CN203746044U - OGS structure and capacitive touch screen with same - Google Patents

OGS structure and capacitive touch screen with same Download PDF

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Publication number
CN203746044U
CN203746044U CN201320883454.9U CN201320883454U CN203746044U CN 203746044 U CN203746044 U CN 203746044U CN 201320883454 U CN201320883454 U CN 201320883454U CN 203746044 U CN203746044 U CN 203746044U
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CN
China
Prior art keywords
fpc
control
substrate
integrated touch
ogs structure
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Expired - Fee Related
Application number
CN201320883454.9U
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Chinese (zh)
Inventor
卢金妹
白雪松
彭小宁
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Shenzhen Holitech Optoelectronics Co Ltd
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BYD Co Ltd
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Priority to CN201320883454.9U priority Critical patent/CN203746044U/en
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Publication of CN203746044U publication Critical patent/CN203746044U/en
Anticipated expiration legal-status Critical
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Abstract

The utility model provides an OGS structure and a capacitive touch screen with the same. The OGS structure comprises an FPC, a substrate and a fixing assembly, wherein the fixing assembly is arranged in a bonding area between the FPC and the substrate and enables the FPC and the substrate to be bonded as a whole in an adhering mode. The OGS structure and the capacitive touch screen with the same can avoid cocking and tearing of the FPC, prevent moisture and impurities in air from entering, is not prone to causing scratching of the FPC, can improve the yield of products, and improve the stability of the products.

Description

Integrated touch-control OGS structure and there is its capacitive touch screen
Technical field
The utility model relates to touch control field, particularly a kind of integrated touch-control OGS structure and have the capacitive touch screen of this integrated touch-control OGS structure.
Background technology
Existing GF(Glass File, glass film) attaching process of capacitance touch screen comprises: a kind of for by TP(Touch Panel, touch pad) product primary mirror sheet Lens with FPC(Flexible Printed Circuit, flexible circuit board) Sensor (a kind of parts with touch function) by UV(Ultraviolet Ray, ultraviolet light) glue bond forms.Because UV glue had mobility before solidifying, therefore its fillibility is than OCA(Optically Clear Adhesive, optical cement) glue has obvious lifting, can fill the offset between FPC to Lens, and can solve well the problem that occurs bubble when OCD fits, in addition, the thickness of UV glue can need to be adjusted according to the structure of product, and can be very thin, therefore paid close attention to by industry gradually, and applied, but, FPC is between Lens and Sensor, even can protect by heat pressing process, still can make that FPC is easy to break causes short circuit.Another kind of OGS (One Glass Solution, monolithic glass scheme) capacitance touch screen of structure adopts the monolithic glass by one glass() with FPC by ACF(Anisotropic Conductive Film, each guide property conducting film) technique that forms of bonding, FPC directly contacts with extraneous, because FPC is flexible, so be easy to becoming FPC to tear up or lose.
Wherein, in correlation technique, Glass (glass) general thickness in capacitance touch screen is 0.7mm-1.1mm, comprises Asahi Glass (Asahi), imperial trace (Dragontrial) and healthy and free from worry (Corning).A kind of structure of FPC as shown in Figure 1, include gum base materials and without gum base materials, as shown in Figure 1, the left side, for there being gum base materials FPC, comprises that each metallic copper Cu layer, middle layer are PI(Polyimide up and down, polyimide), be respectively Adh(Adhesive in PI both sides, tackifier) bonding, the right is without gum base materials FPC, comprises each metal Cu layer up and down, middle PI layer.Wherein, it is as shown in table 1 that one is selected glue-free substrate process requirement:
Table 1
At present, the technique of the most simply making of capacitance touch screen is: by sticking machine, ACF is upper to being placed on FPC, then by FPC and Glass contraposition, weld together by hot press, wherein, hot pressing stress area is ACF region.
The shortcoming that prior art exists has: 1, the Lens of the capacitance touch screen of prior art has one deck ink layer, be mainly used to cover the circuit on Sensor, when from the Lens front illuminated UV light time, UV glue between Lens and FPC cannot be irradiated to, therefore cannot solidify, the reliability and stability of complete machine completed knocked down products are all had to impact, can cause the perk of FPC and tear.2, for the product after fixture laminating, after preventing a period of time, between FPC and one glass, because solidifying not fill area, cause easily entering impurity in steam and air and enter, thereby affect the reliability and stability of completed knocked down products.3, because FPC is flexible, the bonding region of some product extends out for example 0.2mm again taking golden finger overall length and beam overall as benchmark, other all expose, the stressed gravity of FPC concentrates in hot pressing position, the two-sided EMI((Electro Magnetic Interference that is all designed with of FPC at present, electromagnetic interference (EMI)) protection, resistance to bending can circulate, but in assembling process, bending can be because bonding area be too small repeatedly, thereby cause FPC perk and tear, cause yield on the low side, 4, touch-screen and FPC directly carry out hot pressing, PFC is in the time being subject to external force, easily pull hot pressing district, cause FPC perk, if overlay in addition bad, and touch-screen is in the time of assembling, easily make FPC be touched panel glass substrate edges scratch, cause short circuit.
Utility model content
The purpose of this utility model is intended to solve above-mentioned technical matters.
For this reason, an object of the present utility model is to propose a kind of integrated touch-control OGS structure, this integrated touch-control OGS structure can be avoided FPC perk and tear, and can prevent entering of impurity in steam and air, be difficult for causing the scuffing of FPC, and can improve the yield of the product with this structure, improve its stability.
Another object of the present utility model is to propose a kind of capacitive touch screen.
For achieving the above object, the utility model proposes a kind of integrated touch-control OGS structure on the one hand, and this integrated touch-control OGS structure comprises flexible PCB FPC; Substrate; And fixation kit, described fixation kit is arranged on bonding region between described FPC and described substrate so that described FPC and described substrate sticking are integrated.
Integrated touch-control PGS structure of the present utility model, is integrated FPC and substrate sticking by fixation kit, and is completely fixed, can strengthen lifting surface area, reduce golden finger place gravity, can avoid the perk of FPC and tear, and can prevent entering of impurity in steam and air.And fixation kit can be filled smooth by the overhanging portion between FPC and substrate, thereby in the time that integrated touch-control OGS structure is assembled in complete machine, can increase the service life short circuit if generation bending is difficult for causing FPC scuffing to cause, for example, reuse number of times and can reach 500 times.
Wherein, described fixation kit can be high temperature resistant double faced adhesive tape, and concrete example is as being high temperature resistant silicon glue.
Wherein, described high temperature resistant silica gel comprises glass layer of cloth, silica gel resin and the polyimide PI diaphragm of the polythene PE diaphragm that is cascading, high temperature resistant silicon adhesive layer, Teflon.
Fixation kit adopts for example high temperature resistant silica gel of high temperature resistant double faced adhesive tape, can under hot conditions, there is excellent dimensional stability, for example can under the high temperature of 280 degrees Celsius, keep stable adhesive strength, improve the stability that adopts this integrated touch-control OGS infrastructure product.
Wherein, described substrate can be glass substrate.
Particularly, substrate shown in comprises the monolithic glass layer, conducting wire hyaline layer and the ink decorative layer that are cascading.
Wherein, described fixation kit pastes the back side of the described FPC after hot pressing ACF.
Fixation kit pastes the back side of the FPC after hot pressing, pulls hot pressing district can avoid being subject to external force time, avoids FPC to be scratched.
Between described FPC and described substrate, be connected with ACF, the adjacent setting of described fixation kit and ACF.
In addition, the back side of described FPC has golden finger, and described fixation kit is covered on described golden finger.
For achieving the above object, the utility model proposes a kind of capacitive touch screen on the other hand, and this capacitive touch screen comprises above-mentioned integrated touch-control OGS structure.
Capacitive touch screen of the present utility model, by above-mentioned integrated touch-control OGS structure, can improve reliability and stability, enhances productivity and yield.In addition can increase the service life.
The aspect that the utility model is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present utility model.
Brief description of the drawings
The utility model above-mentioned and/or additional aspect and advantage will become from the following description of the accompanying drawings of embodiments obviously and easily and understand, wherein:
Fig. 1 is FPC structural representation of the prior art;
Fig. 2 is according to the schematic diagram of the integrated touch-control OGS structure of an embodiment of the present utility model;
Fig. 3 is according to the OGS structural representation of an example in correlation technique;
Fig. 4 is the rhythmo structure schematic diagram according to the high temperature resistant silica gel of an embodiment of the present utility model; And
Fig. 5 is according to the block diagram of the capacitive touch screen of the utility model embodiment.
Embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Be exemplary below by the embodiment being described with reference to the drawings, only for explaining the utility model, and can not be interpreted as restriction of the present utility model.
Disclosing below provides many different embodiment or example to be used for realizing different structure of the present utility model.Of the present utility model open in order to simplify, hereinafter the parts to specific examples and setting are described.Certainly, they are only example, and object does not lie in restriction the utility model.In addition, the utility model can be in different examples repeat reference numerals and/or letter.This repetition is in order to simplify and object clearly, itself do not indicate the relation between discussed various embodiment and/or setting.In addition, the various specific technique that the utility model provides and the example of material, but those of ordinary skill in the art can recognize the property of can be applicable to of other techniques and/or the use of other materials.In addition, First Characteristic described below Second Characteristic it " on " structure can comprise that the first and second Characteristics creations are the direct embodiment of contact, also can comprise the embodiment of other Characteristics creation between the first and second features, such the first and second features may not be direct contacts.
In description of the present utility model, it should be noted that, unless otherwise prescribed and limit, term " installation ", " being connected ", " connection " should be interpreted broadly, for example, can be mechanical connection or electrical connection, also can be the connection of two element internals, can be to be directly connected, and also can indirectly be connected by intermediary, for the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term.
A kind of integrated touch-control OGS structure proposing according to the utility model embodiment and the capacitive touch screen with this integrated touch-control OGS structure are described with reference to the accompanying drawings.
In fact, OGS structure is at direct formation conducting film on glass and sensor, the touch screen of OGS structure can comprise substrate, the Decorative frame of substrate surrounding, touch function layer on substrate and Decorative frame, touch function floor has hot pressing district, and FPC pin is undertaken realizing and being electrically connected with touch function floor after hot pressing by hot pressing district.
Fig. 2 is the integrated touch-control OGS structure according to an embodiment of the utility model.As shown in Figure 2, the integrated touch-control OGS structure of the utility model embodiment comprises flexible PCB FPC10, substrate 20 and fixation kit 30.Wherein, fixation kit 30 is arranged on bonding region between FPC10 and substrate 20 so that FPC10 and substrate 20 are pasted is integrated.
In the utility model embodiment, substrate 20 can be glass substrate.For example as shown in Figure 2, in the integrated touch-control OGS structure of the utility model embodiment, substrate 20 can comprise the monolithic glass layer 201, conducting wire hyaline layer 202 and the ink decorative layer 203 that are cascading, and wherein, ink decorative layer 203 is for covering conducting wire hyaline layer 202.In addition, also comprise finishing strips 1 in OGS structure, the finishing strips 1 of FPC10 can increase hardness, and flatness is good, is convenient to soldered elements, and ground connection performance is good.
In an embodiment of the present utility model, fixation kit 30 can be high temperature resistant double faced adhesive tape.Particularly, as shown in Figure 3, in correlation technique, by sticking machine, ACF is upper to being placed on FPC, and FPC and substrate 20 contrapositions are welded together by hot press, wherein, hot pressing stress area is ACF region, between FPC10 and substrate 20, leave overhanging portion Z, lifting surface area is little, is easy to cause the perk of FPC10 and tear.And in the integrated touch-control OGS structure of the utility model embodiment, as shown in Figure 2, between FPC10 and substrate 20, be connected with ACF, fixation kit 30 setting adjacent with ACF.For example high temperature resistant double faced adhesive tape of fixation kit 30 is overlayed on to the back side of the FPC10 after hot pressing ACF, fixation kit 30 bonding region between FPC and substrate 20 is above-mentioned overhanging portion, the back side that it is emphasized that FPC10 has golden finger, and fixation kit 30 is covered on golden finger.Thereby FPC10 and substrate 20 are become one, thereby can strengthen lifting surface area, reduce golden finger place gravity, and then can avoid the perk of FPC10 and tear.In addition, adopt high temperature resistant double faced adhesive tape can ensure under hot conditions, there is excellent dimensional stability.
Particularly, in an embodiment of the present utility model, for example high temperature resistant double faced adhesive tape of fixation kit 30 can be high temperature resistant silicon glue.Particularly, as shown in Figure 4, high temperature resistant silica gel can comprise glass layer of cloth 403, high performance silicon gum resin 404 and the polyimide PI diaphragm 405 of the polythene PE diaphragm 401 that is cascading, high temperature resistant silicon adhesive layer 402, Teflon.After FPC10 and substrate 20 complete hot pressing process, high temperature resistant silicon sticker is overlayed on the golden finger at the FPC10 back side after hot pressing ACF, and then can paste the back side at FPC10 with fixation kit 30 by fixture.Compared with OGS structure in correlation technique, after hot pressing ACF, the FPC10 back side pastes high temperature resistant silica gel, can make FPC10 and substrate 20 paste is integrated, and fixation kit 30 sticking areas can be filled smooth by the overhanging portion between FPC10 and substrate 20, thereby while being assembled in complete machine for touch pad, cause short circuit if be difficult for causing the scuffing of FPC10 while bending.
In sum, according to the integrated touch-control OGS structure of the utility model embodiment, by fixation kit, FPC and substrate sticking are integrated, and be completely fixed, can strengthen lifting surface area, reduce golden finger place gravity, can avoid the perk of FPC and tear, and can prevent entering of impurity in steam and air.And fixation kit can be filled smooth by the overhanging portion between FPC and substrate, thereby in the time that integrated touch-control OGS structure is assembled in complete machine, short circuit can increase serviceable life if generation bending is difficult for causing FPC scuffing to cause, for example, reuse number of times and can reach 500 times.In addition, compared with UV glue, fixation kit adopts high temperature resistant double faced adhesive tape or high temperature resistant silica gel, can under hot conditions, have excellent dimensional stability, for example can under the high temperature of 280 degrees Celsius, keep stable adhesive strength, improve the stability that adopts this integrated touch-control OGS infrastructure product.
The capacitive touch screen that embodiment proposes on the other hand according to the utility model embodiment is described with reference to the accompanying drawings.
As shown in Figure 5, the capacitive touch screen 501 of the utility model embodiment comprises the integrated touch-control OGS structure 502 that above-described embodiment proposes.
The capacitive touch screen of the utility model embodiment, by above-mentioned integrated touch-control OGS structure, can improve reliability and stability, enhances productivity and yield.In addition can increase the service life.
In the description of this instructions, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And specific features, structure, material or the feature of description can be with suitable mode combination in any one or more embodiment or example.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that not departing from principle of the present utility model and spirit and can carry out multiple variation, amendment, replacement and modification to these embodiment, scope of the present utility model is by claims and be equal to and limit.

Claims (10)

1. an integrated touch-control OGS structure, is characterized in that, comprising:
Flexible PCB FPC;
Substrate; And
Fixation kit, described fixation kit is arranged on bonding region between described FPC and described substrate so that described FPC and described substrate sticking are integrated.
2. integrated touch-control OGS structure as claimed in claim 1, is characterized in that, described fixation kit is high temperature resistant double faced adhesive tape.
3. integrated touch-control OGS structure as claimed in claim 2, is characterized in that, described high temperature resistant double faced adhesive tape is high temperature resistant silica gel.
4. integrated touch-control OGS structure as claimed in claim 3; it is characterized in that, described high temperature resistant silica gel comprises glass layer of cloth, silica gel resin and the polyimide PI diaphragm of the polythene PE diaphragm that is cascading, high temperature resistant silicon adhesive layer, Teflon.
5. integrated touch-control OGS structure as claimed in claim 1, is characterized in that, described substrate is glass substrate.
6. the integrated touch-control OGS structure as described in claim 1 or 5, is characterized in that, shown in substrate comprise the monolithic glass layer, conducting wire hyaline layer and the ink decorative layer that are cascading.
7. integrated touch-control OGS structure as claimed in claim 1, is characterized in that, described fixation kit pastes the back side of the described FPC after hot pressing ACF.
8. integrated touch-control OGS structure as claimed in claim 1, is characterized in that, is connected with ACF, the adjacent setting of described fixation kit and ACF between described FPC and described substrate.
9. integrated touch-control OGS structure as claimed in claim 1, is characterized in that, the back side of described FPC has golden finger, and described fixation kit is covered on described golden finger.
10. a capacitive touch screen, is characterized in that, comprises integrated touch-control OGS structure as claimed in any one of claims 1-9 wherein.
CN201320883454.9U 2013-12-30 2013-12-30 OGS structure and capacitive touch screen with same Expired - Fee Related CN203746044U (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105224137A (en) * 2015-10-21 2016-01-06 长沙市宇顺显示技术有限公司 A kind of method touching aobvious product and upper glass FPC binding sealing thereof
CN106793743A (en) * 2016-12-12 2017-05-31 晟光科技股份有限公司 A kind of inexpensive FPC designs implementation method
CN109001921A (en) * 2018-07-20 2018-12-14 深圳市宇顺电子股份有限公司 A kind of process control method solving LCD product ACF zonal corrosion

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105224137A (en) * 2015-10-21 2016-01-06 长沙市宇顺显示技术有限公司 A kind of method touching aobvious product and upper glass FPC binding sealing thereof
CN105224137B (en) * 2015-10-21 2019-02-22 长沙市宇顺显示技术有限公司 A method of touching aobvious product and the sealing of glass FPC binding thereon
CN106793743A (en) * 2016-12-12 2017-05-31 晟光科技股份有限公司 A kind of inexpensive FPC designs implementation method
CN109001921A (en) * 2018-07-20 2018-12-14 深圳市宇顺电子股份有限公司 A kind of process control method solving LCD product ACF zonal corrosion

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ASS Succession or assignment of patent right

Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD.

Free format text: FORMER OWNER: BIYADI CO., LTD.

Effective date: 20150828

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Effective date of registration: 20150828

Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee after: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd.

Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009

Patentee before: BYD Co.,Ltd.

CP01 Change in the name or title of a patent holder

Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee after: Shenzhen helitai photoelectric Co.,Ltd.

Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co

Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd.

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140730

Termination date: 20211230

CF01 Termination of patent right due to non-payment of annual fee