CN204031580U - A kind of thermal printing header structure - Google Patents
A kind of thermal printing header structure Download PDFInfo
- Publication number
- CN204031580U CN204031580U CN201320688806.5U CN201320688806U CN204031580U CN 204031580 U CN204031580 U CN 204031580U CN 201320688806 U CN201320688806 U CN 201320688806U CN 204031580 U CN204031580 U CN 204031580U
- Authority
- CN
- China
- Prior art keywords
- pad
- flexible pcb
- micropore
- thermal printing
- header structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of flexible PCB, comprises flexible PCB body, and one end of aforementioned flexible PCB body has multiple spaced apart pads side by side, it is characterized in that offering micropore at least one described pad.Further, the diameter of described micropore is 0.2mm～0.3mm.The invention also discloses a kind of thermal printing header structure, compared with prior art, the utility model has the advantage of: on pad, micropore sets up, make flexible PCB and the unnecessary high temperature melting tin on corresponding welding body pad flow to this hole and concentrate, reach the consistency of thickness of the fusing tin layer of each pad; What this had ensured that thermal head presses down is distributed to the identical equiblibrium mass distribution of power of each pad as power; This realizes the consistency of the temperature of each weld welding, and reliable welding quality is high; While having avoided existing flexible circuit boards solder, roll the short circuit problem of overflow edge simultaneously.
Description
Technical field
The utility model relates to a kind of flexible PCB, and this flexible PCB can be applied to the various product scopes such as thermal printer, computer, mobile phone, the invention also discloses a kind of thermal printing header structure.
Background technology
Flexible PCB is that the one of making as base material taking polyimides or polyester film has height reliability, excellent flexible printed circuit.Be called for short soft board or FPC, have that distribution density is high, lightweight, the feature of thin thickness.At present, be applied to widely thermal printer, computer, field of mobile phones, usually, one end of flexible PCB has multiple spaced apart pads side by side, in the time carrying out thermal compression welding operation, easily produce weld rosin joint and the scolding tin short circuit problem in calendering overflow edge, during particularly for the many situation of number of pads, problems of welded quality performance is larger, seriously causes product quality to decline and cost increase problem.
Utility model content
Technical problem to be solved in the utility model is that a kind of flexible PCB that melts tin thickness homogeneous, is difficult for the short circuit of calendering overflow edge is provided for the above-mentioned state of the art.
Another technical problem to be solved in the utility model is to provide a kind of welding temperature consistency the high and reliable flexible PCB of welding quality stable for the above-mentioned state of the art.
Another technical problem to be solved in the utility model is to provide a kind of thermal printing header structure that melts tin thickness homogeneous, is difficult for the short circuit of calendering overflow edge.
Another technical problem to be solved in the utility model is to provide a kind of welding temperature consistency the high and reliable thermal printing header structure of welding quality stable for the above-mentioned state of the art.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of flexible PCB, comprise flexible PCB body, one end of aforementioned flexible PCB body has multiple spaced apart pads side by side, it is characterized in that offering micropore at least one described pad.
As preferably, on described each pad, offer 1～3 micropore.
As preferably, the diameter of described micropore is 0.2mm～0.3mm.
When flexible PCB is while being two-sided, described micropore is metallization via hole.
A kind of thermal printer header structure, comprise flexible PCB and thermal printing head, one end of aforementioned flexible PCB has multiple spaced apart pads side by side, and this pad and thermal printing head are bonded as one, and it is characterized in that offering micropore at least one described pad.
Compared with prior art, the utility model has the advantage of: the setting up of micropore on pad, make flexible PCB flow to this hole with the unnecessary high temperature melting tin on corresponding welding body pad and concentrate, reach the consistency of thickness of the fusing tin layer of each pad; What this had ensured that thermal head presses down is distributed to the identical equiblibrium mass distribution of power of each pad as power; This realizes the consistency of the temperature of each weld welding, and reliable welding quality is high; While having avoided existing flexible circuit boards solder, roll the short circuit problem of overflow edge simultaneously.
Brief description of the drawings
Fig. 1 is example structure schematic diagram.
Fig. 2 is flexible circuit board structure schematic diagram in embodiment.
Embodiment
Below in conjunction with accompanying drawing, embodiment is described in further detail the utility model.
As depicted in figs. 1 and 2, thermal printer header structure in the present embodiment comprises flexible PCB and thermal printing head 2, one end of flexible PCB 1 has multiple spaced apart pads 11 side by side, this pad 11 is bonded as one with thermal printing head 2, offers a micropore 12 on each pad 11.The diameter of each micropore 12 is 0.2mm～0.3mm.When flexible PCB 1 is while being two-sided, micropore 12 is metallization via hole.On each pad in the present embodiment, micropore 12 quantity can also be two or three.
The setting up of micropore on pad, makes flexible PCB flow to this hole with the unnecessary high temperature melting tin on corresponding welding body pad and concentrates, and reaches the consistency of thickness of the fusing tin layer of each pad; What this had ensured that thermal head presses down is distributed to the identical equiblibrium mass distribution of power of each pad as power; This realizes the consistency of the temperature of each weld welding, and reliable welding quality is high; While having avoided existing flexible circuit boards solder, roll the short circuit problem of overflow edge simultaneously.
Claims (2)
1. a thermal printing header structure, comprise flexible PCB and thermal printing head, one end of aforementioned flexible PCB has multiple spaced apart pads side by side, and this pad and thermal printing head are bonded as one, and it is characterized in that offering micropore at least one described pad;
The diameter of described micropore is 0.2mm～0.3mm;
Described micropore is metallization via hole.
2. thermal printing header structure according to claim 1, is characterized in that offering 1～3 micropore on described each pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320688806.5U CN204031580U (en) | 2013-11-04 | 2013-11-04 | A kind of thermal printing header structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320688806.5U CN204031580U (en) | 2013-11-04 | 2013-11-04 | A kind of thermal printing header structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204031580U true CN204031580U (en) | 2014-12-17 |
Family
ID=52071401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320688806.5U Expired - Fee Related CN204031580U (en) | 2013-11-04 | 2013-11-04 | A kind of thermal printing header structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204031580U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110356122A (en) * | 2018-03-26 | 2019-10-22 | 罗姆股份有限公司 | Thermal printing head |
-
2013
- 2013-11-04 CN CN201320688806.5U patent/CN204031580U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110356122A (en) * | 2018-03-26 | 2019-10-22 | 罗姆股份有限公司 | Thermal printing head |
| CN110356122B (en) * | 2018-03-26 | 2021-09-17 | 罗姆股份有限公司 | Thermal print head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20171104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |