CN203675430U - Flexible printed circuit board - Google Patents
Flexible printed circuit board Download PDFInfo
- Publication number
- CN203675430U CN203675430U CN201420018415.7U CN201420018415U CN203675430U CN 203675430 U CN203675430 U CN 203675430U CN 201420018415 U CN201420018415 U CN 201420018415U CN 203675430 U CN203675430 U CN 203675430U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- floor
- solder ink
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011889 copper foil Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 abstract 14
- 239000013039 cover film Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 2
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Abstract
The utility model discloses a flexible printed circuit board characterized in that the flexible printed circuit board comprises a first zone, a second zone and a third zone; each of the first zone and the third zone comprises a solder resist ink layer, a copper foil layer, a PP layer, a cover film layer, a copper base material layer, another a cover film layer, another PP layer, another copper foil layer and another solder resist ink layer; and the second zone comprises a silver foil layer, a cover film layer, a copper base material layer, another cover film layer and another silver foil layer. The flexible printed circuit board provided by the utility model is advantageous in that the thickness of solder resist ink can be controlled no larger than 15 [mu]m, conveniences are brought to assemblies of high-end encapsuled products; product damages caused by bad focusing, resulting from excessive height difference of solder resist ink surface layers, of a camera are avoided; and the service life of an electronic product is prolonged.
Description
Technical field
The utility model relates to a kind of printed circuit board, particularly a kind of flexible circuit board.
Background technology
Flexible circuit board is widely used in all kinds of electric equipments, is the product that all kinds of electronic devices and components are electrically connected; Common flexible circuit board comprises insulating base and the copper foil layer that is overlying on insulating base surface, and traditional flexible circuit board is inflexible hardboard.
The complicated structure of flexible circuit board is made up of a lot of parts; it is that the flexible circuit board being combined into by soft board and hardboard also claims Rigid Flex, is followed successively by from top to bottom: anti-solder ink, fine copper, solid, PP, YB, diaphragm, Copper Foil, diaphragm, YB, PP, solid, fine copper, anti-solder ink.Such flexible circuit board is to replace product insulation with solder-mask printing ink, the low floating of present stage anti-solder ink floor height is not etc., evenness is between 0.005mm-0.055mm, cause client to assemble difficult production efficiency low, may cause electronic devices and components simultaneously or print the decline in useful life of flexible wiring board entirety processed.
Summary of the invention
The utility model, for the deficiencies in the prior art, provides a kind of flexible circuit board.The technical scheme that the utility model adopts is as follows:
A kind of flexible circuit board, is characterized in that, comprises a district: anti-solder ink floor, copper foil layer, PP floor, covering rete, copper substrate layer, covering rete, PP floor, copper foil layer, anti-solder ink floor; 2nd district: silver foil floor, covering rete, copper substrate layer, covering rete, silver foil floor; 3rd district: anti-solder ink floor, copper foil layer, PP floor, covering rete, copper substrate layer, covering rete, PP floor, copper foil layer, anti-solder ink floor; Described anti-solder ink layer and copper foil layer strike up partnership.
As above a kind of flexible circuit board, wherein, described anti-solder ink layer adopts liquid anti-solder ink.
As above a kind of flexible circuit board, wherein, described liquid anti-solder ink is the one in black, green, white.
As above a kind of flexible circuit board, wherein, described anti-solder ink layer and copper foil layer top layer are combined into one by printing.
As above a kind of flexible circuit board, wherein, the evenness of described anti-solder ink layer is abrasive structure.
As above a kind of flexible circuit board, wherein, the thickness of described anti-solder ink layer is at 1-15um.
The utility model flexible circuit board, improve the evenness on flexible circuit board (Rigid Flex) anti-solder ink top layer, can be by anti-solder ink THICKNESS CONTROL at 1-15um, be convenient to the assembling of high-end encapsulating products, the bad damage of product that causes of focusing of having avoided crossing because of anti-solder ink top layer height extreme difference ambassador's camera, makes client improve the utilance of product.
High efficiency focus function is provided, be convenient to the evenness of the electronic devices and components assembling on flexible circuit board, especially for cam lens focusing, avoided causing because anti-solder ink layer difference of height is excessive cam lens focusing bad, the useful life of having improved electronic product.
Brief description of the drawings
Describe the utility model in detail below in conjunction with the drawings and specific embodiments:
Fig. 1 is the structural representation of flexible circuit board.
1, anti-solder ink layer; 2, copper foil layer; 3, PP layer; 4, cover rete; 5, copper substrate layer; 6, silver foil layer.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach object and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
A kind of flexible circuit board, is characterized in that, comprises a district: anti-solder ink floor 1, copper foil layer 2, PP floor 3, covering rete 4, copper substrate layer 5, covering rete 4, PP floor 3, copper foil layer 2, anti-solder ink floor 1; 2nd district: silver foil floor 6, covering rete 4, copper substrate layer 5, covering rete 4, silver foil floor 6; 3rd district: anti-solder ink floor 1, copper foil layer 2, PP floor 3, covering rete 4, copper substrate layer 5, covering rete 4, PP floor 3, copper foil layer 2, anti-solder ink floor 1; Described anti-solder ink layer 1 strikes up partnership with copper foil layer 2.
As shown in Figure 1, anti-solder ink layer 1 strikes up partnership by printing with copper foil layer 2, described anti-solder ink layer 1 adopts liquid anti-solder ink, liquid anti-solder ink is black, green, one in white, the evenness of described liquid anti-solder ink comprises anti-solder ink layer 1, copper foil layer 2, the evenness of liquid anti-solder ink adopts the operating type that grinds (sticky mill), can be by anti-solder ink THICKNESS CONTROL at 1-15um, be convenient to the assembling of high-end encapsulating products, avoid crossing because of anti-solder ink top layer height extreme difference the bad damage of product that causes of focusing of ambassador's camera, make client improve the utilance of product.
More than show and described general principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; under the prerequisite that does not depart from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. a flexible circuit board, is characterized in that, comprises a district: anti-solder ink floor, copper foil layer, PP floor, covering rete, copper substrate layer, covering rete, PP floor, copper foil layer, anti-solder ink floor; 2nd district: silver foil floor, covering rete, copper substrate layer, covering rete, silver foil floor; 3rd district: anti-solder ink floor, copper foil layer, PP floor, covering rete, copper substrate layer, covering rete, PP floor, copper foil layer, anti-solder ink floor; Described anti-solder ink layer and copper foil layer strike up partnership by printing.
2. a kind of flexible circuit board according to claim 1, is characterized in that, described anti-solder ink layer adopts liquid anti-solder ink.
3. a kind of flexible circuit board according to claim 2, is characterized in that, described liquid anti-solder ink is the one in black, green, white.
4. a kind of flexible circuit board according to claim 1, is characterized in that, described anti-solder ink layer and copper foil layer top layer are combined into one by printing.
5. a kind of flexible circuit board according to claim 1, is characterized in that, the evenness of described anti-solder ink layer is abrasive structure.
6. a kind of flexible circuit board according to claim 1, is characterized in that, the thickness of described anti-solder ink layer is 1-15um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420018415.7U CN203675430U (en) | 2014-01-13 | 2014-01-13 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420018415.7U CN203675430U (en) | 2014-01-13 | 2014-01-13 | Flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203675430U true CN203675430U (en) | 2014-06-25 |
Family
ID=50971672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420018415.7U Expired - Lifetime CN203675430U (en) | 2014-01-13 | 2014-01-13 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203675430U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106993115A (en) * | 2016-01-20 | 2017-07-28 | 南昌欧菲光电技术有限公司 | Camera module and its FPC |
| CN109714893A (en) * | 2019-02-26 | 2019-05-03 | 深圳市吉泰电子有限公司 | A kind of high-frequency ceramic Rigid Flex and preparation method thereof |
-
2014
- 2014-01-13 CN CN201420018415.7U patent/CN203675430U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106993115A (en) * | 2016-01-20 | 2017-07-28 | 南昌欧菲光电技术有限公司 | Camera module and its FPC |
| CN109714893A (en) * | 2019-02-26 | 2019-05-03 | 深圳市吉泰电子有限公司 | A kind of high-frequency ceramic Rigid Flex and preparation method thereof |
| CN109714893B (en) * | 2019-02-26 | 2020-05-05 | 深圳市吉泰电子有限公司 | High-frequency ceramic soft and hard combined board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI WLCP ELECTRICAL SCIENCE + TECHNOLOGY CO., Free format text: FORMER NAME: SHANGHAI WLCP ELECTRICAL SCIENCE + TECHNOLOGY LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 201700 Shanghai city Qingpu New Road No. 1168 Patentee after: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. Address before: 201700 Shanghai city Qingpu New Road No. 1168 Patentee before: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140625 |