CN203503319U - Electric conductive film - Google Patents
Electric conductive film Download PDFInfo
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- CN203503319U CN203503319U CN201320460069.3U CN201320460069U CN203503319U CN 203503319 U CN203503319 U CN 203503319U CN 201320460069 U CN201320460069 U CN 201320460069U CN 203503319 U CN203503319 U CN 203503319U
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- lead
- conductive layer
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Abstract
The utility model relates to an electric conductive film. The electric conductive file comprises a transparent substrate having a first surface and a second surface opposite to the first surface; a grid-shaped electric conductive layer arranged on the first surface; and a lead wire electrode arranged on the first surface and including a lead wire contact and a lead wire circuit, wherein the lead wire contact is disposed inside the grid of the electric conductive layer and electrically connected with the electric conductive layer. The electric conductive film has a relatively high production yield.
Description
[technical field]
The utility model relates to a kind of touch-control conducting film.
[background technology]
Conducting film is in touch-screen, to receive the sensing element of the input signals such as touch.At present, ITO(tin indium oxide) layer is vital part in conducting film.Although the develop rapidly at a tremendous pace of the manufacturing technology of touch-screen, take projecting type capacitor screen as example, there is not too large change in the basic manufacturing process of ITO layer, always inevitably needs ITO plated film in recent years, and ITO is graphical.
Therefore indium is a kind of metal material of costliness, usings ITO as the material of conductive layer, has promoted to a great extent the cost of touch-screen.Moreover ITO conductive layer, in graphical technique, need carry out etching by whole the ITO film having plated, to form ITO pattern, in this technique, a large amount of ITO is etched, causes a large amount of noble metal wastes and pollutes.
Conductive layer in conducting film is electrically connected to circuit board by lead-in wire electrode.Lead-in wire electrode generally includes lead-in wire contact and lead wire circuit, and conductive layer edge is electrically connected to lead-in wire contact.Like this, in the process of preparation, higher to the required precision of aiming at conductive layer edge with the lead-in wire contact of lead-in wire electrode, and easily produce and disconnect, cause producing yield lower.
[utility model content]
In view of above-mentioned condition, be necessary to provide a kind of conducting film with higher production yield.
A conducting film, it comprises:
Transparent substrates, comprises first surface and the second surface being oppositely arranged with described first surface;
Conductive layer, is located at described first surface, and described conductive layer is latticed;
Lead-in wire electrode, is located at described first surface, and described lead-in wire electrode comprises lead-in wire contact and lead-in wire circuit, and described lead-in wire contact is located at the grid inside of described conductive layer and is electrically connected to described conductive layer.
Compared to traditional conducting film, the lead-in wire contact of above-mentioned conducting film is arranged at the grid inside of conductive layer, in the process of preparation, low for the required precision of aiming at, be difficult for because lead-in wire contact is not aimed at and produces defective products with the edge of conductive layer, thereby there is higher production yield.
In an embodiment, described conductive layer is convexly set in described first surface therein.
In an embodiment, described lead-in wire electrode is convexly set in described first surface therein.
In an embodiment, described first surface is formed with grid groove therein, and described conductive layer is contained in described grid groove.
In an embodiment, described first surface is formed at lead-in wire groove therein, and described lead-in wire electrode is contained in described lead-in wire groove.
In an embodiment, the grid of described conductive layer is regular grid or random grid therein.
In an embodiment, the width of described grid groove is d1 therein, and the degree of depth is h, wherein, and 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1>1.
In an embodiment, described grid groove is that bottom is " V " font, " W " font, arc or corrugated micro-groove therein.
In an embodiment, the degree of depth of described micro-groove is 500nm～1 μ m therein.
In an embodiment, also comprise hypothallus therein, described hypothallus is located at the first surface of described transparent substrates, and described conductive layer and described lead-in wire electrode are located at described hypothallus away from a side of transparent substrates.
In an embodiment, also comprise the protective clear layer that covers described conductive layer and described lead-in wire electrode surface therein.
[accompanying drawing explanation]
Fig. 1 is the structural representation of the conducting film of the utility model execution mode;
Fig. 2 is the vertical view of the conducting film in Fig. 1;
Fig. 3 (a) is the structural representation of different embodiment of bottom of the grid groove of the conducting film shown in Fig. 2 to Fig. 3 (d);
Fig. 4 (a) is the structural representation of different embodiment of the grid of the conducting film shown in Fig. 2 to Fig. 4 (d);
Fig. 5 is the exploded view of the conducting film of another execution mode;
Fig. 6 is the profile of the conducting film of another execution mode;
Fig. 7 is conducting film in Fig. 1 profile in another embodiment;
Fig. 8 is conducting film in Fig. 1 profile in another embodiment;
Fig. 9 (a) is in the utility model execution mode, in transparent substrates, to form the structural representation of lead-in wire electrode step to Fig. 9 (e).
[embodiment]
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.In accompanying drawing, provided preferred embodiment of the present utility model.But the utility model can be realized in many different forms, be not limited to embodiment described herein.On the contrary, providing the object of these embodiment is to make to the understanding of disclosure of the present utility model more thoroughly comprehensively.
It should be noted that, when element is called as " being fixed on " another element, can directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology of using are herein identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term using in specification of the present utility model herein, just in order to describe the object of specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Refer to Fig. 1, the conducting film 200 of the utility model execution mode comprises transparent substrates 210, hypothallus 220 and the first conductive layer 230.
Please refer to Fig. 2, in grid groove 221, be filled with electric conducting material to form cross one another conductive thread, cross one another conductive thread forms conductive layer 230.Electric conducting material is silver, copper, conducting polymer or ITO.Preferably, conductive layer 230 and grid groove 221 form by the mode of impression.
Further, grid groove 221 for bottom be " V " font, " W " font, arc or corrugated micro-groove.Refer to Fig. 3 (a) to Fig. 3 (d), grid groove 221 shown in Fig. 3 (a) for bottom be the micro-groove of " V " font, grid groove 221 shown in Fig. 3 (b) for bottom be the micro-groove of " W " font, the micro-groove that grid groove 221 shown in Fig. 3 (c) is arc for bottom, the grid groove 221 shown in Fig. 3 (d) for bottom be corrugated micro-groove.Preferably, the degree of depth of micro-groove is 500nm～1 μ m.
Preferably, the width of grid groove 221 is d1, and the degree of depth is h, wherein, and 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1>1.
Further, refer to Fig. 4 (a) to Fig. 4 (d), the grid of conductive layer 230 is regular grid or random grid.Grid is as shown in Figure 4 (a) random grid, and Fig. 4 (b) is respectively regular hexagonal cell, network and square net to the grid shown in Fig. 4 (d).
In the execution mode shown in Fig. 1, only shown the conductive layer 230 of conducting film, conductive layer 230 is comprised of the conduction band of a plurality of array arrangements.Certainly, in concrete application, conducting film also comprises another conductive layer 250.Refer to Fig. 5, in illustrated execution mode, the conduction band of conductive layer 230 extends along the direction of the first dimension, and the conduction band of conductive layer 250 extends along the direction of the second dimension, and the first dimension direction is mutually vertical with two-dimensional directional.Certainly, the first dimension direction and two-dimensional directional also can obliques.
Further, please refer to Fig. 2 and Fig. 6, conducting film 200 also comprises lead-in wire electrode 260.Lead-in wire electrode 260 is electrically connected to conductive layer 230.Lead-in wire electrode 260 comprises lead-in wire contact 262 and lead-in wire circuit 264.Lead-in wire contact 262 is roughly strip.Lead-in wire contact 262 is located at the grid inside of conductive layer 230.In the illustrated embodiment, conductive layer 230 is comprised of the conduction band of a plurality of array arrangements, and each lead-in wire contact 262 extends along the Width of conduction band, thereby lead-in wire contact 262 intersects and is electrically connected to many conductive threads of conduction band.One end of lead-in wire circuit 264 is electrically connected to and extends to outside conductive layer 230 with lead-in wire contact 262.
It should be noted that, in the embodiment showing at Fig. 6, lead-in wire electrode 260 is contained in the lead-in wire groove 223 that is opened in hypothallus 220.Certainly, in other embodiments, lead-in wire electrode 260 also can directly be convexly set in hypothallus 220 away from the surface of substrate 210, and as in the embodiment shown in fig. 7, lead-in wire electrode 260 is convexly set in hypothallus 220 away from the surface of substrate 210.Lead-in wire electrode 260 can form by modes such as silk screen printing, impression or inkjet printings.
In the present embodiment, lead-in wire electrode 260 comprises cross one another conductive lead wire.The network of lead-in wire electrode 260 is identical with the network of conductive layer 230, is regular grid or random grid, is specifically as follows Fig. 4 (a) to the structure shown in Fig. 4 (d).The lead-in wire structure and parameters of groove 223 is all identical with the structure and parameters of grid groove 221.Certainly, in other embodiment, when lead-in wire electrode 260 can also be for salient line strip, the live width of lead-in wire electrode 260 is 50 μ m～200 μ m, is highly 5 μ m～10 μ m.
Preferably, the material of lead-in wire electrode 260 is the conducting metals such as silver, copper.
Further, conducting film 200 also comprises the protective clear layer (not shown) that is covered in conductive layer 230 surfaces.Protective clear layer covering conductive layer 230 and hypothallus 220 are away from the surface of transparent substrates 210.Because conductive layer 230 is located at the surface of hypothallus 220, therefore, on the surface of conductive layer 230, form protective clear layer 2 so that conductive layer 230 and lead-in wire electrode 260 are formed to protection, avoid scratching.Preferably, the material of protective clear layer is UV glue, impression glue or Merlon.
Certainly, hypothallus 220 can omit, and now grid groove 221 is opened in the first surface of transparent substrates 210, and lead-in wire groove 223 is opened in the first surface of transparent substrates 210, and conductive layer 230 and lead-in wire electrode 26 are directly located at the first surface of transparent substrates.
It should be noted that, grid groove 221 can omit, and now conductive layer 230 is directly convexly set in the first surface of transparent substrates 210.Refer to Fig. 8, in illustrated embodiment, conductive layer 230 is directly convexly set in the first surface of transparent substrates 210.
Refer to Fig. 9 (a) to Fig. 9 (e), specifically, in illustrated embodiment, the step that forms lead-in wire electrode 260 on transparent substrates 210 surfaces comprises:
As shown in Fig. 9 (a), the conductive material layer 300 of the electrode 260 that is formed on the surface of transparent substrates 210 going between;
As shown in Figure 9 (b), in the surperficial setting of conductive material layer 300, can form the shadow shield 400 of corresponding lead-in wire electrode 260;
As shown in Figure 9 (c), conductive material layer 300 is carried out to exposure light irradiation;
As shown in Fig. 9 (d), conductive material layer 300 is carried out to etching and form the lead-in wire electrode 260 as shown in Fig. 9 (e).
Compared to traditional conducting film, above-mentioned conducting film 200 at least has the following advantages:
(1) the lead-in wire contact 262 of above-mentioned conducting film 200 is arranged at the grid inside of conductive layer 230, in the process of preparation, low for the required precision of aiming at, be difficult for because lead-in wire contact 262 is not aimed at and produces defective products with the edge of conductive layer 230, thereby there is higher production yield.
(2) conductive layer 230 of above-mentioned conducting film 200 is latticed, replaces conventional I TO process structure, thereby reduce costs simplified manufacturing technique with network.
(3), by form grid groove 221 on hypothallus 220, the interior filled conductive silk thread of grid groove 221 forms conductive layer 230, thereby can reduce the thickness of conducting film 200; Adopt this flush type design simultaneously, the performance of conducting film 200 is well protected.
(4) by the surface at conductive layer 230, form protective clear layer 280, can protect conductive layer 230 to avoid being scratched, can prevent electric conducting material oxidation simultaneously.
(5) grid groove 221 for bottom be " V " font, " W " font, arc or corrugated micro-groove, conductive ink in the groove of grid groove 221 is when drying like this, and the electric conducting material after conductive ink polycondensation is not easy to occur to dry there will not be the phenomenon of disconnection.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (11)
1. a conducting film, is characterized in that, comprising:
Transparent substrates, comprises first surface and the second surface being oppositely arranged with described first surface;
Conductive layer, is located at described first surface, and described conductive layer is latticed;
Lead-in wire electrode, is located at described first surface, and described lead-in wire electrode comprises lead-in wire contact and lead-in wire circuit, and described lead-in wire contact is located at the grid inside of described conductive layer and is electrically connected to described conductive layer.
2. conducting film as claimed in claim 1, is characterized in that, described conductive layer is convexly set in described first surface.
3. conducting film as claimed in claim 1, is characterized in that, described lead-in wire electrode is convexly set in described first surface.
4. conducting film as claimed in claim 1, is characterized in that, described first surface is formed with grid groove, and described conductive layer is contained in described grid groove.
5. conducting film as claimed in claim 1, is characterized in that, described first surface is formed at lead-in wire groove, and described lead-in wire electrode is contained in described lead-in wire groove.
6. conducting film as claimed in claim 1, is characterized in that, the grid of described conductive layer is regular grid or random grid.
7. conducting film as claimed in claim 4, is characterized in that, the width of described grid groove is d1, and the degree of depth is h, wherein, and 1 μ m≤d1≤5 μ m, 2 μ m≤h≤6 μ m, h/d1>1.
8. conducting film as claimed in claim 4, is characterized in that, described grid groove is that bottom is " V " font, " W " font, arc or corrugated micro-groove.
9. conducting film as claimed in claim 8, is characterized in that, the degree of depth of described micro-groove is 500nm～1 μ m.
10. conducting film as claimed in claim 1, is characterized in that, also comprises hypothallus, and described hypothallus is located at the first surface of described transparent substrates, and described conductive layer and described lead-in wire electrode are located at described hypothallus away from a side of transparent substrates.
11. conducting films as claimed in claim 1, is characterized in that, also comprise the protective clear layer that covers described conductive layer and described lead-in wire electrode surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320460069.3U CN203503319U (en) | 2013-07-30 | 2013-07-30 | Electric conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320460069.3U CN203503319U (en) | 2013-07-30 | 2013-07-30 | Electric conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203503319U true CN203503319U (en) | 2014-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320460069.3U Ceased CN203503319U (en) | 2013-07-30 | 2013-07-30 | Electric conductive film |
Country Status (1)
| Country | Link |
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| CN (1) | CN203503319U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426504A (en) * | 2013-07-30 | 2013-12-04 | 南昌欧菲光科技有限公司 | Conductive film |
| CN105856707A (en) * | 2015-01-18 | 2016-08-17 | 朱继承 | Separable printed film, composite type printed structure and manufacturing method thereof |
-
2013
- 2013-07-30 CN CN201320460069.3U patent/CN203503319U/en not_active Ceased
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426504A (en) * | 2013-07-30 | 2013-12-04 | 南昌欧菲光科技有限公司 | Conductive film |
| CN103426504B (en) * | 2013-07-30 | 2017-04-05 | 南昌欧菲光科技有限公司 | Conducting film |
| CN105856707A (en) * | 2015-01-18 | 2016-08-17 | 朱继承 | Separable printed film, composite type printed structure and manufacturing method thereof |
| CN105856707B (en) * | 2015-01-18 | 2019-04-16 | 昇印光电（昆山）股份有限公司 | One kind can release printing film, compound print structure and production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330000 Jiangxi city of Nanchang province Huangjiahu road Nanchang economic and Technological Development Zone Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330000 Jiangxi city of Nanchang province Huangjiahu road Nanchang economic and Technological Development Zone Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330000 Jiangxi city of Nanchang province Huangjiahu road Nanchang economic and Technological Development Zone Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330000 Jiangxi city of Nanchang province Huangjiahu road Nanchang economic and Technological Development Zone Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210421 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330000 Jiangxi city of Nanchang province Huangjiahu road Nanchang economic and Technological Development Zone Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20180510 Decision number of declaring invalidation: 35832 Granted publication date: 20140326 |
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| IW01 | Full invalidation of patent right |