CN103176680A - Touch panel and manufacturing method of touch panel - Google Patents
Touch panel and manufacturing method of touch panel Download PDFInfo
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- CN103176680A CN103176680A CN2013100746597A CN201310074659A CN103176680A CN 103176680 A CN103176680 A CN 103176680A CN 2013100746597 A CN2013100746597 A CN 2013100746597A CN 201310074659 A CN201310074659 A CN 201310074659A CN 103176680 A CN103176680 A CN 103176680A
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- insulation substrate
- transparent insulation
- transparent
- grid
- electrode layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Abstract
The invention discloses a touch panel. The touch panel comprises a first transparent insulating substrate, a second transparent insulating substrate, an induction electrode layer and a driving electrode layer, wherein the second transparent insulating substrate comprises a first surface which faces the first transparent insulating substrate and a second surface which is opposite to the first surface; the induction electrode layer is arranged between the first transparent insulating substrate and the second transparent insulating substrate and comprises a plurality of induction electrodes which are arranged independently, and each induction electrode comprises a grid conductive circuit; and the driving electrode layer is arranged on the first surface or the second surface of the second transparent insulating substrate and comprises a plurality of driving electrodes which are arranged independently, and each driving electrode comprises a grid conductive circuit. The invention further discloses a manufacturing method of the touch panel. The touch panel is low in cost and high in sensitivity.
Description
Technical field
The present invention relates to the touch technology field, particularly relate to the manufacture method of a kind of contact panel and a kind of contact panel.
Background technology
Contact panel is widely used in various electronic installations with display screen, as smart mobile phone, TV, PDA, panel computer, notebook computer, comprise industry and show to touch the computing machine such as machining tool, Integral computer and super or electronic equipment etc.Contact panel can be divided into condenser type, resistance-type and surperficial optical waves type etc. according to principle of work.
Capacitance type touch-control panel is to utilize the electric current induction of human body to carry out work.When finger touch was on metal level, due to people's bulk electric field, user and contact panel surface formation were with a coupling capacitance, and for high-frequency current, electric capacity is direct conductor, so finger siphons away a very little electric current from contact point.This electric current flows out the electrode from four jiaos of contact panel respectively, and the electric current of these four electrodes of flowing through is directly proportional to the distance of finger to four jiaos, and controller draws the position of touch point by the accurate Calculation to these four current ratios.
Capacitance type touch-control panel all adopts glass ITO or film ITO(also namely to form on glass or film at present) formation drive electrode and induction electrode pattern.But above-mentioned glass ITO or film ITO form drive electrode and there is following shortcoming in the induction electrode pattern: ITO drive electrode or induction electrode projection easily are scratched or drop at glass surface or transparent membrane surface on the one hand, cause producing yield and reduce; On the other hand, glass ITO or film ITO main material are mainly the rare metal indiums, phosphide material rare, therefore cost compare is expensive, and ITO is larger at the resistance of doing large touch panel or sheet resistance, affect signaling rate, cause touch sensitivity poor, thereby it is not good enough to affect whole electronic product user experience sense.
Summary of the invention
Based on this, be necessary to provide the contact panel that a kind of cost is lower, sensitivity is higher.
A kind of manufacture method of contact panel also is provided in addition.
A kind of contact panel comprises: the first transparent insulation substrate; The second transparent insulation substrate comprises towards the first surface of described the first transparent insulation substrate and the second surface relative with described first surface; The induction electrode layer is arranged between described the first transparent insulation substrate and the second transparent insulation substrate, and the induction electrode layer comprises some independent induction electrodes that arrange, and described each induction electrode comprises the grid conducting channel; Reach drive electrode layer, be arranged on first surface or the second surface of described the second transparent insulation substrate, drive electrode layer comprises some independent drive electrodes that arrange, and described each drive electrode comprises the grid conducting channel.
A kind of contact panel comprises: rigidity transparent insulation substrate; The induction electrode layer is formed at a surface of described rigidity transparent insulation substrate, comprises some independent induction electrodes that arrange; Each induction electrode of described induction electrode layer comprises the grid conducting channel; The flexible and transparent dielectric substrate comprises first surface and the second surface relative with described first surface; Drive electrode layer is formed at first surface or the second surface of described flexible and transparent dielectric substrate, comprises some independent drive electrodes that arrange; Each drive electrode of described drive electrode layer comprises the grid conducting channel; The first surface of described flexible and transparent dielectric substrate or second surface fit on described rigidity transparent insulation substrate.
A kind of manufacture method of contact panel comprises the steps: to provide the first transparent insulation substrate; One side at described the first transparent insulation substrate forms the induction electrode layer; The induction electrode of described induction electrode layer is the grid conducting channel that comprises a large amount of unit grids; The second transparent insulation substrate is provided; One side at described the second transparent insulation substrate forms drive electrode layer; The drive electrode of described drive electrode layer is the grid conducting channel that comprises a large amount of unit grids; Described the second transparent insulation substrate is attached on described the first transparent insulation substrate.
A kind of manufacture method of contact panel comprises the steps: to provide the first transparent insulation substrate; The second transparent insulation substrate is provided; One side at described the second transparent insulation substrate forms drive electrode layer; The drive electrode of described drive electrode layer is the grid conducting channel that comprises a large amount of unit grids; Another side at described the second transparent insulation substrate forms the induction electrode layer; The induction electrode of described induction electrode layer is the grid conducting channel that comprises a large amount of unit grids; Described the first transparent insulation substrate is attached on described the second transparent insulation substrate.
Above-mentioned contact panel and manufacture method thereof, because the drive electrode with contact panel is made as the conductive grid that the grid conducting channel forms, therefore contact panel do not exist exist when adopting film ITO such as the surface easily scratch or drop, the problem such as cost is higher, sheet resistance is larger during large scale, therefore the cost of contact panel is lower, sensitivity is higher.
Description of drawings
Fig. 1 is the electronic equipment schematic diagram of using contact panel of the present invention;
Fig. 2 is the cross sectional representation of first kind contact panel of the present invention;
Fig. 3 is the cross sectional representation of an embodiment shown in Figure 2;
Fig. 4 is the floor map that induction electrode layer shown in Figure 3 forms the first transparent insulation substrate one surface;
Fig. 5 is the floor map that drive electrode layer shown in Figure 3 forms the second transparent insulation substrate one surface;
Fig. 6 is that Fig. 4 or Fig. 5 are along the schematic cross-section of aa ' profile line;
Fig. 7 is that Fig. 4 or Fig. 5 are along the schematic cross-section of bb ' profile line;
Fig. 8 is the cross sectional representation of Equations of The Second Kind contact panel of the present invention;
Fig. 9 is the cross sectional representation of an embodiment shown in Figure 8;
Figure 10 is the cross sectional representation of the present invention's the 3rd class contact panel;
Figure 11 is the cross sectional representation of an embodiment shown in Figure 10;
Figure 12 is the cross sectional representation of an embodiment of the present invention's the 4th class contact panel;
Figure 13 a and Figure 13 b are induction electrode and drive electrode arrangement and shape schematic diagram;
Figure 14 a, 14b, 14c and 14d are respectively the A part that corresponds respectively in an embodiment in Figure 13 a or the partial enlarged drawing of the part of the B in Figure 13 b;
Figure 15 is the manufacture method process flow diagram of the contact panel of an embodiment;
Figure 16 is the step S104 particular flow sheet in flow process shown in Figure 15;
Induction electrode layer and the drive electrode stratiform structural drawing of Figure 17 for obtaining according to the step S104 in flow process shown in Figure 15;
Figure 18 is the manufacture method process flow diagram of the contact panel of another embodiment;
Figure 19 is the particular flow sheet of the step S204 in flow process shown in Figure 180.
Embodiment
For the ease of understanding the present invention, the below is described more fully the present invention with reference to relevant drawings.Provided first-selected embodiment of the present invention in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, providing the purpose of these embodiment is to make to disclosure of the present invention more thoroughly comprehensively.
Unless otherwise defined, all technology of using of this paper and scientific terminology are with to belong to the implication that those skilled in the art of the present invention understand usually identical.The term that uses in instructions of the present invention herein is not intended to be restriction the present invention just in order to describe the purpose of specific embodiment.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
" transparent " in described transparent insulation substrate can be regarded as " transparent " and " substantially transparent " in the present invention; " insulation " in the transparent insulation substrate can be regarded as " insulation " and " dielectric medium (dielectric) " in the present invention.Therefore " transparent insulation substrate " described in the present invention should be explained and include but not limited to transparent insulation substrate, substantially transparent dielectric substrate, transparent dielectric medium substrate and substantially transparent dielectric medium substrate.
See also Fig. 1, be one of them embodiment of the electronic equipment of using contact panel of the present invention, wherein said electronic equipment is smart mobile phone or flat computer.In above-mentioned electronic equipment 10, described contact panel 100 fits in the upper surface of LCD display, is used for one of them I/O equipment of electronic equipment man-machine interaction.Can easily understand, also can be applicable to mobile phone, mobile communication phone, TV, panel computer, notebook computer, the industrial lathe that comprises touch display screen, aviation at described contact panel 100 of the present invention and touch the computer equipments such as display electronics assemblies, GPS electronic installation, Integral computer and super.
As shown in Figure 2, be the cross sectional representation of the first kind embodiment of contact panel of the present invention.This contact panel 100 comprises the first transparent insulation substrate 110, induction electrode layer 120, bonding coat 130, drive electrode layer 140 and the second transparent insulation substrate 150.Described induction electrode layer 120 is arranged between described the first transparent insulation substrate 110 and the second transparent insulation substrate 150.Wherein the second transparent insulation substrate 150 comprises towards the first surface 152 of described the first transparent insulation substrate and the second surface 154 relative with described first surface.Described drive electrode layer 150 is formed at described first surface 152.In other embodiments, described drive electrode layer 150 also can be arranged at second surface 154.
Described bonding coat 130 is used for the first transparent insulation substrate 110 and the second transparent insulation substrate 150 are bonded into one.When described drive electrode layer 150 was arranged on first surface 152, described bonding coat 130 also was used for the setting of insulating between induction electrode layer 120 and drive electrode layer 140.Bonding coat 130 can be selected optically transparent OCA(Optical Clear Adhesive) glue or LOCA glue.
Please refer to Fig. 3, is first kind contact panel one embodiment cross sectional representation of the present invention.Fig. 4 is the planimetric map of induction electrode layer 120.With reference to figure 3 and Fig. 4, described induction electrode layer 120 comprises some independent induction electrode 120a that arrange, and described each induction electrode 120a comprises grid conducting channel 120b.With reference to figure 5, described drive electrode layer 140 comprises some independent drive electrode 140a that arrange.Described " the independent setting " can be understood as and include but not limited to " the independent setting ", " isolation arranges " or several explanations such as " insulation arrange " in the present invention.
In capacitance type touch-control panel, induction electrode and drive electrode are requisite two parts of touch-control sensing assembly.The general touch face near contact panel of induction electrode, drive electrode is relatively away from touch face.Drive electrode connects the sweep signal generating means, provides sweep signal by the sweep signal generating means, and induction electrode produces electrical quantity when being touched by energized conductor changes, with touch sensitive zone or position of touch.
Wherein, each induction electrode that described inductive layer 120 comprises is electrically connected to the sensing of described contact panel peripheral hardware detecting processing module, described each drive electrode that drives layer 140 is electrically connected to the pumping signal module of described contact panel peripheral hardware, forms mutual capacitance between described induction electrode and described drive electrode.When described contact panel surface generation touch action, the mutual capacitance value of touching central area can change, described touch action is converted to electric signal, just can obtain the coordinate data of touch action center through the processing to capacitance domain transformation data, the electronic installation that can process related data just can be judged the touch action correspondence according to the coordinate data of touch action center and fit in accurate location on display screen at contact panel, thereby completes corresponding corresponding function or input operation.
Described drive electrode layer 140 and induction electrode layer 120 adopts substantially similar or same way as is made in the present invention, and the mesh shape of each grid conducting channel that drive electrode layer 140 and induction electrode layer 120 comprise can be incomplete same.
Specifically, please in the lump with reference to figure 6 and Fig. 7, be respectively that Fig. 4 or Fig. 5 are along the schematic cross-section of aa ' profile line and bb ' profile line.Below describe as an example of the induction electrode layer example, described induction electrode layer 120 comprises some separate grid conducting channel 120b.Described grid conducting channel 120b embeds or is embedded in transparent insulating layer 160, and described transparent insulating layer 160 attaches to the surface of the first transparent insulation substrate 110 by adhesion promoting layer 21.The material of described grid conducting channel 120b is selected from gold, silver, copper, aluminium, zinc, vermeil or alloy at least both.Above-mentioned material easily obtains, and cost is lower, and particularly the silver slurry makes above-mentioned grid conducting channel 120b, conducts electricity very well, and cost is low.
Can easily understand, it is in the majority that grid conducting channel 120b embeds or be embedded in transparent insulating layer 160 mode, wherein a kind of optimal way is to form some staggered grid grooves at described transparent insulating layer 160, described grid conducting channel 120b is arranged at described groove, thereby makes grid conducting channel 120b to embed or to imbed transparent insulating layer 160 surfaces of form the first transparent insulation substrate 110.The first transparent insulation substrate 110 that can prevent from like this depending on described induction electrode 120a is in mobile or handling process, and induction electrode 120a firmly depends on the first transparent insulation substrate 110, is not easy damaged or comes off.Easily learn, grid conducting channel 120b also can directly embed or imbed the surface of the first transparent insulation substrate 110.
More particularly, the mesh spacing of described grid conducting channel 120b is d
1, and 100 μ m≤d
1＜600 μ m; The square resistance of grid conducting channel is R and 0.1 Ω/sq≤R＜200 Ω/sq.
The square resistance of described grid conducting channel 120b is that R affects the current signal transmission speed, thereby affects the contact panel reaction sensitivity.So described grid conducting channel 120b square resistance is R and is preferably 1 Ω/sq≤R≤60 Ω/sq.Square resistance R in this scope, can significantly improve the conduction Film conductivity, significantly improve the transmission speed of electric signal, and low than 0.1 Ω/sq≤R＜200 Ω/sq to the requirement of precision, namely reduce technological requirement under the prerequisite that guarantees electric conductivity, reduced cost.Certainly in manufacture process, the square resistance of grid conducting channel 120b is that a plurality of factors such as R and mesh spacing, material, wire diameter (live width) determine jointly.
The grid live width of described grid conducting channel 120b is d
2, and 1 μ m≤d
2≤ 10 μ m.The live width of grid affects the light transmission of conducting film, and the grid live width is less, and light transmission is better.Needing the mesh lines spacing d of conductive grid
1Be 100 μ m≤d
1When＜600 μ m, the square resistance R of grid conducting channel 120b are 0.1 Ω/sq≤R＜200 Ω/sq, grid live width d
2Be 1 μ m≤d
2≤ 10 μ m can meet the demands, and can improve the light transmission of whole contact panel simultaneously.The grid live width d of grid conducting channel 120b particularly
2Be 2 μ m≤d
2During＜5 μ m, the contact panel glazed area is larger, and light transmission is better, and accuracy requirement is relatively low.
In embodiment preferably, grid conducting channel 120b selects ag material, and adopts regular figure, mesh lines spacing 200 μ m～500 μ m; Grid conducting channel surface resistance is 4 Ω/sq≤R＜50 Ω/sq, and the coating weight of silver is 0.7g/m
2～1.1g/m
2
In embodiment one, get d
1=200 μ m, R=4～5 Ω/sq, argentiferous measures 1.1g/m
2, grid live width d
2Get 500nm～5 μ m.Certainly, what of the value of square resistance R, silver content all can be subject to grid live width d
2With the impact of the depth of groove of filling, grid live width d
2Depth of groove larger, that fill is larger, and square resistance can increase thereupon to some extent, silver content also increases thereupon.
In embodiment two, get d
1=300 μ m, R=10 Ω/sq, argentiferous measures 0.9～1.0g/m
2, grid live width d
2Get 500nm～5 μ m.Certainly, what of the value of square resistance R, silver content all can be subject to grid live width d
2With the impact of the depth of groove of filling, grid live width d
2Depth of groove larger, that fill is larger, and square resistance can increase thereupon to some extent, silver content also increases thereupon.
In embodiment three, get d
1=500 μ m, R=30～40 Ω/sq, argentiferous measures 0.7g/m
2, grid live width d
2Get 500nm～5 μ m.Certainly, what of the value of square resistance R, silver content all can be subject to grid live width d
2With the impact of the depth of groove of filling, grid live width d
2Depth of groove larger, that fill is larger, and square resistance can increase thereupon to some extent, silver content also increases thereupon.
Certainly, make above-mentioned grid conducting channel 120b except selecting the metallic conduction material, can also select a kind of the making in electrically conducting transparent macromolecular material, Graphene or carbon nano-tube.
Similarly, drive electrode layer 140 adopts and above-mentioned induction electrode layer 120 is basically identical mode, material and technique are made.Wherein the drive electrode of drive electrode layer 140 comprises the grid conducting channel 140b with a large amount of grid cells.
In this class embodiment, described induction electrode layer 120 directly is formed at the surface of the first transparent insulation substrate 110, and described the first transparent insulation substrate is rigid substrate.More particularly, glass or transparent plastic board that the process intensive treatment that described rigid substrate adopts is crossed are called for short tempered glass or reinforced plastic plate.Wherein said tempered glass comprise have anti-dazzle, sclerosis, the functional layer of anti-reflection or atomizing functions.Wherein, have the functional layer of anti-dazzle or atomizing functions, formed by the applying coating with anti-dazzle or atomizing functions, coating comprises metal oxide particle; Functional layer with sclerosis function is formed or is directly hardened by chemistry or physical method by the high-molecular coating coating with sclerosis function; Functional layer with anti-reflection function is titania coating, magnesium fluoride coating or calcium fluoride coating.Be appreciated that adopting the good plastic plate of transmittance also can process as above-mentioned tempered glass mode makes rigidity transparent insulation substrate of the present invention.
Please further with reference to figure 3, described the second transparent insulation substrate 150 is made for flexible material, as selects any one in flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA).In addition, in order to increase by the second transparent insulation substrate viscosity, all set up an adhesion promoting layer 141 at first surface or the second surface of the second transparent insulation substrate, so that upper transparent insulating layer firmly sticks in the second transparent insulation substrate.What be necessary to illustrate is that because described the second transparent insulation substrate is that flexible material is made, therefore in mobile or handling process, deformation or bending unavoidably occur flexible material, therefore adopt the drive electrode that embeds or imbed more reliable.
a certain specific embodiment in the first kind embodiment of contact panel of the present invention, the first transparent insulation substrate 110 adopts tempered glass, the substrate that the second transparent insulation substrate 150 adopts poly terephthalic acid class plastics (PET) to make, form the induction electrode layer 120 that comprises the grid conducting channel at this tempered glass, the substrate one surface formation of making at poly terephthalic acid class plastics (PET) simultaneously comprises the drive electrode layer 140 of grid conducting channel, then the flexible substrate of poly terephthalic acid class plastics (PET) being made fits on the first transparent insulation substrate 110 that tempered glass makes, the purpose of above-mentioned embodiment more easily fits on tempered glass flexible substrate, and make the contact panel that the present invention comprises.Above-mentioned manufacturing process is simple, reduces simultaneously the thickness of contact panel.
See also Fig. 8 and Fig. 9, be the cross sectional representation of Equations of The Second Kind contact panel of the present invention and the cross sectional representation of an embodiment.This class embodiment is in the difference of first kind embodiment: described drive electrode layer 240 is arranged at the second surface of the second transparent insulation substrate 250.Perhaps change a kind of statement, relative first kind contact panel mode, described second transparent insulation substrate 250 back sides and the first transparent insulation substrate 210 that is provided with drive electrode layer 240 fits in one.And described induction electrode layer 220 forms identical with first kind embodiment with drive electrode layer 240.
See also Figure 10 and Figure 11, be the cross sectional representation of the present invention's the 3rd class contact panel and the cross sectional representation of an embodiment.With respect to first kind embodiment, described induction electrode layer 320 is formed at the first surface of the second transparent insulation substrate 350, and described drive electrode layer 340 is formed at the second surface of the second transparent insulation substrate 350, i.e. the DITO structure.Drive electrode layer 340 has grid conducting channel 340b.Then pass through bonding coat 330 with on described DITO structure applying the first transparent insulation substrate 310.In this class embodiment, described the first transparent insulation substrate can be selected any one in tempered glass, flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA).
See also Figure 12, be the cross sectional representation of the present invention's the 4th class contact panel.This contact panel comprises the second transparent insulation substrate 450, drive electrode layer 440, bonding coat 430, induction electrode layer 420, the first transparent insulation substrate 410, bonding coat 430 and the 3rd transparent insulation substrate 470 that stacks gradually.Induction electrode layer 420 can be bonding by adhesion promoting layer 21 and the first transparent insulation substrate 410; Drive electrode layer 440 can be bonding by adhesion promoting layer 21 and the second transparent insulation substrate 450.Induction electrode layer 420 comprises grid conducting channel 420b, and drive electrode layer 440 comprises grid conducting channel 440b.With respect to above-mentioned three class embodiments, this class embodiment also comprises the 3rd transparent insulation substrate 470, and described the 3rd transparent insulation substrate 470 can be selected tempered glass and pliability transparent panel.Wherein the pliability transparent panel can select any one in flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA) to make.
The embodiment of this class embodiment and above-mentioned three classes also has following difference: the first transparent insulation substrate 410 and the second transparent insulation substrate 450 all can adopt selects any one in tempered glass, flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA) to make.Wherein better mode of priority is, the first transparent insulation substrate 410 and the second transparent insulation substrate 450 all adopt flexible substrate, as flexible polyethylene terephthalate (PET).
See also Figure 13 a and Figure 13 b, comprise induction electrode and drive electrode arrangement and the shape floor map of a few class embodiments for the present invention.The induction electrode of described separate setting is parallel and equally spaced setting in first axial (X-axis); The drive electrode of described separate setting is parallel and equally spaced setting in second axial (Y-axis).Wherein Figure 13 a induction electrode and drive electrode be square shape structure (bar) and mutually vertical interlaced arrange; Figure 13 b induction electrode and drive electrode are that diamond shaped structure and mutual vertical interlaced are arranged.
Figure 14 a, 14b, 14c and 14d are respectively the A part that corresponds respectively in an embodiment in Figure 13 a or the partial enlarged drawing of the part of the B in Figure 13 b.
Grid conducting channel shown in Figure 14 a and 14b adopts irregular grid, and the manufacture difficulty of this irregular grid conducting channel is lower, saves concerned process steps etc.
Grid conducting channel shown in 14c and 14d, the regular figure of described grid conducting channel 140 for being evenly arranged.Conductive grid is arranged evenly rule, mesh lines spacing d
1All equate, can make the contact panel printing opacity even on the one hand; On the other hand, the square resistance of grid conducting channel (abbreviation sheet resistance) is evenly distributed, and resistance deviation is little, need not the setting for the revisal resistance deviation, makes imaging even.Can be the straight line grid pattern of nearly orthogonal form, crooked wave grid pattern etc.The unit grid of grid conducting channel can be regular figure, and such as triangle, rhombus or regular polygon etc. also can be irregular geometric figures.
What need to further illustrate is, the mesh shape that described drive electrode and induction electrode comprise the grid conducting channel can take different shapes, and namely described drive electrode and the induction electrode mesh shape that comprises the grid conducting channel all adopts regular grid shape or irregularly shaped.In other embodiments, the mesh shape that described drive electrode comprises the grid conducting channel adopts the regular grid shape, and induction electrode comprises the mesh shape of grid conducting channel and adopts irregularly shaped; Or described drive electrode comprises, and induction electrode comprises the mesh shape of grid conducting channel and adopts regular shape.
Can also further be interpreted as, drive described the mesh shape formation differentiation combination that each drive electrode of layer comprises the grid conducting channel, and/or each induction electrode of described inductive layer comprise the mesh shape formation differentiation combination of grid conducting channel.
As shown in figure 15, be the manufacture method flow process of the contact panel of an embodiment.Please in the lump with reference to figure 3, the method comprises the steps.
S101: the first transparent insulation substrate is provided.Described the first transparent insulation substrate 110 adopts rigidity transparent insulation substrate or flexible transparent insulation substrate, and wherein rigidity transparent insulation substrate can adopt tempered glass and pliability transparent panel.Wherein the pliability transparent panel can select any one in flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA) to make.
S102: the surface at described the first transparent insulation substrate forms the induction electrode layer.
S103: the second transparent insulation substrate is provided.The second transparent insulation substrate 150 is the flexible and transparent insulated substrate, can select any one in flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA) to make.The second transparent insulation substrate 150 is the pliability film, can be attached at easily on the first transparent insulation substrate 110 of rigidity.
S104: the surface at described the second transparent insulation substrate forms drive electrode layer.
Above-mentioned steps S101～S102 and step S103～S104 there is no sequencing.Both can first complete forming induction electrode layer 120 on the first transparent insulation substrate 110, also can first complete forming drive electrode layer 140 on the second transparent insulation substrate 150, perhaps both carry out simultaneously.
S105: described the second transparent insulation substrate is attached on described the first transparent insulation substrate.
The mode that attaches both can be as shown in Figure 3, is the one side that the second transparent insulation substrate 150 is provided with drive electrode layer 140 is fitted with the one side that the first transparent insulation substrate 110 is provided with induction electrode layer 120.Can be also as shown in Figure 8, the second transparent insulation substrate flexibility insulated substrate 250 not established the one side of drive electrode layer 240 and fitted with the one side that the first transparent insulation substrate 210 is provided with induction electrode layer 220.
Specifically comprise with reference to Figure 16～17 above-mentioned steps S102 and S104:
S141: be coated with transparent insulating layer on described the first transparent insulation substrate and the second transparent insulation substrate.Describe as an example of coating transparent insulating layer on the second transparent insulation substrate example.Transparent insulating layer 160 is exemplified as UV glue.For increasing the adhesion of impression glue and the second transparent insulation substrate, can add adhesion promoting layer between the second transparent insulation substrate 150 and transparent insulating layer 160.
S142: described transparent insulating layer impression forms the grid groove.With reference to Figure 17, after pressing through mould on transparent insulating layer 160, form a plurality of grid grooves 170 identical with the drive electrode shape, drive electrode layer 140 is formed in this grid groove 170.
S143: add metal paste in described grid groove and carry out blade coating and sintering curing to form conductive grid.Metal paste is added in grid groove 170, and through blade coating, make in the grid groove and fill metal paste, then carry out sintering curing and can obtain conductive grid.This metal paste is preferably nanometer silver paste.In other embodiment, the metal that forms the grid conducting channel can also adopt the alloy at least both of gold, silver, copper, aluminium, zinc, vermeil or above metal.
In other embodiment, the grid conducting channel can also adopt other techniques to realize, for example photoetching process.
Further, with reference to Figure 12, can also form transparent panel on the first transparent insulation substrate.This transparent panel is selected tempered glass or pliability transparent panel.
As shown in figure 18, be the manufacture method flow process of the contact panel of another embodiment.Please in the lump with reference to Figure 11, the method comprises the steps.
S201: the first transparent insulation substrate is provided.Described the first transparent insulation substrate 310 adopts rigidity transparent insulation substrate or flexible transparent insulation substrate, and wherein rigidity transparent insulation substrate can adopt tempered glass and pliability transparent panel.Wherein the pliability transparent panel can select any one in flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA) to make.
S202: the second transparent insulation substrate is provided.The second transparent insulation substrate 350 is the flexible and transparent insulated substrate, can adopt and can select any one in flexible polyethylene terephthalate (PET), polycarbonate (PC), tygon (PE), Polyvinylchloride (PVC), polypropylene (PP), polystyrene (PS) or polymethylmethacrylate (PMMA) to make.The second transparent insulation substrate 350 is the pliability film, can be attached at easily on the first transparent insulation substrate 310.
S203: the surface at described the second transparent insulation substrate forms drive electrode layer.
S204: another surface at described the second transparent insulation substrate forms the induction electrode layer.
Above-mentioned steps S203 and S204 there is no sequencing.Both can first complete forming induction electrode layer 320 on the second transparent insulation substrate 350, and also can first complete and form drive electrode layer 340 on the second transparent insulation substrate 350.
S205: described the first transparent insulation substrate is attached on described the second transparent insulation substrate.
The mode that attaches specifically is provided with the first transparent insulation substrate 310 and the second transparent insulation substrate 350 the one side applying of induction electrode layer 320.
With reference to Figure 18～19, above-mentioned steps S202 and S204 specifically comprise:
S241: be coated with transparent insulating layer on described the first transparent insulation substrate and the second transparent insulation substrate.Transparent insulating layer 160 is exemplified as UV glue.For increasing the adhesion of impression glue and flexible insulation substrate, can add adhesion promoting layer between the second transparent insulation substrate 150 and transparent insulating layer 160.
S242: described transparent insulating layer impression forms the grid groove.With reference to Figure 17, after pressing through mould on transparent insulating layer 160, form a plurality of grid grooves 170 identical with the drive electrode shape, drive electrode layer 140 is formed in this grid groove 170.
S243: add metal paste in described grid groove and carry out blade coating and sintering curing to form conductive grid.Metal paste is added in grid groove 170, and through blade coating, make in the grid groove and fill metal paste, then carry out sintering curing and can obtain conductive grid.This metal paste is preferably nanometer silver paste.In other embodiment, the metal that forms the grid conducting channel can also adopt the alloy at least both of gold, silver, copper, aluminium, zinc, vermeil or above metal.
In other embodiment, the grid conducting channel can also adopt other techniques to realize, for example photoetching process.
Further, can also form transparent panel on the first transparent insulation substrate.This transparent panel is selected tempered glass or pliability transparent panel.
Said method is made as with the drive electrode of contact panel the conductive grid that the grid conducting channel forms, therefore contact panel do not exist exist when adopting film ITO such as the surface easily scratch or drop, the problem such as cost is higher, sheet resistance is larger during large scale, therefore the cost of contact panel is lower, sensitivity is higher.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (36)
1. a contact panel, is characterized in that, comprising:
The first transparent insulation substrate;
The second transparent insulation substrate comprises towards the first surface of described the first transparent insulation substrate and the second surface relative with described first surface;
The induction electrode layer is arranged between described the first transparent insulation substrate and the second transparent insulation substrate, and the induction electrode layer comprises some independent induction electrodes that arrange, and described each induction electrode comprises the grid conducting channel; And
Drive electrode layer is arranged on first surface or the second surface of described the second transparent insulation substrate, and drive electrode layer comprises some independent drive electrodes that arrange, and described each drive electrode comprises the grid conducting channel.
2. contact panel according to claim 1, is characterized in that, the mesh spacing of described grid conducting channel is d
1, and 100 μ m≤d
1＜600 μ m; The square resistance of grid conducting channel is R and 0.1 Ω/sq≤R＜200 Ω/sq.
3. contact panel according to claim 1, is characterized in that, also comprises the transparent insulating layer that is formed at described the first transparent insulation substrate and the second transparent insulation substrate one surface, and described grid conducting channel embeds or imbeds and is arranged in transparent insulating layer.
4. contact panel according to claim 3, is characterized in that, described transparent insulating layer forms some staggered grid grooves, and described grid conducting channel is arranged at described grid groove.
5. according to claim 1,2 or 3 described contact panels, is characterized in that, described the first transparent insulation substrate is rigid substrate, and described the second transparent insulation substrate is flexible substrate.
6. contact panel according to claim 5, it is characterized in that, the first transparent insulation substrate of described rigidity is tempered glass, and the second transparent insulation substrate of described flexibility is any one in flexible polyethylene terephthalate, polycarbonate, tygon, Polyvinylchloride, polypropylene, polystyrene or polymethylmethacrylate.
7. according to claim 1,2 or 3 described contact panels, is characterized in that, described the first transparent insulation substrate is flexible substrate, and the second transparent insulation substrate is selected rigid substrate or flexible substrate.
8. contact panel according to claim 7, is characterized in that, also comprises the transparent panel that fits in described the first transparent insulation substrate one surface.
9. contact panel according to claim 8, is characterized in that, described transparent panel is selected tempered glass or pliability transparent panel.
10. according to claim 1,2 or 3 described contact panels, is characterized in that, also comprises bonding coat, and described bonding coat is formed between described the first transparent insulation substrate and the second transparent insulation substrate.
11. contact panel according to claim 10 is characterized in that, described bonding coat is optically transparent OCA glue or LOCA glue.
12. the described contact panel of according to claim 1 to 4 any one is characterized in that, the grid of described grid conducting channel adopts the regular geometric patterned grid.
13. the described contact panel of according to claim 1 to 4 any one is characterized in that, the grid of described grid conducting channel adopts the irregular geometric figures grid.
14. the described contact panel of according to claim 1 to 4 any one is characterized in that described grid conducting channel is selected ag material, the mesh lines spacing 200 μ m of grid conducting channel～500 μ m; The sheet resistance of grid conducting channel is 4 Ω/sq≤R＜50 Ω/sq, and the coating weight of silver is 0.7g/m
2～1.1g/m
2
15. the described contact panel of according to claim 1 to 4 any one is characterized in that, described grid conducting channel selects any one in the alloy material at least both of gold, silver, copper, aluminium, zinc, vermeil or above metal to make.
16. according to claim 3 or 4 described contact panels, described transparent insulating layer can be light binding, hot-setting adhesive or certainly do adhesive curing formation.
17. a contact panel comprises:
Rigidity transparent insulation substrate;
The induction electrode layer is formed at a surface of described rigidity transparent insulation substrate, comprises some independent induction electrodes that arrange; Each induction electrode of described induction electrode layer comprises the grid conducting channel;
The flexible and transparent dielectric substrate comprises first surface and the second surface relative with described first surface;
Drive electrode layer is formed at first surface or the second surface of described flexible and transparent dielectric substrate, comprises some independent drive electrodes that arrange; Each drive electrode of described drive electrode layer comprises the grid conducting channel;
The first surface of described flexible and transparent dielectric substrate or second surface fit on described rigidity transparent insulation substrate.
18. contact panel according to claim 17 is characterized in that, the mesh spacing of described grid conducting channel is d
1, and 100 μ m≤d
1＜600 μ m; The square resistance of grid conducting channel is R and 0.1 Ω/sq≤R＜200 Ω/sq.
19. contact panel according to claim 17 is characterized in that, also comprises the transparent insulating layer that is formed at described the first transparent insulation substrate and the second transparent insulation substrate one surface, described grid conducting channel embeds or imbeds and is arranged in transparent insulating layer.
20. contact panel according to claim 19 is characterized in that, described transparent insulating layer forms some staggered grid grooves, and described grid conducting channel is arranged at described grid groove.
21. contact panel according to claim 17, it is characterized in that, described rigidity transparent insulation substrate is tempered glass, and described flexible and transparent dielectric substrate is selected any one in flexible polyethylene terephthalate, polycarbonate, tygon, Polyvinylchloride, polypropylene, polystyrene or polymethylmethacrylate.
22. according to claim 17 to the 21 described contact panels of any one, it is characterized in that, the grid of described grid conducting channel adopts the regular geometric patterned grid.
23. according to claim 17 to the 21 described contact panels of any one, it is characterized in that, the grid of described grid conducting channel adopts the irregular geometric figures grid.
24. contact panel according to claim 22 is characterized in that, the unit grid of described grid is shaped as single triangle, rhombus or regular polygon.
25. the manufacture method of a contact panel comprises the steps:
The first transparent insulation substrate is provided;
One side at described the first transparent insulation substrate forms the induction electrode layer; The induction electrode of described induction electrode layer is the grid conducting channel that comprises a large amount of unit grids;
The second transparent insulation substrate is provided;
One side at described the second transparent insulation substrate forms drive electrode layer; The drive electrode of described drive electrode layer is the grid conducting channel that comprises a large amount of unit grids;
Described the second transparent insulation substrate is attached on described the first transparent insulation substrate.
26. the manufacture method of contact panel according to claim 25 is characterized in that, described one side at the first transparent insulation substrate forms the induction electrode layer and specifically comprises in the step that the one side of the second transparent insulation substrate forms drive electrode layer:
Be coated with transparent insulating layer on described the first transparent insulation substrate and the second transparent insulation substrate;
Form the grid groove at described transparent insulating layer impression;
Form described grid conducting channel in described grid groove.
27. the manufacture method of contact panel according to claim 26 is characterized in that, the described step that forms the grid conducting channel in the grid groove specifically comprises: add metal paste and carry out blade coating and sintering curing in described grid groove.
28. the manufacture method of contact panel according to claim 25, it is characterized in that, described the second transparent insulation substrate is attached on the first transparent insulation substrate specifically: the one side that the second transparent insulation substrate is formed with drive electrode layer forms thoughts with the first transparent insulation substrate and answers the one side of electrode layer to fit; Perhaps, the one side that the second transparent insulation substrate is not formed with drive electrode layer answers the one side of electrode layer to fit with the first transparent insulation substrate formation thoughts.
29. the manufacture method of according to claim 25～28 described contact panels of any one is characterized in that, a surface that also is included in described the first transparent insulation substrate forms transparent panel.
30. the manufacture method of contact panel according to claim 29 is characterized in that, described transparent panel is selected tempered glass or pliability transparent panel.
31. the manufacture method of a contact panel comprises the steps:
The first transparent insulation substrate is provided;
The second transparent insulation substrate is provided;
One side at described the second transparent insulation substrate forms drive electrode layer; The drive electrode of described drive electrode layer is the grid conducting channel that comprises a large amount of unit grids; Another side at described the second transparent insulation substrate forms the induction electrode layer; The induction electrode of described induction electrode layer is the grid conducting channel that comprises a large amount of unit grids;
Described the first transparent insulation substrate is attached on described the second transparent insulation substrate.
32. the manufacture method of contact panel according to claim 31 is characterized in that, described one side at the first transparent insulation substrate forms the induction electrode layer and specifically comprises in the step that the one side of the second transparent insulation substrate forms drive electrode layer:
Be coated with transparent insulating layer on described the first transparent insulation substrate and described the second transparent insulation substrate;
Form the grid groove at described transparent insulating layer impression;
Form described grid conducting channel in described grid groove.
33. the manufacture method of contact panel according to claim 32 is characterized in that, the described step that forms the grid conducting channel in the grid groove specifically comprises: add metal paste and carry out blade coating and sintering curing in described grid groove.
34. the manufacture method of contact panel according to claim 32, it is characterized in that, described the first transparent insulation substrate is attached on the second transparent insulation substrate specifically: the first transparent insulation substrate and the second transparent insulation substrate are formed thoughts answer the one side of electrode layer to fit.
35. the manufacture method of according to claim 31～34 described contact panels of any one is characterized in that, a surface that also is included in described the first transparent insulation substrate forms transparent panel.
36. the manufacture method of contact panel according to claim 35 is characterized in that, described transparent panel is selected tempered glass or pliability transparent panel.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310074659.7A CN103176680B (en) | 2013-03-08 | 2013-03-08 | Touch panel and manufacturing method of touch panel |
| KR1020137028853A KR101571617B1 (en) | 2013-03-08 | 2013-07-08 | Touch panel and manufacturing method thereof |
| PCT/CN2013/078990 WO2014134896A1 (en) | 2013-03-08 | 2013-07-08 | Touch panel and manufacturing method therefor |
| US13/985,934 US9081455B2 (en) | 2013-03-08 | 2013-07-08 | Touch panel and manufacturing method thereof |
| JP2015503750A JP6030220B2 (en) | 2013-03-08 | 2013-07-08 | Touch panel and manufacturing method thereof |
| TW102132096A TWI536234B (en) | 2013-03-08 | 2013-09-06 | Touch panel and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310074659.7A CN103176680B (en) | 2013-03-08 | 2013-03-08 | Touch panel and manufacturing method of touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN103176680A true CN103176680A (en) | 2013-06-26 |
| CN103176680B CN103176680B (en) | 2015-05-13 |
Family
ID=48636606
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310074659.7A Active CN103176680B (en) | 2013-03-08 | 2013-03-08 | Touch panel and manufacturing method of touch panel |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6030220B2 (en) |
| KR (1) | KR101571617B1 (en) |
| CN (1) | CN103176680B (en) |
| TW (1) | TWI536234B (en) |
| WO (1) | WO2014134896A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2014134896A1 (en) | 2014-09-12 |
| TW201435696A (en) | 2014-09-16 |
| CN103176680B (en) | 2015-05-13 |
| KR20140120812A (en) | 2014-10-14 |
| TWI536234B (en) | 2016-06-01 |
| KR101571617B1 (en) | 2015-11-24 |
| JP6030220B2 (en) | 2016-11-24 |
| JP2015513750A (en) | 2015-05-14 |
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Effective date of registration: 20210222 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330000 Huang Jia Hu Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Patentee before: Nanchang OFilm Tech. Co.,Ltd. |