CN107369491A - A kind of conducting film and preparation method - Google Patents
A kind of conducting film and preparation method Download PDFInfo
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- CN107369491A CN107369491A CN201610316066.0A CN201610316066A CN107369491A CN 107369491 A CN107369491 A CN 107369491A CN 201610316066 A CN201610316066 A CN 201610316066A CN 107369491 A CN107369491 A CN 107369491A
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- groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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Abstract
The invention discloses a kind of conducting film and preparation method.The conducting film includes：Supporting body, the supporting body are provided with first surface.Conduction region, the first surface of the supporting body offer the first groove；Conductive material is filled in first groove and forms interconnected conductive grid, the interconnected conductive grid forms the conduction region；Lead district, the first surface of the supporting body offer the second groove, and filling conductive material in second groove forms contact conductor, and the contact conductor forms the lead district；The contact conductor is electrically connected with the conductive grid.First depth of groove is m and the first recess width is that the ratio between n, m, n is A, and second depth of groove is m and the second recess width is that the ratio between s, m, s is B；Wherein, B<A.Design intensive compared to traditional electrode lead areas metal wire and that depth-to-width ratio is larger, more easy mold release, substantially prolongs the mold use life-span, and conductive material density is bigger, and electric conductivity is more preferable.
Description
Technical field
The present invention relates to conductive technical field of membrane, more particularly to a kind of conducting film and preparation method.
Background technology
Nesa coating be it is a kind of both there is high electric conductivity, and have the excellent of good translucency to visible ray
The conducting film of performance, is with a wide range of applications.Liquid crystal display has been successfully applied in recent years, has been touched
Control panel, electromagnetic wave proof, the transparency electrode transparent surface heating element and luminescent device of solar cell
Deng in field.
Traditional touch-screen typically uses tin-doped indium oxide (Indium Tin Oxides, ITO) conductive layer.
When preparing ITO layer, plated film is always inevitably needed, graphically, electrode silver wire makes.And
Need to be etched ito film when ITO pattern, this traditional Making programme is complicated and tediously long, makes
The poorly conductive of conductive layer, so as to cause yields not high.And this Making programme will to technique, equipment
Ask higher, substantial amounts of ITO materials are also wasted in etching, and produce the largely Industry Waste containing heavy metal
Liquid.
The development of wire netting conduction membrane technology compensate for disadvantages described above.Wire netting conducting film lead electrode is typically adopted
With smaller latticed design, and the depth-to-width ratio of grid line groove is identical with visible area transparency electrode.Its
Production process includes, to be first coated with one layer of UV glue or impressing glue in thereon, mould then being fitted in into substrate
On, solidification, finally it is stripped.However, during mould and colloidal materials are stripped, glue is had on mould
The residual of material, mold use is influenceed, more production can be caused not to be normally carried out.
The content of the invention
Based on this, it is necessary to provide a kind of conducting film and preparation method to solve the problems, such as techniques discussed above.
The present invention a technical scheme be：
A kind of conducting film, including：
Supporting body, the supporting body are provided with first surface and the second surface being oppositely arranged with first surface；
Conduction region, the first surface of the supporting body offers the first groove, and first groove is formed mutually
The grid of connection；Conductive material is filled in first groove and forms interconnected conductive grid, the phase
Intercommunicated conductive grid forms the conduction region；
Lead district, the first surface of the supporting body offer the second groove, filled in second groove conductive
Material forms contact conductor, and the contact conductor forms the lead district；The contact conductor and the conduction
Grid is electrically connected with；
First depth of groove is m and the first recess width is that the ratio between n, m, n is A, second groove
Depth is m and the second recess width is that the ratio between s, m, s is B；Wherein, B<A.
In one of the embodiments, the conduction region includes some of some conductive grids formation insulated from each other
Conductive channel, each conductive channel corresponds to respectively is electrically connected with the contact conductor.
In one of the embodiments, color matching area, color matching area tool are provided between the adjacent conductive channel
There is first groove, and first groove type is into grid；Conductive material shape is filled in first groove
Into color matching area.
In one of the embodiments, the ratio between second depth of groove and the second recess width B are less than 0.8.
In one of the embodiments, second depth of groove is less than or equal to the ratio between the second recess width B
0.5。
In one of the embodiments, the conductive material average grain diameter filled in first groove is less than described the
The conductive material average grain diameter filled in two grooves.
In one of the embodiments, the supporting body is substrate and the hypothallus in the substrate, described
Conduction region and lead district are located at side of the hypothallus away from substrate；Or, the supporting body is polymer,
The conduction region and lead district are located at the first surface of the polymer.
In one of the embodiments, the second surface of the supporting body also is provided with conduction region and lead district, described
Conductive grid and the contact conductor are electrically connected with；Or, the supporting body first surface side is provided with insulating barrier,
Side of the insulating barrier away from first surface is provided with conduction region and lead district, the conductive grid and the electricity
Pole lead is electrically connected with.
In one of the embodiments, the hypothallus and polymer are thermosetting cement or optic-solidified adhesive.
In one of the embodiments, the filling conductive material is selected from metal, metal oxide or organic conductive
It is one or more of in material.
In one of the embodiments, the conductive material filled in second groove is more than including at least particle diameter
500nm conductive material and particle diameter is less than or equal to 500nm conductive material.
In one of the embodiments, the conductive material filled in second groove comprise at least particle diameter be more than etc.
It is less than or equal to 400nm conductive material in 800nm conductive material and particle diameter.
The present invention also discloses a kind of conductive membrane preparation method, comprises the following steps：
S1, the first groove and the second groove are opened up on supporting body surface, and first groove is formed mutually
The grid of connection；
S2, make that first depth of groove is m and the first recess width is that the ratio between n, m, n is A, described
Two depths of groove are m and the second recess width is that the ratio between s, m, s is B, wherein, B<A；
S3, conductive material is filled in first groove and the second groove, fill and lead in first groove
Electric material forms interconnected conductive grid, and the interconnected conductive grid forms conduction region；It is described
Conductive material is filled in second groove and forms contact conductor, the contact conductor forms lead district；The electrode
It is electrically connected between lead and the conductive grid.
In one of the embodiments, it is some conductive logical to be formed that some conductive grids are set on the conduction region
Road, and it is insulated from each other between the conductive channel, each described conductive channel one end is electrically connected with electrode
Lead.
In one of the embodiments, color matching region, the color matching area are provided between the adjacent conductive channel
With first groove, and first groove type is into grid；Conductive material is filled in first groove
Form color matching area.
In one of the embodiments, the conductive material filled in second groove is more than including at least particle diameter
500nm conductive materials and particle diameter are less than or equal to 500nm conductive material.
In one of the embodiments, filling conductive material method is first in first groove and the second groove
The conductive material that particle diameter is more than 500nm is filled, 500nm conductive material is then less than in filling particle diameter；Or,
The conductive material that particle diameter is less than 500nm is first filled, 500nm conductive material is then more than in filling particle diameter.
Beneficial effects of the present invention：
(1) technical scheme provided by the invention, conduction region use the first groove, and contact conductor is recessed using second
Groove, first depth of groove is m and the first recess width is that the ratio between n, m, n is A, second groove
Depth is m and the second recess width is that the ratio between s, m, s is B；Wherein, B<A；Compared to traditional electrode lead
The design that regional metal line is intensive and depth-to-width ratio is larger, more easy mold release, substantially prolongs the mold use life-span,
And conductive material density is bigger, electric conductivity is more preferable.
(2) technical scheme provided by the invention, the conductive material filled in second groove comprise at least grain
Footpath is more than 500nm conductive materials and particle diameter is less than or equal to 500nm conductive material, so contact conductor
The conductive material of two or more particle diameters is contained in region, so enhances the electric conductivity of contact conductor well, by
It is different in depth-to-width ratio, so second groove in contact conductor region can preferably accommodate the conductive material of big particle diameter.
Brief description of the drawings
Fig. 1 is a kind of conducting film cross section structure schematic diagram of the present invention.
Fig. 2 is a kind of conducting film planar structure schematic diagram of the present invention.
Fig. 3 is a kind of conductor film sections mplifying structure schematic diagram of the present invention.
Fig. 4 is a kind of another cross section structure schematic diagram of conducting film of the present invention.
Fig. 5 is a kind of another planar structure schematic diagram of conducting film of the present invention.
Fig. 6 is a kind of another mplifying structure schematic diagram of conducting film of the present invention.
Fig. 7 is a kind of conducting film another kind cross section structure schematic diagram of the present invention.
Fig. 8 is a kind of conducting film another kind cross section structure schematic diagram of the present invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.
The better embodiment of the present invention is given in accompanying drawing.But the present invention can pass through many different forms
To realize, however it is not limited to embodiment disclosed below.On the contrary, provide the purpose of these embodiments
It is the more thorough and comprehensive for making to understand the disclosure.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly another
On individual element or there may also be element placed in the middle.When an element is considered as " connection " another yuan
Part, it can be directly to another element or may be simultaneously present centering elements.It is used herein
Term " vertical ", " horizontal ", "left", "right" and similar statement simply to illustrate that mesh
, it is unique embodiment to be not offered as.
Unless otherwise defined, technology of all of technologies and scientific terms used here by the article with belonging to the present invention
The implication that the technical staff in field is generally understood that is identical.Art used in the description of the invention herein
Language is intended merely to describe the purpose of specific embodiment, it is not intended that in the limitation present invention.It is used herein
Term "and/or" include the arbitrary and all combinations of one or more related Listed Items.
A kind of conducting film, including：Supporting body, the supporting body are provided with first surface and relative with first surface
The second surface of setting；Conduction region, the first surface of the supporting body offer the first groove, and described
One groove forms interconnected grid；Conductive material is filled in first groove and forms interconnected lead
Power grid, the interconnected conductive grid form the conduction region；Lead district, the of the supporting body
One surface offers the second groove, and filling conductive material in second groove forms contact conductor, the electricity
Pole lead forms the lead district；The contact conductor is electrically connected with the conductive grid；Described first is recessed
Groove depth is m and the first recess width is that the ratio between n, m, n is A, and second depth of groove is m and second
Recess width is that the ratio between s, m, s is B；Wherein, B<A.The supporting body is for substrate and located at the substrate
Upper hypothallus or the supporting body are polymer, wherein, the hypothallus and polymer be thermosetting cement or
Optic-solidified adhesive, the conduction region and lead district are located at side or the conduction of the hypothallus away from substrate
Area and lead district are located at the first surface of the polymer.
In order to gather the signal of diverse location point, the conduction region is formed including some conductive grids insulated from each other
Some conductive channels, each conductive channel corresponds to respectively is electrically connected with contact conductor；Each is conductive
Passage all guides to the signal of the conductive channel on external equipment in the presence of an at least contact conductor, so makes
The change of electric signal can be all gathered well；Wherein, the contact conductor connected on each conductive channel is mutual
Independent.
In order to ensure the uniformity of the overall optical effect in conducting film surface, set between the adjacent conductive channel
There is a color matching area, the color matching area has the first groove, and first groove type is into grid；Described first is recessed
Conductive material is filled in groove and forms color matching area or filling non electrically conductive material, is matched colors between area and conductive channel
It is insulated from each other；Mesh parameter in the mesh parameter and conductive channel in area of matching colors can be the same or different,
Network can also be different, and it between connection or each grid is phase that can be between the grid in area of matching colors
Mutually disconnect；The insulation mode matched colors between region and conductive channel can be breakaway-element or the grid on border
Mutually stagger on summit.
In order to improve the performance of contact conductor, the ratio between second depth of groove and the second recess width B are less than etc.
In 0.8, further, the ratio between second depth of groove and the second recess width B are less than or equal to 0.5, more enter
One step, the ratio between second depth of groove and the second recess width B are less than 0.15, but second groove
The ratio between depth and the second recess width B are more than 0；Due to mainly using narrow frame at present, so contact conductor
Width is more narrow better on the premise of contact conductor performance is ensured.
Conductive layer will ensure electric conductivity and optical effect, the ratio between first depth of groove and the first recess width
A is more than or equal to 0.8.
Conducting film can also be double-deck structure, be more to use two layers of conducting film when as touch-screen,
So can more preferable position location, the second surface of the supporting body also is provided with conduction region and lead district, institute
The conductive grid and the contact conductor are electrically connected with；Or, the supporting body first surface side is provided with insulation
Layer, side of the insulating barrier away from first surface is provided with conduction region and lead district, the conductive grid and institute
State contact conductor electric connection.Second conductive coating structure can be that convex can also be groove structure.
Certain conducting film can also be one-layer multi-point structure.
Wherein, the first groove and the second groove fill conductive material and are selected from graphene, charcoal, metal, metal
One or more of in oxide or organic conductive material, metal can be gold, silver or copper etc., conducting metal
Oxide can be ITO etc., and organic conductive material can be PEDOT.Wherein, filled in first groove
Conductive material average grain diameter be less than the conductive material average grain diameter filled in second groove.For example, institute
State the conductive material filled in the second groove and comprise at least particle diameter is more than 500nm conductive materials and particle diameter is less than etc.
In 500nm conductive material；Further, the conductive material filled in second groove comprises at least grain
Conductive material of the footpath more than or equal to 800nm and particle diameter are less than or equal to 400nm conductive material；In first groove
The conductive material of big particle diameter may be contained, described big particle diameter conductive material is that particle diameter is more than 500nm, if
The conductive material particle diameter of filling is more greatly because the widths affect of the first groove may not be inserted in the first groove.
So from another angle, conducting film of the invention includes supporting body and is arranged at drawing on the supporting body
Line area.The supporting body is provided with first surface and the second surface being oppositely arranged with first surface, described to hold
The first surface of carrier offers the second groove.Conductive material is filled in second groove and is formed electrode and is drawn
Line, the contact conductor form the lead district, and the conductive material comprises at least two kinds and above difference grain
The conductive material of footpath size.
Present invention further teaches conductive membrane preparation method, comprise the following steps：
S1, the first groove and the second groove are opened up on supporting body surface, and first groove is formed mutually
The grid of connection；Supporting body can directly be heat cure or photo-curable polymer, directly be opened using mould
If the first groove and the second groove；Or the supporting body is that substrate surface is provided with hypothallus, the matrix
Layer has heat cure or photocuring characteristic, and the first groove is opened up in side of the hypothallus away from substrate using mould
And second groove；Wherein, " open up " can be impressing mode or laser direct-writing mode,
Either mode of photoetching etc.；
S2, make that first depth of groove is m and the first recess width is that the ratio between n, m, n is A, described
Two depths of groove are m and the second recess width is that the ratio between s, m, s is B, wherein, B<A.Described second is recessed
The ratio between groove depth and the second recess width B are less than or equal to 0.15, further, second depth of groove and the
The ratio between two recess widths B is less than or equal to 0.5, further, second depth of groove and the second recess width
The ratio between B be less than 0.8, but the ratio between second depth of groove and the second recess width B are more than 0；
S3, conductive material is filled in first groove and the second groove, fill and lead in first groove
Electric material forms interconnected conductive grid, and the interconnected conductive grid forms conduction region；It is described
Conductive material is filled in second groove and forms contact conductor；The contact conductor forms lead district, the electrode
Lead is electrically connected with the conductive grid.The conductive material filled in second groove comprises at least particle diameter
More than the conductive material that 500nm conductive materials and particle diameter are less than or equal to 500nm.
Wherein, some conductive grids are set on the conduction region to form some conductive channels, and the conduction
Insulated from each other between passage, each described conductive channel one end is electrically connected with contact conductor.Each is led
Electric channel all guides to the signal of the conductive channel on external equipment in the presence of an at least contact conductor, so makes
The change that can all gather electric signal well；Wherein, the contact conductor connected on each conductive channel is phase
It is mutually independent.
Wherein, color matching region is provided between the adjacent conductive channel, the color matching area has the first groove,
And first groove type is into grid；Conductive material is filled in first groove and forms color matching area.Color matching area
Mesh parameter and conductive channel in mesh parameter can be the same or different, network can not also
Together, matching colors between the grid in area can mutually be disconnected between connection or each grid；Color matching area
Insulation mode between domain and conductive channel can mutually stagger for the grid vertex on breakaway-element or border.
Wherein, filling conductive material method is more than for first filling particle diameter in first groove and the second groove
500nm conductive material, 500nm conductive material is then less than in filling particle diameter；Or, first filling particle diameter is small
In 500nm conductive material, then in conductive material of the filling particle diameter more than 500nm.
Hereinafter, diagram is refer to, specifically describes embodiments of the present invention.Referring to Fig. 1, it is a kind of conduction
The cross section structure of film, conducting film are substrate PET 11 successively from bottom to top, and thickness is 100 μm；Adhesion promoting layer 12,
Wherein tack coat can also not have to, merely just in order to increase caking property；Bearing bed is with groove structure
Esters of acrylic acid UV glue 13,3 μm of 14 depth of the second groove of lead district, 20 μm of width, 10 μm, 6
μm or 3.75 μm, 3 μm of 15 depth of the first groove of conduction region, 2.2 μm of width；Lead district ditch groove depth
Wide ratio is less than conduction region；What is filled in second groove 14, the first groove 15 is argent, the second groove 14
In metallic silver particles average diameter be 1um, the metallic silver particles average diameter in the first groove 15 is
500nm；Argent thickness is less than gash depth, about 2 μm, or argent thickness is equal to gash depth,
About 3 μm.
The plan that Fig. 2 is the present embodiment bearing bed is referred to, conduction region 21 and lead district are set on bearing bed
22.The pattern of conductive channel 210 can be arranged as required to need for multiple rows of, multiple row, the electrode of each pattern
Contact conductor 220 corresponding to connecting respectively, to realize electric signal transmission.Conductive channel 210 is by network
Form, 2.2 μm of grid lines line width, the grid lines length of side is preferably 260 μm, and acute angle is 60 °.Electrode
Lead 220 is made up of the single line that line width is 20 μm.Specifically can be from the lead district enlarged drawing shown in Fig. 3
Go out.The black lines of conductive channel 210 are formed by filling argent in the first groove 15, contact conductor 220
Black lines formed by filling argent in the second groove 14, white space is insulating regions, white space
For esters of acrylic acid UV glue 13.
Referring to Fig. 4, the cross-sectional view of another conducting film.Conducting film is substrate glass successively from bottom to top
Glass 41 (may also be referred to as supporting body), thickness 0.5mm；Bearing bed is the acrylate with groove structure
Class UV glue 42,3.5 μm of 43 depth of the second groove of lead district, 10 μm of width, the first of conduction region is recessed
3.5 μm of 44 depth of groove, 2.5 μm of width；The second groove of lead district depth-to-width ratio is less than conduction region.Second is recessed
What is filled in the groove 44 of groove 43 and first is metallic copper, the metallic silver particles average diameter in the second groove 43
For 800nm or 1 μm, the metallic copper particle average diameter in the first groove 44 is 400nm or 500nm；Gold
Belong to silver-colored thickness to be less than, more than or equal to gash depth.
Refer to the plan that Fig. 5 is the present embodiment conducting film.Wherein, bearing bed sets conduction region 51 and drawn
Line area 52.Conductive channel 510 is formed with contact conductor 520 by grid.The pattern of conductive channel 510 can
To be arranged as required to as multiple rows of, multiple row, the conductive channel of each pattern needs to connect corresponding electrode respectively
Lead 520, to realize electric signal transmission.Conductive channel 510 is made up of irregular polygon random grid, net
2.5 μm of ruling line width, net lattice control diameter is preferably 150um.Contact conductor 520 is by grid lines 10um's
Square mesh is formed, and the square mesh length of side is 20um.Specifically can be from the contact conductor region amplification shown in Fig. 6
Find out in figure.The black lines of conductive channel 510 are formed by filling metallic copper in the first groove 44, and electrode draws
The black lines of line 520 are formed by filling metallic copper in the second groove 43, and white space is insulating regions, empty
White region is esters of acrylic acid UV glue 42.
The conducting film that above-described embodiment provides, the grid of the conductive channel is except rhombus or irregular polygon
Outside, it can also be the rules such as square, parallelogram, regular hexagon, curvilinear boundary quadrilateral or polygon
Shape.Curvilinear boundary quadrilateral refers to there is four curls, and there is relative two curls same shape and curve to walk
To.The contact conductor can also be parallelogram, regular hexagon, song in addition to single line or square
The regular shape such as side quadrangle or polygon.
The metal material filled in metal grill conductive layer groove of the present invention can be gold, silver, copper, aluminium,
Nickel, zinc or the alloy wherein arbitrarily more than both or both.
Esters of acrylic acid UV glue with groove structure, equally can be with having same nature or can with UV glue
To reach the organic materials such as the ultraviolet-curable materials of identical purpose, thermoplastic or thermosets to substitute,
Such as：PMMA, PC, PDMS etc..
Referring to Fig. 7, conducting film of the present invention can also be bilateral structure.Conducting film is provided with the from top to bottom
One bearing bed, the bearing bed of substrate 60 and second, the first bearing bed are the esters of acrylic acid with groove structure
UV glue 61,3.5 μm of 65 depth of the second groove of lead district, 5 μm of width, the first groove 63 of conduction region
3.5 μm of depth, 2.5 μm of width；The second groove of lead district depth-to-width ratio is less than electrode zone；Second bearing bed
For the esters of acrylic acid UV glue 62 with groove structure, likewise, the depth of the second groove 66 of lead district
3.5 μm, 5 μm of width, 3.5 μm of 64 depth of the first groove of conduction region, 2.5 μm of width；Lead district
Second groove depth-to-width ratio is less than electrode zone.
Referring to Fig. 8, conducting film of the present invention can also be single-surface double-layer structure.Conducting film is set from bottom to top
There are the first bearing bed, the second bearing bed and substrate 70, the first bearing bed is the acrylic acid with groove structure
Esters UV glue 71,3.5 μm of 75 depth of the second groove of lead district, 5 μm of width, the first of conduction region is recessed
3.5 μm of 73 depth of groove, 2.5 μm of width；The second groove of lead district depth-to-width ratio is less than electrode zone；Second
Bearing bed is the esters of acrylic acid UV glue 72 with groove structure, likewise, the second groove 76 of lead district
3.5 μm of depth, 5 μm of width, 3.5 μm of 74 depth of the first groove of conduction region, 2.5 μm of width；Draw
Line area the second groove depth-to-width ratio is less than electrode zone.
Conducting film described on end, disclosed, conduction region use the first groove, and contact conductor uses
Second groove, first depth of groove is m and the first recess width is that the ratio between n, m, n is A, described
Two depths of groove are m and the second recess width is that the ratio between s, m, s is B；Wherein, B<A；Compared to traditional electricity
The design that pole lead areas metal wire is intensive and depth-to-width ratio is larger, more easy mold release, substantially prolongs making for mould
With the life-span, and conductive material density is bigger, and electric conductivity is more preferable.And the conduction filled in second groove
Material comprises at least the conductive material that particle diameter is more than 500nm conductive materials and particle diameter is less than or equal to 500nm, this
Sample one carrys out the conductive material that electrode lead areas contains two or more particle diameters, so enhances electrode well and draws
The electric conductivity of line, because depth-to-width ratio is different, so second groove in contact conductor region can be accommodated preferably greatly
The conductive material of particle diameter.
In addition, the first bearing bed and the second bearing bed described here is intended merely to conveniently being compiled for narration
Number, and the order of priority is not present, the first groove and the second groove are then the different groove of groove parameters,
Distinct groove.First groove 15,44,63,64,73,74 and the second groove 14,43,65,
66th, 75,76 different numberings simply is employed in order to preferably describe in different structure, the first groove is
Groove in conductive channel, the second groove are the groove of contact conductor, but the one the second are also not present successively
Sequentially.
In order to facilitate the understanding of the purposes, features and advantages of the present invention, above in conjunction with accompanying drawing pair
The embodiment of the present invention is described in detail.Elaborated in superincumbent description many details with
It is easy to fully understand the present invention.But the present invention can be come in fact with being much different from other manner described above
Apply, those skilled in the art can make similar improvements without departing from the spirit of the invention, therefore this hair
It is bright not limited by particular embodiments disclosed above.Also, each technical characteristic of embodiment described above can
Arbitrarily to be combined, to make description succinct, it is not all to each technical characteristic in above-described embodiment can
Can combination be all described, as long as however, contradiction is not present in the combination of these technical characteristics, should all recognize
For be this specification record scope.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, can also make it is some deformation and
Improve, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is defined.
Claims (17)
1. a kind of conducting film, including：
Supporting body, the supporting body are provided with first surface and the second surface being oppositely arranged with first surface；
Conduction region, the first surface of the supporting body offers the first groove, and first groove is formed mutually
The grid of connection；Conductive material is filled in first groove and forms interconnected conductive grid, the phase
Intercommunicated conductive grid forms the conduction region；
Lead district, the first surface of the supporting body offer the second groove, filled in second groove conductive
Material forms contact conductor, and the contact conductor forms the lead district；The contact conductor and the conduction
Grid is electrically connected with；
First depth of groove is m and the first recess width is that the ratio between n, m, n is A, second groove
Depth is m and the second recess width is that the ratio between s, m, s is B；Wherein, B<A.
2. a kind of conducting film according to claim 1, it is characterised in that the conduction region is included each other
Some conductive channels that some conductive grids of insulation are formed, each conductive channel connect to electrotropism respectively
Connect the contact conductor.
A kind of 3. conducting film according to claim 2, it is characterised in that the adjacent conductive channel it
Between be provided with color matching area, the color matching area has first groove, and first groove type is into grid；Institute
State and conductive material formation color matching area is filled in the first groove.
A kind of 4. conducting film according to claim 1, it is characterised in that second depth of groove and the
The ratio between two recess widths B is less than 0.8.
A kind of 5. conducting film according to claim 4, it is characterised in that second depth of groove and the
The ratio between two recess widths B is less than or equal to 0.5.
6. a kind of conducting film according to claim 1, it is characterised in that filled in first groove
Conductive material average grain diameter is less than the conductive material average grain diameter filled in second groove.
7. a kind of conducting film according to claim 1, it is characterised in that the supporting body is substrate and set
Hypothallus in the substrate, the conduction region and lead district are located at one of the hypothallus away from substrate
Side；
Or, the supporting body is polymer, the conduction region and lead district are located at the first table of the polymer
Face.
A kind of 8. conducting film according to claim 1, it is characterised in that the second surface of the supporting body
Conduction region and lead district also are provided with, the conductive grid and the contact conductor are electrically connected with；
Or, the supporting body first surface side is provided with insulating barrier, side of the insulating barrier away from first surface is set
There are conduction region and lead district, the conductive grid and the contact conductor are electrically connected with.
9. a kind of conducting film according to claim 7, it is characterised in that the hypothallus and polymer
For thermosetting cement or optic-solidified adhesive.
A kind of 10. conducting film according to claim 1, it is characterised in that the filling conductive material choosing
It is one or more of from metal, metal oxide or organic conductive material.
11. a kind of conducting film according to claim 10, it is characterised in that filled out in second groove
The conductive material filled comprises at least conductive material of the particle diameter more than 500nm and particle diameter leading less than or equal to 500nm
Electric material.
12. a kind of conducting film according to claim 11, it is characterised in that filled in second groove
Conductive material comprise at least conductive material of the particle diameter more than or equal to 800nm and particle diameter less than or equal to 400nm
Conductive material.
13. a kind of conductive membrane preparation method, comprises the following steps：
S1, the first groove and the second groove are opened up on supporting body surface, and first groove is formed mutually
The grid of connection；
S2, make that first depth of groove is m and the first recess width is that the ratio between n, m, n is A, described
Two depths of groove are m and the second recess width is that the ratio between s, m, s is B, wherein, B<A；
S3, conductive material is filled in first groove and the second groove, fill and lead in first groove
Electric material forms interconnected conductive grid, and the interconnected conductive grid forms conduction region；It is described
Conductive material is filled in second groove and forms contact conductor, the contact conductor forms lead district；The electrode
It is electrically connected between lead and the conductive grid.
14. a kind of conductive membrane preparation method according to claim 13, it is characterised in that in the conduction
Some conductive grids are set in area to form some conductive channels, and it is insulated from each other between the conductive channel,
Each described conductive channel one end is electrically connected with contact conductor.
15. a kind of conductive membrane preparation method according to claim 14, it is characterised in that described adjacent
Color matching region is provided between conductive channel, the color matching area has first groove, and first groove
Form grid；Conductive material is filled in first groove and forms color matching area.
16. a kind of conductive membrane preparation method according to claim 13, it is characterised in that described second is recessed
The conductive material filled in groove comprises at least particle diameter and is less than or equal to 500nm more than 500nm conductive materials and particle diameter
Conductive material.
17. a kind of conductive membrane preparation method according to claim 13, it is characterised in that described first
Filling conductive material method is more than 500nm conductive material for first filling particle diameter in groove and the second groove,
Then it is less than 500nm conductive material in filling particle diameter；Or, first fill the conduction material that particle diameter is less than 500nm
Material, 500nm conductive material is then more than in filling particle diameter.
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| CN201610316066.0A CN107369491A (en) | 2016-05-13 | 2016-05-13 | A kind of conducting film and preparation method |
| CN202110348890.5A CN113066604A (en) | 2016-05-13 | 2016-05-13 | Conductive film and preparation method thereof |
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| WO2019228079A1 (en) * | 2018-05-29 | 2019-12-05 | 昇印光电（昆山）股份有限公司 | Electrically-conductive film and manufacturing method |
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| WO2020211591A1 (en) * | 2019-04-19 | 2020-10-22 | 昇印光电（昆山）股份有限公司 | Electrically conductive film |
| CN111863314A (en) * | 2019-04-30 | 2020-10-30 | 昇印光电（昆山）股份有限公司 | Conducting film |
| CN113514163A (en) * | 2021-06-22 | 2021-10-19 | 苏州纳格光电科技有限公司 | Temperature detection device |
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| CN113066604A (en) | 2021-07-02 |
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