CN102083269A - Ceramic circuit substrate and manufacturing method thereof - Google Patents
Ceramic circuit substrate and manufacturing method thereof Download PDFInfo
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- CN102083269A CN102083269A CN2011100336076A CN201110033607A CN102083269A CN 102083269 A CN102083269 A CN 102083269A CN 2011100336076 A CN2011100336076 A CN 2011100336076A CN 201110033607 A CN201110033607 A CN 201110033607A CN 102083269 A CN102083269 A CN 102083269A
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- substrate
- ceramic circuit
- circuit board
- embryo
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Abstract
The invention relates to a ceramic circuit substrate and a manufacturing method thereof. The ceramic circuit substrate comprises a substrate and a blank. The surface of the substrate is provided with a plurality of bonding pads; and the blank is stacked on the surface of the substrate and provided with a plurality of through holes, wherein the positions of the through holes correspond to the bonding pads, and the diameters of the through holes are greater than those of the bonding pads. The ceramic circuit substrate is provided with a solder mask layer which can be used for preventing a solder bridge and preventing the substrate from warping.
Description
Technical field
The present invention is about a kind of ceramic circuit board and manufacture method thereof, in particular to a kind of manufacture method with ceramic circuit board and this ceramic circuit board of anti-welding function.
Background technology
Along with making rapid progress of electronic technology, electronic product is also towards light, thin, short, little trend design.Wiring design at this kind electronic product, wiring board (wired board) is the packaging element that often uses, and for example is printed circuit board (PCB) (printing circuit board), wafer carrier (chip carrier) or low-temperature co-fired ceramic substrate wiring boards such as (LTCC).
Traditionally, be subject to the printing perforate only below 200 microns (um), and have resolution not good with problem such as printed dimensions deviation, only can do local anti-welding and can't print welding resisting layer (solder mask) on every side at joint sheet (pad), and then cause and to contact with each other between tin ball and tin ball and form Xi Qiao, and produce short circuit phenomenon.In addition,, when using ceramic gypsum to print,, make the ceramic paste shrinkage different, cause in the common burning process that product produces the phenomenon of warpage with baseplate material because printing area is bigger because the track footpath is bigger.
In view of traditional method there is no the problem of effective solution Xi Qiao and substrate warp, so need the ceramic circuit board that proposes a kind of novelty badly, can be used for preventing Xi Qiao and substrate warp.
Summary of the invention
One of the object of the invention is to provide ceramic circuit board, and this ceramic circuit board has welding resisting layer, in order to preventing that in the process of welding, tin ball and tin ball are in contact with one another and form Xi Qiao, and the generation short circuit phenomenon.
Another object of the present invention is to provide ceramic circuit board, be used for preventing the process of burning, produce the problem of substrate warp altogether.
The present invention comprises substrate and gives birth to embryo about a kind of ceramic circuit board.Substrate surface has a plurality of joint sheets.Give birth to embryo and stack on the surface of this substrate, this life embryo has plurality of through holes, and wherein the position of these through holes is corresponding to these joint sheets, and the diameter of these through holes is greater than the diameter of these joint sheets.
According to ceramic circuit board of the present invention, substrate is identical with the shrinkage of giving birth to embryo.The material of perhaps giving birth to embryo is identical with substrate.
According to ceramic circuit board of the present invention, substrate is a low-temperature co-fired ceramic substrate.
According to ceramic circuit board of the present invention, plurality of through holes forms by laser or mechanical through hole device.
According to ceramic circuit board of the present invention, the thickness of giving birth to embryo is between 10 to 50 microns.
The present invention may further comprise the steps about a kind of manufacture method of ceramic circuit board.Provide the surface to have the substrate of a plurality of joint sheets.The living embryo that stacks on this substrate surface is provided, and this life embryo has plurality of through holes, and wherein the position of these through holes is corresponding to these joint sheets, and the diameter of these through holes is greater than the diameter of these joint sheets.
According to the manufacture method of ceramic circuit board of the present invention, substrate is identical with the shrinkage of giving birth to embryo.The material of perhaps giving birth to embryo is identical with substrate.Substrate is a low-temperature co-fired ceramic substrate.Plurality of through holes forms by laser or mechanical through hole device.The thickness of giving birth to embryo is between 10 to 50 microns.
By the present invention, this ceramic circuit board has welding resisting layer, can be used for preventing Xi Qiao and substrate warp.
Description of drawings
Fig. 1 shows the profile of ceramic circuit board according to an embodiment of the invention.
Fig. 2 A to Fig. 2 B shows the manufacture method schematic diagram of gas tight ceramics layer according to an embodiment of the invention.
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows now.
The profile of Fig. 1 is to show ceramic circuit board 1 according to an embodiment of the invention, it comprises: substrate 11, its surface has a plurality of joint sheets 12, and substrate 11 can be low-temperature co-fired ceramic substrate, and wherein above-mentioned low-temperature co-fired ceramic substrate can be made of a plurality of ceramic layer 15; And give birth to embryo 13, and stack on the surface of substrate 11, give birth to embryo 13 and have plurality of through holes 14, wherein the position of this plurality of through holes 14 is corresponding to these a plurality of joint sheets 12, and the diameter of this through hole 14 is greater than the diameter of this joint sheet 12.In addition, the thickness of giving birth to embryo 13 and can see through laser or mechanical through hole device (not shown) form these through holes 14 between 10～50 microns.What need to specify is that substrate 11 is identical with the shrinkage of life embryo 13, and it is also identical to constitute both material.As shown in Figure 1, when the tin ball 17 with IC wafer 16 is soldered to the joint sheet 12 of substrate 11, gives birth to embryo 13 and will can be used as welding resisting layer, avoiding producing Xi Qiao between the tin ball, and then produce short circuit phenomenon.In addition, the thickness of giving birth to embryo 13 can be designed to identical with the thickness of substrate 11 according to actual conditions.
Fig. 2 A to Fig. 2 B shows the manufacture method schematic diagram of gas tight ceramics layer 1 according to an embodiment of the invention.Shown in Fig. 2 A, the invention provides the substrate 11 that the surface has a plurality of joint sheets, and substrate 11 can be low-temperature co-fired ceramic substrate, wherein above-mentioned low-temperature co-fired ceramic substrate can be made of a plurality of ceramic layer.In addition, the central authorities of substrate 11 are provided with electronic circuit 18.Shown in Fig. 2 B, the invention provides the living embryo 13 that stacks on this substrate surface, give birth to embryo 13 and have plurality of through holes 14, wherein the position of this plurality of through holes 14 is corresponding to these a plurality of joint sheets 12, and the diameter of this through hole 14 is greater than the diameter 12 of this joint sheet.In addition, the thickness of giving birth to embryo 13 and can see through laser or mechanical through hole device (not shown) form these through holes 14 between 10～50 microns.What need to specify is that substrate 11 is identical with the shrinkage of life embryo 13, and it is also identical to constitute both material.Then, will give birth to embryo 13 in the mode of sintering and stack, and only expose needed joint sheet 12 (as shown in Figure 1) with substrate 11.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.Must be pointed out that the embodiment that has disclosed does not limit the scope of the invention.
Claims (10)
1. ceramic circuit board is characterized in that comprising:
Substrate, its surface has a plurality of joint sheets; And
Give birth to embryo, stack on the surface of this substrate, this life embryo has plurality of through holes, and wherein the position of this plurality of through holes is corresponding to these a plurality of joint sheets, and the diameter of this through hole is greater than the diameter of this joint sheet.
2. ceramic circuit board as claimed in claim 1 is characterized in that this substrate is identical with the shrinkage of this life embryo; The material that perhaps should give birth to embryo is identical with this substrate.
3. ceramic circuit board as claimed in claim 1 is characterized in that this substrate is a low-temperature co-fired ceramic substrate.
4. ceramic circuit board as claimed in claim 1 is characterized in that this plurality of through holes forms by laser or mechanical through hole device.
5. ceramic circuit board as claimed in claim 1, the thickness that it is characterized in that this life embryo is between 10 to 50 microns.
6. the manufacture method of a ceramic circuit board is characterized in that comprising:
Provide the surface to have the substrate of a plurality of joint sheets; And
The living embryo that stacks on this substrate surface is provided, and this life embryo has plurality of through holes, and wherein the position of this plurality of through holes is corresponding to these a plurality of joint sheets, and the diameter of this through hole is greater than the diameter of this joint sheet.
7. the manufacture method of ceramic circuit board as claimed in claim 6 is characterized in that this substrate is identical with the shrinkage of this life embryo; The material that perhaps should give birth to embryo is identical with this substrate.
8. the manufacture method of ceramic circuit board as claimed in claim 6 is characterized in that this substrate is a low-temperature co-fired ceramic substrate.
9. the manufacture method of ceramic circuit board as claimed in claim 6 is characterized in that this plurality of through holes forms by laser or mechanical through hole device.
10. the manufacture method of ceramic circuit board as claimed in claim 6, the thickness that it is characterized in that this life embryo is between 10 to 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100336076A CN102083269A (en) | 2011-01-22 | 2011-01-22 | Ceramic circuit substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100336076A CN102083269A (en) | 2011-01-22 | 2011-01-22 | Ceramic circuit substrate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102083269A true CN102083269A (en) | 2011-06-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100336076A Pending CN102083269A (en) | 2011-01-22 | 2011-01-22 | Ceramic circuit substrate and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN102083269A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9607862B2 (en) | 2012-09-11 | 2017-03-28 | Globalfoundries Inc. | Extrusion-resistant solder interconnect structures and methods of forming |
| CN108807428A (en) * | 2018-04-26 | 2018-11-13 | 武汉高芯科技有限公司 | Focal plane arrays (FPA) and preparation method thereof with isolated column |
| CN109524310A (en) * | 2018-10-11 | 2019-03-26 | 中国电子科技集团公司第四十三研究所 | A kind of ltcc substrate cofiring welding resistance layer manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11112149A (en) * | 1997-09-30 | 1999-04-23 | Elna Co Ltd | Multilayered printed wiring board |
| CN1510979A (en) * | 2002-12-23 | 2004-07-07 | 矽统科技股份有限公司 | High-density circuit board without weld pad design and manufacturing method thereof |
| JP2007053206A (en) * | 2005-08-17 | 2007-03-01 | Tdk Corp | Electronic component and manufacturing method thereof |
| JP4284782B2 (en) * | 1999-10-08 | 2009-06-24 | 株式会社村田製作所 | Multilayer ceramic substrate and manufacturing method thereof |
-
2011
- 2011-01-22 CN CN2011100336076A patent/CN102083269A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11112149A (en) * | 1997-09-30 | 1999-04-23 | Elna Co Ltd | Multilayered printed wiring board |
| JP4284782B2 (en) * | 1999-10-08 | 2009-06-24 | 株式会社村田製作所 | Multilayer ceramic substrate and manufacturing method thereof |
| CN1510979A (en) * | 2002-12-23 | 2004-07-07 | 矽统科技股份有限公司 | High-density circuit board without weld pad design and manufacturing method thereof |
| JP2007053206A (en) * | 2005-08-17 | 2007-03-01 | Tdk Corp | Electronic component and manufacturing method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9607862B2 (en) | 2012-09-11 | 2017-03-28 | Globalfoundries Inc. | Extrusion-resistant solder interconnect structures and methods of forming |
| US10049897B2 (en) | 2012-09-11 | 2018-08-14 | Globalfoundries Inc. | Extrusion-resistant solder interconnect structures and methods of forming |
| CN108807428A (en) * | 2018-04-26 | 2018-11-13 | 武汉高芯科技有限公司 | Focal plane arrays (FPA) and preparation method thereof with isolated column |
| CN109524310A (en) * | 2018-10-11 | 2019-03-26 | 中国电子科技集团公司第四十三研究所 | A kind of ltcc substrate cofiring welding resistance layer manufacturing method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110601 |