CN107066949A - fingerprint module, display screen and mobile terminal - Google Patents
fingerprint module, display screen and mobile terminal Download PDFInfo
- Publication number
- CN107066949A CN107066949A CN201710148907.6A CN201710148907A CN107066949A CN 107066949 A CN107066949 A CN 107066949A CN 201710148907 A CN201710148907 A CN 201710148907A CN 107066949 A CN107066949 A CN 107066949A
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- Prior art keywords
- substrate
- fingerprint module
- display
- wafer
- gold thread
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Abstract
The invention discloses a kind of fingerprint module, non-display face for display panel of fitting carries out fingerprint recognition, the fingerprint module includes substrate, wafer and gold thread, the wafer includes the first surface and second surface being oppositely arranged, the second surface laminating substrate, the gold thread is connected electrically between the wafer and the substrate, on the direction perpendicular to the substrate, and the gold thread is located between the first surface and the substrate.On the direction perpendicular to the substrate, gold thread is located between first surface and substrate, the non-display face of first surface laminating is not interfered, the non-display face of display panel so that the first surface of wafer is directly fitted, reduce the thickness of fingerprint module, be conducive to the lightening design of mobile terminal, improve Consumer's Experience.
Description
Technical field
The present invention relates to fingerprint identification technology field, more particularly, to a kind of fingerprint module, display screen and mobile terminal.
Background technology
Fingerprint identification technology is that one kind is convenient, safely identifies technology, and it is used by recognizing that the finger print information of user is recognized
The identity at family.In recent years, the use of fingerprint identification technology on mobile terminals is also increasingly paid close attention to by people.Optical profile type refers to
Line identification is a kind of widely used fingerprint recognition mode, and fingerprint module is known by analyzing the optical signal that the valley and a ridge of fingerprint reflects
Other finger print information.In order to which the display function of mobile terminal is combined with fingerprint identification function, often optical fingerprint module is fitted
In the bottom of display panel, while display panel sends display light display image, fingerprint module is received and touched in glass cover
The display light of the finger reflection of plate surface, and analyzed and recognized.
In the prior art, the wafer of fingerprint module is fitted on substrate, deviated from using gold thread electrical connection substrate with wafer
The contact of the side surface of substrate one, i.e. wafer face the contact of the side surface of display panel one, and note epoxy resin in wafer surface and
Gold thread region is with packaging protection wafer and gold thread.Due to the gold thread of connection wafer contact be partially interposed in display panel and wafer it
Between, and protected using epoxy encapsulation, the epoxy resin between wafer and display panel increases the thickness of fingerprint module, from
And the overall thickness of mobile terminal is increased, Consumer's Experience is influenceed, and increase production material cost.
The content of the invention
It is existing to solve the technical problem to be solved in the present invention is to provide a kind of fingerprint module, display screen and mobile terminal
There is the thickness of fingerprint module in technology big, the overall thickness of mobile terminal is big, influences Consumer's Experience, production material cost is high to ask
Topic.
In order to solve the above technical problems, the present invention provides a kind of fingerprint module, the non-display face for display panel of fitting
Carry out fingerprint recognition, the fingerprint module includes substrate, wafer and gold thread, the wafer include the first surface that is oppositely arranged and
Second surface, the second surface laminating substrate, the gold thread is connected electrically between the wafer and the substrate, is being hung down
Directly on the direction of the substrate, the gold thread is located between the first surface and the substrate.
Further, the wafer also includes the connection end for connecting the first surface and the second surface, the connection
End includes first side, second side and joint face, and the first side connects the first surface and the joint face, described
Second side connects the joint face and the second surface, and the first side is located at the company respectively with the second side
The relative both sides of junction, the gold thread passes through wafer described in the first contact portion located at the joint face.
Further, the wafer also includes the connection end for connecting the first surface and the second surface, the connection
Hold as inclined plane, and the inclined plane and the angle of the second surface are acute angle, and the gold thread passes through to be tilted located at described
Wafer described in first contact portion in face.
Further, the fingerprint module also includes protective layer, for the gold thread to be encapsulated to the connection end and described
Substrate.
Further, the protective layer is coplanar away from the surface of the substrate side and the first surface.
Further, the fingerprint module also includes flexible PCB, and the flexible PCB fits the substrate away from institute
The surface of wafer side is stated, the mainboard for electrically connecting the substrate and mobile terminal.
Further, the fingerprint module also includes steel benefit, and the steel subsidy closes the flexible PCB and deviates from the substrate
The surface of side.
Further, fitted between the flexible PCB and the substrate by anisotropic conductive film.
The present invention also provides a kind of display screen, and the display screen includes display panel, glass cover-plate and any of the above one
Described fingerprint module, the display panel is by display surface display image, and the glass cover-plate fits in the display surface, institute
The first surface for stating fingerprint module fits in the non-display face of the display panel, and the fingerprint module, which is used to receive, to be touched
The display light reflected in the finger of the glass cover plate surfaces.
The present invention also provides a kind of mobile terminal, and the mobile terminal includes the fingerprint module described in any of the above one.
Beneficial effects of the present invention are as follows：On the direction perpendicular to the substrate, gold thread is located at first surface and substrate
Between, the non-display face of first surface laminating, the non-display of display panel so that the first surface of wafer is directly fitted are not interfered
Face, reduces the thickness of fingerprint module, is conducive to the lightening design of mobile terminal, improves Consumer's Experience.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other substantially modes of texturing are obtained according to these accompanying drawings.
Fig. 1 is the section partial schematic diagram for the fingerprint module that the embodiment of the present invention one is provided.
Fig. 2 is the structural representation for the fingerprint module that the embodiment of the present invention one is provided.
Fig. 3 is the close-up schematic view for the fingerprint module that the embodiment of the present invention one is provided.
Fig. 4 is the section partial schematic diagram for the fingerprint module that the embodiment of the present invention two is provided.
Fig. 5 is the section partial schematic diagram for the fingerprint module that the embodiment of the present invention three is provided.
Fig. 6 is the structural representation of display screen provided in an embodiment of the present invention.
Fig. 7 is the section partial schematic diagram of display screen provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Also referring to Fig. 1, Fig. 2, Fig. 3, Fig. 6 and Fig. 7, the fingerprint module 100 that the embodiment of the present invention one is provided is optics
Formula fingerprint recognition module, applied to mobile terminal, the mobile terminal can be the electronics such as mobile phone, notebook computer, tablet personal computer
Equipment.In the present embodiment, the laminating display panel 80 of fingerprint module 100 carries out fingerprint recognition, specifically, display panel 80 includes using
In the display surface 804 of display image and the non-display face 802 being oppositely arranged with display surface 804, display panel 80 is generally transparent
Structure, fingerprint module 100 fits in non-display face 802, and receives by touching in the light of the finger reflection on the surface of display panel 80
Line realizes fingerprint identification function.In a kind of preferably embodiment, the light source of finger reflection is in the display of display panel 80
The image light for display image that face 804 is sent, rationally make use of image light, reduce energy consumption, other embodiment
In, the light of finger reflection can also derive from the light of the generator transmitting located at black lights such as the infrared rays of display panel 80
Line, the display image of display panel 80 is not influenceed.
Fingerprint module 100 includes substrate 20, wafer 10 and gold thread 30, and wafer 10 is used for the light for receiving user's finger reflection
Line, and the optical signal is converted into electric signal for analysis, identification.Wafer 10 is semi-conducting material, specifically, wafer 10 is wrapped
Include the first surface 102 being oppositely arranged, second surface 104 and connection end 106, the connection of connection end 106 first surface 102 and second
Surface 104.Non-display face 802 of the first surface 102 for display panel 80 of fitting, further, first surface 102 passes through core
Piece is bonded glued membrane or the non-display face 802 of other glue-film stickup display panels 80.The adhesive substrates 20 of second surface 104, it is a kind of compared with
In good embodiment, second surface 104 is by chip bonding glue-film stickup on substrate 20.In the present embodiment, substrate 20 is
Printed circuit board (PCB) (Printed Circuit Board, PCB).In a kind of preferably embodiment, first surface 102 and second
Surface 104 is plane, and wafer 10 and display panel 80, wafer 10 and substrate 20 is more easy to attach, and the seam at laminating position
Gap is small, and laminating is firm, the overall intensity of enhancing fingerprint module 100.
Gold thread 30 is connected electrically between wafer 10 and substrate 20, on the direction perpendicular to substrate 20, and gold thread 30 is located at the
Between one surface 102 and substrate 20.Specifically, wafer 10 also include connection first surface 102 and second surface 104 and connection
End 106, connection end 106 is provided with the first contact 402, and the vertical range between the first contact 402 and second surface 104 is less than first
Vertical range between surface 102 and second surface 104, i.e. the first contact 402 are located at first surface 102 and second surface 104
Between, substrate 20 is provided with the second contact 404, and gold thread 30 is electrically connected between the first contact 402 and the second contact 404, and is passed through
First contact 402 makes wafer 10 be electrically connected with substrate 20 with the second contact 404, gold thread 30 include between substrate 20 it is vertical away from
From maximum summit, the vertical range between summit and substrate 20 is less than the vertical range between first surface 102 and substrate 20.
The electric conductivity of gold thread 30 is good, can quickly and efficiently transmit electric signal.Further, positive throwing of first contact 402 in substrate 20
Shadow is located at outside the scope of first surface 102, and the first contact 402 is located at the model of second surface 104 in the orthographic projection of substrate 20
Within enclosing, the second contact 404 is located at second surface 104 outside the scope of the orthographic projection of substrate 20.
On the direction perpendicular to substrate 20, gold thread 30 is located between first surface 102 and substrate 20, and the first table is not interfered
Face 102 is fitted non-display face 802, the non-display face of the display panel 80 so that first surface 102 of wafer 10 is directly fitted
802, the thickness of fingerprint module 100 is reduced, is conducive to the lightening design of mobile terminal, Consumer's Experience is improved.
In the present embodiment, connection end 106 includes first side 112, second side 114 and joint face 110, first side
112 connection first surfaces 102 and joint face 110, the connection joint face 110 of second side 114 and second surface 104, first side
112 are located at the relative both sides of joint face 110 with second side 114 respectively, and the first contact 402 is located at joint face 110.Specifically
, connection end 106 is step-like.Step-like connection end 106 includes joint face 110, and joint face 110 is in the thickness side of wafer 10
Upwards between first surface 102 and second surface 104, on the width vertical with the thickness direction of wafer 10, even
Junction 110 is located at the region of the orthographic projection of second surface 104 on the base plate 20 and the orthographic projection of first surface 102 on the base plate 20
Between, further, joint face 110 deviates from substrate 20, i.e., in face of display panel 80.First contact 402 is located at joint face 110
On, the second contact 404 is on substrate 20, and because joint face 110 deviates from substrate 20, gold thread 30 is needed after connecting the first contact 402
The second contact 404 could be connected to the bending of the direction of substrate 20.Specifically, gold thread 30 include first end 302, the second end 304 and
The bending segment 306 at the end 304 of first end 302 and second is connected, first end 302 connects the first contact 402 by modes such as welding, the
Two ends 304 connect the second contact 404 by modes such as welding, and bending segment 306 is located at joint face 110 and shown with the non-of display panel 80
Show between face 802, and there is space between the peak of bending segment 306 and non-display face 802, so that gold thread 30 does not interfere aobvious
Show that panel 80 and the laminating of wafer 10 are contacted.
Further, the second contact 404 is located at the surface that substrate 20 faces the side of wafer 10, and the second contact 404
Outside scope of the second surface 104 in the orthographic projection of substrate 20.Specifically, projection of first contact 402 in second surface 104
Non-intersect in the view field of second surface 104 with the second contact 404, i.e. the first contact 402 and the second contact 404 are in wafer 10
Thickness direction on staggeredly, to facilitate gold thread 30 to connect the first contact 402 and the second contact 404.In the present embodiment, the first contact
402 quantity is multiple, and in joint face 110, array is arranged in one direction for the first contact 402, and the quantity of the second contact 404 is
Multiple, in substrate 20, array is arranged in one direction on the surface of the side of wafer 10 for the second contact 404, the quantity of gold thread 30
To be multiple, each gold thread 30 connects a pair of corresponding contacts 404 of first contact 402 and second, with realize wafer 10 it is overall and
The electrical connection of substrate 20.
First contact 402 is located between first surface 102 and second surface 104, between the summit of gold thread 30 and substrate 20
Vertical range be less than vertical range between first surface 102 and substrate 20, i.e. the integral position of gold thread 30 is between first surface
Between 102 and substrate 20, first surface 102 is not interfered to be fitted non-display face 802, so that the first surface 102 of wafer 10 is straight
The non-display face 802 of laminating display panel 80 is connect, the thickness of fingerprint module 100 is reduced, is conducive to the lightening of mobile terminal
Design, improves Consumer's Experience.
In the present embodiment, fingerprint module 100 also includes protective layer 50, for gold thread 30 to be encapsulated to connection end 106 and base
Plate 20.In a kind of preferably embodiment, protective layer 50 is formed for the epoxy resin of injection, and epoxy resin is insulating materials, no
The phenomenons such as short circuit can be caused to occur.Protective layer 50 is located between non-display face 802, connection end 106 and substrate 20, and protective layer 50 is same
When covering first side 112, joint face 110, second side 114, gold thread 30 and substrate 20, the side such as weld because gold thread 30 passes through
Formula connects the first contact 402 and the second contact 404, if gold thread 30, which is collided or collided with, can cause the contact of gold thread 30 and first
402 or second contact 404 come off, cause fingerprint module 100 to work bad, metal lead wire region covered using protective layer 50, and
The contact 402 of gold thread 30 and first and the second contact 404 are coated completely, are packaged in protective layer 50, gold thread 30 is effectively protected.
Further, protective layer 50 also plays the effect of protection to the edge of wafer 10 and substrate 20.
In the present embodiment, protective layer 50 is coplanar away from the surface of the side of substrate 20 and first surface 102, further, protects
Sheath 50 is fitted the non-display face 802 of display panel 80 jointly away from the surface of the side of substrate 20 and first surface 102, to avoid
There is difference in height in first surface 102 and protective layer 50, cause first surface 102 to show with non-between the surface of the side of substrate 20
Show and there is gap between face 802 or fit built on the sand.
In the present embodiment, fingerprint module 100 also includes flexible PCB 60, and the adhesive substrates 20 of flexible PCB 60 are away from crystalline substance
The surface of first 10 sides, the mainboard for electrically connecting substrate 20 and mobile terminal.Specifically, substrate 20 passes through surface mounting technology
(Surface Mount Technology, SMT) fits in the surface of flexible PCB 60.Surface mounting technology is that one kind will be without drawing
Pin or short leg surface-assembled component (flexible PCB 60) are arranged on the surface of printed circuit board (substrate 20), by returning
The method such as fluid welding or immersed solder is subject to the circuit load technology of welding assembly.Surface mounting technology reliability is high, shock resistance is strong, weldering
Point defect rate is low, and easy to automate, improves production efficiency.Further, substrate 20 faces the one of flexible PCB 60
Side is provided with contact, and flexible PCB 60 is provided with contact in face of the side of substrate 20, and substrate 20 passes through contact with flexible PCB 60
It is electrically connected with each other.In the present embodiment, the one end of flexible PCB 60 is connected with substrate 20, and the other end is connected by board to board connector
The mainboard of mobile terminal is connect, the fingerprint electric signal that mainboard is returned to fingerprint module 100 is analyzed, calculated.
In the present embodiment, fingerprint module 100 also includes steel and mends 70, and steel mends 70 and fits flexible PCB 60 away from substrate 20 1
The surface of side.Specifically, steel mends 70 is pasted on the surface that flexible PCB 60 deviates from the side of substrate 20, flexible circuit by viscose
When plate 60 is by surface mounting technology adhesive substrates 20, the high temperature reflux weldering in paster technique can cause the flexible PCB of softness
60 at high operating temperatures curling warp, the higher steel of intensity is mended 70 and fitted flexible PCBs 60 and fixing flexible circuit board 60, presses
Pressure flexible PCB 60 makes flexible PCB 60 keep open and flat state and not warp, and optimizes surface mount process, improves
The product yield of fingerprint module 100.
First contact 402 is located between first surface 102 and second surface 104, between the summit of gold thread 30 and substrate 20
Vertical range be less than vertical range between first surface 102 and substrate 20, i.e. the integral position of gold thread 30 is between first surface
Between 102 and substrate 20, first surface 102 is not interfered to be fitted non-display face 802, so that the first surface 102 of wafer 10 is straight
The non-display face 802 of laminating display panel 80 is connect, the thickness of fingerprint module 100 is reduced, is conducive to the lightening of mobile terminal
Design, improves Consumer's Experience.
Fig. 4 be the embodiment of the present invention two provide the fingerprint recognition module of fingerprint module 100, as illustrated, embodiment two with
The difference of embodiment one is, passes through (the Anisotropic of anisotropic conductive film 62 between flexible PCB 60 and substrate 20
Conductive Film, ACF) laminating.The characteristics of anisotropic conductive film 62 is that Z axis electrically conducts direction and XY insulating planars
Resistance characteristic there is obvious difference, i.e. Z axis electrical communication, X/Y plane insulation.It is soft that anisotropic conductive film 62 plays adhesion
Property circuit board 60 and substrate 20 effect outside, additionally it is possible to make contact and base of the flexible PCB 60 in face of the side surface of substrate 20 1
Plate 20 faces the contact electrical communication of the side surface of flexible PCB 60 1, and make between each contact on flexible PCB 60, base
Mutually insulated between each contact on plate 20, it is to avoid short-circuit phenomenon occurs.Anisotropic conductive film 62 is by way of hot pressing
Flexible PCB 60 is set to be fitted with substrate 20, the temperature of hot pressing is much smaller than the temperature of Reflow Soldering, and will not cause flexible PCB
60 warp, thus the present embodiment provide fingerprint module 100 need not paste steel mend 70 strengthen flexible PCBs 60 intensity to prevent
Only flexible PCB 60 warps, and reduces the thickness of fingerprint module 100, so that the overall thickness of mobile terminal is advantageously reduced,
Lightening design is realized, Consumer's Experience is improved.
Fig. 5 be the embodiment of the present invention three provide the fingerprint recognition module of fingerprint module 100, as illustrated, embodiment three with
The difference of embodiment one is that connection end 106 is inclined plane 120, and the angle α of inclined plane 120 and second surface 104 is sharp
Angle, second surface 104 covers orthographic projection of the first surface 102 in second surface 104.First contact 402 is located at inclined plane 120
On surface, the first end 302 of gold thread 30 connects the first contact 402 by modes such as welding, and the second end 304 passes through the modes such as welding
The second contact 404 is connected, bending segment 306 is located between inclined plane 120 and the non-display face 802 of display panel 80, and bends
There is space, so that gold thread 30 does not interfere the patch of display panel 80 and wafer 10 between the peak of section 306 and non-display face 802
Splice grafting is touched.In the present embodiment, the quantity of the first contact 402 is multiple, and the first contact 402 is in the battle array in one direction of inclined plane 120
Row arrangement, the quantity of the second contact 404 is multiple, and the second contact 404 is faced on the surface of the side of wafer 10 along one in substrate 20
Individual direction array arrangement, the quantity of gold thread 30 is multiple, and each gold thread 30 connects a pair of corresponding first contacts 402 and second
Contact 404, to realize the overall electrical connection with substrate 20 of wafer 10.
First contact 402 is located between first surface 102 and second surface 104, between the summit of gold thread 30 and substrate 20
Vertical range be less than vertical range between first surface 102 and substrate 20, i.e. the integral position of gold thread 30 is between first surface
Between 102 and substrate 20, first surface 102 is not interfered to be fitted non-display face 802, so that the first surface 102 of wafer 10 is straight
The non-display face 802 of laminating display panel 80 is connect, the thickness of fingerprint module 100 is reduced, is conducive to the lightening of mobile terminal
Design, improves Consumer's Experience.
Fig. 6 and Fig. 7 are referred to, the present invention also provides a kind of display screen, and display screen includes display panel 80, glass cover-plate 90
And fingerprint module 100, display panel 80 fits in display surface 804, fingerprint by the display image of display surface 804, glass cover-plate 90
The first surface 102 of module 100 fits in the non-display face 802 of display panel 80, and fingerprint module 100 is touched in glass for reception
The display light of the finger reflection on the surface of glass cover plate 90.Display applications provided in an embodiment of the present invention are in mobile terminal, the shifting
Dynamic terminal can be the electronic equipments such as mobile phone, notebook computer, tablet personal computer.
In the present embodiment, the laminating display panel 80 of fingerprint module 100 carries out fingerprint recognition, specifically, display panel 80 is wrapped
Include for the display surface 804 of display image and the non-display face 802 being oppositely arranged with display surface 804, display panel 80 is generally
Transparent configuration, fingerprint module 100 fits in non-display face 802, and receives by touching the finger reflection in the surface of display panel 80
Light realize fingerprint identification function.In a kind of preferably embodiment, the light source of finger reflection is in display panel 80
The image light for display image that display surface 804 is sent, rationally make use of image light, reduces energy consumption, other implementations
In mode, the light of finger reflection can also derive from the generator transmitting located at black lights such as the infrared rays of display panel 80
Light, the display image of display panel 80 is not influenceed.
The display screen that embodiments of the invention are provided is combined fingerprint identification function with display function, improves user's body
Test, the first contact 402 is located between first surface 102 and second surface 104, vertical between the summit of gold thread 30 and substrate 20
Distance is less than the vertical range between first surface 102 and substrate 20, i.e., the integral position of gold thread 30 is between first surface 102 and base
Between plate 20, do not interfere first surface 102 to be fitted non-display face 802 so that the first surface 102 of wafer 10 directly fit it is aobvious
Show the non-display face 802 of panel 80, reduce the thickness of fingerprint module 100, be conducive to the lightening design of mobile terminal, improve
Consumer's Experience.
In the present embodiment, the quantity of wafer 10 is multiple, and the array arrangement of wafer 10 is in substrate 20 and covers non-display face
802, for realizing full frame fingerprint recognition.Specifically, wafer 10 is used to receive the optical signal for including finger print information, multiple wafers 10
It is covered with the non-display face 802 of whole of display panel 80, when user's finger presses the optional position of glass cover-plate 90, the position pair
The wafer 10 answered receives the light of finger surface reflection, is converted to after electric signal and to be transferred to mobile terminal by flexible PCB 60
Mainboard analyzed, calculated, recognize finger print information, so as to realize the fingerprint identification function of full screen, improve Consumer's Experience.
Embodiments of the invention also provide a kind of mobile terminal, and mobile terminal refers to the computer that can be used on the move and set
It is standby, including but not limited to mobile phone, notebook, tablet personal computer, POS, vehicle-mounted computer, camera etc..Further, mobile terminal bag
Include glass cover-plate 90, display panel 80, mainboard, bonnet and above-described fingerprint module 100.Display panel 80 passes through display surface
804 display images, glass cover-plate 90 fits in display surface 804, and the first surface 102 of fingerprint module 100 fits in display panel
80 non-display face 802, fingerprint module 100, which is used to receive, to be touched in the display light of the finger reflection on the surface of glass cover-plate 90.
Mainboard is placed in bonnet, and electrically connects fingerprint module 100 and display panel 80 by flexible PCB 60.Fingerprint module 100 is
Optical fingerprint module 100, fingerprint module 100 converts optical signal into finger print information electric signal, and passes through flexible PCB 60
Mainboard is transferred to, mainboard carries out calculating analysis recognizing finger print information to finger print information electric signal.Meanwhile, display panel 80 passes through
Flexible PCB 60 electrically connects mainboard, the content of the mainboard control display image of display panel 80 and bright dark.In a kind of embodiment,
Mainboard connection display panel 80 is connected fingerprint module 100 with mainboard and shares same flexible PCB 60, to reduce mobile terminal
Internal electronic device quantity, simplifies in the structure of mobile terminal, other embodiment, and mainboard connection display panel 80 is used
It is different flexible PCBs 60 that flexible PCB 60 and mainboard, which connect the flexible PCB 60 that fingerprint module 100 uses, and phase
Mutually work independently, improve operating efficiency.
The mobile terminal that embodiments of the invention are provided is combined fingerprint identification function with display function, improves user's body
Test, the first contact 402 is located between first surface 102 and second surface 104, vertical between the summit of gold thread 30 and substrate 20
Distance is less than the vertical range between first surface 102 and substrate 20, i.e., the integral position of gold thread 30 is between first surface 102 and base
Between plate 20, do not interfere first surface 102 to be fitted non-display face 802 so that the first surface 102 of wafer 10 directly fit it is aobvious
Show the non-display face 802 of panel 80, reduce the thickness of fingerprint module 100, be conducive to the lightening design of mobile terminal, improve
Consumer's Experience.
Above disclosed is only several preferred embodiments of the invention, can not limit the power of the present invention with this certainly
Sharp scope, one of ordinary skill in the art will appreciate that all or part of flow of above-described embodiment is realized, and according to present invention power
Profit requires made equivalent variations, still falls within and invents covered scope.
Claims (10)
1. a kind of fingerprint module, the non-display face for display panel of fitting carries out fingerprint recognition, it is characterised in that the fingerprint
Module includes substrate, wafer and gold thread, and the wafer includes the first surface and second surface being oppositely arranged, the second surface
Fit the substrate, the gold thread is connected electrically between the wafer and the substrate, on the direction perpendicular to the substrate,
The gold thread is located between the first surface and the substrate.
2. fingerprint module according to claim 1, it is characterised in that the wafer also include connecting the first surface with
The connection end of the second surface, the connection end includes first side, second side and joint face, the first side connection
The first surface and the joint face, the second side connect the joint face and the second surface, first side
Face and the second side are located at the relative both sides of the joint face respectively, and the gold thread passes through located at the of the joint face
Wafer described in one contact portion.
3. fingerprint module according to claim 1, it is characterised in that the wafer also include connecting the first surface with
The connection end of the second surface, the connection end is inclined plane, and the inclined plane and the angle of the second surface be
Acute angle, the gold thread passes through wafer described in the first contact portion located at the inclined plane.
4. the fingerprint module according to Claims 2 or 3, it is characterised in that the fingerprint module also includes protective layer, is used for
The gold thread is encapsulated to the connection end and the substrate.
5. fingerprint module according to claim 4, it is characterised in that the protective layer deviates from the surface of the substrate side
It is coplanar with the first surface.
6. fingerprint module according to claim 5, it is characterised in that the fingerprint module also includes flexible PCB, institute
State the fit substrate of flexible PCB and deviate from the surface of the wafer side, for electrically connecting the substrate and mobile terminal
Mainboard.
7. fingerprint module according to claim 6, it is characterised in that the fingerprint module also includes steel and mended, and the steel is mended
The flexible PCB of fitting deviates from the surface of the substrate side.
8. fingerprint module according to claim 6, it is characterised in that pass through between the flexible PCB and the substrate
Anisotropic conductive film is fitted.
9. a kind of display screen, it is characterised in that it is any that the display screen includes display panel, glass cover-plate and claim 1 to 8
Fingerprint module described in one, the display panel fits in the display by display surface display image, the glass cover-plate
Face, the first surface of the fingerprint module fits in the non-display face of the display panel, and the fingerprint module is used to connect
Receive and touch in the display light of the finger reflection of the glass cover plate surfaces.
10. a kind of mobile terminal, it is characterised in that the mobile terminal includes the fingerprint described in claim 1 to 8 any one
Module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710148907.6A CN107066949A (en) | 2017-03-13 | 2017-03-13 | fingerprint module, display screen and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710148907.6A CN107066949A (en) | 2017-03-13 | 2017-03-13 | fingerprint module, display screen and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107066949A true CN107066949A (en) | 2017-08-18 |
Family
ID=59623117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710148907.6A Pending CN107066949A (en) | 2017-03-13 | 2017-03-13 | fingerprint module, display screen and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107066949A (en) |
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| CN106897712A (en) * | 2017-03-13 | 2017-06-27 | 广东欧珀移动通信有限公司 | Fingerprint module, display screen and mobile terminal |
| CN108519794A (en) * | 2018-03-23 | 2018-09-11 | 维沃移动通信有限公司 | A kind of mobile terminal |
| CN108551498A (en) * | 2018-02-27 | 2018-09-18 | 努比亚技术有限公司 | Terminal |
| CN110321831A (en) * | 2019-06-28 | 2019-10-11 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
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Application publication date: 20170818 |