CN102063232A - Structure of capacitance type multi-point touch-control panel and manufacturing method thereof - Google Patents
Structure of capacitance type multi-point touch-control panel and manufacturing method thereof Download PDFInfo
- Publication number
- CN102063232A CN102063232A CN2009102223639A CN200910222363A CN102063232A CN 102063232 A CN102063232 A CN 102063232A CN 2009102223639 A CN2009102223639 A CN 2009102223639A CN 200910222363 A CN200910222363 A CN 200910222363A CN 102063232 A CN102063232 A CN 102063232A
- Authority
- CN
- China
- Prior art keywords
- matrix electrodes
- forming step
- conducting wire
- upper substrate
- scale
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 239000011159 matrix material Substances 0.000 claims abstract description 108
- 238000000034 method Methods 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000004568 cement Substances 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 238000012360 testing method Methods 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 11
- 239000012780 transparent material Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 238000012956 testing procedure Methods 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 4
- 230000011218 segmentation Effects 0.000 claims description 4
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000005341 toughened glass Substances 0.000 claims description 2
- 238000013518 transcription Methods 0.000 claims description 2
- 230000035897 transcription Effects 0.000 claims description 2
- 238000001312 dry etching Methods 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Electronic Switches (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a structure of a capacitance type multi-point touch-control panel and a manufacturing method thereof. The structure comprises an outer-layer lens and a touch-control sensing chip which are combined into a whole by using transparent optical cement. The outer-layer lens comprises an upper substrate, a first matrix electrode, an ink pattern and a conducting circuit, wherein the touch-control sensing chip comprises a lower substrate and a second matrix electrode. The manufacturing method comprises the following steps of a large substrate feeding process and a small substrate feeding process, wherein the large substrate feeding process comprises a first matrix electrode forming step, an ink pattern forming step, a conducting circuit forming step, a second matrix electrode forming step, a plying step and a dividing step, and the first matrix electrode forming process comprises a packaging step and a testing step. The reliability of the capacitance type multi-point touch-control panel can be effectively improved, the production efficiency can be increased and the production cost can be lowered.
Description
Technical field
The present invention relates to a kind of structure of condenser type multi-point touch panel, and a kind of method for making of condenser type multi-point touch panel.
Background technology
Consult Fig. 1, be the diagrammatic cross-section of prior art condenser type multi-point touch panel construction.As shown in Figure 1, prior art multi-point touch panel 1 structure comprises outer eyeglass 10 and touch-control sensing sheet 20 two parts, and is combined into one with a transparent optical cement 30.Outer minute surface 10 comprises upper substrate 11 and ink logo 15, and comprises infrabasal plate 21, first matrix electrodes 23, second matrix electrodes 25, metallic circuit 27 and protective seam 29 by touch-control sensing sheet 20.Upper substrate 11 and infrabasal plate 21 are glass or transparent plastic; Ink logo 15 is formed on the upper substrate 11, and the layout of being printed for one deck printing ink at least is in order to the circuit that hides the below and increase the design aesthetic feeling; First matrix electrodes 23 and second matrix electrodes 25 are formed at two surfaces of infrabasal plate 21 respectively for transparent conductive material is generally tin indium oxide (ITO); Metal level is formed at the matrix electrodes outside and by top printing ink shelter, forms in the mode of metal wire, in order to reducing the resistance of second matrix electrodes, and connects outside flexible circuit board; Protective seam is generally the protective clear layer of silicon dioxide, in order to the protection metal level.
In the condenser type multi-point touch panel construction among Fig. 1, infrabasal plate 21 is as the dielectric material between first matrix electrodes 23 and second matrix electrodes 25, to produce capacity effect, but used thickness of glass is generally 0.4～0.7 centimetre, after contact panel is finished, because of first and second matrix electrodes distance too big, so that finger differs too big to its level of electric capacity signal of first matrix electrodes and the formation of second matrix electrodes respectively, and be difficult for identification, need to do compensation in addition with accurate decoding integrated circuit (IC).In addition; plate each indium oxide layer tin on the two sides of infrabasal plate; with current thin film transistor (thin film transistor; TFT) process apparatus or color filter (color filter; CF) process apparatus is incompatible; and need deposit protective seam 29 with protection metallic circuit 27 in the manufacture of semiconductor mode usually, make that production efficiency is low, manufacturing cost is quite expensive.
Consult Fig. 2, be the diagrammatic cross-section of the another kind of condenser type multi-point touch of prior art panel construction.As shown in Figure 2, in order to improve above-mentioned shortcoming, and form the structure of another kind of touch-control sensing sheet 40, comprise infrabasal plate 41, first matrix electrodes 43, second matrix electrodes 45, metallic circuit 47 and dielectric layer 49, metallic circuit 47 is formed between dielectric layer 49 and the infrabasal plate 41, and be connected with second matrix electrodes 45, wherein dielectric layer 49 is to replace first kind of infrabasal plate of the prior art (glass) dielectric layer with the film in the TFT processing procedure.Though this structure goes for existing thin film transistor (TFT) process apparatus, and dwindle first matrix electrodes 43 and second matrix electrodes, 45 distances, but because of the thickness that uses its dielectric layer of TFT processing procedure too thin again, cause user's finger electric capacity signal too faint, and must solve with the part line width that dwindles two electrode matrixes 43 and 45, its spinoff is exactly to need to utilize accurate micro-photographing process to make the wide electrode matrix of this fine rule, and the number of plies too much causes the processing procedure cost waste, and uses metallic circuit more to cause production reliability relatively poor.
In addition, consult Fig. 3, for looking synoptic diagram on the connected mode of prior art matrix electrodes and metallic circuit.As shown in Figure 3, other consults Fig. 1 and Fig. 2, metallic circuit 27,47 is formed between infrabasal plate 21 or infrabasal plate 41 and the dielectric layer 49, and connect second matrix electrodes 25 or 45, for the convenience on designing, usually the mode that equals interval width b with conducting wire width a designs, and forms width a less than interval width b after etching, because circuit is thinner, the yield of processing procedure is relatively poor.
Summary of the invention
The present invention is directed to the drawback of above-mentioned prior art, structure of a kind of condenser type multi-point touch panel and preparation method thereof is provided.
The structure of condenser type multi-point touch panel of the present invention comprises:
One outer eyeglass comprises a upper substrate, one first matrix electrodes, an ink logo and a conducting wire, and wherein this upper substrate is a transparent material; This first matrix electrodes is formed on this upper substrate, has one first matrix electrodes pattern, is a transparent conductive material; This ink logo is formed on this upper substrate, in order to hide the circuit of below, is an insulating material; This conducting wire is an electrically conductive paste materials, be formed on this ink logo and non-printing opacity place, and it is partly superimposed in this first matrix electrodes, in order to reduce the resistance of this first matrix electrodes, further connect a flexible circuit board, will be sent to this first matrix electrodes from the signal of a control chip;
One touch-control sensing sheet comprises an infrabasal plate and one second matrix electrodes, and wherein this infrabasal plate is a transparent material; This second matrix electrodes is a transparent conductive material and has one second matrix electrodes pattern, in order to produce a capacity effect with this first matrix electrodes; And
One optical cement; it is a transparent insulation colloid; as a dielectric material and binding material; have the surface of this first matrix electrodes and a surface with this second matrix electrodes of this touch-control sensing sheet in order to one of this skin eyeglass of fitting; form an electric capacity to cohere this first matrix electrodes and this second matrix electrodes, and protect this conducting wire.
The present invention also provides a kind of method for making of condenser type multi-point touch panel, and step comprises:
One first matrix electrodes forming step is to form one first matrix electrodes at a large-scale upper substrate;
One ink logo forming step is to embark on journey after the step finishing this first matrix electrodes, and at least one ink logo is printed on this large-scale upper substrate, and this ink logo can separate with one with this first matrix electrodes or partly superimposed at interval;
One conducting wire forming step is after finishing this ink logo forming step, and a conductive rubber is formed on this ink logo, this conductive rubber is solidified to form a conducting wire again;
One second matrix electrodes forming step is to form one first matrix electrodes at a large-scale infrabasal plate;
One applying step after this conducting wire forming step and this second matrix electrodes forming step are finished, should reach this large-scale infrabasal plate applying by large-scale upper substrate with a transparent optical cement, this optical cement was solidified again;
One segmentation procedure is after this applying step is finished, and this large-scale upper substrate and this large-scale infrabasal plate of having fitted cut into a plurality of condenser type multi-point touch panels; And
One encapsulation and testing procedure, this conducting wire of this condenser type multi-point touch panel after will cutting apart engages with a flexible circuit board, is packaged in the suitable module again, passes through a plurality of tests guaranteeing quality,
Wherein this first matrix electrodes forming step, this ink logo forming step and this conducting wire forming step and this second matrix electrodes forming step carry out simultaneously.
Structure of condenser type multi-point touch panel of the present invention and preparation method thereof; first matrix electrodes and conducting wire are formed in the outer eyeglass; the conducting wire uses the low conducting resinl material of chemical activity not to be vulnerable to oxidation and chemical corrosion; make fiduciary level increase, and can be with semiconductor or TFT manufacturing method thereof deposition protective seam.And reduce simultaneously the number of plies of structure as bonding and dielectric material with optical cement.In addition, add etching mode with printing and form electrode matrix and circuit, cost adds etch process more than the little shadow that uses semiconductor or TFT and comes lowly.The method for making of condenser type multi-point touch panel of the present invention in addition can use existing printed circuit board (PCB) process apparatus to finish, technology maturation, and have higher production efficiency.
Description of drawings
Fig. 1 is the diagrammatic cross-section of condenser type multi-point touch panel construction in the prior art.
Fig. 2 is the diagrammatic cross-section of another kind of condenser type multi-point touch panel construction in the prior art.
Fig. 3 is for looking synoptic diagram on the connected mode of matrix electrodes in the prior art and metallic circuit.
Fig. 4 is the diagrammatic cross-section of the structure of condenser type multi-point touch panel of the present invention.
Fig. 5 is the diagrammatic cross-section of the another kind of structure of touch-control sensing sheet of condenser type multi-point touch panel of the present invention.
Fig. 6 is for looking synoptic diagram on the connected mode of the present invention's first matrix electrodes and conducting wire.
Fig. 7 is the schematic flow sheet of condenser type multi-point touch panel making method of the present invention.
Embodiment
Those skilled in the art below cooperate Figure of description that embodiments of the present invention are done more detailed description, so that can implement after studying this instructions carefully according to this.
Consult Fig. 4, diagrammatic cross-section for the structure of condenser type multi-point touch panel of the present invention, as shown in Figure 4, the structure of condenser type multi-point touch panel 3 of the present invention comprises outer eyeglass 60 and touch-control sensing sheet 70 two parts, and is combined into one with a transparent optical cement 80.Outer eyeglass 60 comprises upper substrate 61, first matrix electrodes 63, ink logo 65 and conducting wire 67, and touch-control sensing sheet 70 from bottom to top comprises the infrabasal plate 71 and second matrix electrodes 75.
Consult Fig. 5, be the diagrammatic cross-section of the another kind of structure of the touch-control sensing sheet of condenser type multi-point touch panel of the present invention.As shown in Figure 5, touch-control sensing sheet 70 of the present invention particularly when the material of infrabasal plate 71 is flexual transparent material, can further comprise a gum 77 and a gum diaphragm in the below of infrabasal plate 71.
Consult Fig. 6, for looking synoptic diagram on the connected mode of the present invention's first matrix electrodes 63 and conducting wire 67.As shown in Figure 6, conducting wire 67 is formed on the ink logo 65, slightly is longer than the length of ink logo 65, and superimposed with the pattern part of first matrix electrodes 63.Directly conducting wire 67 is combined with ink logo 65 in the present invention, conducting wire 67 is lowered for the influence of vision, and can have the acceptance rate of the width of broad with the raising processing procedure, the conducting wire width c of most preferred embodiment of the present invention is 7: 3 to the ratio of interval width d, but does not limit therewith.
Consult Fig. 7, be the schematic flow sheet of the method for making of condenser type multi-point touch panel of the present invention.As shown in Figure 7, condenser type multi-point touch panel making method of the present invention comprises the first matrix electrodes forming step S12, ink logo forming step S14, conducting wire forming step S16, the second matrix electrodes forming step S20, applying step S30, segmentation procedure S40 and encapsulation and testing procedure S50, and wherein step S 12～16 carries out simultaneously with step S20.
The first matrix electrodes forming step S12 is that the electrode pattern with electrically conducting transparent is formed on the transparent large-scale upper substrate, the mode that forms can see through methods such as sputter, evaporation, plating or electroless plating transparent conductive material is deposited on the large-scale upper substrate, then, electrode pattern is isolated in direct more radium-shine processing; Or utilize method for photolithography, the mode of developing again with the light shield exposure behind the coating photoresistance is printed out electrode pattern, forms electrode pattern with etching mode again; Or use printing process directly etching paste to be printed on the transparency conducting layer, form electrode pattern with etching mode again.Wherein etching mode can be wet etching or dry ecthing.Ink logo forming step S14 finishes first matrix electrodes behind large-scale upper substrate, with mode of printing will be at least one deck ink logo be printed on the large-scale upper substrate, this ink logo can separate with one with first matrix electrodes or partly superimposed at interval.Conducting wire forming step S16 is formed at a conductive rubber on this ink logo with spraying mode of printing, transcription mode of printing, letterpress mode, intaglio printing mode or wire mark mode, and be connected with matrix electrodes, this conductive rubber is solidified to form the conducting wire, wherein this conductive rubber can be elargol, gold size, carbon paste or graphite glue etc. again.
The second matrix electrodes forming step S20 is that the electrode pattern with electrically conducting transparent is formed on the transparent large-scale infrabasal plate, in order to become capacity effect with this first matrix electrodes type, the mode that forms can see through methods such as sputter, evaporation, plating or electroless plating electrode material is deposited on the large-scale infrabasal plate, then, electrode pattern is isolated in direct more radium-shine processing; Or utilize method for photolithography, the mode of developing again with the light shield exposure behind the coating photoresistance is printed out electrode pattern, forms electrode pattern with etching mode again; Or use printing process directly etching paste to be printed on the transparency conducting layer, form electrode pattern with etching mode again.Wherein etching mode can be wet etching or dry ecthing.Applying step S30 aims at the back applying with transparent optical cement with the large-scale upper substrate and the large-scale infrabasal plate that have pattern respectively, optical cement is solidified again.Segmentation procedure S30 cuts into a plurality of condenser type multi-point touch panels with the large-scale upper and lower base plate that applying is finished.Encapsulation and testing procedure S50 engage the conducting wire with flexible circuit board, can further stick gum and gum diaphragm in the below (outside) of infrabasal plate in addition.The various tests of process are to guarantee the quality of condenser type multi-point touch panel then.
The above only is in order to explain preferred embodiment of the present invention; be not that attempt is done any pro forma restriction to the present invention according to this; therefore, all have in that identical creation spirit is following do relevant any modification of the present invention or change, all must be included in the category that the invention is intended to protect.
Claims (12)
1. the structure of a condenser type multi-point touch panel is characterized in that, comprises:
One outer eyeglass comprises a upper substrate, one first matrix electrodes, an ink logo and a conducting wire, and wherein this upper substrate is a transparent material; This first matrix electrodes is formed on this upper substrate, has one first matrix electrodes pattern, is a transparent conductive material; This ink logo is formed on this upper substrate, in order to hide the circuit of below, is an insulating material; This conducting wire is an electrically conductive paste materials, be formed on this ink logo and non-printing opacity place, and it is partly superimposed in this first matrix electrodes, in order to reduce the resistance of this first matrix electrodes, further connect a flexible circuit board, will be sent to this first matrix electrodes from the signal of a control chip;
One touch-control sensing sheet comprises an infrabasal plate and one second matrix electrodes, and wherein this infrabasal plate is a transparent material; This second matrix electrodes is a transparent conductive material and has one second matrix electrodes pattern, in order to produce a capacity effect with this first matrix electrodes; And
One optical cement; it is a transparent insulation colloid; as a dielectric material and binding material; have the surface of this first matrix electrodes and a surface with this second matrix electrodes of this touch-control sensing sheet in order to one of this skin eyeglass of fitting; form an electric capacity to cohere this first matrix electrodes and this second matrix electrodes, and protect this conducting wire.
2. structure as claimed in claim 1 is characterized in that, described touch-control sensing sheet further comprises a gum and a gum diaphragm do not form this second matrix electrodes in one of this infrabasal plate surface.
3. structure as claimed in claim 1 is characterized in that, this transparent material that forms this upper substrate and this infrabasal plate be a clear glass, a transparent tempered glass, a transparent plastic or a flexible transparent material at least one of them.
4. structure as claimed in claim 1 is characterized in that, this transparent conductive material that forms this first matrix electrodes and this second matrix electrodes is one of them of metal level of tin indium oxide, zinc oxide aluminum, indium zinc oxide or nano-scale.
5. structure as claimed in claim 1 is characterized in that, this electrically conductive paste materials that forms this conducting wire is one of them of an elargol, a gold size, a carbon paste or a graphite glue.
6. structure as claimed in claim 1 is characterized in that, this conducting wire has 1: 3 conducting channel width is to the interval width ratio.
7. the method for making of a condenser type multi-point touch panel is characterized in that step comprises:
One first matrix electrodes forming step is to form one first matrix electrodes at a large-scale upper substrate;
One ink logo forming step is to embark on journey after the step finishing this first matrix electrodes, and at least one ink logo is printed on this large-scale upper substrate, and this ink logo can separate with one with this first matrix electrodes or partly superimposed at interval;
One conducting wire forming step is after finishing this ink logo forming step, and a conductive rubber is formed on this ink logo, this conductive rubber is solidified to form a conducting wire again;
One second matrix electrodes forming step is to form one first matrix electrodes at a large-scale infrabasal plate;
One applying step after this conducting wire forming step and this second matrix electrodes forming step are finished, should reach this large-scale infrabasal plate applying by large-scale upper substrate with a transparent optical cement, this optical cement was solidified again;
One segmentation procedure is after this applying step is finished, and this large-scale upper substrate and this large-scale infrabasal plate of having fitted cut into a plurality of condenser type multi-point touch panels; And
One encapsulation and testing procedure, this conducting wire of this condenser type multi-point touch panel after will cutting apart engages with a flexible circuit board, is packaged in the suitable module again, passes through a plurality of tests guaranteeing quality,
Wherein this first matrix electrodes forming step, this ink logo forming step and this conducting wire forming step and this second matrix electrodes forming step carry out simultaneously.
8. method for making as claimed in claim 7, it is characterized in that, this first matrix electrodes forming step is to see through a sputter process, an evaporation processing procedure, an electroplating process or an electroless plating processing procedure, one transparent conductive material is deposited on this large-scale upper substrate, again with a radium-shine job operation or a method for photolithography and an engraving method or use a printing process directly an etching paste to be printed on this transparent conductive material, isolate one first matrix electrodes pattern respectively with this engraving method again, wherein this engraving method is a wet etch process or a dry-etching method.
9. method for making as claimed in claim 7 is characterized in that, this encapsulation and testing procedure further comprise this condenser type multi-point touch panel after cutting apart is coated with a gum and sticks a gum diaphragm in this large-scale infrabasal plate.
10. method for making as claimed in claim 7, it is characterized in that, this second matrix electrodes forming step is for seeing through a sputter process, an evaporation processing procedure, an electroplating process or an electroless plating processing procedure, one transparent conductive material is deposited on this large-scale infrabasal plate, again respectively or use a printing process directly an etching paste to be printed on this transparent conductive material with a radium-shine job operation or a method for photolithography and an engraving method, isolate one second matrix electrodes pattern with this engraving method again, wherein this engraving method is a wet etch process or a dry-etching method.
11. method for making as claimed in claim 7 is characterized in that, this conducting wire is for forming with a spraying mode of printing, a transcription mode of printing, a letterpress mode, an intaglio printing mode or a wire mark mode.
12. method for making as claimed in claim 7 is characterized in that, this electrically conductive paste materials that forms this conducting wire is one of them of an elargol, a gold size, a carbon paste or a graphite glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102223639A CN102063232A (en) | 2009-11-16 | 2009-11-16 | Structure of capacitance type multi-point touch-control panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102223639A CN102063232A (en) | 2009-11-16 | 2009-11-16 | Structure of capacitance type multi-point touch-control panel and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102063232A true CN102063232A (en) | 2011-05-18 |
Family
ID=43998533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102223639A Pending CN102063232A (en) | 2009-11-16 | 2009-11-16 | Structure of capacitance type multi-point touch-control panel and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102063232A (en) |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324283A (en) * | 2011-08-31 | 2012-01-18 | 苏州达方电子有限公司 | Manufacturing methods of conductive film and touch display panel as well as single-layer type touch panel |
| CN102662543A (en) * | 2012-03-27 | 2012-09-12 | 深圳市宝明科技股份有限公司 | Novel ITO (indium tin oxide) gap-bridge integrated capacitive touch screen and manufacturing method of novel ITO gap-bridge integrated capacitive touch screen |
| CN102799326A (en) * | 2012-07-03 | 2012-11-28 | 深圳市长江力伟股份有限公司 | Capacitive screen function sheet with double-faced electrode routing and machining method thereof |
| CN102955596A (en) * | 2011-08-20 | 2013-03-06 | 宸鸿科技(厦门)有限公司 | Method and device for processing protective layer |
| CN102999206A (en) * | 2012-08-10 | 2013-03-27 | 苏州合美硕触控技术有限公司 | Touch screen with double layers of circuits and manufacturing method thereof |
| CN103159401A (en) * | 2011-12-09 | 2013-06-19 | 三星康宁精密素材株式会社 | Method of cutting tempered glass and method of fabricating touchscreen using the same |
| CN103176681A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method of touch panel |
| CN103176679A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch screen and manufacturing method of touch screen |
| CN103176652A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch screen and manufacturing method of touch screen |
| CN103176680A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method of touch panel |
| CN103336595A (en) * | 2013-05-27 | 2013-10-02 | 深圳市易玻光电配件有限公司 | Touch panel applying soft glass |
| CN103345346A (en) * | 2013-07-19 | 2013-10-09 | 信利光电股份有限公司 | Capacitive touch screen and method for binding flexible circuit board thereof |
| CN103543862A (en) * | 2012-07-13 | 2014-01-29 | 永恒科技有限公司 | Touch screens and manufacturing method thereof |
| CN103576957A (en) * | 2012-07-31 | 2014-02-12 | 瀚宇彩晶股份有限公司 | Touch device substrate with logo pattern and manufacturing method of touch device substrate |
| CN103677400A (en) * | 2012-09-25 | 2014-03-26 | 郡是株式会社 | Display device having touch panel |
| WO2014063417A1 (en) * | 2012-10-25 | 2014-05-01 | 南昌欧菲光科技有限公司 | Conductive structure in transparent conductive film, transparent conductive film, and manufacturing method |
| CN104220969A (en) * | 2012-03-02 | 2014-12-17 | 诺瓦利亚公司 | Touch-sensitive input device |
| CN104347155A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| US9081455B2 (en) | 2013-03-08 | 2015-07-14 | Nanchang O-Film Tech. Co., Ltd. | Touch panel and manufacturing method thereof |
| US9148143B2 (en) | 2012-09-27 | 2015-09-29 | Tpk Touch Systems (Xiamen) Inc. | Touch device and manufacturing method thereof |
| CN105487728A (en) * | 2014-09-17 | 2016-04-13 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method therefor |
| US9354671B2 (en) | 2012-09-27 | 2016-05-31 | Tpk Touch Systems (Xiamen) Inc. | Touch device and manufacturing method thereof |
| US9400912B2 (en) | 2014-08-26 | 2016-07-26 | Egis Technology Inc. | Capacitive fingerprint sensor and fingerprint sensing method thereof |
| CN107003787A (en) * | 2014-11-12 | 2017-08-01 | 株式会社东进世美肯 | Method for forming electrode pattern and electrode pattern |
| CN114489361A (en) * | 2020-10-23 | 2022-05-13 | 苏州绘格光电科技有限公司 | Conductive electrode and touch screen with same |
| CN114489396A (en) * | 2020-10-23 | 2022-05-13 | 苏州绘格光电科技有限公司 | Conductive electrode and preparation method and application thereof |
-
2009
- 2009-11-16 CN CN2009102223639A patent/CN102063232A/en active Pending
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102955596A (en) * | 2011-08-20 | 2013-03-06 | 宸鸿科技(厦门)有限公司 | Method and device for processing protective layer |
| CN102955596B (en) * | 2011-08-20 | 2016-04-06 | 宸鸿科技(厦门)有限公司 | Protective seam disposal route and device thereof |
| CN102324283A (en) * | 2011-08-31 | 2012-01-18 | 苏州达方电子有限公司 | Manufacturing methods of conductive film and touch display panel as well as single-layer type touch panel |
| CN103159401A (en) * | 2011-12-09 | 2013-06-19 | 三星康宁精密素材株式会社 | Method of cutting tempered glass and method of fabricating touchscreen using the same |
| CN104220969A (en) * | 2012-03-02 | 2014-12-17 | 诺瓦利亚公司 | Touch-sensitive input device |
| US9762235B2 (en) | 2012-03-02 | 2017-09-12 | Novalia Ltd | Touch-sensitive input device |
| CN102662543A (en) * | 2012-03-27 | 2012-09-12 | 深圳市宝明科技股份有限公司 | Novel ITO (indium tin oxide) gap-bridge integrated capacitive touch screen and manufacturing method of novel ITO gap-bridge integrated capacitive touch screen |
| CN102662543B (en) * | 2012-03-27 | 2013-10-30 | 深圳市宝明科技股份有限公司 | ITO (indium tin oxide) gap-bridge integrated capacitive touch screen and manufacturing method of ITO gap-bridge integrated capacitive touch screen |
| CN102799326A (en) * | 2012-07-03 | 2012-11-28 | 深圳市长江力伟股份有限公司 | Capacitive screen function sheet with double-faced electrode routing and machining method thereof |
| CN103543862A (en) * | 2012-07-13 | 2014-01-29 | 永恒科技有限公司 | Touch screens and manufacturing method thereof |
| CN103576957A (en) * | 2012-07-31 | 2014-02-12 | 瀚宇彩晶股份有限公司 | Touch device substrate with logo pattern and manufacturing method of touch device substrate |
| CN102999206A (en) * | 2012-08-10 | 2013-03-27 | 苏州合美硕触控技术有限公司 | Touch screen with double layers of circuits and manufacturing method thereof |
| CN103677400B (en) * | 2012-09-25 | 2018-05-08 | 郡是株式会社 | Display device with contact panel |
| CN103677400A (en) * | 2012-09-25 | 2014-03-26 | 郡是株式会社 | Display device having touch panel |
| US9148143B2 (en) | 2012-09-27 | 2015-09-29 | Tpk Touch Systems (Xiamen) Inc. | Touch device and manufacturing method thereof |
| US9354671B2 (en) | 2012-09-27 | 2016-05-31 | Tpk Touch Systems (Xiamen) Inc. | Touch device and manufacturing method thereof |
| WO2014063417A1 (en) * | 2012-10-25 | 2014-05-01 | 南昌欧菲光科技有限公司 | Conductive structure in transparent conductive film, transparent conductive film, and manufacturing method |
| WO2014134895A1 (en) * | 2013-03-08 | 2014-09-12 | 南昌欧菲光科技有限公司 | Touch screen and manufacturing method therefor |
| CN103176652A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch screen and manufacturing method of touch screen |
| WO2014134896A1 (en) * | 2013-03-08 | 2014-09-12 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method therefor |
| CN103176681A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method of touch panel |
| CN103176679A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch screen and manufacturing method of touch screen |
| CN103176680B (en) * | 2013-03-08 | 2015-05-13 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method of touch panel |
| CN103176652B (en) * | 2013-03-08 | 2015-05-13 | 南昌欧菲光科技有限公司 | Touch screen and manufacturing method of touch screen |
| US9081455B2 (en) | 2013-03-08 | 2015-07-14 | Nanchang O-Film Tech. Co., Ltd. | Touch panel and manufacturing method thereof |
| WO2014134894A1 (en) * | 2013-03-08 | 2014-09-12 | 南昌欧菲光科技有限公司 | Touch screen and manufacturing method therefor |
| CN103176680A (en) * | 2013-03-08 | 2013-06-26 | 南昌欧菲光科技有限公司 | Touch panel and manufacturing method of touch panel |
| CN103336595A (en) * | 2013-05-27 | 2013-10-02 | 深圳市易玻光电配件有限公司 | Touch panel applying soft glass |
| CN103345346A (en) * | 2013-07-19 | 2013-10-09 | 信利光电股份有限公司 | Capacitive touch screen and method for binding flexible circuit board thereof |
| CN104347155A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Transparent conducting film |
| US9400912B2 (en) | 2014-08-26 | 2016-07-26 | Egis Technology Inc. | Capacitive fingerprint sensor and fingerprint sensing method thereof |
| CN105487728A (en) * | 2014-09-17 | 2016-04-13 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method therefor |
| CN105487728B (en) * | 2014-09-17 | 2019-08-16 | 宸鸿科技(厦门)有限公司 | Touch panel and preparation method thereof |
| CN107003787A (en) * | 2014-11-12 | 2017-08-01 | 株式会社东进世美肯 | Method for forming electrode pattern and electrode pattern |
| CN114489361A (en) * | 2020-10-23 | 2022-05-13 | 苏州绘格光电科技有限公司 | Conductive electrode and touch screen with same |
| CN114489396A (en) * | 2020-10-23 | 2022-05-13 | 苏州绘格光电科技有限公司 | Conductive electrode and preparation method and application thereof |
| CN114489396B (en) * | 2020-10-23 | 2024-01-23 | 苏州绘格光电科技有限公司 | Conductive electrode and preparation method and application thereof |
| CN114489361B (en) * | 2020-10-23 | 2024-01-23 | 苏州绘格光电科技有限公司 | Conductive electrode and touch screen with same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102063232A (en) | Structure of capacitance type multi-point touch-control panel and manufacturing method thereof | |
| US10698539B2 (en) | UV film sensor and preparation method therefor, and touch control screen | |
| CN103123562B (en) | A kind of touch-screen and preparation method thereof | |
| CN101853114B (en) | Capacitive touch screen with electrodes and manufacturing method thereof | |
| CN105528568B (en) | Fingeprint distinguisher and its manufacture method | |
| CN105528104A (en) | A touch control panel having a fingerprint identification function and a method for manufacturing the same | |
| TW201243665A (en) | Fabrication method of touch device | |
| CN103257746A (en) | Manufacturing method of OGS touch screen | |
| CN104142762A (en) | Capacitive touch screen and preparation method thereof | |
| CN108984025A (en) | Single-layer double-side electrode of capacitance type touch control screen and preparation method thereof | |
| US20130059128A1 (en) | Touch-on-lens device and method for manufacturing the same | |
| CN106597719A (en) | Touch control display screen, manufacturing method thereof and touch control display device | |
| CN102778988B (en) | Integration projected capacitive touch screen display apparatus module and manufacture method thereof | |
| CN106909258A (en) | A kind of structure of touch screen function piece lead and preparation method thereof | |
| CN203250299U (en) | Graphene capacitive touch screen | |
| CN106155416A (en) | A kind of composite membrane touch sensing and preparation method thereof | |
| CN104238782A (en) | Touch screen electrode preparation method | |
| US20160252997A1 (en) | Ogs touch screen substrate and method of manufacturing the same, and related apparatus | |
| CN204808272U (en) | Touch panel with fingerprint identification function | |
| CN104820535A (en) | Process for manufacturing single-layer multi-point capacitive touch screen with pure ITO membrane structure | |
| US20150253901A1 (en) | Manufacturing method for single-sided multi-layer circuit pattern for touch panel | |
| WO2019056809A1 (en) | Touch panel, manufacturing method therefor, and display device | |
| CN103324376A (en) | One-chip type capacitive touch screen and preparation method thereof | |
| CN201654751U (en) | Capacitive touch screen | |
| CN103853410B (en) | Manufacturing process for functional sheet of OGS (One Glass Solution) touch screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: LI ZONGTING Free format text: FORMER OWNER: XIANGHONG SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20110708 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIPEI COUNTY, TAIWAN, CHINA TO: HSINCHU CITY, TAIWAN, CHINA |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20110708 Address after: Hsinchu City, Taiwan, China Applicant after: Li Zongting Address before: Taiwan County, Taipei, China Applicant before: Xianghong Technology Inc. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110518 |