CN205193832U - Fingerprint identification module and electron device - Google Patents
Fingerprint identification module and electron device Download PDFInfo
- Publication number
- CN205193832U CN205193832U CN201521030387.1U CN201521030387U CN205193832U CN 205193832 U CN205193832 U CN 205193832U CN 201521030387 U CN201521030387 U CN 201521030387U CN 205193832 U CN205193832 U CN 205193832U
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- fingerprint recognition
- stiffening plate
- pattern
- recognition module
- drift angle
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- 238000009434 installation Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 21
- 230000001788 irregular Effects 0.000 claims description 3
- 238000006748 scratching Methods 0.000 description 5
- 230000002393 scratching effect Effects 0.000 description 5
- RMPWIIKNWPVWNG-UHFFFAOYSA-N 1,2,3,4-tetrachloro-5-(2,3,4-trichlorophenyl)benzene Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1Cl RMPWIIKNWPVWNG-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004064 dysfunction Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
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Abstract
The utility model provides a fingerprint identification module and including the electron device of fingerprint identification module. The fingerprint identification module includes fingerprint identification chip, base plate and stiffening plate, the fingerprint identification chip is used for receiving user's fingerprint information, base plate electric connection fingerprint identification chip and flexible circuit board, the stiffening plate is used for bearing the fingerprint identification chip and the base plate, the fingerprint identification chip the base plate reaches the stiffening plate stacks gradually the setting, the stiffening plate includes the knurling pattern, the knurling pattern is used for reducing when the stiffening plate receives pressure the deflection of stiffening plate. The utility model discloses a fingerprint identification module has higher quality.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to a kind of fingerprint recognition module and electronic installation.
Background technology
Along with the development of science and technology, fingerprint recognition module has been applied in all kinds of portable electron device more and more widely.Such as, an existing class is provided with the smart mobile phone of fingerprint recognition module, and user can realize mobile phone by described fingerprint recognition fingerprint and unlock, the functions such as fingerprint recognition payment.Generally include fingerprint recognition chip and stiffening plate in present fingerprint recognition module, stiffening plate is for supporting fingerprint recognition chip.The comparatively large and surface smoothing of existing stiffening plate area, in making transportation, stiffening plate is easily subject to the impact of stress, thus cause distortion, tilting, thus can cause carrying out surface mount (SurfaceMountTechnology at fingerprint recognition module, SMT) can dry joint be caused in technological process, cause the circuit malfunction in electronic installation, dysfunction.
Utility model content
The utility model provides a kind of fingerprint recognition module, described fingerprint recognition module comprises fingerprint recognition chip, substrate and stiffening plate, described fingerprint recognition chip is for receiving the finger print information of user, described electrical property of substrate connects described fingerprint recognition chip and flexible PCB, described stiffening plate is for carrying described fingerprint recognition chip and described substrate, described fingerprint recognition chip, described substrate and described stiffening plate are cascading, the surface of described stiffening plate comprises embossed pattern, described embossed pattern is for reducing the deflection of described stiffening plate when described stiffening plate is under pressure.
Wherein, described embossed pattern is regular grid pattern or is random grid pattern.
Wherein, when described embossed pattern is regular grid pattern, described embossed pattern comprises multiple grid cell, and described grid cell is any one or multiple combination in square, rectangle, regular pentagon, regular hexagon.
Wherein, when described embossed pattern is random grid pattern, described embossed pattern comprises multiple grid cell, and described grid cell is irregular polygon.
Wherein, described embossed pattern is made up of groove, and the depth range of described groove is 0.01mm ~ 0.02mm.
Wherein, described embossed pattern comprises multiple pattern unit, and described pattern unit is greater than the distribution density of the centre of surface at described stiffening plate in the distribution density of the marginal surface of described stiffening plate.
Wherein, described embossed pattern comprises multiple pattern unit, described stiffening plate comprises free end and link, described free end and described link are oppositely arranged, described link is fitted with flexible PCB, and the distribution density of the pattern unit of described free end is greater than the distribution density of the pattern unit of described link.
Wherein, the distribution density of described pattern unit increases to described free end dimension linear from described link.
Wherein, described stiffening plate comprises the first drift angle and the second drift angle, described first drift angle and described second drift angle are concave shaped, described first drift angle is arranged on described link, described second drift angle arranges described free end, and the center of described first drift angle, the center of described second drift angle and being centrally located on same straight line of described stiffening plate.
The utility model additionally provides a kind of electronic installation, and described electronic installation comprises the fingerprint recognition module of any one embodiment in aforementioned each embodiment.
Compared to prior art, in fingerprint recognition module of the present utility model, embossed pattern is set on the stiffening plate carrying described fingerprint recognition chip and described substrate, when described stiffening plate is when being subject to the affecting of stress, described embossed pattern can eliminate stress, therefore, described embossed pattern can reduce the deflection of described stiffening plate when described stiffening plate is under pressure, thus improves SMT process yields, ensure that the quality of fingerprint recognition module and electronic installation.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The perspective view of the fingerprint recognition module that Fig. 1 provides for the utility model one better embodiment.
Fig. 2 is the package assembly schematic diagram of the fingerprint recognition module of the utility model one better embodiment.
Fig. 3 is the cross-sectional view along the fingerprint recognition module of I-I line in Fig. 2.
The structural representation of the stiffening plate of the fingerprint recognition module that Fig. 4 provides for the utility model one better embodiment.
The structural representation of the electronic installation that Fig. 5 provides for the utility model one better embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
See also Fig. 1 to Fig. 4, the perspective view of the fingerprint recognition module that Fig. 1 provides for the utility model one better embodiment; Fig. 2 is the package assembly schematic diagram of the fingerprint recognition module of the utility model one better embodiment; Fig. 3 is the cross-sectional view along the fingerprint recognition module of I-I line in Fig. 2; The structural representation of the stiffening plate of the fingerprint recognition module that Fig. 4 provides for the utility model one better embodiment.Fingerprint recognition module 100 is applied to electronic installation, for realizing the unblock, fingerprint recognition payment etc. of electronic installation.Described electronic installation includes but are not limited to as smart mobile phone, internet device (MobileInternetDevice, MID), e-book, portable broadcast station (PlayStationPortable, or the portable electric appts such as personal digital assistant (PersonalDigitalAssistant, PDA) PSP).Described fingerprint recognition module 100 comprises fingerprint recognition chip 110, substrate 130 and stiffening plate 150.Described fingerprint recognition chip 110 for receiving the finger print information of user, and senses the fingerprint of user and identifies, the constitution and principle of described fingerprint recognition chip 110 can adopt any suitable prior art, does not repeat them here.Described substrate 130 is for being electrically connected described fingerprint recognition chip 110 and flexible PCB 170, and described stiffening plate 150 is for carrying described fingerprint recognition chip 110 and described substrate 130.Described fingerprint recognition chip 110 can be communicated by other elements (such as, control chip etc.) in described flexible PCB 170 and electronic installation.Described fingerprint recognition chip 110, described substrate 130 and described stiffening plate 150 are cascading.The surface of described stiffening plate 150 comprises embossed pattern 151, and described embossed pattern 151 is for reducing the deflection of described stiffening plate 150 when described stiffening plate 150 is under pressure.Particularly, described substrate 130 comprises the first surface 130a and second surface 130b that are oppositely arranged.Described fingerprint recognition module 100 is arranged on described first surface 130a, and the contiguous described second surface 130b of described stiffening plate 150 is arranged.
In one embodiment, described embossed pattern 151 is only arranged on the surface of the contiguous described substrate 130 of described stiffening plate 150, and described stiffening plate 150 does not arrange described embossed pattern away from the surface of described substrate 130.In another embodiment, described embossed pattern 151 is only arranged on the surface of described stiffening plate 150 away from described substrate 130, and the surface of the contiguous described substrate 130 of described stiffening plate 150 does not arrange described embossed pattern 151.In another embodiment, described embossed pattern 151 is arranged on the surface of the contiguous described substrate 130 of described stiffening plate 150, and is arranged on the surface of described stiffening plate 150 away from described substrate 130.
Described embossed pattern 151 can be the lattice of rule or be random grid pattern.
In one embodiment, when described embossed pattern 151 is regular grid pattern, described embossed pattern 151 comprises multiple grid cell, and described grid cell 151 is any one or multiple combination in square, rectangle, regular pentagon, regular hexagon.Understandably, when the grid cell in described embossed pattern 151 is square, the grid cell in described embossed pattern is rectangular distribution.
In another embodiment, when described embossed pattern 151 is random grid pattern, described embossed pattern 151 comprises multiple grid cell, and described grid cell is irregular polygon.
Described embossed pattern 151 is made up of groove in one embodiment, and the depth range of described groove is 0.01mm ~ 0.02mm.
In one embodiment, described embossed pattern 151 comprises multiple pattern unit, and described pattern unit is greater than the distribution density of the centre of surface at described stiffening plate 150 in the distribution density of the marginal surface of described stiffening plate 150.Under normal circumstances, it is large that the stress that the marginal surface of described stiffening plate 150 is subject to is subject to stress compared to the centre of surface of described stiffening plate 150, therefore, arranging more pattern unit at the marginal surface 150 of described stiffening plate 150 compared to the centre of surface of described stiffening plate 150 can make the edge of described stiffening plate 150 discharge stress better, reduce the distortion of described stiffening plate 150 better, ensure the flatness of described stiffening plate 150.
Described embossed pattern 151 comprises multiple pattern unit, correspondingly, described stiffening plate 150 comprises free end 150a and link 150b, described free end 150a and described link 150b is oppositely arranged, described link 150b is fitted with flexible PCB 170, in the diagram, described pattern unit is uniformly distributed.Preferably, the distribution density of the pattern unit of described free end 150a is greater than the distribution density of the pattern unit of described link 150b.Preferably, the distribution density of described pattern unit increases to described free end 150a dimension linear from described link 150b.Because described link 150b is fitted with flexible PCB 170, described free end 150a does not have the laminatings such as element, therefore, described free end 150a is subject to the degree of stress deformation can be larger compared to the distortion of described link 150b, therefore, described free end 150a be provided with described stiffening plate 150 can be made to be subject to stress compared to the more pattern unit of described link 150b time, described free end 150a has more pattern unit to discharge stress, thus make the deformation extent of described stiffening plate 150 entirety less, ensure that the flatness of described stiffening plate 150.
In the present embodiment, described stiffening plate 150 comprises the first drift angle 153 and the second drift angle 155.Described first drift angle 153 and described second drift angle 155 are concave shaped, described first drift angle 153 is arranged on described link 150b, described second drift angle 155 is arranged on described free end 150a, and the center of described first drift angle 153, the center of described second drift angle 155 and being centrally located on same straight line of described stiffening plate 150.In other words, the line at the center of described first drift angle 153 and the center of described second drift angle 155 is through the center of described stiffening plate 150.In the present embodiment, first drift angle 153 of described stiffening plate 150 and described second drift angle 155 are set to concave shaped, compared to being angular shape, first drift angle 153 of concave shaped and the second drift angle 155 can reduce the stress of the first drift angle 153 and the second drift angle 155, thus make the deformation extent of described stiffening plate 150 entirety less, ensure that the flatness of described stiffening plate 150.
The utility model additionally provides a kind of electronic installation, is introduced, sees also Fig. 5 below in conjunction with Fig. 1 to Fig. 4 to the novel electronic installation provided of this use, the structural representation of the electronic installation that Fig. 5 provides for the utility model one better embodiment.The novel electronic installation provided of this use includes but are not limited to as portable electric appts such as smart mobile phone, internet device, e-book, portable broadcast station or personal digital assistants.Described electronic installation 10 comprises foregoing fingerprint recognition module 100, describes, do not repeat them here before the concrete structure of described fingerprint recognition module 100 refers to.Described fingerprint recognition module 100 can be arranged on the front end of described electronic installation 10, such as, is arranged on the non-display area arranged around viewing area in described electronic installation 10.Wherein, described viewing area is for showing the information such as word, pattern.Described non-display area is arranged around described viewing area, for hiding the lead-in wire of drawing viewing area or for hiding the elements such as circuit in electronic installation 10, user is avoided directly to see in described non-display area the original papers such as the corresponding circuit arranged when operating described electronic installation 10.In another embodiment, described fingerprint recognition module 100 can also be arranged on the sidewall of the housing of described electronic installation 10, when described fingerprint identification module 100 is arranged on the sidewall of the housing of described electronic installation 10, preferably, described fingerprint recognition chip 110 is scratching formula fingerprint recognition chip.The size of scratching formula fingerprint recognition chip is less, thus the thinner thickness of described electronic installation 10 can be made, described scratching formula fingerprint recognition chip is for receiving the scratching operation of user's finger, and generate multiple fingerprint image according to the scratching operation of user, and described multiple fingerprint image is spliced, to produce the finger print information of user.In another embodiment, described fingerprint recognition module 100 can also be arranged on the bonnet of the housing of described electronic installation 10, and the viewing area of described bonnet and described electronic installation 10 is oppositely arranged.
Compared to prior art, in fingerprint recognition module 100 of the present utility model, embossed pattern 151 is set on the stiffening plate 150 carrying described fingerprint recognition chip 110 and described substrate 130, when described stiffening plate 150 is when being subject to the affecting of stress, described embossed pattern 151 can eliminate stress, therefore, described embossed pattern 151 can reduce the deflection of described stiffening plate 150 when described stiffening plate 150 is under pressure, thus improve SMT process yields, ensure that the quality of fingerprint recognition module 100 and electronic installation 10.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Above embodiment is only in order to illustrate the technical solution of the utility model and unrestricted, although be described in detail the utility model with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can modify to the technical solution of the utility model or equivalent replacement, and not depart from the spirit and scope of technical solutions of the utility model.
Claims (10)
1. a fingerprint recognition module, it is characterized in that, described fingerprint recognition module comprises fingerprint recognition chip, substrate and stiffening plate, described fingerprint recognition chip is for receiving the finger print information of user, described electrical property of substrate connects described fingerprint recognition chip and flexible PCB, described stiffening plate is for carrying described fingerprint recognition chip and described substrate, described fingerprint recognition chip, described substrate and described stiffening plate are cascading, the surface of described stiffening plate comprises embossed pattern, described embossed pattern is for reducing the deflection of described stiffening plate when described stiffening plate is under pressure.
2. fingerprint recognition module as claimed in claim 1, is characterized in that, described embossed pattern is regular grid pattern or is random grid pattern.
3. fingerprint recognition module as claimed in claim 2, it is characterized in that, when described embossed pattern is regular grid pattern, described embossed pattern comprises multiple grid cell, and described grid cell is any one or multiple combination in square, rectangle, regular pentagon, regular hexagon.
4. fingerprint recognition module as claimed in claim 2, it is characterized in that, when described embossed pattern is random grid pattern, described embossed pattern comprises multiple grid cell, and described grid cell is irregular polygon.
5. fingerprint recognition module as claimed in claim 1, it is characterized in that, described embossed pattern is made up of groove, and the depth range of described groove is 0.01mm ~ 0.02mm.
6. fingerprint recognition module as claimed in claim 1, it is characterized in that, described embossed pattern comprises multiple pattern unit, and described pattern unit is greater than the distribution density of the centre of surface at described stiffening plate in the distribution density of the marginal surface of described stiffening plate.
7. fingerprint recognition module as claimed in claim 1, it is characterized in that, described embossed pattern comprises multiple pattern unit, described stiffening plate comprises free end and link, described free end and described link are oppositely arranged, described link is fitted with flexible PCB, and the distribution density of the pattern unit of described free end is greater than the distribution density of the pattern unit of described link.
8. fingerprint recognition module as claimed in claim 7, it is characterized in that, the distribution density of described pattern unit increases to described free end dimension linear from described link.
9. fingerprint recognition module as claimed in claim 8, it is characterized in that, described stiffening plate comprises the first drift angle and the second drift angle, described first drift angle and described second drift angle are concave shaped, described first drift angle is arranged on described link, described second drift angle arranges described free end, and the center of described first drift angle, the center of described second drift angle and being centrally located on same straight line of described stiffening plate.
10. an electronic installation, is characterized in that, described electronic installation comprises fingerprint recognition module as claimed in any one of claims 1 to 9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521030387.1U CN205193832U (en) | 2015-12-11 | 2015-12-11 | Fingerprint identification module and electron device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521030387.1U CN205193832U (en) | 2015-12-11 | 2015-12-11 | Fingerprint identification module and electron device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205193832U true CN205193832U (en) | 2016-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521030387.1U Expired - Fee Related CN205193832U (en) | 2015-12-11 | 2015-12-11 | Fingerprint identification module and electron device |
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| Country | Link |
|---|---|
| CN (1) | CN205193832U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106096596A (en) * | 2016-08-16 | 2016-11-09 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
| CN106407774A (en) * | 2016-08-26 | 2017-02-15 | 广东欧珀移动通信有限公司 | Terminal |
| WO2017202367A1 (en) * | 2016-05-25 | 2017-11-30 | 广东欧珀移动通信有限公司 | Mobile terminal |
| EP3288246A1 (en) * | 2016-08-16 | 2018-02-28 | Guangdong Oppo Mobile Telecommunications Corp., Ltd | Fingerprint module and method for manufacturing the fingerprint module |
| CN107958176A (en) * | 2016-11-01 | 2018-04-24 | 深圳信炜科技有限公司 | Bio-identification module and mobile terminal |
| CN108108650A (en) * | 2016-11-25 | 2018-06-01 | 敦泰电子有限公司 | Fingerprint identification module, device and its manufacturing method and electrical equipment |
| CN110321876A (en) * | 2019-07-24 | 2019-10-11 | 维沃移动通信有限公司 | Capacitive fingerprint identifies mould group and terminal device |
-
2015
- 2015-12-11 CN CN201521030387.1U patent/CN205193832U/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10440164B2 (en) | 2016-05-25 | 2019-10-08 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Mobile terminal for fingerprint identification |
| WO2017202367A1 (en) * | 2016-05-25 | 2017-11-30 | 广东欧珀移动通信有限公司 | Mobile terminal |
| US20190037060A1 (en) * | 2016-05-25 | 2019-01-31 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Mobile terminal and terminal |
| CN106096596A (en) * | 2016-08-16 | 2016-11-09 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
| EP3288246A1 (en) * | 2016-08-16 | 2018-02-28 | Guangdong Oppo Mobile Telecommunications Corp., Ltd | Fingerprint module and method for manufacturing the fingerprint module |
| CN106096596B (en) * | 2016-08-16 | 2018-03-27 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module preparation method and mobile terminal |
| US10368444B2 (en) | 2016-08-16 | 2019-07-30 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal |
| US10342137B2 (en) | 2016-08-16 | 2019-07-02 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal |
| CN108462768A (en) * | 2016-08-16 | 2018-08-28 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module production method and mobile terminal |
| CN106407774B (en) * | 2016-08-26 | 2019-04-26 | Oppo广东移动通信有限公司 | Terminal |
| CN106407774A (en) * | 2016-08-26 | 2017-02-15 | 广东欧珀移动通信有限公司 | Terminal |
| CN107958176A (en) * | 2016-11-01 | 2018-04-24 | 深圳信炜科技有限公司 | Bio-identification module and mobile terminal |
| CN108108650A (en) * | 2016-11-25 | 2018-06-01 | 敦泰电子有限公司 | Fingerprint identification module, device and its manufacturing method and electrical equipment |
| CN110321876A (en) * | 2019-07-24 | 2019-10-11 | 维沃移动通信有限公司 | Capacitive fingerprint identifies mould group and terminal device |
| CN110321876B (en) * | 2019-07-24 | 2021-05-25 | 维沃移动通信有限公司 | Capacitance fingerprint identification module and terminal equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210706 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20211211 |