CN204731795U - A kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment - Google Patents
A kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment Download PDFInfo
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- CN204731795U CN204731795U CN201520175658.6U CN201520175658U CN204731795U CN 204731795 U CN204731795 U CN 204731795U CN 201520175658 U CN201520175658 U CN 201520175658U CN 204731795 U CN204731795 U CN 204731795U
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- recognition module
- bezel ring
- fingerprint recognition
- substrate
- fingerprint
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Abstract
The utility model provides a kind of fingerprint recognition module, comprising: substrate, be positioned at the bezel ring, on described substrate and be positioned at the chip of described bezel ring; Described substrate is connect by solder sphere and described chip electrical; Described bezel ring, is connected with described substrate and described chip respectively by sealing, and the side that is connected with described substrate of described bezel ring, is formed with boss.The utility model additionally provides a kind of fingerprint acquisition apparatus comprising panel assembly and above-mentioned fingerprint recognition module.The utility model provides a kind of electronic equipment with fingerprint identification device.The utility model, under sufficient pressure can effective management and control glue thickness by forming boss bottom bezel ring.
Description
Technical field
The utility model relates to technical field of semiconductors, particularly relates to a kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment.
Background technology
Along with the development of electronic technology and semiconductor technology, the requirement of user to electronic equipments safety is more and more higher, fingerprint, as the unique feature of human body, is that the fingerprint identification technology of identifying code has been widely used in the safety verification of electronic equipment with fingerprint characteristic.
Namely fingerprint recognition is utilize the feature of fingerprint uniqueness and stability to realize the identification of user, and remembers identifying code without the need to user.Therefore, the application of fingerprint identification technology is day by day universal.Common fingerprint acquisition apparatus such as comprises capacitive fingerprint sensing device, capacitive fingerprint sensing device forms conducting channel on base material substrate, when pointing with fingerprint sensor electric coupling, the different capacitances produced by the projection of fingerprint ridge and the depression of fingerprint paddy are detected and form fingerprint group.
But, in prior art when assembling fingerprint recognition module, will as shown in Figure 1, after chip circumference smears sealing, when frame bezel is set in chip circumference and presses down, if when the pressure pressed down is different, glue variable thickness can be caused to cause, and (pressure is larger, remaining glue thickness is less), make final glue thickness be difficult to management and control.
Utility model content
For the defect of prior art, the utility model provides a kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment, by forming boss bottom bezel ring, and under sufficient pressure can effective management and control glue thickness.
First aspect, the utility model provides a kind of fingerprint recognition module, comprising: substrate, be positioned at the bezel ring, on described substrate and be positioned at the chip of described bezel ring;
Described substrate is connect by solder sphere and described chip electrical;
Described bezel ring, is connected with described substrate and described chip respectively by sealing, and the side that is connected with described substrate of described bezel ring, is formed with boss.
Preferably, the thickness of described boss is 0.01mm to 0.1mm.
Preferably, the thickness of described boss is 0.05mm.
Preferably, described boss is CD line or bump structure.
Preferably, described substrate is flexible PCB or printed circuit board (PCB).
Preferably, if described substrate is flexible PCB, then the below of described flexible PCB is provided with support member.
Preferably, described support member comprises steel disc.
Preferably, described boss and described bezel ring, one-body molded.
Second aspect, the utility model provides a kind of fingerprint acquisition apparatus, comprises panel assembly and above-mentioned fingerprint recognition module.
The third aspect, the utility model provides a kind of electronic equipment with fingerprint acquisition apparatus, it is characterized in that, comprises above-mentioned fingerprint acquisition apparatus.
As shown from the above technical solution, the utility model provides a kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment, by forming boss bottom bezel ring, under sufficient pressure can effective management and control glue thickness, and described glue thickness is the thickness of boss.And forming boss in the bottom of bezel ring, the bottom of bezel ring, and glue-contact area are increased and makes cover plate and substrate bonding power stronger, bezel ring, is not easy to come off from substrate in production and assembly process or when receiving external force.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these figure.
Fig. 1 is the structural representation of fingerprint recognition module in prior art;
Fig. 2 is the structural representation of a kind of fingerprint recognition module that the utility model one embodiment provides;
Fig. 3 is the structural representation of the bezel ring, that another embodiment of the utility model provides;
Fig. 4 is the front view of the bezel ring, that another embodiment of the utility model provides;
Fig. 5 is the structural representation of a kind of fingerprint recognition module that another embodiment of the utility model provides;
Fig. 6 is the electronic equipment front view with fingerprint recognition module that another embodiment of the utility model provides.
1, substrate; 2, bezel ring; 3, chip; 4, solder sphere (solder sphere is by glue sealing); 5, sealing; 7, support member; 8, glue.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 2, the utility model one embodiment provides a kind of fingerprint recognition module, comprising: substrate 1, be positioned at the bezel ring, 2 on described substrate and be positioned at the chip 3 of described bezel ring, 2;
Wherein, described substrate 1 is electrically connected with described chip 3 by solder sphere (solder sphere is by glue sealing) 4;
Described bezel ring, 2 is connected with described substrate 1 and described chip 3 respectively by sealing 5, and it should be noted that, bezel ring, sectional view as shown in Figure 3, and the side that described bezel ring, 2 is connected with described substrate 1 is formed with boss.
Front view as shown in Figure 4, the bottom surface be connected with described substrate 1 of bezel ring, is formed with multiple boss.
Wherein, described boss and described bezel ring, 2 can be one-body molded.
In this enforcement, bezel ring, 2 can select suitable material to make, as plastics, metal etc.
In the present embodiment, the thickness d of described boss is 0.01mm to 0.1mm.For example, if needing to control sealing thickness is 0.05mm, as long as be then 0.05mm by the THICKNESS CONTROL of the boss bottom bezel ring, after chip circumference and substrate smear sealing, directly the bezel ring, with boss is pressed down, just can control the clearance fit requirement of bezel ring, package size 0.05mm.Namely by boss THICKNESS CONTROL sealing thickness.
In the present embodiment, described boss is CD line or bump structure.And if boss is CD line, then this CD line can play simultaneously lead glue groove and the thick object of fixing glue.It should be noted that, if boss is salient point mechanism, then the shape of boss xsect can be arbitrary shape, and such as this boss can be square, rectangular parallelepiped, cylinder, the frustum of a cone etc.。Can produce following beneficial effect like this: under sufficient pressure can effective management and control glue thickness, and described glue thickness is the thickness of boss; And forming boss in the bottom of bezel ring, the bottom of bezel ring, and glue-contact area are increased and makes cover plate and substrate bonding power stronger, bezel ring, is not easy to come off from substrate in production and assembly process or when receiving external force.
Wherein, described substrate 1 specifically can comprise flexible PCB (Flexible Printed Circuit is called for short FPC) or printed circuit board (PCB) (Printed Circuit Board is called for short PCB).
It should be noted that, as shown in Figure 5, if described substrate 1 is FPC, then this fingerprint recognition module except comprising substrate 1, be positioned at the bezel ring, 2 on described substrate and be positioned at the chip 3 of described bezel ring, also comprise the support member 7 of the below being arranged at substrate FPC, this support member 7 can be steel disc etc., for when user presses fingerprint acquisition apparatus, supports the substrate FPC be positioned at above support member 7.And described support member and substrate FPC are bonded together by glue 8.
The utility model embodiment provides a kind of fingerprint recognition module, by forming boss bottom bezel ring, under sufficient pressure can effective management and control glue thickness, and described glue thickness is the thickness d of boss.
The utility model still another embodiment provides a kind of fingerprint acquisition apparatus, and this fingerprint acquisition apparatus comprises the fingerprint recognition module that panel assembly and above-described embodiment provide.
The utility model still another embodiment provides a kind of electronic equipment with fingerprint acquisition apparatus, comprises the fingerprint acquisition apparatus that above-described embodiment provides.This electronic equipment can be mobile phone, and as shown in Figure 6,107 is the screen of this mobile phone, and wherein, fingerprint recognition module is positioned at 102,104 places of mobile phone key.
The utility model still another embodiment provides a kind of method for making of above-mentioned fingerprint recognition module, and described method comprises:
S1: substrate and chip are coupled together by solder sphere;
S2: apply one deck sealing on the side of described chip and described substrate;
In this step, it should be noted that when substrate applies sealing at bezel ring, the part be connected with substrate to be coated with and be covered with sealing.
S3: be sheathed on outside described chip by bezel ring, presses down described bezel ring, until boss bottom described bezel ring, and described substrate contacts.
In this step, press down bezel ring, until boss and described substrate contacts, then can control sealing thickness by the thickness of adjustment boss.
Wherein, described substrate is flexible PCB FPC or printing board PCB.
And if described substrate is FPC, need to arrange support member in the below of described FPC, to support described FPC.
Specifically, if substrate is FPC, the utility model still another embodiment provides a kind of method for making of fingerprint recognition module, and the method comprises the steps:
S10: apply one deck glue on support member, is pasted together substrate FPC and support member by glue;
S20: substrate FPC and chip are coupled together by solder sphere;
S30: apply one deck sealing on the side of described chip and described substrate FPC;
S40: be sheathed on outside described chip by bezel ring, presses down described bezel ring, until the boss bottom described bezel ring, contacts with described substrate FPC.
Present embodiments provide the method for making of above-mentioned fingerprint recognition module, this programme passes through bottom original bezel ring, mill out CD lines or salient point mechanism, as long as ensure that enough pressure is due to effective management and control glue thickness (glue thickness is consistent with the height of the boss of bezel ring).
In instructions of the present utility model, describe a large amount of detail.But can understand, embodiment of the present utility model can be put into practice when not having these details.In some instances, be not shown specifically known method, structure and technology, so that not fuzzy understanding of this description.
Those skilled in the art can understand, although embodiments more described herein to comprise in other embodiment some included feature instead of further feature, the combination of the feature of different embodiment means and to be within scope of the present utility model and to form different embodiments.Such as, in the following claims, the one of any of embodiment required for protection can use with arbitrary array mode.
Last it is noted that above each embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to foregoing embodiments, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of each embodiment technical scheme of the utility model, it all should be encompassed in the middle of the scope of claim of the present utility model and instructions.
Claims (10)
1. a fingerprint recognition module, is characterized in that, comprising: substrate, be positioned at the bezel ring, on described substrate and be positioned at the chip of described bezel ring;
Described substrate is connect by solder sphere and described chip electrical;
Described bezel ring, is connected with described substrate and described chip respectively by sealing, and the side that is connected with described substrate of described bezel ring, is formed with boss.
2. fingerprint recognition module according to claim 1, is characterized in that, the thickness of described boss is 0.01mm to 0.1mm.
3. fingerprint recognition module according to claim 1, is characterized in that, the thickness of described boss is 0.05mm.
4. fingerprint recognition module according to claim 1, is characterized in that, described boss is CD line or bump structure.
5. fingerprint recognition module according to claim 1, is characterized in that, described substrate is flexible PCB or printed circuit board (PCB).
6. fingerprint recognition module according to claim 5, is characterized in that, if described substrate is flexible PCB, then the below of described flexible PCB is provided with support member.
7. fingerprint recognition module according to claim 6, is characterized in that, described support member comprises steel disc.
8. fingerprint recognition module according to claim 1, is characterized in that, described boss and described bezel ring, one-body molded.
9. a fingerprint acquisition apparatus, is characterized in that, comprises panel assembly and the fingerprint recognition module described in any one of claim 1-8.
10. there is an electronic equipment for fingerprint acquisition apparatus, it is characterized in that, comprise fingerprint acquisition apparatus according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520175658.6U CN204731795U (en) | 2015-03-26 | 2015-03-26 | A kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520175658.6U CN204731795U (en) | 2015-03-26 | 2015-03-26 | A kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204731795U true CN204731795U (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520175658.6U Expired - Fee Related CN204731795U (en) | 2015-03-26 | 2015-03-26 | A kind of fingerprint recognition module, fingerprint acquisition apparatus and electronic equipment |
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| CN (1) | CN204731795U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104933400A (en) * | 2015-03-26 | 2015-09-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module, manufacturing method thereof and fingerprint sensing device |
| US11453174B2 (en) | 2016-04-12 | 2022-09-27 | Woodwelding Ag | Fastening objects to each other |
-
2015
- 2015-03-26 CN CN201520175658.6U patent/CN204731795U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104933400A (en) * | 2015-03-26 | 2015-09-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module, manufacturing method thereof and fingerprint sensing device |
| US11453174B2 (en) | 2016-04-12 | 2022-09-27 | Woodwelding Ag | Fastening objects to each other |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330000, No. 1189, Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330000, No. 1189, Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330000, No. 1189, Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330000, No. 1189, Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210802 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330000, No. 1189, Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151028 |
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| CF01 | Termination of patent right due to non-payment of annual fee |