode touch screen comprises overlay, individual layer multipoint mode conducting film and shows module that described individual layer multipoint mode conducting film is above-mentioned individual layer multipoint mode conducting film.
Above-mentioned individual layer multipoint mode conducting film, its flexible connection section and transparent substrates form integral structure, individual layer multipoint mode conducting film is electrically connected to outside by flexible connection section, has saved flexible PCB and the technique relevant to flexible PCB, makes the cost of individual layer multipoint mode conducting film lower.Simultaneously, above-mentioned individual layer multipoint mode conducting film is formed with the grid groove on hypothallus, fills the first conductive thread in the grid groove and forms the first conductive layer.Therefore, with the embedded grider structure, replace conventional I TO process structure, saved follow-up etch process, saved a large amount of noble metals, further reduced cost.
The accompanying drawing explanation
The structural representation of the individual layer multipoint mode touch screen that Fig. 1 is embodiment of the present invention;
The top view that Fig. 2 is the transparent substrates in Fig. 1;
Fig. 3 is the top view of body and oar connecting portion in transparent substrates shown in Fig. 2;
The profile that Fig. 4 is the individual layer multipoint mode conducting film in Fig. 1;
Fig. 5 (a) is to the structural representation of the different embodiment of the bottom of Fig. 5 (d) grid groove that is the individual layer multipoint mode conducting film shown in Fig. 4;
Fig. 6 (a) is to the structural representation of the different embodiment of Fig. 6 (d) grid that is the individual layer multipoint mode conducting film shown in Fig. 4;
The profile of the individual layer multipoint mode conducting film that Fig. 7 is another execution mode;
Fig. 8 is the individual layer multipoint mode conducting film profile in another embodiment in Fig. 1;
Fig. 9 is the individual layer multipoint mode conducting film profile in another embodiment in Fig. 1;
Figure 10 is the individual layer multipoint mode conducting film profile in another embodiment in Fig. 1;
Figure 11 is the individual layer multipoint mode conducting film profile in another embodiment in Fig. 1.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Provided better embodiment of the present invention in accompanying drawing.But the present invention can realize in many different forms, is not limited to execution mode described herein.On the contrary, providing the purpose of these execution modes is make disclosure of the present invention is understood more comprehensively thorough.
It should be noted that, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement just for illustrative purposes, do not mean it is unique execution mode.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present invention with scientific terminology.The term used in specification of the present invention herein, just in order to describe the purpose of concrete execution mode, is not intended to be restriction the present invention.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Refer to Fig. 1, the individual layer multipoint mode touch screen 10 in preferred embodiment of the present invention comprises demonstration module 100, individual layer multipoint mode conducting film 200 and the overlay 300 stacked gradually.
Refer to Fig. 2 and Fig. 3, transparent substrates 210 comprises body 212 and the flexible connection section 214 extended to form by a side of body 212.Body 212 is provided with induction zone 212a and is positioned at the rim area 212b at induction zone 212a edge.The width of flexible connection section 214 is less than the width that body 212 is extended with a side of flexible connection section 214, and flexible connection section 214 is provided with the conducting circuit.Flexible connection section 214 is at least one, and forms integral structure with transparent substrates 210.Flexible connection section 214 is for being connected with outer relay part.Flexible connection section 214 can adopt the mode of direct laminating to be connected with outer relay part, and in addition, flexible connection section 214 also can for male end or female end be direct and outer relay part carries out socket connection.
Refer to Fig. 4, individual layer multipoint mode conducting film 200 comprises transparent substrates 210, hypothallus 220, the first conductive layer 230, insulating barrier 240 and the second conductive layer 250.
Be filled with electric conducting material in grid groove 221 to form cross one another the first conductive thread, cross one another the first conductive thread forms the first conductive layer 230.Electric conducting material is silver, copper, conducting polymer or ITO.Preferably, the first conductive layer 230 and grid groove 221 form by the mode of impression.
Further, grid groove 221 is rough surface for bottom, and grid groove 221 is " V " font, " W " font, arc or corrugated micro-groove for bottom.Refer to Fig. 5 (a) to Fig. 5 (d), the micro-groove that grid groove 221 shown in Fig. 5 (a) is " V " font for bottom, the micro-groove that grid groove 221 shown in Fig. 5 (b) is " W " font for bottom, the micro-groove that grid groove 221 shown in Fig. 5 (c) is arc for bottom, the grid groove 221 shown in Fig. 5 (d) is corrugated micro-groove for bottom.Preferably, the degree of depth of micro-groove is 500nm～1 μ m.
Preferably, the width of grid groove 221 is d1, and the degree of depth is h, wherein, and 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1>1.
Please again consult Fig. 4, insulating barrier 240 is formed at the surface of the first conductive layer 230, and is embedded in grid groove 221.Insulating barrier 240, for the first conductive layer 230 and the second conductive layer 250 are separated, makes not conducting mutually between the first conductive layer 230 and the second conductive layer 250.The material of insulating barrier 240 is some insulating material such as dielectric ink or insulating cement.It is before liquid because of electric conducting material, filling, when the electric conducting material by liquid is filled in grid groove 221, grid groove 221 is rough surface for bottom, and grid groove 221 is " V " font for bottom, " W " font, arc or corrugated micro-groove, be conducive to decompose the tension force of liquid electric conducting material when contacting with grid groove 221 bottoms, to avoid overtension, make liquid electric conducting material shrink to be the structure of some spherical or almost sphericals, minimizing electric conducting material after sintering be some apart from one another by the probability of spherical or almost spherical, the connectedness of electric conducting material inside after the raising sintering, guarantee the electric conductivity of nesa coating.
The second conductive layer 250 is formed at the induction zone 212a of hypothallus 220.The second conductive layer 250 is convexly set in the side surface of hypothallus 220 away from transparent substrates 210, and separates by insulating barrier 240 and the first conductive layer 230.The second conductive layer 250 comprises cross one another the second conductive thread.The second conductive layer 250 completes by modes such as exposure imaging, silk screen printings.The second conductive layer 250 materials are silver, copper, conducting polymer or ITO.
Further, the first conductive layer 230 and the second conductive layer 250 are comb teeth-shaped or latticed.Refer to Fig. 6 (a) to Fig. 6 (d), the grid of the first conductive layer 230 and the second conductive layer 250 is regular grid or random grid.Grid as shown in Figure 6 (a) is random grid, and Fig. 6 (b) is respectively regular hexagonal cell, network and square net to the grid shown in Fig. 6 (d).
In the execution mode shown in Fig. 4, the first conductive layer 230 and the second conductive layer 250 form by the conduction band of a plurality of array arrangements.The conduction band of the first conductive layer 230 extends along the direction of the first dimension, and the conduction band of the second conductive layer 250 extends along the direction of the second dimension, the first dimension direction and the second dimension direction oblique.Certainly, in other execution mode, the first dimension direction is mutually vertical with the second dimension direction.Please consult Fig. 7, in illustrated execution mode, the conduction band of the first conductive layer 230 extends along the direction of the first dimension simultaneously, and the conduction band of the second conductive layer 250 extends along the direction of the second dimension, and the first dimension direction is mutually vertical with the second dimension direction.
Further, refer to Fig. 8, individual layer multipoint mode conducting film 200 also comprises the first lead-in wire electrode 260 and the second lead-in wire electrode 270 of being located at rim area 212b.The first lead-in wire electrode 260 is electrically connected to the first conductive layer 230, and the second lead-in wire electrode 270 is electrically connected to the second conductive layer 250.The conducting link tester is crossed the first lead-in wire electrode 260 and is electrically connected to the first conductive layer 230.The conducting link tester is crossed the second lead-in wire electrode 270 and is electrically connected to the second conductive layer 250.Concrete, the first lead-in wire electrode 260 is contained in the first groove 223 of the rim area 212b that is opened in hypothallus 220, and the second lead-in wire electrode 270 is contained in the second groove 225 of the rim area 212b that is opened in hypothallus 220.Be appreciated that in other embodiments, the first lead-in wire electrode 260 and the second lead-in wire electrode 270 also can directly be convexly set in the surface of rim area 212b.The first lead-in wire electrode 260 and the second lead-in wire electrode 270 can form by modes such as silk screen printing, impression or inkjet printings.
Specifically in the present embodiment, the first lead-in wire electrode 260 comprises cross one another the first conductive lead wire, and the second lead-in wire electrode 270 comprises cross one another the second conductive lead wire, and the first lead-in wire electrode 260 and the second lead-in wire electrode 270 are network.The structure and parameters of the first groove 223 and the second groove 225 is all identical with the structure and parameters of grid groove 221.Certainly, in other embodiment, the first lead-in wire electrode 260 and the second lead-in wire electrode 270 can also be linear, and the live width of the first lead-in wire electrode 260 and the second lead-in wire electrode 270 is 50 μ m～200 μ m, is highly 5 μ m～10 μ m.
Preferably, the material of the first lead-in wire electrode 260 and the second lead-in wire electrode 270 is silver, copper, conducting polymer or ITO.
Refer to Fig. 9, further, individual layer multipoint mode conducting film 200 also comprises the protective clear layer 280 that is covered in the second conductive layer 250 surfaces.Protective clear layer 280 covering the second conductive layers 250 and hypothallus 220 are away from the surface of transparent substrates 210.Because the second conductive layer 250 is convexly set in the surface of hypothallus 220, therefore, form protective clear layer 280 on the surface of the second conductive layer 250 so that the second conductive layer 250 is formed to protection, avoid scratching.Preferably, the material of protective clear layer 280 is UV glue, impression glue or Merlon.Finally, the transmitance of whole individual layer multipoint mode conducting film 200 is not less than 86%.Please consult Figure 10 and Figure 11, in other embodiment, hypothallus 220 can omit simultaneously, and transparent substrates 210 comprises induction zone 212a and the rim area 212b adjacent with induction zone 212a.Now grid groove 221 is opened in the induction zone 212a of transparent substrates 210, and the first groove 223 and the second groove 225 are opened in the rim area 212b of transparent substrates 210, and the second conductive layer 250 is located at the induction zone 212a of transparent substrates 210.
Compared to traditional individual layer multipoint mode conducting film, above-mentioned individual layer multipoint mode conducting film 200 at least has the following advantages:
(1) flexible connection section 214 forms integral structure with transparent substrates 210, individual layer multipoint mode conducting film 200 is electrically connected to outside by flexible connection section 214, save flexible PCB and the technique relevant to flexible PCB, made the cost of individual layer multipoint mode conducting film 200 lower.Simultaneously, above-mentioned individual layer multipoint mode conducting film 200 is formed with grid groove 221 on hypothallus 220, interior filling the first conductive thread of grid groove 221 forms the first conductive layer 230, therefore, replace conventional I TO process structure with the embedded grider structure, save follow-up etch process, saved a large amount of noble metals, further reduced cost.
(2) by forming the first conductive layer 230 and the second conductive layer 250, the first conductive layers 230 and the second conductive layer 250, by insulating barrier 240, separate, the inductive effects of two conductive layers is better.
(3) by form grid groove 221 on hypothallus 220, interior filling the first conductive thread of grid groove 221 forms the first conductive layer 230, thereby can reduce the thickness of individual layer multipoint mode conducting film 100; Adopt this flush type design simultaneously, the performance of individual layer multipoint mode conducting film 100 is well protected.
(4) form protective clear layer 280 by the surface at the second conductive layer 250, can protect the second conductive layer 250 to avoid being scratched, can prevent the electric conducting material oxidation simultaneously.
(5) grid groove 221 is " V " font, " W " font, arc or corrugated micro-groove for bottom, conductive ink in the groove of grid groove 221 is when drying like this, and the electric conducting material after the conductive ink polycondensation is not easy to occur drying not there will be the phenomenon of disconnection.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (17)
1. an individual layer multipoint mode conducting film, is characterized in that, comprising:
Transparent substrates, at least one flexible connection section that comprises body and extended to form by a side of described body, the width of described flexible connection section is less than the width that described body is extended with a side of described flexible connection section, described flexible connection section is provided with the conducting circuit, and described body is provided with induction zone and is positioned at the rim area at described induction zone edge;
The first conductive layer, be latticed, is arranged at described induction zone, and described the first conductive layer comprises cross one another the first conductive thread, and described induction zone offers the grid groove, and described the first conductive layer is contained in described grid groove;
Insulating barrier, be arranged in the first conductive thread top and be embedded at described grid groove;
The second conductive layer, be latticed, is arranged at the induction zone of described transparent substrates, and separate by described insulating barrier with described the first conductive layer, and described the second conductive layer comprises cross one another the second conductive thread;
The first lead-in wire electrode, be arranged at described rim area, and described the first lead-in wire electrode is electrically connected to described the first conductive layer, and described conducting link tester is crossed described the first lead-in wire electrode and is electrically connected to described the first conductive layer; And
The second lead-in wire electrode, be arranged at described rim area, and described the second lead-in wire electrode is electrically connected to described the second conductive layer, and described conducting link tester is crossed described the second lead-in wire electrode and is electrically connected to described the second conductive layer.
2. individual layer multipoint mode conducting film as claimed in claim 1, it is characterized in that, also comprise hypothallus, described hypothallus is located at described transparent substrates surface, described induction zone and described rim area are located at the side of described hypothallus away from transparent substrates, and described the first conductive layer and described the second conductive layer all are arranged at the induction zone of described hypothallus.
3. individual layer multipoint mode conducting film as claimed in claim 1, is characterized in that, described the first lead-in wire electrode and described the second lead-in wire electrode are linear.
4. individual layer multipoint mode conducting film as claimed in claim 1, is characterized in that, the material of described insulating barrier is dielectric ink or insulating cement.
5. individual layer multipoint mode conducting film as claimed in claim 3, is characterized in that, described the first lead-in wire electrode comprises cross one another the first conductive lead wire, and described the second lead-in wire electrode comprises cross one another the second conductive lead wire.
6. individual layer multipoint mode conducting film as claimed in claim 1, is characterized in that, described the first lead-in wire electrode is positioned at the surface of described rim area, or offers the first groove on described rim area, and described the first lead-in wire is contained in and is opened in described the first groove.
7. individual layer multipoint mode conducting film as claimed in claim 6, is characterized in that, described the second lead-in wire electrode is positioned at the surface of described rim area, or offers the second groove on described rim area, and described the second lead-in wire is contained in and is opened in described the second groove.
8. individual layer multipoint mode conducting film as claimed in claim 1, is characterized in that, the grid of described the first conductive layer and described the second conductive layer is regular grid or random grid.
9. individual layer multipoint mode conducting film as claimed in claim 1, is characterized in that, the width of described grid groove is d1, and the degree of depth is h, wherein, and 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1>1.
10. individual layer multipoint mode conducting film as claimed in claim 1, is characterized in that, described grid groove is that bottom is " V " font, " W " font, arc or corrugated micro-groove.
11. individual layer multipoint mode conducting film as claimed in claim 10, is characterized in that, the degree of depth of described micro-groove is 500nm～1 μ m.
12. individual layer multipoint mode conducting film as claimed in claim 1 is characterized in that the material of described transparent substrates is thermoplastic or PET.
13. individual layer multipoint mode conducting film as claimed in claim 2, is characterized in that, the material of described hypothallus is UV glue, impression glue or Merlon.
14. individual layer multipoint mode conducting film as claimed in claim 1 is characterized in that the material of described the first conductive thread and described the second conductive thread is silver, copper, conducting polymer or ITO.
15. individual layer multipoint mode conducting film as claimed in claim 1, is characterized in that, also comprises the protective clear layer that covers described the second conductive layer surface.
16. individual layer multipoint mode conducting film as claimed in claim 15, is characterized in that, the material of described protective clear layer is UV glue, impression glue or Merlon.
17. an individual layer multipoint mode touch screen comprises overlay, individual layer multipoint mode conducting film and shows module that it is characterized in that, described individual layer multipoint mode conducting film is individual layer multipoint mode conducting film as described as claim 1～16 any one.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000231011A (en) * | 1999-02-09 | 2000-08-22 | Sharp Corp | Optical device and stamper used for its production |
| CN201765581U (en) * | 2009-09-21 | 2011-03-16 | 株式会社和冠 | Position detection device |
| CN102782624A (en) * | 2010-03-03 | 2012-11-14 | 未来奈米科技股份有限公司 | Capacitive touch panel and manufacturing method for same |
| CN102903423A (en) * | 2012-10-25 | 2013-01-30 | 南昌欧菲光科技有限公司 | Conduction structure in transparent conduction film, transparent conduction film and manufacture method thereof |
| CN103187119A (en) * | 2013-02-06 | 2013-07-03 | 南昌欧菲光科技有限公司 | Conductive film, preparation method for conductive film and touch screen comprising conductive film |
| CN203386170U (en) * | 2013-07-30 | 2014-01-08 | 南昌欧菲光科技有限公司 | Single-layer multi-point type touch screen and single-layer multi-point type touch conducting film thereof |
-
2013
- 2013-07-30 CN CN2013103251685A patent/CN103426503A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000231011A (en) * | 1999-02-09 | 2000-08-22 | Sharp Corp | Optical device and stamper used for its production |
| CN201765581U (en) * | 2009-09-21 | 2011-03-16 | 株式会社和冠 | Position detection device |
| CN102782624A (en) * | 2010-03-03 | 2012-11-14 | 未来奈米科技股份有限公司 | Capacitive touch panel and manufacturing method for same |
| CN102903423A (en) * | 2012-10-25 | 2013-01-30 | 南昌欧菲光科技有限公司 | Conduction structure in transparent conduction film, transparent conduction film and manufacture method thereof |
| CN103187119A (en) * | 2013-02-06 | 2013-07-03 | 南昌欧菲光科技有限公司 | Conductive film, preparation method for conductive film and touch screen comprising conductive film |
| CN203386170U (en) * | 2013-07-30 | 2014-01-08 | 南昌欧菲光科技有限公司 | Single-layer multi-point type touch screen and single-layer multi-point type touch conducting film thereof |
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Application publication date: 20131204 |