CN203376990U - Transparent conductive film - Google Patents
Transparent conductive film Download PDFInfo
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- CN203376990U CN203376990U CN201320463567.3U CN201320463567U CN203376990U CN 203376990 U CN203376990 U CN 203376990U CN 201320463567 U CN201320463567 U CN 201320463567U CN 203376990 U CN203376990 U CN 203376990U
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- conductive layer
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- nesa coating
- groove
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Abstract
The utility model provides a transparent conductive film, which comprises a substrate or a substrate whose surface is provided with a base material layer, a conductive layer and a flexible connecting component, wherein the conductive layer is arranged on the substrate or the base material layer, and extends to an invisible area; and the flexible connecting component comprises a base plate and a lead electrode arranged on the base plate. The flexible connecting component is adhered to grids, which extend to the invisible area, of the conductive layer so as to realize electrical connection between the lead electrode and the conductive layer. According to the utility model, the electrical connection is realized through adhering the flexible connecting component with the lead electrode to the grids, which extend to the invisible area, of the conductive layer, thereby being capable of solving a problem that undesirable phenomena such as short circuit, scratches and the like occur in a one-time molding process of the lead electrode and the conductive layer in the prior art because the grids where a lead is located are relatively dense.
Description
Technical field
The utility model relates to a kind of nesa coating, belongs to electronic display technology conducting film field, relates in particular to a kind of nesa coating for touch-screen.
Background technology
Nesa coating is a kind of film that has satisfactory electrical conductivity and have high transmission rate at visible light wave range.Nesa coating has been widely used in the fields such as flat panel display, photovoltaic device, contact panel and electromagnetic shielding at present, has the extremely wide market space.
In the making field of touch-screen, nesa coating, as receiving the sensing element of the input signals such as touch in touch-screen, is therefore the critical elements that guarantees and promote touch screen performance.At present, ITO(tin indium oxides that use in touch-screen) film is vital part in nesa coating as the ITO layer of conductive layer more.Although the develop rapidly at a tremendous pace of the manufacturing technology of touch-screen, take the projecting type capacitor screen as example, too large change does not occur in the basic manufacturing process of ITO layer in recent years, inevitably need in substrate, form ITO film and graphical.But, indium is a kind of metal material of costliness, the ITO film is as conductive layer, promoted to a great extent the cost of touch-screen, and the ITO conductive layer is in graphical technique, need be by whole ITO rete by mask etch to form pattern, a large amount of like this ITO films is etched, also causes serious waste and the pollution of noble metal.
On the other hand, in the making of transparent conductive film, conductive layer is to complete by one-shot forming technique with being connected of electrode of lead-in wire, that is: first conductive layer is extended to invisible range, then directly on the conductive layer grid of this invisible range, form the lead-in wire electrode, realize being electrically connected to of conductive layer and the electrode that goes between.The connected mode of this conductive layer and lead-in wire electrode, can cause lead-in wire the phenomenons such as short circuit, cut to occur because the grid at lead-in wire place is closeer, causes fraction defective to increase.
The utility model content
The technical problem underlying that the utility model solves, be to provide a kind of transparent conductive film, fit and realize being electrically connected to by extending to the invisible range grid with the flexible connection parts of leaded electrode and conductive layer, can solve prior art will go between in electrode and conductive layer one-shot forming process, because the grid at the lead-in wire place is closeer, the problem that can cause the bad phenomenon such as short circuit, cut to produce.
The utility model provides a kind of nesa coating, comprising:
Substrate or surface are formed with the substrate of hypothallus;
Conductive layer, described conductive layer is to be arranged in described substrate or the latticed conductive layer on described hypothallus, and extends to invisible range;
The flexible connection parts, described flexible connection parts comprise substrate and are arranged at described on-chip lead-in wire electrode, these flexible connection parts are realized being electrically connected to of lead-in wire electrode and conductive layer with the grid laminating that described conductive layer extends to invisible range.
Further, the laminating that described flexible connection parts and described conductive layer extend to the grid of invisible range is fitted by conducting resinl.
Further, described substrate or described hypothallus are provided with latticed groove, are filled with electric conducting material in this latticed groove and form conductive layer.
Further, the bottom of described latticed groove is provided with the micro-groove that the degree of depth is 500nm～1 μ m, and the cross section of described micro-groove is in the shape of the letter V, W font, arc or waveform.
Further, described latticed groove is for forming described substrate or described hypothallus impression.
Further, the width of described latticed groove is 1 μ m～5 μ m, and the degree of depth is 2 μ m～6 μ m, and the ratio of the degree of depth and width is greater than 1.
Further, the grid of described latticed groove is regular grid or random grid, and wherein said regular grid is square net, rectangular mesh, equality four limit row grid or regular hexagonal cells.
Further, described lead-in wire electrode is linear, and the lead-in wire electrode live width be 50-200 μ m, be highly 5-10 μ m.
Further, the groove type lead-in wire electrode that described lead-in wire electrode is formed for the substrate to the flexible connection parts impresses; Perhaps for carrying out the lead-in wire electrode of the graphical bulge-structure formed on the substrate at the flexible connection parts.
In a kind of execution mode of the present utility model, described substrate or described hypothallus are provided with latticed groove, and are filled with electric conducting material formation conductive layer in this latticed groove.Wherein, the bottom of described latticed groove is provided with the micro-groove that the degree of depth is 500nm～1 μ m, the cross section of described micro-groove can be in the shape of the letter V, W font, arc or waveform, and described micro-groove structure can prevent when the electric conducting material polycondensation that breaking to form of electric conducting material from opening circuit.Further, the width of described latticed groove is 1 μ m～5 μ m, is highly 2 μ m～6 μ m, and the ratio of height and the width is greater than 1, and in the utility model scheme, when offering above-mentioned micro-groove, the height of described groove is interpreted as the maximum height of groove; The grid of described latticed groove is regular grid or random grid, and wherein said regular grid is square net, rectangular mesh, equality four limit row grid or regular hexagonal cells.In another kind of execution mode of the present utility model, described conductive layer can also carry out graphically forming bulge-structure on described substrate or described hypothallus.
In a kind of execution mode of the present utility model, described conductive layer is latticed, and by filled conductive material (conduction slurries) in described groove, then sintering forms described latticed conductive layer.Further, the material of described electric conducting material comprises silver, copper or conducting polymer.
In the nesa coating provided at the utility model, the lead-in wire electrode first is arranged on the substrate of flexible connection parts, for example, by the combination of flexible connection parts (FPC connector) and conductive layer, is beneficial to the connection effect that guarantees the two and the quality of conducting film.
The lead-in wire electrode that the utility model is used is linear, and the lead-in wire electrode live width be 50-200 μ m, be highly 5-10 μ m.Further, described lead-in wire electrode can form by modes such as silk screen printing, impression or inkjet printings.Wherein, the groove type lead-in wire electrode that described lead-in wire electrode is formed for the substrate to the flexible connection parts impresses; Perhaps for carrying out the lead-in wire electrode of the graphical bulge-structure formed on the substrate at the flexible connection parts.
The material of the substrate that the utility model is used is thermoplastic, and described thermoplastic is Merlon, polymethyl methacrylate or PETG; The layer material of described matrix is ultraviolet cured adhesive, impression glue or Merlon.
The material of the substrate that the utility model is used is thermoplastic, and described thermoplastic is Merlon, polymethyl methacrylate or PETG.
The utility model has following beneficial effect than prior art:
1, nesa coating of the present utility model can adopt the electric conducting material of relative low price, and its production cost greatly reduces for the ITO conducting film.
2, transparent conductive film of the present utility model, fit and realize being electrically connected to by extending to the invisible range grid with the flexible connection parts of leaded electrode and conductive layer, can solve prior art will go between in electrode and conductive layer one-shot forming process, because the grid at the lead-in wire place is closeer, the problem that can cause the bad phenomenon such as short circuit, cut to produce.
The accompanying drawing explanation
The nesa coating schematic cross-section that Fig. 1 is an execution mode.
The nesa coating schematic cross-section that Fig. 2 is another execution mode.
The nesa coating floor map that Fig. 3 (a)-Fig. 3 (b) is an execution mode.
The structural representation of the latticed bottom portion of groove grid that Fig. 4 is an execution mode.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making under the creative work prerequisite the every other embodiment obtained, and all belong to the scope of the utility model protection.
Embodiment 1
Shown in figure 1, nesa coating in the present embodiment, comprise substrate 101, hypothallus 102, conductive layer 103 and with the flexible connection parts 104 of leaded electrode, wherein said hypothallus 102 is located in described substrate 101, described conductive layer 103 and described being located on described hypothallus 102 around property link 104 with leaded electrode.
With reference to figure 3(a)-Fig. 3 (b) and Fig. 1, described flexible connection parts 104 include substrate and are arranged at described on-chip lead-in wire electrode, and described lead-in wire electrode comprises internal wiring terminal 303 and the lead-in wire 302 be connected with internal wiring terminal 303, described internal wiring terminal 303 is fitted and is realized being electrically connected to by anisotropic conductive with the grid 301 that described conductive layer 103 extends to invisible range.
In the present embodiment, be provided with the latticed groove formed by the impression mode on hypothallus 102, and the electric conducting material that is copper by material is filled in described latticed groove; The width of wherein said latticed groove is 1 μ m～5 μ m, the degree of depth is 2 μ m～6 μ m, the ratio of the degree of depth and width is greater than 1, the grid of described latticed groove can be regular grid or random grid, and described regular grid can be square net, rectangular mesh, equality four limit row grid or regular hexagonal cells; And being provided with the degree of depth in the bottom of described latticed groove is the micro-groove of 500nm～1 μ m, described micro-groove cross section is in the shape of the letter V, W font, arc or waveform (shown in Fig. 4).
In the present embodiment, the lead-in wire electrode is linear, and the lead-in wire electrode live width be 50-200 μ m, be highly 5-10 μ m.It can make by following manner: 1) graphical groove on substrate, particularly in the bottom of groove, be provided with micro-groove, and for reducing the contraction of electric conducting material when the dry solidification, thereby prevent the electric conducting material fracture and form and open circuit; 2) utilize mode filled conductive material (as the Nano Silver ink) in groove such as blade coating, then carry out sintering, thereby form groove type lead-in wire electrode in groove.One-shot forming technique described above also is applicable to the formation of conductive layer, and therefore not to repeat here.
The material of the substrate of using in the present embodiment is thermoplastic, as Merlon (PC), polymethyl methacrylate (PMMA) or PETG (PET); The material of described hypothallus is ultraviolet cured adhesive, impression glue or Merlon, and it can be formed in described substrate 101 by modes such as blade coating, sprayings.
In the present embodiment, the material of the substrate that uses is thermoplastic, as Merlon (PC), polymethyl methacrylate (PMMA) or PETG (PET).
The visible light transmissivity of the nesa coating that the present embodiment provides is not less than 86%.Particularly, this nesa coating can be used for the making of touch-screen.
Embodiment 2
Shown in figure 2, nesa coating in the present embodiment, comprise substrate 201, hypothallus 202, conductive layer 203 and with the flexible connection parts 204 of leaded electrode, wherein said hypothallus 202 is located in described substrate 201, described conductive layer 203 and described being located on described hypothallus 202 around property link 204 with leaded electrode.
With reference to figure 3(a)-Fig. 3 (b) and Fig. 2, described flexible connection parts 204 include substrate and are arranged at described on-chip lead-in wire electrode, and described lead-in wire electrode comprises internal wiring terminal 303 and the lead-in wire 302 be connected with internal wiring terminal 303, described internal wiring terminal 303 is fitted and is realized being electrically connected to by anisotropic conductive with the grid 301 that described conductive layer 203 extends to invisible range.
In the present embodiment, be provided with the latticed groove formed by the impression mode on hypothallus 202, and be that silver-colored electric conducting material is located in described latticed groove by material; The width of wherein said latticed groove is 1 μ m～5 μ m, the degree of depth is 2 μ m～6 μ m, the ratio of the degree of depth and width is greater than 1, the grid of described latticed groove can be regular grid or random grid, and described regular grid can be square net, rectangular mesh, equality four limit row grid or regular hexagonal cells; And being provided with the degree of depth in the bottom of described latticed groove is the micro-groove of 500nm～1 μ m, described micro-groove cross section is in the shape of the letter V, W font, arc or waveform (shown in Fig. 4).
In the present embodiment, the lead-in wire electrode is linear, and the lead-in wire electrode live width be 50-200 μ m, be highly 5-10 μ m.It can make by following manner: form protruding lead-in wire electrode on the surface of substrate by methods such as chemical wet etchings.Wherein, described chemical wet etching specifically can comprise: the surface-coated conductive photoreceptor material at substrate, then by shadow shield, carry out exposure-processed, and through etching, form described convex type lead-in wire electrode.
The material of the substrate of using in the present embodiment is thermoplastic, as Merlon (PC), polymethyl methacrylate (PMMA) or PETG (PET); The material of described hypothallus is ultraviolet cured adhesive, impression glue or Merlon, and it can be formed in described substrate 201 by modes such as blade coating, sprayings.
In the present embodiment, the material of the substrate that uses is thermoplastic, as Merlon (PC), polymethyl methacrylate (PMMA) or PETG (PET).
The visible light transmissivity of the nesa coating that the present embodiment provides is not less than 86%.Particularly, this nesa coating can be used for the making of touch-screen.
As the variation of above-mentioned specific embodiments, the conductive layer in embodiment 1 and embodiment 2 also can be directly forms in substrate 101 or substrate 201, and generation type can be for impression etc.Structure and the connected mode of lead-in wire electrode are same as the previously described embodiments.
Finally it should be noted that: above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although with reference to previous embodiment, the utility model is had been described in detail, those of ordinary skill in the art is to be understood that: its technical scheme that still can put down in writing aforementioned each embodiment is modified, or part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (9)
1. a nesa coating, is characterized in that, comprising:
Substrate or surface are formed with the substrate of hypothallus;
Conductive layer, described conductive layer is to be arranged in described substrate or the latticed conductive layer on described hypothallus, and extends to invisible range;
The flexible connection parts, described flexible connection parts comprise substrate and are arranged at described on-chip lead-in wire electrode, these flexible connection parts are realized being electrically connected to of lead-in wire electrode and conductive layer with the grid laminating that described conductive layer extends to invisible range.
2. nesa coating according to claim 1, is characterized in that, described flexible connection parts and described conductive layer extend to the laminating of the grid of invisible range and fitted by conducting resinl.
3. nesa coating according to claim 1, is characterized in that, described substrate or described hypothallus are provided with latticed groove, is filled with electric conducting material in this latticed groove and forms conductive layer.
4. nesa coating according to claim 3, is characterized in that, the bottom of described latticed groove is provided with the micro-groove that the degree of depth is 500nm～1 μ m, and the cross section of described micro-groove is in the shape of the letter V, W font, arc or waveform.
5. nesa coating according to claim 3, is characterized in that, described latticed groove is for forming described substrate or described hypothallus impression.
6. according to the described nesa coating of any one in claim 3-5, it is characterized in that, the width of described latticed groove is 1 μ m～5 μ m, and the degree of depth is 2 μ m～6 μ m, and the ratio of the degree of depth and width is greater than 1.
7. according to the described nesa coating of any one in claim 3-5, it is characterized in that, the grid of described latticed groove is regular grid or random grid, and wherein said regular grid is square net, rectangular mesh, equality four limit row grid or regular hexagonal cells.
8. nesa coating according to claim 1, is characterized in that, described lead-in wire electrode is linear, and the lead-in wire electrode live width be 50-200 μ m, be highly 5-10 μ m.
9. according to the described nesa coating of claim 1 or 8, it is characterized in that the groove type lead-in wire electrode that described lead-in wire electrode is formed for the substrate to the flexible connection parts impresses; Perhaps for carrying out the lead-in wire electrode of the graphical bulge-structure formed on the substrate at the flexible connection parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320463567.3U CN203376990U (en) | 2013-07-31 | 2013-07-31 | Transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320463567.3U CN203376990U (en) | 2013-07-31 | 2013-07-31 | Transparent conductive film |
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| Publication Number | Publication Date |
|---|---|
| CN203376990U true CN203376990U (en) | 2014-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201320463567.3U Withdrawn - After Issue CN203376990U (en) | 2013-07-31 | 2013-07-31 | Transparent conductive film |
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| CN (1) | CN203376990U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347154A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| CN105856707A (en) * | 2015-01-18 | 2016-08-17 | 朱继承 | Separable printed film, composite type printed structure and manufacturing method thereof |
| CN107622817A (en) * | 2016-07-15 | 2018-01-23 | 昇印光电（昆山）股份有限公司 | A kind of flexible electrode film, preparation method and application |
| CN108228002A (en) * | 2018-02-11 | 2018-06-29 | 业成科技（成都）有限公司 | Touch panel and apply its touch control display apparatus |
| CN110544551A (en) * | 2018-05-29 | 2019-12-06 | 昇印光电（昆山）股份有限公司 | Conductive film and preparation method |
-
2013
- 2013-07-31 CN CN201320463567.3U patent/CN203376990U/en not_active Withdrawn - After Issue
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347154A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| CN105856707A (en) * | 2015-01-18 | 2016-08-17 | 朱继承 | Separable printed film, composite type printed structure and manufacturing method thereof |
| CN105856707B (en) * | 2015-01-18 | 2019-04-16 | 昇印光电（昆山）股份有限公司 | One kind can release printing film, compound print structure and production method |
| CN107622817A (en) * | 2016-07-15 | 2018-01-23 | 昇印光电（昆山）股份有限公司 | A kind of flexible electrode film, preparation method and application |
| CN107622817B (en) * | 2016-07-15 | 2020-04-07 | 昇印光电（昆山）股份有限公司 | Preparation method of flexible electrode film |
| CN111354508A (en) * | 2016-07-15 | 2020-06-30 | 昇印光电（昆山）股份有限公司 | Flexible electrode film and application |
| CN111354508B (en) * | 2016-07-15 | 2022-08-19 | 昇印光电（昆山）股份有限公司 | Flexible electrode film and application |
| CN108228002A (en) * | 2018-02-11 | 2018-06-29 | 业成科技（成都）有限公司 | Touch panel and apply its touch control display apparatus |
| CN108228002B (en) * | 2018-02-11 | 2021-08-24 | 业成科技（成都）有限公司 | Touch panel and touch display device using same |
| CN110544551A (en) * | 2018-05-29 | 2019-12-06 | 昇印光电（昆山）股份有限公司 | Conductive film and preparation method |
| CN110544551B (en) * | 2018-05-29 | 2021-05-11 | 昇印光电（昆山）股份有限公司 | Conductive film and preparation method |
| US11443873B2 (en) | 2018-05-29 | 2022-09-13 | Shine Optoelectronics (Kunshan) Co., Ltd | Conductive film and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140101 Effective date of abandoning: 20171103 |