CN103440904A - Conductive film - Google Patents
Conductive film Download PDFInfo
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- CN103440904A CN103440904A CN2013103252207A CN201310325220A CN103440904A CN 103440904 A CN103440904 A CN 103440904A CN 2013103252207 A CN2013103252207 A CN 2013103252207A CN 201310325220 A CN201310325220 A CN 201310325220A CN 103440904 A CN103440904 A CN 103440904A
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Abstract
A conductive film comprises a transparent substrate, first conductive layers and second conductive layers. The conductive patterns of the first conductive layers are meshed, and the first conductive layers are arranged on the transparent substrate in a protruding mode. The conductive patterns of the second conductive layers are meshed, and the second conductive layers are arranged on the transparent substrate in the protruding mode. The meshes of the first conductive layers and the meshes of the second conductive layers are mutually staggered. The cost of the conductive film is low.
Description
[technical field]
The present invention relates to a kind of conducting film, particularly relate to a kind of touch-control conducting film.
[background technology]
Nesa coating is to receive the sensing element of the input signals such as touch in touch-screen.At present, ITO(tin indium oxide) layer is vital part in nesa coating.Although the develop rapidly at a tremendous pace of the manufacturing technology of touch-screen, take the projecting type capacitor screen as example, too large change does not occur in the basic manufacturing process of ITO layer in recent years, always inevitably needs the ITO plated film, and ITO is graphical.
Therefore indium is a kind of metal material of costliness, usings ITO as the material of conductive layer, has promoted to a great extent the cost of touch-screen.The ITO pattern of conductive layer is generally strip, triangle or rhombus etc., this large-area ITO pattern array formation conductive layer of arranging.Yet, because the ITO material cost is high, large-area ITO pattern array causes the cost of traditional conducting film higher.
[summary of the invention]
In view of above-mentioned condition, be necessary to provide a kind of lower-cost conducting film.
A kind of conducting film, it comprises:
Transparent substrates;
The first conductive layer, the conductive pattern of described the first conductive layer is latticed, and described the first conductive layer is convexly set on described transparent substrates;
The second conductive layer, the conductive pattern of described the second conductive layer is latticed, and described the second conductive layer is convexly set on described transparent substrates;
Wherein, the grid of the grid of described the first conductive layer and described the second conductive layer staggers mutually.
Compared to traditional conducting film, the first conductive layer of above-mentioned conducting film and the conductive pattern of the second conductive layer are latticed, and the material that latticed conductive pattern is used is less, thereby reduces costs; The grid of the first conductive layer and the second conductive layer staggers mutually, without aligning, simplify technique, further reduce costs, the grid mutually staggered can prevent due to the upper and lower not high grid density difference that makes of two-grid alignment precision simultaneously, and then cause the transmitance of light different, thereby above-mentioned conducting film visual effect is better, is difficult for the region contrast difference.
In embodiment, described transparent substrates comprises first surface and the second surface relative with described first surface therein, and described the first conductive layer is located at described first surface, and described the second conductive layer is located at described second surface.
In embodiment, also comprise hypothallus therein, between described the first conductive layer and described first surface, between described the second conductive layer and described second surface, be provided with hypothallus.
In embodiment, also comprise protective clear layer therein, described the first conductive layer and described the second conductive layer surface are provided with protective clear layer.
Therein in embodiment, also comprise insulating barrier, described transparent substrates comprises first surface and the second surface relative with described first surface, described the first conductive layer is located at described first surface, described insulating barrier is located at the surface of described the first conductive layer, and described the second conductive layer is located on described insulating barrier.
In embodiment, also comprise hypothallus therein, described hypothallus is located between described the first conductive layer and described first surface.
In embodiment, also comprise protective clear layer therein, described protective clear layer is located at described the second conductive layer surface.
In embodiment, also comprise the first lead-in wire electrode and the second lead-in wire electrode therein, described the first lead-in wire electrode is electrically connected to the first conductive layer, and described second electrode that goes between is electrically connected to the second conductive layer.
In embodiment, described the first lead-in wire electrode and the second lead-in wire electrode are convexly set in described transparent substrates therein.
In embodiment, described the first lead-in wire electrode and the second lead-in wire electrode are latticed or linear therein.
In embodiment, the grid of described the first conductive layer and described the second conductive layer is regular grid therein.
In embodiment, described regular grid is regular hexagonal cell, network or square net therein.
In embodiment, the material of described the first conductive layer and described the second conductive layer is silver, copper, conducting polymer or ITO therein.
In embodiment, the material of described transparent substrates is thermoplastic, PET or glass therein.
In embodiment, the material of described hypothallus is UV glue, impression glue or Merlon therein.
In embodiment, the material of described protective clear layer is UV glue, impression glue or Merlon therein.
[accompanying drawing explanation]
The profile of the conducting film that Fig. 1 is embodiment of the present invention;
The vertical view that Fig. 2 is the conducting film in Fig. 1;
Fig. 3 (a) is to the structural representation of the different embodiment of Fig. 3 (c) grid that is the conducting film shown in Fig. 2;
The exploded view that Fig. 4 is the conducting film in Fig. 1;
The profile of the conducting film that Fig. 5 is another execution mode;
The profile of the conducting film that Fig. 6 is another execution mode;
Fig. 7 (a) is to form the structural representation of the first conductive layer step in embodiment of the present invention on transparent substrates to Fig. 7 (e).
[embodiment]
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Provided preferred embodiment of the present invention in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present invention more comprehensively thorough.
It should be noted that, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present invention with scientific terminology.The term used in specification of the present invention herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Refer to Fig. 1, the conducting film 200 of embodiment of the present invention comprises transparent substrates 210, hypothallus 220, the first conductive layer 230 and the second conductive layer 250.
Please consult Fig. 2, the first conductive layer 230 is convexly set in the surface of the hypothallus 220 of first surface 212 simultaneously.The first conductive layer 230 is latticed.The material of the first conductive layer 230 is silver, copper, conducting polymer or ITO.
The second conductive layer 250 is convexly set in the surface of the hypothallus 220 of second surface 214.The second conductive layer 250 is latticed.The material of the second conductive layer 250 is silver, copper, conducting polymer or ITO.
Further, the grid of the first conductive layer 230 and the second conductive layer 250 is regular grid.The grid of the grid of the first conductive layer 230 and the second conductive layer 250 staggers mutually.Refer to Fig. 3 (a) to Fig. 3 (c), Fig. 3 (b) is respectively regular hexagonal cell, network and square net to the grid shown in Fig. 3 (c).
Refer to Fig. 4, in the illustrated embodiment, the first conductive layer 230 and the second conductive layer 250 form by the conduction band of a plurality of array arrangements.The conduction band of the first conductive layer 230 extends along the direction of the first dimension, and the conduction band of the second conductive layer 250 extends along the direction of the second dimension, and the first dimension direction is mutually vertical with the second dimension direction.Certainly, in other execution mode, the first dimension direction and the second dimension direction oblique.
Further, please again consult Fig. 2, conducting film 200 also comprises is located at the first lead-in wire electrode 260 and the second lead-in wire electrode (not shown).The first lead-in wire electrode 260 is positioned at the edge of the first conductive layer 230 and is electrically connected to the first conductive layer 230, and the second lead-in wire electrode is positioned at the edge of the second conductive layer 250 and is electrically connected to the second conductive layer 250.The first lead-in wire electrode 260 and the second lead-in wire electrode are convexly set in the surface of hypothallus 220.The first lead-in wire electrode 260 and the second lead-in wire electrode can form by modes such as silk screen printing, etching, impression or inkjet printings.
In the present embodiment, the first lead-in wire electrode 260 comprises cross one another the first conductive lead wire, and the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the first lead-in wire electrode 260 and the second lead-in wire electrode are network.The network of the first lead-in wire electrode 260 and the second lead-in wire electrode 270 is identical with the network of the first conductive layer 230 and the second conductive layer 250, is specifically as follows Fig. 3 (a) to the structure shown in Fig. 3 (c).Certainly, in other embodiment, the first lead-in wire electrode 260 and the second lead-in wire electrode can also be linear.
Preferably, the material of the first lead-in wire electrode 260 and the second lead-in wire electrode 270 is silver, copper, conducting polymer or ITO.
Further, conducting film 200 also comprises the protective clear layer (not shown).In present embodiment, protective clear layer has two, and one of them protective clear layer is covered in the surface of the first conductive layer 230 and the first lead-in wire electrode 260, and another protective clear layer is covered in the surface of the second conductive layer 250 surfaces and the second lead-in wire electrode.Because the first conductive layer 230, the second conductive layer 250, the first lead-in wire electrode 260 and the second lead-in wire electrode all are convexly set in the surface of hypothallus 220; therefore; form protective clear layer on the surface of the first conductive layer 230 and the first lead-in wire electrode 260 so that the first conductive layer 230 and the first lead-in wire electrode 260 are formed to protection; avoid scratching; form protective clear layer so that the second conductive layer 250 is formed to protection on the surface of the second conductive layer 250 and the second lead-in wire electrode, avoid scratching.Preferably, the material of protective clear layer is UV glue, impression glue or Merlon.
In the execution mode shown in Fig. 1, the first conductive layer 230 and the second conductive layer 250 lay respectively at 210 two relative surfaces of transparent substrates, certainly in other embodiments, the first conductive layer 230 and the second conductive layer 250 also can be positioned at the homonymy of transparent substrates 210.Refer to Fig. 5, in the illustrated embodiment, hypothallus 220 only has one deck, and first surface 212, the first conductive layers 230 that hypothallus 220 is formed at transparent substrates 210 are convexly set in the surface of hypothallus 220.The surface of the first conductive layer 230 is formed with insulating barrier 240.The second conductive layer 250 is convexly set in the surface of insulating barrier 240.Edge layer 240, for the first conductive layer 230 and the second conductive layer 250 are separated, makes not conducting mutually between the first conductive layer 230 and the second conductive layer 250.In present embodiment, the material of insulating barrier 240 is dielectric ink or insulating cement.
In the execution mode shown in Fig. 1, be equipped with hypothallus 220 between the first conductive layer 230 and the second conductive layer 250 and transparent substrates 210 to increase the adhesion between the first conductive layer 230 and the second conductive layer 250 and transparent substrates 210, certainly, in other execution mode, hypothallus 220 can omit.Refer to Fig. 6, in the illustrated embodiment, first surface 212, the second conductive layers 250 that the first conductive layer 230 is convexly set in transparent substrates 210 directly are convexly set in the second surface 214 of transparent substrates 210.
Refer to Fig. 7 (a) to Fig. 7 (e), specifically, in illustrated embodiment, the step that forms the first conductive layer 230 on transparent substrates 210 surfaces comprises:
As shown in Figure 7 (a), be formed for the conductive material layer 300 of the first conductive layer 230 on the surface of transparent substrates 210;
As shown in Figure 7 (b) shows, can form the shadow shield 400 of the first corresponding conductive layer 230 in the surperficial setting of conductive material layer 300;
As shown in Fig. 7 (c), conductive material layer 300 is carried out to exposure light irradiation;
As shown in Fig. 7 (d), conductive material layer 300 is carried out to etching and form the first conductive layer 230 as shown in Fig. 7 (e).
Certainly, the first conductive layer 230 and the second conductive layer 250 can also adopt the additive method preparations such as silk screen printing.
Compared to traditional conducting film, above-mentioned conducting film 200 at least has the following advantages:
(1) above-mentioned conducting film 200 replaces conventional I TO process structure with network, and the material that latticed conductive pattern is used is less, thereby reduces costs; In the first conductive layer 230 and the second conductive layer 250 wherein one deck grid mutually stagger, without aligning, simplify technique, further reduce costs, the grid mutually staggered can prevent due to the upper and lower not high grid density difference that makes of two-grid alignment precision simultaneously, and then cause the transmitance of light different, thereby above-mentioned conducting film visual effect is better, is difficult for the region contrast difference.
(2) by forming the first conductive layer 230 and the second conductive layer 250, the first conductive layers 230 and the second conductive layer 250, by insulating barrier 240, separate, the inductive effects of two conductive layers is better.
(3) by between the first conductive layer 230 and the second conductive layer 250 and transparent substrates 210, hypothallus 220 being set, can increase the adhesion between the first conductive layer 230 and the second conductive layer 250 and transparent substrates 210.
(4) form protective clear layer by the surface at the first conductive layer 230 and the second conductive layer 250, can protect the first conductive layer 230 and the second conductive layer 250 to avoid being scratched, can prevent the electric conducting material oxidation simultaneously.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (16)
1. a conducting film, is characterized in that, comprising:
Transparent substrates;
The first conductive layer, the conductive pattern of described the first conductive layer is latticed, and described the first conductive layer is convexly set on described transparent substrates;
The second conductive layer, the conductive pattern of described the second conductive layer is latticed, and described the second conductive layer is convexly set on described transparent substrates;
Wherein, the grid of the grid of described the first conductive layer and described the second conductive layer staggers mutually.
2. conducting film as claimed in claim 1, is characterized in that, described transparent substrates comprises first surface and the second surface relative with described first surface, and described the first conductive layer is convexly set in described first surface, and described the second conductive layer is convexly set in described second surface.
3. conducting film as claimed in claim 2, is characterized in that, also comprises hypothallus, between described the first conductive layer and described first surface, between described the second conductive layer and described second surface, be provided with hypothallus.
4. conducting film as claimed in claim 2, is characterized in that, also comprises protective clear layer, and described the first conductive layer and described the second conductive layer surface all are coated with protective clear layer.
5. conducting film as claimed in claim 1, it is characterized in that, also comprise insulating barrier, described transparent substrates comprises first surface and the second surface relative with described first surface, described the first conductive layer is convexly set in described first surface, described insulating barrier is located at the surface of described the first conductive layer, and described the second conductive layer is convexly set on described insulating barrier.
6. conducting film as claimed in claim 5, is characterized in that, also comprises hypothallus, and described hypothallus is located between described the first conductive layer and described first surface.
7. conducting film as claimed in claim 5, is characterized in that, also comprises protective clear layer, and described protective clear layer is located at described the second conductive layer surface.
8. conducting film as claimed in claim 1, is characterized in that, also comprises the first lead-in wire electrode and the second lead-in wire electrode, and described the first lead-in wire electrode is electrically connected to the first conductive layer, and described the second lead-in wire electrode is electrically connected to the second conductive layer.
9. conducting film as claimed in claim 8, is characterized in that, described the first lead-in wire electrode and the second lead-in wire electrode are convexly set in described transparent substrates.
10. conducting film as claimed in claim 8, is characterized in that, described the first lead-in wire electrode and the second lead-in wire electrode are latticed or linear.
11. conducting film as claimed in claim 1, is characterized in that, the grid of described the first conductive layer and described the second conductive layer is regular grid.
12. conducting film as claimed in claim 11, is characterized in that, described regular grid is regular hexagonal cell, network or square net.
13. conducting film as claimed in claim 1, is characterized in that, the material of described the first conductive layer and described the second conductive layer is silver, copper, conducting polymer or ITO.
14. conducting film as claimed in claim 1, is characterized in that, the material of described transparent substrates is thermoplastic, PET or glass.
15. conducting film as described as claim 3 or 6, is characterized in that, the material of described hypothallus is UV glue, impression glue or Merlon.
16. conducting film as described as claim 4 or 7, is characterized in that, the material of described protective clear layer is UV glue, impression glue or Merlon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103252207A CN103440904A (en) | 2013-07-30 | 2013-07-30 | Conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103252207A CN103440904A (en) | 2013-07-30 | 2013-07-30 | Conductive film |
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| CN103440904A true CN103440904A (en) | 2013-12-11 |
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| CN2013103252207A Pending CN103440904A (en) | 2013-07-30 | 2013-07-30 | Conductive film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066604A (en) * | 2016-05-13 | 2021-07-02 | 昇印光电（昆山）股份有限公司 | Conductive film and preparation method thereof |
| WO2023071451A1 (en) * | 2021-10-27 | 2023-05-04 | 浙江鑫柔科技有限公司 | Metal grid conductive film and preparation method therefor |
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| JPH06103839A (en) * | 1992-09-21 | 1994-04-15 | Sumitomo Metal Mining Co Ltd | Manufacture of transparent conductive substrate |
| CN1675971A (en) * | 2002-08-08 | 2005-09-28 | 大日本印刷株式会社 | Electromagnetic shielding sheet and method for manufacturing same |
| CN201859664U (en) * | 2010-11-23 | 2011-06-08 | 苏州禾盛新型材料股份有限公司 | Double-faced conductive membrane for projection type capacitance touch panel |
| CN102903423A (en) * | 2012-10-25 | 2013-01-30 | 南昌欧菲光科技有限公司 | Conduction structure in transparent conduction film, transparent conduction film and manufacture method thereof |
| CN203415252U (en) * | 2013-07-30 | 2014-01-29 | 南昌欧菲光科技有限公司 | Conductive film |
-
2013
- 2013-07-30 CN CN2013103252207A patent/CN103440904A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06103839A (en) * | 1992-09-21 | 1994-04-15 | Sumitomo Metal Mining Co Ltd | Manufacture of transparent conductive substrate |
| CN1675971A (en) * | 2002-08-08 | 2005-09-28 | 大日本印刷株式会社 | Electromagnetic shielding sheet and method for manufacturing same |
| CN201859664U (en) * | 2010-11-23 | 2011-06-08 | 苏州禾盛新型材料股份有限公司 | Double-faced conductive membrane for projection type capacitance touch panel |
| CN102903423A (en) * | 2012-10-25 | 2013-01-30 | 南昌欧菲光科技有限公司 | Conduction structure in transparent conduction film, transparent conduction film and manufacture method thereof |
| CN203415252U (en) * | 2013-07-30 | 2014-01-29 | 南昌欧菲光科技有限公司 | Conductive film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113066604A (en) * | 2016-05-13 | 2021-07-02 | 昇印光电（昆山）股份有限公司 | Conductive film and preparation method thereof |
| WO2023071451A1 (en) * | 2021-10-27 | 2023-05-04 | 浙江鑫柔科技有限公司 | Metal grid conductive film and preparation method therefor |
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Application publication date: 20131211 |