CN104347155A - Transparent conducting film - Google Patents
Transparent conducting film Download PDFInfo
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- CN104347155A CN104347155A CN201310328733.3A CN201310328733A CN104347155A CN 104347155 A CN104347155 A CN 104347155A CN 201310328733 A CN201310328733 A CN 201310328733A CN 104347155 A CN104347155 A CN 104347155A
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Abstract
The invention provides a transparent conducting film, which comprises a substrate, a first conducting layer and a first lead electrode, wherein an inducing area and a lead area which is positioned on the edge of the inducing area are arranged on one surface of the substrate; the first conducting layer comprises grid-shaped first conducting patterns, the first conducting patterns are configured at the inducing area and the lead area and are mutually connected, and the first conducting patterns are formed by conducting wires; the first lead electrode is configured at the lead area, and the first lead electrode is electrically connected with the first conducting layer; the width of the conducting wires of the first conducting patterns which are positioned at the inducing area is smaller than that of the conducting wires of the first conducting patterns which are positioned at the lead area. According to the transparent conducting film provided by the invention, the width of the grid lines at the inducing area, i.e. a visual area is smaller than that of the grid lines at the lead area, i.e. a non-visual area; thus, when the first lead electrode is connected with the grid lines of the non-visual area, the conducting performance is greatly enhanced.
Description
Technical field
The present invention relates to touch screen technology, particularly relate to a kind of nesa coating.
Background technology
Nesa coating is a kind of film having good conductivity and have higher light transmittance at visible light wave range, current nesa coating is widely used in the fields such as flat panel display, photovoltaic device, contact panel and electromagnetic shielding, has the extremely wide market space.
Nesa coating is the sensing element receiving the input signals such as touch in touch-screen, at present, indium tin oxide layer (hereinafter referred to as ITO layer) is vital part in nesa coating, although the develop rapidly that the manufacturing technology of touch-screen is at a tremendous pace, but for projecting type capacitor screen, there is not too large change in the basic manufacturing process of ITO layer, always inevitably needs ITO plated film, ITO pattern in recent years.
Indium is a kind of metal material of costliness, therefore using ITO as the material of conductive layer, the cost of upper touch-screen is promoted to a great extent, moreover, ITO conductive layer is in patterning process, whole the ito film of having plated need be etched, to form ITO pattern, in this process, a large amount of ITO is etched, cause a large amount of noble metal wastes, and cause environmental pollution, ITO material and corresponding technique make touch-screen cost remain high.
In addition, the lead-in wire electrode of conducting film and the electric conductivity of conductive layer junction are not fine, there will be conductivity weak situation.
Summary of the invention
The invention provides a kind of nesa coating, for overcoming defect of the prior art, the electric conductivity strengthening conducting film lead-in wire electrode and conductive layer junction also reduces the cost of touch-screen greatly.
A kind of nesa coating provided by the invention, described nesa coating comprises:
Substrate, described substrate one side is provided with induction zone and is positioned at the lead district at edge, described induction zone;
First conductive layer, comprises in latticed first conductive pattern, and described first conductive pattern is configured at described induction zone and lead district and is connected to each other, and described first conductive pattern is made up of conductor wire;
First lead-in wire electrode, is configured at described lead district, and described first lead-in wire electrode is electrically connected with described first conductive layer;
Wherein, the conductor wire width being positioned at described first conductive pattern of described induction zone is less than the conductor wire width of described first conductive pattern being positioned at described lead district.
Particularly, described induction zone is all configured with described first conductive pattern, described lead district partial configuration has described first conductive pattern, and the first conductive pattern being positioned at described lead district is extended to form by the lead district of the first conductive pattern being positioned at described induction zone to its periphery.
Further, the edge being positioned at the first conductive pattern of described lead district is for maximum with described first the go between conductor wire width of Electrode connection.
Wherein, also comprise the second conductive layer and the second lead-in wire electrode being positioned in described substrate or be positioned on described first conductive layer, described second conductive layer comprises in latticed second conductive pattern, and described second conductive pattern is made up of described conductor wire; Described second lead-in wire electrode is electrically connected with described second conductive layer.
Further, described second conductive layer and the second lead-in wire electrode are all located at the another side of described substrate, and described second conductive layer is positioned at the relative projected area of described induction zone and extends to the projected area being positioned at described lead district; Described second lead-in wire electrode is positioned at the relative projected area of described lead district and is electrically connected with the second conductive pattern of the projected area being positioned at described lead district; The conductor wire width being positioned at described second conductive pattern of the projected area of described induction zone is less than the conductor wire width of described second conductive pattern of the projected area being positioned at described lead district.
Further, described second conductive layer is located on described first conductive layer, and is provided with insulating barrier between described first conductive layer and described second conductive layer, and the projection of described second conductive layer is positioned at described induction zone and extends to described lead district; Described second lead-in wire electrode is configured on described insulating barrier, and the projection of described second lead-in wire electrode is positioned at described lead district and is electrically connected with the second conductive pattern being positioned at described lead district that projects; The conductor wire width that projection is positioned at described second conductive pattern of described induction zone is less than the conductor wire width that projection is positioned at described second conductive pattern of described lead district.
Particularly, described substrate is provided with latticed groove, and the conductor wire of described first conductive pattern is all embedded in described latticed groove.
Further, have the first hypothallus between described first conductive layer and described substrate, described latticed groove is located on described first hypothallus, and described first conductive pattern is embedded in described latticed groove.
Wherein, between described first conductive layer and described substrate, there is the first hypothallus, between described second conductive layer and described substrate, there is the second hypothallus, described first hypothallus and the second hypothallus are equipped with latticed groove, described first conductive pattern is embedded in the described latticed groove that is opened on the first hypothallus, and described second conductive pattern is embedded in the described latticed groove that is opened on the second hypothallus.
Wherein, between described first conductive layer and described substrate, there is the first hypothallus, insulating barrier between described first conductive layer and described second conductive layer forms the second hypothallus, described first hypothallus and the second hypothallus are equipped with latticed groove, described first conductive pattern is embedded in the described latticed groove that is opened on the first hypothallus, and described second conductive pattern is embedded in the described latticed groove that is opened on the second hypothallus.
Nesa coating provided by the invention, the grid line live width of induction zone and visible range is less than lead district and non-visible range grid line live width, when such first lead-in wire electrode is connected with the grid line of non-visible range, greatly strengthen electric conductivity.
Accompanying drawing explanation
The front schematic view of substrate in the nesa coating that Fig. 1 provides for the embodiment of the present invention one;
The vertical view of the nesa coating that Fig. 2 provides for the embodiment of the present invention one;
The cutaway view of the nesa coating that Fig. 3 provides for the embodiment of the present invention one;
The partial sectional view of the sub pattern of the nesa coating that Fig. 4 provides for the embodiment of the present invention two;
The upward view of the nesa coating that Fig. 5 provides for the embodiment of the present invention two;
The partial sectional view of the sub pattern of the nesa coating that Fig. 6 provides for the embodiment of the present invention three;
The vertical view of the nesa coating that Fig. 7 provides for the embodiment of the present invention three;
The cutaway view of the nesa coating that Fig. 8 provides for the embodiment of the present invention four;
The partial sectional view of the sub pattern of the nesa coating that Fig. 9 provides for the embodiment of the present invention five;
The partial sectional view of the sub pattern of the nesa coating that Figure 10 provides for the embodiment of the present invention six;
The cutaway view of the nesa coating that Figure 11 provides for the embodiment of the present invention seven;
The partial sectional view of the sub pattern of the nesa coating that Figure 12 provides for the embodiment of the present invention eight;
The cutaway view of the nesa coating that Figure 13 provides for the embodiment of the present invention nine;
Square net schematic diagram in the nesa coating that Figure 14 provides for the embodiment of the present invention;
Regular hexagonal cell schematic diagram in the nesa coating that Figure 15 provides for the embodiment of the present invention;
Network schematic diagram in the nesa coating that Figure 16 provides for the embodiment of the present invention;
Random polygonal mesh schematic diagram in the nesa coating that Figure 17 provides for the embodiment of the present invention.
Embodiment
Embodiment one
As Figure 1-3, the embodiment of the present invention provides a kind of nesa coating, and nesa coating comprises substrate 1, first conductive layer 1a, the first lead-in wire electrode 1b;
Substrate 1 one side is provided with induction zone 11 and is positioned at the lead district 12 at edge, induction zone 11;
First conductive layer 1a, comprises in latticed first conductive pattern, and the first conductive pattern is configured at induction zone 11 and lead district 12 and is connected to each other, and the first conductive pattern is made up of conductor wire;
First lead-in wire electrode 1b, is configured at lead district 12, and the first lead-in wire electrode 1b is electrically connected 1a with the first conductive layer;
Wherein, the conductor wire width being positioned at the first conductive pattern 11a of induction zone is less than the conductor wire width of the first conductive pattern 12a being positioned at lead district.
Nesa coating provided by the invention, the grid line live width of induction zone and visible range is less than lead district and non-visible range grid line live width, when such first lead-in wire electrode is connected with the grid line of non-visible range, the resistance of the wire of junction will reduce, thus greatly strengthen electric conductivity, above-mentioned grid line is exactly conductor wire.First conductive pattern is arranged by multiple sub pattern and forms, and sub pattern is latticed and is continuous print, and the concrete shape of sub pattern is not limit at this, rectangular in the present embodiment, and each sub pattern and one first Electrode connection that goes between, form an electrode.
As the preferred implementation of above-described embodiment, as shown in Figure 1 and Figure 2, induction zone 11 is all configured with the first conductive pattern, lead district 12 partial configuration has the first conductive pattern, and the first conductive pattern 12a being positioned at lead district is extended to form to the lead district of its periphery by the first conductive pattern 11a being positioned at induction zone.There is not blind spot in this arrangement induction zone, ensure that and the stronger conductivity of the first conductive pattern between induction zone and lead district.
As the preferred implementation of above-described embodiment, for increasing the conductivity between lead-in wire electrode and conductive layer further, the edge 13a being positioned at the first conductive pattern 12a of lead district is for maximum with the first conductor wire width that electrode 1b is connected that goes between.Because this edge 13a directly goes between with first, electrode 1b is connected, because this increasing the live width of this place's conductor wire, because the resistance of wire and the cross-sectional area of conductor wire are inverse ratio, be equivalent to the resistance reducing junction, enhance the conductivity between lead-in wire electrode and conductive layer.
On the basis of above-described embodiment, see Fig. 4-7, for the sensitivity of the electric conductivity and touch-screen that increase conducting film further, nesa coating also comprises the second conductive layer 2a and the second lead-in wire electrode 2b being positioned in substrate 1 or be positioned on the first conductive layer 1a, second conductive layer 2a comprises in latticed second conductive pattern, and the second conductive pattern is made up of above-mentioned conductor wire; Second lead-in wire electrode 2b is electrically connected with the second conductive layer 2a.Specifically there are following two kinds of embodiments:
Embodiment two
A kind of execution mode is as follows, conducting film is single-layer double-side structure, see Fig. 4, Fig. 5, the another side that second conductive layer 2a and second lead-in wire electrode 2b is all located at substrate 1 namely with induction zone and the opposing one side of lead district are set, the second conductive layer 2a is positioned at the relative projected area of induction zone and extends to the projected area being positioned at lead district; Second lead-in wire electrode 2b is positioned at the relative projected area of lead district and is electrically connected with the second conductive pattern 22a of the projected area being positioned at lead district; The conductor wire width being positioned at the second conductive pattern 21a of the projected area of induction zone is less than the conductor wire width of the second conductive pattern 22a of the projected area being positioned at lead district.Increase the second conductive layer and the second conductivity gone between electrode.The same, for increasing the second conductive layer and the second conductivity gone between electrode further, the conductor wire width that the electrode 2b that the edge 23a of the second conductive pattern 22a being positioned at the projected area of lead district can be used for going between with second is connected is arranged to maximum.
Embodiment three
Another kind of execution mode is as follows, conducting film is single-surface double-layer structure, and see Fig. 6, Fig. 7, the second conductive layer 2a is located on the first conductive layer 1a, and be provided with insulating barrier 30 between the first conductive layer 1a and the second conductive layer 2a, and the projection of the second conductive layer 2a is positioned at induction zone and extends to lead district; Second lead-in wire electrode 2b is configured on insulating barrier 30, and the projection of the second lead-in wire electrode 2b is positioned at lead district and is electrically connected with the second conductive pattern 22a ' being positioned at lead district that projects; The conductor wire width that projection is positioned at the second conductive pattern 21a ' of induction zone is less than the conductor wire width that projection is positioned at the second conductive pattern 22a ' of lead district.Increase the second conductive layer and the second conductivity gone between electrode.The same, for increasing the second conductive layer and the second conductivity gone between electrode further, the edge 23a ' that projection can be positioned at the second conductive pattern 22a ' of lead district is for being arranged to maximum with the second conductor wire width that electrode 2b is connected that goes between.
In embodiment one and embodiment two, be provided with latticed groove all on the base 1, the conductor wire of the first conductive pattern or the second conductive pattern is all embedded in above-mentioned latticed groove.Protection conductor wire is not frayed.
Latticed groove is specifically compressing by mould, and electric conducting material is heated in liquid pouring to latticed groove can form conductive pattern.The electric conducting material forming the first conductive layer and the second conductive layer can be the electric conducting materials such as silver, copper, conducting polymer, ITO.First lead-in wire electrode or the second lead-in wire electrode can fill formation, namely with the formation structure of above-mentioned conductive layer by above-mentioned electric conducting material in the latticed groove set in advance.
Embodiment four
As shown in Figure 8, have the first hypothallus 10 between the first conductive layer 1a and substrate 1, latticed groove is located on the first hypothallus 10, and the first conductive pattern is embedded in above-mentioned latticed groove.
Embodiment five
As shown in Figure 9, there is between first conductive layer 1a and substrate 1 first hypothallus 10, there is between second conductive layer 2a and substrate 1 second hypothallus 20, first hypothallus 10 and the second hypothallus 20 are equipped with latticed groove, and the first conductive pattern and the second conductive pattern are embedded in latticed groove respectively.First conductive pattern is embedded in the described latticed groove that is opened on the first hypothallus, and the second conductive pattern is embedded in the described latticed groove that is opened on the second hypothallus.
Embodiment six
As shown in Figure 10, there is between first conductive layer 1a and substrate 1 first hypothallus 10, insulating barrier between the first conductive layer 1a and the second conductive layer 2a forms the second hypothallus 20, first hypothallus 10 and the second hypothallus 20 are equipped with latticed groove, and the first conductive pattern and the second conductive pattern are embedded in described latticed groove respectively.First conductive pattern is embedded in the described latticed groove that is opened on the first hypothallus, and the second conductive pattern is embedded in the described latticed groove that is opened on the second hypothallus.
Embodiment seven, eight, nine
Above-mentioned first conductive layer 1a, the second conductive layer 2a and lead-in wire electrode also can adopt following exposure technology to be formed and form bulge-structure on the base 1, as figs 11-13, first photosensitive electric conducting material is coated with in lead areas, shadow shield is placed with above, then light irradiates it, it is exposed, then etches, form the lead-in wire electrode of bulge-structure.Substrate 1 can select the material such as PET or glass, and light transmittance is good, easy-formation.Lead-in wire electrode can also pass through silk screen printing, etching, impression or inkjet printing and be formed.
First conductive layer or the second conductive layer surface also comprise protective clear layer, and described protective clear layer is UV glue, impression glue or Merlon.First hypothallus 10 and 20 cementations of the second hypothallus, for increasing the adhesion of electric conducting material and substrate.
The grid of the grid and the second conductive pattern that form the first conductive pattern can be the random polygonal mesh shown in the network shown in the regular hexagonal cell shown in the square mesh shown in Figure 14, Figure 15, Figure 16 or Figure 17, several network is given in upper figure, certainly can also be other regular polygons, also can be the lattices such as rectangle, parallelogram, random polygon.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a nesa coating, is characterized in that, described nesa coating comprises:
Substrate, described substrate one side is provided with induction zone and is positioned at the lead district at edge, described induction zone;
First conductive layer, comprises in latticed first conductive pattern, and described first conductive pattern is configured at described induction zone and lead district and is connected to each other, and described first conductive pattern is made up of conductor wire;
First lead-in wire electrode, is configured at described lead district, and described first lead-in wire electrode is electrically connected with described first conductive layer;
Wherein, the conductor wire width being positioned at described first conductive pattern of described induction zone is less than the conductor wire width of described first conductive pattern being positioned at described lead district.
2. nesa coating according to claim 1, it is characterized in that, described induction zone is all configured with described first conductive pattern, described lead district partial configuration has described first conductive pattern, and the first conductive pattern being positioned at described lead district is extended to form by the lead district of the first conductive pattern being positioned at described induction zone to its periphery.
3. nesa coating according to claim 2, is characterized in that, the edge being positioned at the first conductive pattern of described lead district is for maximum with described first the go between conductor wire width of Electrode connection.
4. according to the arbitrary described nesa coating of claim 1-3, it is characterized in that, also comprise the second conductive layer and the second lead-in wire electrode being positioned in described substrate or be positioned on described first conductive layer, described second conductive layer comprises in latticed second conductive pattern, and described second conductive pattern is made up of described conductor wire; Described second lead-in wire electrode is electrically connected with described second conductive layer.
5. nesa coating according to claim 4, it is characterized in that, described second conductive layer and the second lead-in wire electrode are all located at the another side of described substrate, and described second conductive layer is positioned at the relative projected area of described induction zone and extends to the projected area being positioned at described lead district; Described second lead-in wire electrode is positioned at the relative projected area of described lead district and is electrically connected with the second conductive pattern of the projected area being positioned at described lead district; The conductor wire width being positioned at described second conductive pattern of the projected area of described induction zone is less than the conductor wire width of described second conductive pattern of the projected area being positioned at described lead district.
6. nesa coating according to claim 4, it is characterized in that, described second conductive layer is located on described first conductive layer, and be provided with insulating barrier between described first conductive layer and described second conductive layer, and the projection of described second conductive layer is positioned at described induction zone and extends to described lead district; Described second lead-in wire electrode is configured on described insulating barrier, and the projection of described second lead-in wire electrode is positioned at described lead district and is electrically connected with the second conductive pattern being positioned at described lead district that projects; The conductor wire width that projection is positioned at described second conductive pattern of described induction zone is less than the conductor wire width that projection is positioned at described second conductive pattern of described lead district.
7., according to the arbitrary described nesa coating of claim 1-3, it is characterized in that, described substrate is provided with latticed groove, and the conductor wire of described first conductive pattern is all embedded in described latticed groove.
8. nesa coating according to claim 7, it is characterized in that, have the first hypothallus between described first conductive layer and described substrate, described latticed groove is located on described first hypothallus, and described first conductive pattern is embedded in described latticed groove.
9. nesa coating according to claim 5, it is characterized in that, between described first conductive layer and described substrate, there is the first hypothallus, between described second conductive layer and described substrate, there is the second hypothallus, described first hypothallus and the second hypothallus are equipped with latticed groove, described first conductive pattern is embedded in the described latticed groove that is opened on the first hypothallus, and described second conductive pattern is embedded in the described latticed groove that is opened on the second hypothallus.
10. nesa coating according to claim 6, it is characterized in that, between described first conductive layer and described substrate, there is the first hypothallus, insulating barrier between described first conductive layer and described second conductive layer forms the second hypothallus, described first hypothallus and the second hypothallus are equipped with latticed groove, described first conductive pattern is embedded in the described latticed groove that is opened on the first hypothallus, and described second conductive pattern is embedded in the described latticed groove that is opened on the second hypothallus.
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| CN201310328733.3A CN104347155A (en) | 2013-07-31 | 2013-07-31 | Transparent conducting film |
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| CN201310328733.3A CN104347155A (en) | 2013-07-31 | 2013-07-31 | Transparent conducting film |
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| CN109002206A (en) * | 2018-06-30 | 2018-12-14 | 云谷（固安）科技有限公司 | The preparation method of touch-control structure, display device and touch-control structure |
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| CN114334272A (en) * | 2021-12-04 | 2022-04-12 | 惠州易晖光电材料股份有限公司 | Grid transparent conductive film and preparation method thereof |
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Application publication date: 20150211 |