CN104347154B - A kind of nesa coating - Google Patents
A kind of nesa coating Download PDFInfo
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- CN104347154B CN104347154B CN201310328558.8A CN201310328558A CN104347154B CN 104347154 B CN104347154 B CN 104347154B CN 201310328558 A CN201310328558 A CN 201310328558A CN 104347154 B CN104347154 B CN 104347154B
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Abstract
The invention provides a kind of nesa coating, including：Substrate or surface are formed with the substrate of hypothallus；Conductive layer, the conductive layer is to be arranged at the latticed conductive layer in the substrate or on the hypothallus, and extends to invisible range；Flexible connecting members, the flexible connecting members include substrate and the lead electrode being arranged on the substrate, and the flexible connecting members are fitted with the grid that the conductive layer extends to invisible range and realize the electrical connection of lead electrode and conductive layer.The present invention carries out realization electrical connection of fitting by the way that the flexible connecting members with leaded electrode and conductive layer are extended into invisible range grid, prior art can be solved by during lead electrode and conductive layer one-shot forming, because the grid at lead is closeer, the problem of bad phenomenons such as short circuit, cut are produced can be caused.
Description
Technical field
The present invention relates to a kind of nesa coating, belong to electronic display technology conducting film field, more particularly to one kind is used for
The nesa coating of touch-screen.
Background technology
Nesa coating is that have a kind of film of high transmission rate with satisfactory electrical conductivity and in visible light wave range.At present thoroughly
Bright conducting film is widely used to the fields such as FPD, photovoltaic device, contact panel and electromagnetic shielding, with extremely wide
The market space.
In the making field of touch-screen, nesa coating is used as the sensing member that the input signals such as touch are received in touch-screen
Part, therefore be the critical elements of guarantee and lifting touch screen performance.At present, it is in touch-screen to use ITO more（Tin indium oxide）Film,
It is vital part in nesa coating as the ITO layer of conductive layer.Although the manufacturing technology of touch-screen one day thousand
In develop rapidly, but by taking projecting type capacitor screen as an example, the basic manufacturing process of ITO layer does not occur too big in recent years
Change, it is inevitable the need for ito film is formed in substrate and graphical.But, indium is a kind of expensive metal material,
Ito film largely improves the cost of touch-screen as conductive layer, and ITO conductive layer is in patterning process, need by
Whole face ito film layer is by mask etch to form pattern, and this large amount of ito film is etched, and also results in the serious of noble metal
Waste and pollute.
On the other hand, in the making of transparent conductive film, the connection of conductive layer and lead electrode is by one-shot forming work
Skill is completed, i.e.,：Conductive layer is first extended into invisible range, then directly lead is formed on the conductive layer grid of the invisible range
Electrode, realizes the electrical connection of conductive layer and lead electrode.The connected mode of this conductive layer and lead electrode, understands at due to lead
Grid it is closeer, cause lead short circuit, the phenomenon such as cut occur, cause fraction defective to increase.
The content of the invention
Technical problem underlying solved by the invention, is to provide a kind of transparent conductive film, by will be with leaded electricity
The flexible connecting members of pole extend to invisible range grid with conductive layer and carry out realization electrical connection of fitting, and can solve prior art
During lead electrode and conductive layer one-shot forming, because the grid at lead is closeer, short circuit, cut etc. can be caused no
The problem of good phenomenon is produced.
The invention provides a kind of nesa coating, including：
Substrate or surface are formed with the substrate of hypothallus；
Conductive layer, the conductive layer is to be arranged at the latticed conductive layer in the substrate or on the hypothallus, and is prolonged
Extend invisible range；
Flexible connecting members, the flexible connecting members include substrate and the lead electrode being arranged on the substrate,
The flexible connecting members are fitted with the grid that the conductive layer extends to invisible range realizes being electrically connected for lead electrode and conductive layer
Connect.
In a kind of embodiment of the present invention, the flexible connecting members extend to not visible with the conductive layer
The laminating of the grid in area is fitted by conducting resinl, wherein the conducting resinl can be anisotropic conductive adhesive paste etc..
In one embodiment of the invention, the substrate or the hypothallus are provided with latticed groove, and should
Filled with conductive material formation conductive layer in latticed groove.Wherein, the bottom of the latticed groove is 500nm provided with depth
~1 μm of micro-groove, the section of the micro-groove can be in the shape of the letter V, W fonts, arc or waveform, and the miniature slot structure can
Conductive material is prevented in conductive material polycondensation breaks to form open circuit.Further, the width of the latticed groove is 1 μm
~5 μm, depth is 2 μm~6 μm, and the ratio of depth and width is more than in 1, the present invention program, when opening up above-mentioned micro-groove, institute
The height for stating groove is interpreted as the maximum height of groove；The grid of the latticed groove be regular grid or random grid,
Wherein described regular grid is square net, rectangular mesh, the side row grid of equality four or regular hexagonal cell.The present invention's
In another embodiment, the conductive layer can also be patterned in the substrate or the hypothallus and form projection
Structure.
In one embodiment of the invention, the conductive layer is latticed, by filling conductive into the groove
Material（Conductive slurries）, then sinter and form the latticed conductive layer.Further, the material of the conductive material includes
Silver, copper or conducting polymer.
In the nesa coating that the present invention is provided, lead electrode is first arranged on the substrate of flexible connecting members, is passed through
Flexible connecting members（Such as FPC connector）And the combination of conductive layer, beneficial to ensure the two connection effect and conducting film matter
Amount.
Lead electrode used in the present invention is linear, and the line width of lead electrode is 50-200 μm, is highly 5-10 μ
m.Further, the lead electrode can be formed by modes such as silk-screen printing, impressing or inkjet printings.Wherein, it is described to draw
Line electrode be the substrates of flexible connecting members is imprinted formed by groove type lead electrode；Or in flexible connecting portion
The lead electrode of bulge-structure formed by being patterned on the substrate of part.
The material of substrate used in the present invention is thermoplastic, and the thermoplastic is makrolon, poly- methyl
Methyl acrylate or polyethylene terephthalate；The layer material of the matrix is ultraviolet cured adhesive, impressing glue or poly- carbon
Acid esters.
The material of substrate used in the present invention is thermoplastic, and the thermoplastic is makrolon, poly- methyl
Methyl acrylate or polyethylene terephthalate.
The present invention has the advantages that compared to prior art：
1st, nesa coating of the invention can use the conductive material of relative low price, its production cost relative to
Substantially reduced for ITO conducting films.
2nd, transparent conductive film of the invention, by the way that the flexible connecting members with leaded electrode and conductive layer are extended to
Invisible range grid carries out laminating and realizes electrical connection, can solve prior art by lead electrode and conductive layer one-shot forming process
In, because the grid at lead is closeer, the problem of bad phenomenons such as short circuit, cut are produced can be caused.
Brief description of the drawings
Fig. 1 is the nesa coating schematic cross-section of an embodiment.
Fig. 2 is the nesa coating schematic cross-section of another embodiment.
Fig. 3（a）- Fig. 3（b）For the nesa coating floor map of an embodiment.
Fig. 4 is the structural representation of the latticed bottom portion of groove grid of an embodiment.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the embodiment of the present invention, to this
Technical scheme in inventive embodiments is clearly and completely described, it is clear that described embodiment is that a part of the invention is real
Apply example, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation
Property work under the premise of the every other embodiment that is obtained, belong to the scope of protection of the invention.
Embodiment 1
With reference to shown in Fig. 1, the nesa coating in the present embodiment, including substrate 101, hypothallus 102, the and of conductive layer 103
Flexible connecting members 104 with leaded electrode, wherein the hypothallus 102 is in the substrate 101, the conductive layer
103 and the leaded electrode of the band around property connection member 104 on the hypothallus 102.
With reference to Fig. 3（a）- Fig. 3（b）And Fig. 1, the flexible connecting members 104 include substrate and are arranged at the base
Lead electrode on piece, and the lead electrode includes internal wiring terminal 303 and the lead 302 being connected with internal wiring terminal 303,
The grid 301 that the internal wiring terminal 303 extends to invisible range with the conductive layer 103 is fitted by anisotropic conductive adhesive paste
Realize electrical connection.
In the present embodiment, it is provided with hypothallus 102 by latticed groove formed by impressing mode, and by material
It is filled in for the conductive material of copper in the latticed groove；The width of wherein described latticed groove be 1 μm~5 μm, depth
For 2 μm~6 μm, the ratio of depth and width is more than 1, and the grid of the latticed groove can be regular grid or Stochastic Networks
Lattice, the regular grid can be square net, rectangular mesh, the side row grid of equality four or regular hexagonal cell；Also,
The bottom of the latticed groove provided with depth be 500nm~1 μm micro-groove, the miniature slot cross-section is in the shape of the letter V, W fonts,
Arc or waveform（Shown in Fig. 4）.
In the present embodiment, lead electrode is linear, and the line width of lead electrode is 50-200 μm, is highly 5-10 μm.
It can be made by following manner：1）The graphical groove on substrate, is particularly provided with micro-groove in the bottom of groove, is used for
Reduce contraction of the conductive material in dry solidification, so as to prevent conductive material to be broken and form open circuit；2）Utilize the side such as blade coating
Formula fills conductive material in a groove（Such as silver ink）, then it is sintered, so as to form groove type lead in a groove
Electrode.One-shot forming technique described above is also applied for the formation of conductive layer, and therefore not to repeat here.
The material of substrate used in the present embodiment is thermoplastic, such as makrolon（PC）, polymethylacrylic acid
Methyl esters（PMMA）Or polyethylene terephthalate（PET）；The material of the hypothallus be ultraviolet cured adhesive, impressing glue or
Makrolon, it can be formed in the substrate 101 by modes such as blade coating, sprayings.
The material of substrate is thermoplastic, such as makrolon used in the present embodiment（PC）, poly-methyl methacrylate
Ester（PMMA）Or polyethylene terephthalate（PET）.
The visible light transmissivity for the nesa coating that the present embodiment is provided is not less than 86%.Particularly, the nesa coating can
Making for touch-screen.
Embodiment 2
With reference to shown in Fig. 2, the nesa coating in the present embodiment, including substrate 201, hypothallus 202, the and of conductive layer 203
Flexible connecting members 204 with leaded electrode, wherein the hypothallus 202 is in the substrate 201, the conductive layer
203 and the leaded electrode of the band around property connection member 204 on the hypothallus 202.
With reference to Fig. 3（a）- Fig. 3（b）And Fig. 2, the flexible connecting members 204 include substrate and are arranged at the base
Lead electrode on piece, and the lead electrode includes internal wiring terminal 303 and the lead 302 being connected with internal wiring terminal 303,
The grid 301 that the internal wiring terminal 303 extends to invisible range with the conductive layer 203 is fitted by anisotropic conductive adhesive paste
Realize electrical connection.
In the present embodiment, it is provided with hypothallus 202 by latticed groove formed by impressing mode, and by material
It is located at for the conductive material of silver in the latticed groove；The width of wherein described latticed groove is 1 μm~5 μm, and depth is 2
μm~6 μm, the ratio of depth and width is more than 1, and the grid of the latticed groove can be regular grid or random grid, institute
It can be square net, rectangular mesh, the side row grid of equality four or regular hexagonal cell to state regular grid；Also, described
The bottom of latticed groove is provided with the micro-groove that depth is 500nm~1 μm, and the miniature slot cross-section is in the shape of the letter V, W fonts, arc
Or waveform（Shown in Fig. 4）.
In the present embodiment, lead electrode is linear, and the line width of lead electrode is 50-200 μm, is highly 5-10 μm.
It can be made by following manner：The lead electrode of projection is formed on the surface of substrate by methods such as chemical wet etchings.Wherein,
The chemical wet etching can specifically include：Conductive photoreceptor material is coated with the surface of substrate, is then exposed by shadow shield
Processing, it is etched, form the convex type lead electrode.
The material of substrate used in the present embodiment is thermoplastic, such as makrolon（PC）, polymethylacrylic acid
Methyl esters（PMMA）Or polyethylene terephthalate（PET）；The material of the hypothallus be ultraviolet cured adhesive, impressing glue or
Makrolon, it can be formed in the substrate 201 by modes such as blade coating, sprayings.
The material of substrate is thermoplastic, such as makrolon used in the present embodiment（PC）, poly-methyl methacrylate
Ester（PMMA）Or polyethylene terephthalate（PET）.
The visible light transmissivity for the nesa coating that the present embodiment is provided is not less than 86%.Particularly, the nesa coating can
Making for touch-screen.
As the change of above-mentioned specific embodiment, the conductive layer in embodiment 1 and embodiment 2 can also be directly in substrate
101 or substrate 201 on formed, generation type can for impressing etc..The structure and connected mode of lead electrode then with above-mentioned implementation
Example is identical.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (12)
1. a kind of nesa coating, it is characterised in that including：
Substrate or surface are formed with the substrate of hypothallus；
Conductive layer, the conductive layer is to be arranged at the latticed conductive layer in the substrate or on the hypothallus, and is extended to
Invisible range；
Flexible connecting members, the flexible connecting members include substrate and the lead electrode being arranged on the substrate, and this is scratched
Property connection member is fitted with the grid that the conductive layer extends to invisible range realizes the electrical connection of lead electrode and conductive layer.
2. nesa coating according to claim 1, it is characterised in that the flexible connecting members prolong with the conductive layer
The laminating for extending the grid of invisible range is fitted by conducting resinl.
3. nesa coating according to claim 1, it is characterised in that the substrate or the hypothallus are provided with grid
Filled with conductive material formation conductive layer in shape groove, the latticed groove.
4. nesa coating according to claim 3, it is characterised in that the bottom of the latticed groove is provided with depth
The micro-groove of 500nm~1 μm, the section of the micro-groove is in the shape of the letter V, W fonts, arc or waveform.
5. nesa coating according to claim 3, it is characterised in that the latticed groove is to the substrate or institute
State hypothallus impressing and formed.
6. the nesa coating according to any one of claim 3-5, it is characterised in that the width of the latticed groove
For 1 μm~5 μm, depth is 2 μm~6 μm, and the ratio of depth and width is more than 1.
7. the nesa coating according to any one of claim 3-5, it is characterised in that the grid of the latticed groove
For regular grid or random grid, wherein the regular grid is square net, rectangular mesh or regular hexagonal cell.
8. nesa coating according to claim 1, it is characterised in that the lead electrode is linear, and lead is electric
The line width of pole is 50-200 μm, is highly 5-10 μm.
9. the nesa coating according to claim 1 or 8, it is characterised in that the lead electrode is to flexible connecting portion
The substrate of part imprinted formed by groove type lead electrode；Or to be patterned on the substrate of flexible connecting members
Formed by bulge-structure lead electrode.
10. nesa coating according to claim 3, it is characterised in that the material of the conductive material include silver, copper or
Conducting polymer.
11. the nesa coating according to claim 1 or 3, it is characterised in that the material of the substrate is thermoplasticity material
Material, the thermoplastic is makrolon, polymethyl methacrylate or polyethylene terephthalate；The hypothallus
Material be ultraviolet cured adhesive, impressing glue or makrolon.
12. nesa coating according to claim 1, it is characterised in that the material of the substrate is thermoplastic, institute
Thermoplastic is stated for makrolon, polymethyl methacrylate or polyethylene terephthalate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328558.8A CN104347154B (en) | 2013-07-31 | 2013-07-31 | A kind of nesa coating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328558.8A CN104347154B (en) | 2013-07-31 | 2013-07-31 | A kind of nesa coating |
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| CN104347154A CN104347154A (en) | 2015-02-11 |
| CN104347154B true CN104347154B (en) | 2017-11-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106218880A (en) * | 2016-08-30 | 2016-12-14 | 成都创客空间科技有限公司 | A kind of aircraft containing macromolecule conducting material |
| CN113572872B (en) * | 2021-07-13 | 2022-11-22 | 荣耀终端有限公司 | Transmission assembly and foldable electronic equipment |
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| CN102479016A (en) * | 2010-11-26 | 2012-05-30 | 奇美电子股份有限公司 | Touch screen |
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| CN103165226A (en) * | 2013-03-28 | 2013-06-19 | 南昌欧菲光科技有限公司 | Transparent conductive film and preparation method thereof |
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| JP3491415B2 (en) * | 1995-01-13 | 2004-01-26 | セイコーエプソン株式会社 | Manufacturing method of liquid crystal display device |
| JP4273702B2 (en) * | 2002-05-08 | 2009-06-03 | 凸版印刷株式会社 | Manufacturing method of conductive film |
| CN102903423B (en) * | 2012-10-25 | 2015-05-13 | 南昌欧菲光科技有限公司 | Conduction structure in transparent conduction film, transparent conduction film and manufacture method thereof |
| CN203376990U (en) * | 2013-07-31 | 2014-01-01 | 南昌欧菲光科技有限公司 | Transparent conductive film |
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Patent Citations (4)
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|---|---|---|---|---|
| CN201765581U (en) * | 2009-09-21 | 2011-03-16 | 株式会社和冠 | Position detection device |
| CN102782624A (en) * | 2010-03-03 | 2012-11-14 | 未来奈米科技股份有限公司 | Capacitive touch panel and manufacturing method for same |
| CN102479016A (en) * | 2010-11-26 | 2012-05-30 | 奇美电子股份有限公司 | Touch screen |
| CN103165226A (en) * | 2013-03-28 | 2013-06-19 | 南昌欧菲光科技有限公司 | Transparent conductive film and preparation method thereof |
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Effective date of registration: 20180927 Address after: 330000 room 1408, red Gucheng tower, 545 Exhibition Road, Nanchang, Jiangxi. Patentee after: Nanchang Institute of virtual reality Limited by Share Ltd Address before: 330013 Jiangxi, Nanchang, Chang Bei Economic Development Zone Huang Jia Hu Road, Ophelia Light Technology Park Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Co-patentee before: Suzhou OFilm Tech. Co.,Ltd. |