CN203675431U - Flexible multilayer printed circuit board - Google Patents
Flexible multilayer printed circuit board Download PDFInfo
- Publication number
- CN203675431U CN203675431U CN201420018588.9U CN201420018588U CN203675431U CN 203675431 U CN203675431 U CN 203675431U CN 201420018588 U CN201420018588 U CN 201420018588U CN 203675431 U CN203675431 U CN 203675431U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- district
- zone
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011889 copper foil Substances 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 58
- 230000002787 reinforcement Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 3
- 239000013039 cover film Substances 0.000 abstract 6
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- -1 covering rete Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a flexible multilayer printed circuit board. The flexible multilayer printed circuit board comprises a first zone, a second zone and a third zone, wherein the first zone comprises a solder resist ink layer, a copper foil layer, a bonding layer, a cover film layer, a copper base material layer, another cover film layer, a conducting resin layer and a bearing layer; the second zone comprises a silver foil layer, a cover film layer, a copper base material layer, another cover film layer and another silver foil layer; the third zone comprises a bearing layer, a conducting resin layer, a solder resist ink layer, a copper foil layer, a bonding layer, a cover film layer, a copper base material layer and another cover film layer; a chip assembling position in the first zone is hollowed out, a metal stiffening plate of the bearing layer of the first zone is in a raised shape and fills in the hollowed position of the first zone, and a chip is assembled in the bearing layer. The flexible multilayer printed circuit board is advantageous in that deformations, when the circuit board goes by high temperature higher than 240 DEG C, of the circuit board are overcome; focusing of a camera is especially improved; badness caused by assembly unevenness of the electronic components is avoided; and the service life of the electronic components or electronic equipment are raised.
Description
Technical field
The utility model relates to a kind of circuit board, particularly a kind of flexible print multilayer circuit board.
Background technology
Flexible circuit board is widely used in all kinds of electric equipments, is the product that all kinds of electronic devices and components are electrically connected, and it is widely used in the multiple electronic products such as mobile phone, notebook computer, PDA, digital camera, LCDs.The flexible circuit board distortion that product occurs in the time of the high temperature through more than 240 DEG C makes its client assembling difficulty, affects the useful life of electronic devices and components or electronic equipment.
Summary of the invention
The utility model, for the deficiencies in the prior art, provides a kind of flexible print multilayer circuit board.The technical scheme that the utility model adopts is as follows:
A kind of flexible print multilayer circuit board, is characterized in that, comprises a district: anti-solder ink floor, copper foil layer, following layer, covering rete, copper substrate layer, covering rete, conductive adhesive layer, bearing bed; 2nd district: silver foil floor, covering rete, copper substrate layer, covering rete, silver foil floor; 3rd district: bearing bed, conductive adhesive layer, anti-solder ink floor, copper foil layer, following layer, covering rete, copper substrate layer, covering rete; In the middle of one district, cartridge chip position is designed to hollow out, and an area carrier layer metal reinforcement plate is convex form, is filled in a hollow out position, district, and chipset is contained in bearing bed.
As above a kind of flexible print multilayer circuit board, wherein, three sidewall of a described each floor in district are filled with bearing bed metal reinforcement plate, and former and later two sidewall dress camera positions, a district are spill.
As above a kind of flexible print multilayer circuit board, wherein, described anti-solder ink layer and the stacked setting of copper foil layer, anti-solder ink is printed on copper foil layer surface and is combined into one.
As above a kind of flexible print multilayer circuit board, wherein, described covering rete is the material of epoxy resin (AD glue) and polyimides (PI) composition.
As above a kind of flexible print multilayer circuit board, wherein, described following layer is epoxy resin (AD glue) or conducting resinl.
As above a kind of flexible print multilayer circuit board, wherein, described bearing bed is metal reinforcement plate.
As above a kind of flexible print multilayer circuit board, wherein, the stacked setting of described copper foil layer and bearing bed is also bonded to one by the described following layer of being located between copper foil layer and bearing bed.
The utility model advantage: solved the circuit board distortion that product occurs in the time of the high temperature through more than 240 DEG C, especially focus on and improve significantly for camera, avoid electronic devices and components to assemble bad that out-of-flatness causes, promoted the useful life of electronic devices and components or electronic equipment.
Brief description of the drawings
Describe the utility model in detail below in conjunction with the drawings and specific embodiments:
Fig. 1 is the structural representation of flexible print multilayer circuit board;
Fig. 2 is the side schematic view at flexible print multilayer circuit board one dress camera position, district.
1, anti-solder ink layer; 2, copper foil layer; 3, following layer; 4, cover rete; 5, copper substrate layer; 6, conductive adhesive layer; 7, bearing bed; 8, silver foil layer.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach object and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
A kind of flexible print multilayer circuit board, is characterized in that, comprises a district: anti-solder ink floor 1, copper foil layer 2, following layer 3, covering rete 4, copper substrate layer 5, covering rete 4, conductive adhesive layer 6, bearing bed 7; 2nd district: silver foil floor 8, covering rete 4, copper substrate layer 5, covering rete 4, silver foil floor 8; 3rd district: bearing bed 7, conductive adhesive layer 6, anti-solder ink floor 1, copper foil layer 2, following layer 3, covering rete 4, copper substrate layer 5, covering rete 4; In the middle of one district, cartridge chip position is designed to hollow out, and an area carrier layer 7 metal reinforcement plate are convex form, are filled in a hollow out position, district, and chipset is contained in bearing bed 7.
As above a kind of flexible print multilayer circuit board, wherein, three sidewall of a described each floor in district are filled with bearing bed 7 metal reinforcement plates, and former and later two sidewall dress camera positions, a district are spill.
As above a kind of flexible print multilayer circuit board, wherein, described anti-solder ink layer 1 and the stacked setting of copper foil layer 2, anti-solder ink is printed on copper foil layer 2 surfaces and is combined into one.
As above a kind of flexible print multilayer circuit board, wherein, described covering rete 4 is the material of epoxy resin (AD glue) and polyimides (PI) composition.
As above a kind of flexible print multilayer circuit board, wherein, described following layer 3 is epoxy resin (AD glue) or conducting resinl.
As above a kind of flexible print multilayer circuit board, wherein, described bearing bed 7 is metal reinforcement plates.
As above a kind of flexible print multilayer circuit board, wherein, described copper foil layer 2 and the stacked setting of bearing bed 7 are also bonded to one by the described following layer 3 of being located between copper foil layer 2 and bearing bed 7.
As shown in Figure 1, for the structural representation of flexible print multilayer circuit board, one district comprises: anti-solder ink floor 1, copper foil layer 2, following layer 3, cover rete 4, copper substrate layer 5, cover rete 4, conductive adhesive layer 6, bearing bed 7, stacked setting between each layer, anti-solder ink layer 1 and the stacked setting of copper foil layer 2 be in case solder paste ink print on copper foil layer 2 surface and be combined into one, bearing bed 7 is metal reinforcement plates, adopt stainless steel stiffening plate or phosphor-copper stiffening plate, in the middle of one district, cartridge chip position is designed to hollow out, one area carrier layer 7 metal reinforcement plate are convex form, be filled in a hollow out position, district, chipset is contained in bearing bed 7.One three, the each floor in district sidewall is filled with bearing bed 7 metal reinforcement plates, and former and later two sidewall dress camera positions, a district are spill.As shown in Figure 2, it is the side schematic view at flexible print multilayer circuit board one dress camera position, district, former and later two sidewall dress camera position bearing bed metal reinforcement plates of one district are filled, dress camera position in the middle of one both sides, district, first the mode of or laser cutting die-cut with mould is by this position hollow out, be designed to spill, phosphor-copper stiffening plate or stainless steel stiffening plate will be processed and etch partially in or beyond factory, are convenient to electronic devices and components on circuit board and install smooth.
More than show and described general principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; under the prerequisite that does not depart from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (7)
1. a flexible print multilayer circuit board, is characterized in that, comprises a district: anti-solder ink floor (1), copper foil layer (2), following layer (3), covering rete (4), copper substrate layer (5), conductive adhesive layer (6), bearing bed (7); 2nd district: silver foil floor (8), covering rete (4), copper substrate layer (5); 3rd district: bearing bed (7), conductive adhesive layer (6), anti-solder ink floor (1), copper foil layer (2), following layer (3), covering rete (4), copper substrate layer (5), in the middle of one district, cartridge chip position is designed to hollow out, one area carrier layer (7) metal reinforcement plate is convex form, be filled in a hollow out position, district, chipset is contained in bearing bed (7).
2. a kind of flexible print multilayer circuit board according to claim 1, is characterized in that, three sidewall of a described each floor in district are filled with bearing bed metal reinforcement plate, and former and later two sidewall dress camera positions, a district are spill.
3. a kind of flexible print multilayer circuit board according to claim 1, is characterized in that, described anti-solder ink layer and the stacked setting of copper foil layer, and anti-solder ink is printed on copper foil layer surface and is combined into one.
4. a kind of flexible print multilayer circuit board according to claim 1, is characterized in that, described covering rete is the material of epoxy resin (AD glue) and polyimides (PI) composition.
5. a kind of flexible print multilayer circuit board according to claim 1, is characterized in that, described following layer is epoxy resin (AD glue) or conducting resinl.
6. a kind of flexible print multilayer circuit board according to claim 1, is characterized in that, described bearing bed is metal reinforcement plate.
7. a kind of flexible print multilayer circuit board according to claim 1, is characterized in that, the stacked setting of described copper foil layer and bearing bed is also bonded to one by the described following layer of being located between copper foil layer and bearing bed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420018588.9U CN203675431U (en) | 2014-01-13 | 2014-01-13 | Flexible multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420018588.9U CN203675431U (en) | 2014-01-13 | 2014-01-13 | Flexible multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203675431U true CN203675431U (en) | 2014-06-25 |
Family
ID=50971673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420018588.9U Expired - Lifetime CN203675431U (en) | 2014-01-13 | 2014-01-13 | Flexible multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203675431U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763853A (en) * | 2014-01-13 | 2014-04-30 | 上海温良昌平电器科技有限公司 | Multi-layer flexible printed circuit board |
-
2014
- 2014-01-13 CN CN201420018588.9U patent/CN203675431U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763853A (en) * | 2014-01-13 | 2014-04-30 | 上海温良昌平电器科技有限公司 | Multi-layer flexible printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI WLCP ELECTRICAL SCIENCE + TECHNOLOGY CO., Free format text: FORMER NAME: SHANGHAI WLCP ELECTRICAL SCIENCE + TECHNOLOGY LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 201700 Shanghai city Qingpu New Road No. 1168 Patentee after: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. Address before: 201700 Shanghai city Qingpu New Road No. 1168 Patentee before: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140625 |
|
| CX01 | Expiry of patent term |