CN106096596B - Fingerprint module, fingerprint module preparation method and mobile terminal - Google Patents
Fingerprint module, fingerprint module preparation method and mobile terminal Download PDFInfo
- Publication number
- CN106096596B CN106096596B CN201610675359.8A CN201610675359A CN106096596B CN 106096596 B CN106096596 B CN 106096596B CN 201610675359 A CN201610675359 A CN 201610675359A CN 106096596 B CN106096596 B CN 106096596B
- Authority
- CN
- China
- Prior art keywords
- fingerprint
- fingerprint chip
- pinboard
- circuit board
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Data Mining & Analysis (AREA)
- General Physics & Mathematics (AREA)
- Artificial Intelligence (AREA)
- Bioinformatics & Computational Biology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Biology (AREA)
- Evolutionary Computation (AREA)
- Bioinformatics & Cheminformatics (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Telephone Set Structure (AREA)
Abstract
A kind of fingerprint module, fingerprint module preparation method and mobile terminal, the fingerprint module includes cover plate, fingerprint chip, pinboard and circuit board, the cover plate is provided with installing zone, the fingerprint chip is fixed on the installing zone, the pinboard fits in fingerprint chip side opposite with the cover plate, to provide oppressive force to the fingerprint chip, the circuit board electrically connects the fingerprint chip through the pinboard.Pressure force is produced to the fingerprint chip using the gravity of the pinboard, to increase the adhesive force of the fingerprint chip and the cover plate, so that the combination of the fingerprint chip and the cover plate is more firm, the fingerprint chip is not easy to be influenceed by the circuit board and depart from the cover plate, so as to improve the quality of the fingerprint module.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of fingerprint module, fingerprint module preparation method and movement are eventually
End.
Background technology
It is applied to as fingerprint recognition is more and more extensive in mobile phone, so as to which the quality requirement to fingerprint module is more and more tighter
Lattice.Usual fingerprint module includes fixed fingerprint chip on the cover board, yet with the lighter in weight of fingerprint chip, causes fingerprint
Chip is easily influenceed by miscellaneous part during cover plate is fixed on and departs from cover plate, so as to cause fingerprint module quality to go out
Existing defect, causes the quality of production of fingerprint module not high.
The content of the invention
Technical problem to be solved of the embodiment of the present invention is, there is provided a kind of fingerprint module, fingerprint mould for improving quality
Group preparation method and mobile terminal.
The present invention provides a kind of fingerprint module, wherein, the fingerprint module includes cover plate, fingerprint chip, pinboard and electricity
Road plate, the cover plate are provided with installing zone, and the fingerprint chip is fixed on the installing zone, and the pinboard fits in the fingerprint
Chip side opposite with the cover plate, to provide oppressive force to the fingerprint chip, the circuit board is electrically connected through the pinboard
Connect the fingerprint chip
Wherein, the pinboard is printed circuit board (PCB).
Wherein, the pinboard includes the first contact surface for being bonded the fingerprint chip and relatively described first contact surface
Second contact surface, first contact surface are provided with the first pin for electrically connecting the fingerprint chip, and second contact surface is provided with
The second pin turned on first pin, the circuit board fits in second contact surface, and electrically connects described second
Pin.
Wherein, the pinboard is flexible PCB.
Wherein, the pinboard includes the second connection end of relatively described first connection end in the first connection end, and described second
Mutually it is laminated after the relatively described first connection end bending in connection end and by viscose glue, first connection end electrically connects the fingerprint core
Piece, the second connection end electrically connect the circuit board.
Wherein, the fingerprint module also includes stiffening plate, and the stiffening plate is laminated in the pinboard and the fingerprint core
The opposite side of piece, the circuit board electrically connect the pinboard by the stiffening plate.
Wherein, mutually led by scolding tin or board to board connector or conducting resinl between the pinboard and the circuit board
It is logical.
Wherein, mutually led by scolding tin or board to board connector or conducting resinl between the pinboard and the fingerprint chip
It is logical.
Wherein, the circuit board is flexible PCB or printed circuit board (PCB).
Wherein, the cover plate includes the lateral surface of medial surface and relatively described medial surface, and the lateral surface is contacting use
Family fingerprint, the lateral surface or the medial surface are provided with groove, and the installing zone is located at the groove of the medial surface, or positioned at institute
State the groove corresponding section of medial surface and the lateral surface.
The present invention also provides a kind of fingerprint module preparation method, wherein, the fingerprint module preparation method includes：
Cover plate, fingerprint chip and pinboard are provided, after the pinboard is fitted in into the fingerprint chip, by the fingerprint
Chip is fixed on the cover plate, and the pinboard provides oppressive force to the fingerprint chip；
Circuit board is provided, the circuit board is electrically connected to the fingerprint chip through the pinboard.
Wherein, the pinboard is printed circuit board (PCB), passes through conducting resinl phase between the pinboard and the fingerprint chip
Fitting.
Wherein, the circuit board is flexible PCB, passes through scolding tin or plate pair between the pinboard and the circuit board
Connector for substrate or conducting resinl are conducted.
Wherein, the fingerprint chip by adhesive plaster together in the medial surface.
The present invention also provides a kind of mobile terminal, wherein, the mobile terminal includes fingerprint mould described in above-mentioned any one
Group.
Fingerprint module, fingerprint module preparation method and mobile terminal provided by the invention, are fitted in by the pinboard
On the fingerprint chip, so as to produce pressure force to the fingerprint chip using the gravity of the pinboard, to increase the finger
The adhesive force of line chip and the cover plate, so that the combination of the fingerprint chip and the cover plate is more firm, the fingerprint
Chip is not easy to be influenceed by the circuit board and depart from the cover plate, so as to improve the quality of the fingerprint module.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the fingerprint module decomposing schematic representation of first embodiment provided by the invention；
Fig. 2 is the assembling schematic diagram of Fig. 1 fingerprint module；
Fig. 3 is the schematic cross-section of Fig. 1 fingerprint module；
Fig. 4 is the decomposing schematic representation of the fingerprint module of second embodiment provided by the invention；
Fig. 5 is the assembling schematic diagram of Fig. 4 fingerprint module；
Fig. 6 is the schematic cross-section of Fig. 4 fingerprint module；
Fig. 7 is the schematic cross-section of the fingerprint module of 3rd embodiment provided by the invention；
Fig. 8 is the schematic cross-section of the fingerprint module of fourth embodiment provided by the invention；
Fig. 9 is the schematic cross-section of the fingerprint module of the 5th embodiment provided by the invention；
Figure 10 is the schematic cross-section of the fingerprint module of sixth embodiment provided by the invention；
Figure 11 is the schematic cross-section of the fingerprint module of the 7th embodiment provided by the invention；
Figure 12 is the schematic cross-section of the fingerprint module of the 8th embodiment provided by the invention；
Figure 13 is the schematic cross-section of the fingerprint module of the 9th embodiment provided by the invention；
Figure 14 is the schematic diagram of mobile terminal provided by the invention；
Figure 15 is the schematic flow sheet of fingerprint module preparation method provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1~Fig. 3 is referred to, the present invention provides a kind of mobile terminal 200 (see Figure 14) of embodiment, the mobile terminal
200 include terminal body 201 (see Figure 14), mainboard 202 (see Figure 14) and are fixed on the terminal body 201 and electrically connect institute
State the fingerprint module 100 of mainboard 202.The fingerprint module 100 receives user fingerprints information, and is transferred to mainboard 202, mainboard
202 control mobile terminal 200 to run according to user fingerprints information.
The mobile terminal can be the intelligent mobile terminals such as mobile phone, computer, flat board, handheld device or media player.
In the present embodiment, illustrated so that the mobile terminal is mobile phone as an example.
As shown in Figures 1 to 3, the fingerprint module 100 includes cover plate 10, fingerprint chip 20, pinboard 30 and circuit board 40.
The cover plate 10 is provided with installing zone 11, and the fingerprint chip 20 is fixed on the installing zone 11.The pinboard 30 fits in institute
Fingerprint chip 20 and the 10 opposite side of cover plate are stated, to push down the fingerprint chip 20.The circuit board 40 is through the switching
Plate 30 electrically connects the fingerprint chip 20.
Fitted in by the pinboard 30 on the fingerprint chip 20, so as to utilize the gravity of the pinboard 30 to institute
State fingerprint chip 20 and produce pressure force, to increase the adhesive force of the fingerprint chip 20 and the cover plate 10, so that described
The combination of fingerprint chip 20 and the cover plate 10 is more firm, and the fingerprint chip 20 is not easy to be influenceed by the circuit board 40 and taken off
From the cover plate 10, so as to improve the quality of the fingerprint module 100.
The cover plate 10 can be mobile phone protecgulum or cell phone rear cover.There is provided first embodiment, the cover plate 10 with
Illustrated exemplified by mobile phone protecgulum.Specifically, the cover plate 10 is covering the display screen 203 of mobile terminal 200.The cover plate
10 include the medial surface 13 that lateral surface 12 and relatively described lateral surface 12 are set.The lateral surface 12 is towards user, the inner side
Face 13 is being bonded the mainboard 203.The medial surface 13 is by transparent area 131 and the shading region adjacent to the lower end of transparent area 131
132.Light of the transparent area 131 through the display screen 203 (see Figure 14).Ink layer is coated with the shading region 132
133, the ink layer 133 covers the light of the non-display area of display screen 203, so as to prevent the light leak of display screen 203.The peace
Dress area 11 is located at the shading region 132, to facilitate user to touch the fingerprint chip 20 on the installing zone 11.More specifically,
The medial surface 13 is provided with groove 134 in the shading region 132.The groove 134 is included close to the bottom surface of the lateral surface 12
135.The installing zone 11 coincides with the bottom surface 135.I.e. described fingerprint chip 20 is fitted on the bottom surface 135.So as to
So that the distance of the fingerprint chip 20 and the lateral surface 12 reduces.So that when user corresponds on the lateral surface 12
The position of the groove 134 touches, and the fingerprint chip 20 can receive the finger print information of user.The bottom surface 135 is to described
The distance L of lateral surface 12 is less than or equal to 0.3mm.By the way that the fingerprint chip 20 to be hidden in the inner side of the cover plate 10, from
And make it that the fingerprint film group 100 reaches water-proof function, but also the appearance property of mobile terminal 200 can be improved.And can
Effectively to reduce the integral thickness of the mobile terminal 200.Certainly, in other embodiments, by strengthening the fingerprint core
The signal receiving performance of piece 20, so as to directly be bonded the fingerprint chip 20 on the medial surface 13, so as to reduce
State the production cost of cover plate 10.
In the present embodiment, the fingerprint chip 20 is in elliptical plate members.The profile of the fingerprint chip 20 is by two semicircles
Formed with a rectangle.The fingerprint chip 20 includes encapsulated layer 21, chip 22 and substrate 23.The chip 22 is fixed on described
On substrate 23, the encapsulated layer 21 is laminated on 23 on the substrate, and coats the chip 22.Specifically, the fingerprint core
Piece 20 includes the identification face 24 being arranged on the encapsulated layer 21 and the joint face 25 being arranged on the substrate 23.It is appreciated that
, the identification face 24 is fitted on the bottom surface 135 towards user, the identification face 24.Institute is passed through in the identification face 24
State the finger print information that cover plate 10 receives user.The joint face 25 can set pad on user, the joint face 25
251, so as to facilitate the fingerprint chip 20 to be electrically connected to the pinboard 30 using pad 251.In other embodiments, institute
Stating fingerprint chip 20 can be with the form of a circular plate.
The pinboard 30 can be hard plate or can provide the plate of gravity contention effect.The pinboard
30 fit on the fingerprint chip 20 so that the fingerprint chip 20, can be with when fitting in the bottom surface 135 of the cover plate 10
Oppressed by the gravity of the pinboard 30, so as to increase conflict power of the fingerprint chip 20 to the cover plate 10 so that institute
Fingerprint chip 20 is stated to combine closely with the cover plate 10.After the fingerprint chip 20 and the cover plate 10 are firmly combined with, by institute
Circuit board 40 is stated to electrically connect with the pinboard 30.So as to which the circuit board 40 is less than institute to the tractive force of the fingerprint chip 20
The adhesive force between fingerprint chip 20 and the cover plate 10 is stated, so as to which the fingerprint chip 20 is not easily disconnected from the cover plate 10, is entered
And it ensure that the quality of the fingerprint module 100.The fingerprint chip 20 is oppressed by the way that the pinboard 30 is balanced, so that
It is bonded between the fingerprint chip 20 and the cover plate 10 closely, and then is less prone to bubble, so as to which the fingerprint chip 20 is flat
It is whole to fit in the cover plate 10, improve the quality of the fingerprint module 100.The pinboard 30 is except to the fingerprint chip
20 are provided outside oppressive force, and the pinboard 30 can also carry out conduction to the fingerprint chip 20, to transmit the fingerprint core
The fingerprint signal pulse of piece 20.The pinboard 30 electrically connects the fingerprint chip 20 and the circuit board 40, by the finger
The electric signal of line chip 20 is transferred to the circuit board 40, and electric signal is transferred to the mobile terminal by the circuit board 40
200 mainboard 202.
Fig. 1~Fig. 3 is referred to, in the first embodiment, the pinboard 30 is printed circuit board (PCB).The pinboard 30 can
To set the circuit of mutual conduction in both sides, so as to be electrically connected the fingerprint chip 20 and the circuit using two lateral circuits
Plate 40, so that the fingerprint chip 20 and the mutual conduction of the circuit board 40.And each weldering of the fingerprint chip 20
Disk 251 can be respectively through different connections to the circuit board 40, to ensure that effective electric signal of the fingerprint chip 20 passes
Pass.Specifically, the pinboard 30 includes the first contact surface 31 for being bonded the fingerprint chip 20 and relatively described first contact
Second contact surface 32 in face 31.First contact surface 31 is provided with multiple first pins 311 for electrically connecting the fingerprint chip 20.
Second contact surface 32 is provided with the multiple second pins 321 being respectively turned on multiple first pins 311.The circuit board
40 fit in second contact surface 32, and electrically connect multiple second pins 321.Multiple first pins 311 can be with
The multiple pads 251 being welded in respectively through scolding tin on the joint face 25.And multiple second pins 321 can weld
In on the circuit board 40.So as to ensure that the structural soundness of the fingerprint module 100, and it ensure that the fingerprint chip 20
With the electric conductivity of the circuit board 40.
The circuit board 40 is provided with the circuit for electrically connecting the pinboard 30.One end of the circuit board 40 is electrically connected to institute
Pinboard 30 is stated, the other end is electrically connected to the mainboard 202 of the mobile terminal 200.And because the fingerprint chip 20 is positioned at shifting
The lower end of dynamic terminal 200, and the mainboard 202 is usually located at the centre position of the mobile terminal 200, it is described so as to be connected to
One end of circuit board 40 can be offset relative to the fingerprint chip 20.So the center of gravity of the circuit board 40 generally relatively described fingerprint
Chip 20 is offset, and the length of the circuit board 40 is longer under normal conditions, and the weight of circuit board 40 is than the fingerprint chip 20
, so the circuit board 40 is influenceed by self gravitation, certain tractive force be present to the fingerprint chip 20 in weight.And due to described
Fingerprint chip 20 is by the contention effect of the pinboard 30, and the fingerprint chip 20 and the cover plate 10 also exist and adhered to
Power, so as to which influence of the circuit board 40 to the fingerprint chip 20 reduces.Therefore the length of the circuit board 40 can increase,
Other electronic components can also be set on the circuit board 40, so as to improve the service efficiency of the circuit board 40, improve institute
State the Adapter Property of fingerprint module 100.The one end of the circuit board 40 away from the fingerprint chip 20 can be connected to the master
The optional position of plate 202, and the circuit board 40 can be in arbitrary structures form in the mobile terminal 200.
In the first embodiment, the circuit board 40 is flexible PCB.The circuit board 40 can be any as needed
Bending.Specifically, the circuit board 40 includes first end 41 and is oppositely arranged the second end 42 of the setting of first end 41.Described first
End 41 is welded in multiple second pins 321 of the pinboard 20 through scolding tin.Second end 42 is provided with connector 421, institute
State connector 421 can with the grafting of mainboard 202, so as to facilitate the fingerprint module 100 and the 202 removable company of mainboard
Connect, it is convenient that the fingerprint module 100 is safeguarded, and the convenient Adapter Property for increasing the fingerprint module 100.The circuit
Plate 40 can also set strengthening course 43 between the first end 41 and second end 42 and be laminated on the strengthening course 43
Electronic component 44.The strengthening course 43 can be that steel is mended, and the electronic component 44 can be electric capacity, resistance or diode etc..
By setting the strengthening course 43 and the electronic component 44 between the first end 41 and second end 42, so as to increase
The Electric signal processing performance of the circuit board 40, and effectively transmit the electric signal of the fingerprint chip 20.It is so that described
Circuit board 40 will not still have an impact to the fingerprint chip 20 in the case of self gravitation is increased, that is, the finger is effectively ensured
The firm combination of line chip 20 and the cover plate 10, so as to improve the quality of the fingerprint module 100.In other embodiment
In, the circuit board 40 can also be laminated on the pinboard 30 after bending.
Fig. 4~Fig. 6 is referred to, the present invention also provides second embodiment, roughly the same with first embodiment, unlike,
The pinboard 30 is flexible PCB.The pinboard 30 can any bending, set so as to convenient on the pinboard 30
Put the convenient copper foil circuit for electrically connecting the fingerprint chip 20 and the circuit board 40.And effectively reduce the pinboard 30
Production cost, and the suitability of the increase pinboard 30.Specifically, the pinboard 30 is relative including the first connection end 33
The second connection end 34 of first connection end 33.After the relatively described bending of first connection end 33 of the second connection end 34 and lead to
Cross viscose glue to be mutually laminated, first connection end 33 electrically connects the fingerprint chip 20, and the second connection end 34 electrically connects described
Circuit board 40.More specifically, the pinboard 30 includes the second of first side 35 and the relatively described setting of first side 35
Side 36.Multiple copper that the second connection end 34 is extended to from first connection end 33 are provided with the first side 35
Tinsel cord road 37.Each copper foil circuit 37 is in the corresponding pad 251 for connecting the fingerprint chip 20 in first connection end 33.
And each copper foil circuit 37 electrically connects the circuit board 40 in the second connection end 34.On first connection end 33
Copper foil circuit 37 is welded on the pad 251 through scolding tin.So as to which first connection end 33 can be stable in the fingerprint core
Piece 20 combines.The profile of first connection end 33 is consistent with the profile of the fingerprint chip 20, and first connection end 33
Geometric center and the geometric center of the fingerprint chip 20 coincide.So as to which first connection end 33 can effectively oppress institute
State fingerprint chip 20.After relatively described first connection end 33 of the second connection end 34 is bent, the second connection end 34 and institute
State the phase stacking of the first connection end 33.The second connection end 34 is connected to the circuit board 40, so that the pinboard 30
With the firm combination of the circuit board 40.The second connection end 34 coincides with first connection end 33, and then causes described
The overall center of gravity of pinboard 30 is relative with the center of gravity of the fingerprint chip 20, so that the whole pinboard 30 is effectively oppressed
The fingerprint chip 20 so that the fingerprint chip 20 is combined closely with the cover plate 10.First connection end 33 and described
Connected between second connection end 34 by dowel 38.And first connection end 33 and the second connection end 34 overlap
Afterwards, bonded together by double faced adhesive tape 39, to cause the overall structure of the pinboard 30 to consolidate, to ensure the switching class 30
Center of gravity can be relative with the geometric center of the fingerprint chip 30.The copper foil circuit 37 is in the first side 35 by institute
State the first connection end 33 and extend to the second connection end 34 through the dowel 38.So as to which the electricity of pinboard 30 be effectively ensured
It is connected to the fingerprint chip 20 and circuit board 40.
In a second embodiment, in order to ensure the intensity of the pinboard 30, and the gravity of the increase pinboard 30,
To improve active force of the pinboard 30 to the fingerprint chip 20, the fingerprint module 100 also includes stiffening plate 50.This reality
Apply in example, the fingerprint module 100 includes two stiffening plates 50.Two stiffening plates 50 fit in described first respectively
On connection end 33 and the second connection end 34, and in the second side 36.The center of gravity of two stiffening plates 50 with
The center of gravity of the fingerprint chip 20 is relative.The stiffening plate 50 can be steel reinforcement or resin reinforcement.Two benefits
Bonded together between strong plate 50 by the double faced adhesive tape 39, so as to prevent the centre-of gravity shift of two stiffening plates 50.
In a second embodiment, led between the pinboard 30 and the circuit board 40 by the phase of board to board connector 60
It is logical.Specifically, the board to board connector 60 includes socket 61 and plug 62.The socket 61 is welded in the pinboard 30
In first side 35, and it is located at the second connection end 34.The socket 61 electrically connects the copper foil circuit 37.The plug 62
It is welded on circuit board 40, and is located at the first end 41.The circuit board 40 is at the first end 41, with the plug 62
Opposite side is provided with reinforcement 45, to strengthen the bond strength of the plug 62 and the socket 61.By in the pinboard
The board to board connector 60 is set between 30 and the circuit board 40, so that the weight penalty of the pinboard 30, with
Strengthen the steadiness to the fingerprint chip 20.And facilitate the circuit board 40 to be connected with the pinboard 30, facilitate institute
State circuit board 40 and the demolition and maintenance of pinboard 30.
Referring to Fig. 7, the present invention also provides 3rd embodiment, and it is roughly the same with first embodiment, the difference is that described turn
It is conducted between fishplate bar 30 and the circuit board 40 by board to board connector 60a.The board to board connector 60a and the plate
Setting identical to the structure of connector for substrate 60, will not be repeated here.Specifically, in the pinboard 30 and the phase of fingerprint chip 20
After fitting, the pinboard 30 and the circuit board 40 are conducted using the board to board connector 60a, so that described
It is connected to using the board to board connector 60a between the pinboard 30 and the circuit board 40, so as to increase the switching
The weight of plate 30, to increase oppressive force of the pinboard 39 to the fingerprint chip 20 so that the fingerprint chip 20 and institute
State the firm combination of cover plate 10.
Referring to Fig. 8, the present invention also provides fourth embodiment, it is roughly the same with first embodiment, unlike, described turn
It is conducted between fishplate bar 30 and the circuit board 40 by conducting resinl 70.Specifically, fit in the finger in the pinboard 30
After line chip 20, the conducting resinl 70 is coated on the second contact surface 32 of the pinboard 30.Then by the circuit board 40
First end 41 be adhered to through the conducting resinl 70 on second contact surface 32.Pressurizeed by being heated to the conducting resinl 70,
The realization pair on the direction of vertical second contact surface 32 after being flattened so as to the metallic carried inside the conducting resinl 70
The second pin 321 turns on the circuit board 40.So that the circuit board 40 is electrically connected with the pinboard 30,
And cause the circuit board 40 and the firm combination of the pinboard 30.
Referring to Fig. 9, the present invention also provides the 5th embodiment, it is roughly the same with first embodiment, unlike, the finger
It is conducted between line chip 20 and the pinboard 30 by board to board connector 60b.The board to board connector 60b with it is described
Board to board connector 60a structures are identical, will not be repeated here.The plate connects machine 60b to plate close to the fingerprint chip 20
One end is welded on the substrate 23 of the fingerprint chip 20, and electrically connects the pad 251 of the joint face 25.The plate connects to plate
The machine 60b other end is welded on the first contact surface 31 of the pinboard 30, and is electrically connected on first contact surface 31
First pin 311.
Referring to Fig. 10, the present invention also provides sixth embodiment, it is roughly the same with the first embodiment, unlike,
It is conducted between the fingerprint chip 20 and the pinboard 30 by conducting resinl 70a.Specifically, in the fingerprint chip 20
The conducting resinl 70a is coated with joint face 25, the pinboard 30 is adhered to the joint face 25 by the conducting resinl 70a
On, and make it that first pin 311 is electrically connected on the joint face 25 through the conducting resinl 70a on first contact surface 31
Pad 251.
Certainly, fingerprint module protection domain provided by the present invention is not excluded for any simple replacement to above-described embodiment,
Or any combination, to form new embodiment.
Figure 11 is referred to, the present invention also provides the 7th embodiment, roughly the same with first embodiment, unlike, it is described
Circuit board 40 is printed circuit board (PCB).The circuit board 40 can be the mainboard of mobile terminal 200 or independently of the shifting
The mainboard 202 of dynamic terminal 200, i.e., mainboard 202 and institute in the mobile terminal 200 is respectively welded in the both sides of described circuit board 40
State pinboard 30.Increased using the rigid of the circuit board 40 so that the firm carrying fingerprint core of the circuit board 40
Piece 20, so that the Quality advance of fingerprint module 100.Certainly, in a second embodiment, the circuit board 40 can also be adopted
Replaced with printed circuit board (PCB).
Figure 12 is referred to, the present invention also provides the 8th embodiment, roughly the same with first embodiment, unlike, it is described
The lateral surface 12 of cover plate 10 opens up the groove 121.It is relative with the groove 121 that the installing zone 11 is located at the medial surface 13
It should locate.I.e. described fingerprint chip 20 fits in the medial surface 13 and the corresponding section of groove 121.The groove 121 includes
Bottom surface 122, the bottom surface 122 to distance 1 between the identification face 21 of the fingerprint chip 20 are less than or equal to 0.3mm.With convenient
For user when being touched on the bottom surface 122 of the groove 121, the fingerprint chip 20 obtains user fingerprints letter by the cover plate 10
Breath.
Figure 13 is referred to, the present invention also provides the 9th embodiment, roughly the same with first embodiment, unlike, it is described
Cover plate 10 is provided through the mounting hole 14 of the lateral surface 12 and the medial surface 13.The installing zone 11 is located at the mounting hole
In 14.I.e. fingerprint chip 20 is located in the mounting hole 14.It is installed on using the fingerprint chip 20 in the mounting hole 14, from
And facilitate user to pass through the identification face 21 that the mounting hole 14 directly touches the fingerprint chip 20, so as to improve the fingerprint core
The fingerprint collecting accuracy of piece 20.
Figure 15 is referred to, the present invention also provides a kind of fingerprint module preparation method, for making the fingerprint module 100.
The fingerprint module making side includes：
S01：Cover plate 10, fingerprint chip 20 and pinboard 30 are provided, the pinboard 30 is fitted in into the fingerprint chip
After 20, the fingerprint chip 20 is fixed on the cover plate 10, the pinboard 30 provides compressing to the fingerprint chip 20
Power.
In the first embodiment, first, there is provided the cover plate 10, the cover plate 10 have medial surface 13.The medial surface
The groove 134 is opened up on 13.
Then, the pinboard 30 is fitted in into the fingerprint chip 20.The pinboard 30 is printed circuit board (PCB).It is described
Fingerprint chip 20 has the joint face 25 set towards the identification face 24 of user and relatively described identification face 24.The pinboard 30
Fitted in through conducting resinl on the joint face 25.So that the pinboard 30 and the overall structure of fingerprint chip 20 consolidate.
Finally, viscose glue is set on the identification face 24, the fingerprint chip 20 is adhered to the groove using viscose glue
In 134.The fingerprint chip 20 is closely contacted at the bottom surface 135 of the groove 134 by the Action of Gravity Field of the pinboard 30.
So that the fingerprint chip 20 and the firm combination of the cover plate 10.
Certainly, the pinboard 30 is fitted in into the fingerprint chip 20 in other embodiments or first
Joint face 25, viscose glue then is coated with the identification face 24 of the fingerprint chip 20, the cover plate 10 is finally provided, by the fingerprint
Chip 20 is adhered on the cover plate 10 through the viscose glue.
In a second embodiment, it is roughly the same with the first embodiment, unlike, the pinboard 30 is flexible electrical
Road plate.First, there is provided the pinboard 30, the pinboard 30 have the first connection end 33 and relatively described first connection end 33
The second connection end 34 of setting.
Then, first connection end 33 is welded on the joint face 25 of the fingerprint chip 20, and described first
Connection end 33 is coated with double faced adhesive tape 39 with the 20 opposite side of fingerprint chip.
After again, by the second connection end 34 to the bending of the first connection end 33 so that the second connection end 34 with
The phase of first connection end 33 stacking, the second connection end 34 are bonded first connection end 33 by the double faced adhesive tape 39,
So that the overall center of gravity of the pinboard 30 with the center of gravity of the fingerprint chip 10 in the direction of the vertical joint face 25
It is oppositely arranged.So as to which the pinboard 30 consolidates with the overall structure of fingerprint chip 20.
Finally, viscose glue is set on the identification face 24, the fingerprint chip 20 is adhered to the groove using viscose glue
In 134.The fingerprint chip 20 is closely contacted at the bottom surface 135 of the groove 134 by the Action of Gravity Field of the pinboard 30.
So that the fingerprint chip 20 and the firm combination of the cover plate 10.
In the third embodiment, the step S01 is carried out using with the first embodiment same way, it is no longer superfluous herein
State.
In the fourth embodiment, the step S01 is carried out using with the first embodiment same way, it is no longer superfluous herein
State.
In the 5th embodiment, mode roughly the same with the first embodiment carries out the step S01, unlike,
It is conducted between the fingerprint chip 20 and the pinboard 30 by board to board connector 60b.
First, the plate is connected to machine 60b to plate and is welded in the fingerprint chip close to one end of the fingerprint chip 20
On 20 substrate 23, and electrically connect the pad 251 of the joint face 25.
Then, the other end that the plate is connected to machine 60b to plate is welded on the first contact surface 31 of the pinboard 30,
And electrically connect the first pin 311 on first contact surface 31.
After again, the both ends that the plate is connected to machine 60b to plate are connected with group, so that the pinboard 30 and the fingerprint chip
20 are fixed together so that the fingerprint chip 20 and the stabilized structure of pinboard 30.Utilize the pinboard 30 and described
Board to board connector 60b gravity oppresses the fingerprint chip 20.
Finally, viscose glue is set on the identification face 24, the fingerprint chip 20 is adhered to the groove using viscose glue
In 134.The fingerprint chip 20 is closely contacted at the bottom surface 135 of the groove 134 by the Action of Gravity Field of the pinboard 30.
So that the fingerprint chip 20 and the firm combination of the cover plate 10.
In the sixth embodiment, mode roughly the same with the first embodiment carries out the step S01, unlike,
It is conducted between the fingerprint chip 20 and the pinboard 30 by conducting resinl 70a.Specific implementation process refers to the above-mentioned 6th
Embodiment illustrates, will not be repeated here.
In the 7th embodiment, mode roughly the same with first embodiment carries out the step S01, unlike, it is described
Circuit board 40 is printed circuit board (PCB).Specific implementation process illustrates with reference to above-mentioned 7th embodiment, will not be repeated here.
In the 8th embodiment, mode roughly the same with first embodiment carries out the step S01, unlike, it is described
The lateral surface 12 of cover plate 10 opens up the groove 121.It is relative with the groove 121 that the installing zone 11 is located at the medial surface 13
It should locate.Specific implementation process illustrates with reference to above-mentioned 8th embodiment, will not be repeated here.
In the 9th embodiment, mode roughly the same with first embodiment carries out the step S01, unlike, it is described
Cover plate 10 is provided through the mounting hole 14 of the lateral surface 12 and the medial surface 13.The installing zone 11 is located at the mounting hole
In 14.Specific implementation process illustrates with reference to above-mentioned 9th embodiment, will not be repeated here.
S02：Circuit board 40 is provided, the circuit board 40 is electrically connected to the fingerprint chip 20 through the pinboard 30.
In the first embodiment, the circuit board 40 is flexible PCB.The circuit board 40 has first end 41 and phase
To the second end 42 for setting first end 41 to set.The first end 41 is welded in the pinboard 20, to realize the circuit
Plate 40 electrically connects the fingerprint chip 20.
In a second embodiment, the step S02 is carried out using with the first embodiment same way, it is no longer superfluous herein
State.
In the third embodiment, mode roughly the same with first embodiment carries out the step S02, the difference is that described turn
It is conducted between fishplate bar 30 and the circuit board 40 by board to board connector 60a.Specific implementation process is real with reference to the above-mentioned 3rd
Example explanation is applied, will not be repeated here.
In the fourth embodiment, mode roughly the same with first embodiment carries out the step S02, the difference is that described turn
It is conducted between fishplate bar 30 and the circuit board 40 by conducting resinl 70.Specific implementation process is said with reference to above-mentioned fourth embodiment
It is bright, it will not be repeated here.
In the 5th embodiment, the step S02 is carried out using with the first embodiment same way, it is no longer superfluous herein
State.
In the sixth embodiment, the step S02 is carried out using with the first embodiment same way, it is no longer superfluous herein
State.
In the 7th embodiment, mode roughly the same with first embodiment carries out the step S02, unlike, it is described
Circuit board 40 is printed circuit board (PCB).Specific implementation process illustrates with reference to above-mentioned 7th embodiment, will not be repeated here.
In the 8th embodiment, the step S02 is carried out using with the first embodiment same way, it is no longer superfluous herein
State.
In the 9th embodiment, the step S02 is carried out using with the first embodiment same way, it is no longer superfluous herein
State.
Fingerprint module, fingerprint module preparation method and mobile terminal provided by the invention, are fitted in by the pinboard
On the fingerprint chip, so as to produce pressure force to the fingerprint chip using the gravity of the pinboard, to increase the finger
The adhesive force of line chip and the cover plate, so that the combination of the fingerprint chip and the cover plate is more firm, the fingerprint
Chip is not easy to be influenceed by the circuit board and depart from the cover plate, so as to improve the quality of the fingerprint module.
Embodiments described above, the restriction to the technical scheme protection domain is not formed.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical scheme
Within enclosing.
Claims (10)
1. a kind of fingerprint module, it is characterised in that the fingerprint module includes cover plate, fingerprint chip, pinboard and circuit board, institute
State cover plate and be provided with installing zone, the fingerprint chip is fixed on the installing zone and has multiple pads, and the pinboard fits in
The fingerprint chip side opposite with the cover plate, to provide oppressive force to the fingerprint chip, to increase the fingerprint chip
With the adhesive force of the cover plate, so that the combination of the fingerprint chip and the cover plate is more firm, the fingerprint chip is sharp
The pinboard is electrically connected to pad, the circuit board electrically connects the fingerprint chip, the multiple weldering through the pinboard
Disk is respectively through different connection to the circuit board, to ensure effective electric signal transmission of the fingerprint chip.
2. fingerprint module as claimed in claim 1, it is characterised in that the pinboard is printed circuit board (PCB).
3. fingerprint module as claimed in claim 2, it is characterised in that the pinboard includes being bonded the of the fingerprint chip
Second contact surface of one contact surface and relatively described first contact surface, first contact surface, which is provided with, electrically connects the fingerprint chip
Multiple first pins, the multiple first pin is respectively welded on the multiple pad, second contact surface be provided with
Multiple second pins that the multiple first pin is respectively turned on, the circuit board fits in second contact surface, and is electrically connected
Connect the second pin.
4. the fingerprint module as described in claims 1 to 3 any one, it is characterised in that the pinboard and the circuit board
Between be conducted by scolding tin or board to board connector or conducting resinl.
5. the fingerprint module as described in claims 1 to 3 any one, it is characterised in that the circuit board is flexible PCB
Or printed circuit board (PCB).
6. the fingerprint module as described in claims 1 to 3 any one, it is characterised in that the cover plate includes medial surface and phase
To the lateral surface of the medial surface, to contact user fingerprints, the lateral surface or the medial surface are provided with recessed the lateral surface
Groove, the installing zone are located at the groove of the medial surface, or positioned at the groove corresponding section of the medial surface and the lateral surface.
7. a kind of fingerprint module preparation method, it is characterised in that the fingerprint module preparation method includes：
Cover plate, fingerprint chip and pinboard are provided, and multiple pads are set on the fingerprint chip, the fingerprint chip passes through institute
State pad and be electrically connected to the pinboard, the fingerprint chip is fixed on the cover plate, the pinboard is to the fingerprint
Chip provides oppressive force, to increase the adhesive force of the fingerprint chip and the cover plate, so that the fingerprint chip and institute
The combination for stating cover plate is more firm；
Circuit board is provided, the circuit board is electrically connected to the fingerprint chip, the multiple pad difference through the pinboard
Through different connection to the circuit board, to ensure effective electric signal transmission of the fingerprint chip.
8. fingerprint module preparation method as claimed in claim 7, it is characterised in that the circuit board is flexible PCB, institute
State and be conducted between pinboard and the circuit board by scolding tin or board to board connector or conducting resinl.
9. fingerprint module preparation method as claimed in claim 7, it is characterised in that the cover plate includes medial surface and relative institute
The lateral surface of medial surface is stated, the lateral surface is to contact user fingerprints, and the fingerprint chip is by adhesive plaster together in described interior
Side.
10. a kind of mobile terminal, it is characterised in that the mobile terminal includes fingerprint mould described in claim 1~6 any one
Group.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810166216.3A CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
| CN201610675359.8A CN106096596B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module, fingerprint module preparation method and mobile terminal |
| EP17185937.4A EP3288246A1 (en) | 2016-08-16 | 2017-08-11 | Fingerprint module and method for manufacturing the fingerprint module |
| US15/677,415 US10368444B2 (en) | 2016-08-16 | 2017-08-15 | Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal |
| PCT/CN2017/097706 WO2018033104A1 (en) | 2016-08-16 | 2017-08-16 | Fingerprint module and method for manufacturing the fingerprint module |
| US15/953,823 US10342137B2 (en) | 2016-08-16 | 2018-04-16 | Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675359.8A CN106096596B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module, fingerprint module preparation method and mobile terminal |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810166216.3A Division CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106096596A CN106096596A (en) | 2016-11-09 |
| CN106096596B true CN106096596B (en) | 2018-03-27 |
Family
ID=58070729
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610675359.8A Active CN106096596B (en) | 2016-08-16 | 2016-08-16 | Fingerprint module, fingerprint module preparation method and mobile terminal |
| CN201810166216.3A Active CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810166216.3A Active CN108462768B (en) | 2016-08-16 | 2016-08-16 | Fingerprint mould group, fingerprint mould group production method and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN106096596B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108462768A (en) * | 2016-08-16 | 2018-08-28 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module production method and mobile terminal |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3288246A1 (en) | 2016-08-16 | 2018-02-28 | Guangdong Oppo Mobile Telecommunications Corp., Ltd | Fingerprint module and method for manufacturing the fingerprint module |
| CN107066949A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN107153826B (en) * | 2017-05-26 | 2020-01-10 | Oppo广东移动通信有限公司 | Manufacturing method of fingerprint identification module and fingerprint identification module |
| CN107273854A (en) * | 2017-06-16 | 2017-10-20 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN113597091A (en) * | 2021-08-03 | 2021-11-02 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205193832U (en) * | 2015-12-11 | 2016-04-27 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and electron device |
| CN105528104A (en) * | 2015-07-03 | 2016-04-27 | 宸鸿科技(厦门)有限公司 | A touch control panel having a fingerprint identification function and a method for manufacturing the same |
| CN205302318U (en) * | 2015-12-01 | 2016-06-08 | 惠州凯尔光电有限公司 | Hidden fingerprint identification module of components and parts |
| CN206178865U (en) * | 2016-08-16 | 2017-05-17 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340430A (en) * | 1986-08-05 | 1988-02-20 | Fujitsu Ltd | Constitution of telephone sounder |
| JP5012744B2 (en) * | 2008-09-17 | 2012-08-29 | 富士通株式会社 | Electronics |
| KR102126816B1 (en) * | 2013-09-09 | 2020-07-08 | 삼성전자주식회사 | Fingerprint recognition apparatus and method |
| CN204203987U (en) * | 2014-10-20 | 2015-03-11 | 上海思立微电子科技有限公司 | A kind of fingerprint detection assembly and fingerprint recognition module |
| CN104779221A (en) * | 2015-04-08 | 2015-07-15 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module packaging structure, method for preparing fingerprint identification module packaging structure as well as electronic equipment |
| CN105046190B (en) * | 2015-05-08 | 2017-12-19 | 苏州迈瑞微电子有限公司 | Fingerprint recognition module |
| CN105759913B (en) * | 2016-02-23 | 2019-04-19 | Oppo广东移动通信有限公司 | Mobile terminal |
| CN106096596B (en) * | 2016-08-16 | 2018-03-27 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module preparation method and mobile terminal |
-
2016
- 2016-08-16 CN CN201610675359.8A patent/CN106096596B/en active Active
- 2016-08-16 CN CN201810166216.3A patent/CN108462768B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105528104A (en) * | 2015-07-03 | 2016-04-27 | 宸鸿科技(厦门)有限公司 | A touch control panel having a fingerprint identification function and a method for manufacturing the same |
| CN205302318U (en) * | 2015-12-01 | 2016-06-08 | 惠州凯尔光电有限公司 | Hidden fingerprint identification module of components and parts |
| CN205193832U (en) * | 2015-12-11 | 2016-04-27 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and electron device |
| CN206178865U (en) * | 2016-08-16 | 2017-05-17 | 广东欧珀移动通信有限公司 | Fingerprint module and mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108462768A (en) * | 2016-08-16 | 2018-08-28 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module production method and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106096596A (en) | 2016-11-09 |
| CN108462768A (en) | 2018-08-28 |
| CN108462768B (en) | 2019-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106096596B (en) | Fingerprint module, fingerprint module preparation method and mobile terminal | |
| CN206178865U (en) | Fingerprint module and mobile terminal | |
| CN106295590A (en) | Fingerprint module, fingerprint module manufacture method and mobile terminal | |
| CN109068478B (en) | Flexible circuit board and display device | |
| CN201234406Y (en) | Flexible printed circuit board | |
| CN107066949A (en) | fingerprint module, display screen and mobile terminal | |
| CN113543476A (en) | Circuit board assembly, manufacturing method thereof and display device | |
| CN105578749A (en) | Circuit board connecting assembly and mobile terminal | |
| CN106329077A (en) | Double-sided board wire-based NFC (Near Field Communication) antenna and electronic device | |
| CN203746044U (en) | OGS structure and capacitive touch screen with same | |
| CN204031276U (en) | A kind of mobile phone camera module | |
| CN207337376U (en) | A kind of critical print structure of circuit of touch panel | |
| CN206164987U (en) | A PCB board and electronic equipment for bed hedgehopping flash light | |
| CN109324707A (en) | The production method of flexible circuit board, touch screen and touch screen | |
| CN105549234B (en) | A kind of battery having a display function and the electronic equipment comprising the battery | |
| CN209373566U (en) | A kind of electronic device | |
| CN203338796U (en) | Transparent conductive film | |
| CN113597091A (en) | Flexible circuit board, display device and preparation method thereof | |
| CN207897217U (en) | A kind of high reliability carbon ink wiring board | |
| CN204990237U (en) | Touch panel | |
| CN206302633U (en) | A kind of pcb board structure for connecting surface-mount type connector pin | |
| CN206340661U (en) | Mobile terminal | |
| CN201557324U (en) | Flexible printed circuit board convenient for installation | |
| CN205983523U (en) | Multi -functional financial IC -card | |
| CN210721420U (en) | Step type flexible PET touch screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. |