CN202178913U - Half hollow type metal-base copper coated board - Google Patents
Half hollow type metal-base copper coated board Download PDFInfo
- Publication number
- CN202178913U CN202178913U CN2011202300159U CN201120230015U CN202178913U CN 202178913 U CN202178913 U CN 202178913U CN 2011202300159 U CN2011202300159 U CN 2011202300159U CN 201120230015 U CN201120230015 U CN 201120230015U CN 202178913 U CN202178913 U CN 202178913U
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- CN
- China
- Prior art keywords
- copper
- adhesive layer
- layer
- plate
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model relates to a half hollow type metal-base copper coated board, comprising a one side copper coated board, a first adhesive layer (3) applied on one side of the copper coated board, a metal base layer (4) adhered by hot pressing on the first adhesive layer (3) of the copper coated board and one or more than one hollow openings (5) going through the first adhesive layer (3) and the one side copper coated board. The half hollow type metal-base copper coated board has a high insulation grade and a high voltage breakdown resistance grade; and when a circuit board is manufactured, a conductive weld leg (9) of components on the circuit board can be directly welded on the metal base layer (4) through the hollow openings (5) in such a way that thermal resistance of insulating layers does not exist and heat can be directly transmitted to the metal base layer (4) by the conductive weld leg (9) through soldering tin to transmit and diffuse the heat as soon as possible; the half hollow type metal-base copper coated board raises a thermal conduction rate and reliability and the service life of terminal products, and the manufacturing method is simple, economic and practical.
Description
Technical field
The utility model relates to the wiring board field, is specifically related to the metal base circuit panel material.More specifically, the utility model relates to the Metal Substrate copper-clad plate of half novel hollow out type.
Background technology
Traditional Metal Substrate copper-clad plate is made up of Copper Foil, insulating barrier and metal substrate, and wherein insulating barrier is made up of polymer, and is generally all thicker; The particularly voltage withstand class Metal Substrate copper-clad plate of having relatively high expectations, insulating barrier is just thicker, and insulating layer thickness just causes thermal resistance to increase; Hinder thermal conduction rate; The heat conduction is slow, the continuous cumulative rises of temperature, and heat distributes and does not go out; The product produced of postorder just is under a kind of condition of high temperature for a long time like this, has also received certain influence in the reliability of its end product and useful life.
Therefore, need the copper-clad plate of a kind of new type of metal base in the art and solve above-mentioned technical problem and other technical problem, and the many technique effects that are superior to prior art are provided.
The utility model content
The utility model is intended to solve above technical problem with other.
The utility model has at first proposed the Metal Substrate copper-clad plate that a kind of insulating barrier contains polyimides; Insulating barrier adopts polyimides; Because the polyimide insulative grade is high, it is high that proof voltage punctures grade, thereby the insulating barrier of the Metal Substrate copper-clad plate of same dielectric grade can make extremely thin; Thermal resistance is low, and it is fast to conduct heat.
But the thermal impedance of the insulating barrier of this Metal Substrate copper-clad plate is compared with traditional Metal Substrate copper-clad plate, though thermal resistance obviously reduces, still also has a spot of thermal resistance, and therefore further improved space is arranged.
In order to address this problem more up hill and dale better; Can on polyimide insulative layer, be coated with the last layer adhesive at single-side coated copper plate; And the hollow out mouth is set; Be made with the metal-based layer heat pressure adhesive then and have high insulation, the wiring board material of half hollow out type Metal Substrate copper-clad plate of high heat-transfer performance.
More specifically,, disclosed a kind of Metal Substrate copper-clad plate of half hollow out type, having comprised: single-side coated copper plate according to the utility model; Be applied to first adhesive layer on the said single-side coated copper plate one side; The metal-based layer of heat pressure adhesive on said first adhesive layer of said single-side coated copper plate; With one or more hollow out mouths of being arranged to run through said single-side coated copper plate and said first adhesive layer.
According to an embodiment of the utility model, said single-side coated copper plate is no glue single-side coated copper plate, comprises the circuit Copper Foil and the polyimide insulative layer that directly are laminated with together.
According to another embodiment of the utility model, said single-side coated copper plate is that the glue single-side coated copper plate is arranged, and comprises circuit Copper Foil, polyimide insulative layer and is bonded in second adhesive layer between said circuit Copper Foil and the polyimide insulative layer.
According to another embodiment of the utility model, said second adhesive layer is the heat curing-type adhesive layer.
According to another embodiment of the utility model, said first adhesive layer is applied on the said polyimide insulative layer of said single-side coated copper plate, and said thus polyimide insulative layer is passed through the said first adhesive layer heat pressure adhesive on said metal-based layer.
According to another embodiment of the utility model, the constituent material of said metal-based layer is selected from that aluminium, copper, aluminium are zinc-plated, aluminium nickel plating, aluminium alloy, copper are zinc-plated, copper nickel plating, copper alloy, iron, iron are zinc-plated, iron nickel plating or ferroalloy.
According to another embodiment of the utility model, said first adhesive layer is the heat curing-type adhesive layer.
According to another embodiment of the utility model, said one or more hollow out mouths run through said single-side coated copper plate and said first adhesive layer, but do not pass said metal-based layer.
The utility model has also disclosed a kind of rigidity wiring board; The utilization of said rigidity wiring board is made according to each described Metal Substrate copper-clad plate in the above claim; And said rigidity wiring board also comprises the components and parts that are mounted thereon, and the heat conduction leg of said components and parts (7) is welded on the said metal-based layer via said hollow out mouth.
According to an embodiment of the rigidity wiring board of the utility model, the heat conduction leg of said components and parts is welded on the said metal-based layer through the scolding tin that is filled in the said hollow out mouth.
According to the utility model; Can on the polyimide insulative layer of single-side coated copper plate, be coated with the last layer adhesive; Element heat conduction leg position according on the wiring board is provided with the hollow out mouth, the height insulation that is made with the metal-based layer heat pressure adhesive then, half hollow out type Metal Substrate copper-clad plate of high heat-transfer performance.Half hollow out type of this structure contains the Metal Substrate copper-clad plate of polyimide insulative layer, and insulating barrier can adopt polyimides, therefore makes its class of insulation high; It is high that proof voltage punctures grade; And after postorder was made into circuit board, the heat conduction leg of components and parts can pass the hollow out mouth and be welded direct on the metal-based layer, thereby did not have the thermal impedance of insulating barrier; Directly heat is passed on the metal-based layer through scolding tin by the heat conduction leg; The heat of generation can be conducted and distribute as early as possible, improved thermal conduction rate, thereby improved simultaneously the reliability and the life-span of end product.And the manufacture method of Metal Substrate copper-clad plate that this half hollow out type contains polyimide insulative layer is simple, and operation is few, and is economical and practical.
According to an embodiment of the utility model, the hollow out mouth is the hollow out mouth of random geometry.
According to an embodiment of the utility model, the hollow out mouth is to be provided with according to the element heat conduction leg position on the postorder wiring board.
According to an embodiment of the utility model, the thickness of polyimides is decided according to the voltage withstand class needs of product.
In following description, with the details of the one or more embodiment that set forth the utility model to accompanying drawing and embodiment.From these descriptions, accompanying drawing and claim, can know the other features, objects and advantages of the utility model.
Description of drawings
Through combining following this specification of advantages, it is more obvious that the characteristic of the utility model, purpose and advantage will become, following to brief description of drawings.
Fig. 1 is the structural representation (wherein 1 is the circuit Copper Foil, and 2 is polyimide insulative layer) of the single-side coated copper plate of one embodiment of the invention.
Fig. 2 is the structural representation of single-side coated copper plate coated with adhesive 3 on polyimide insulative layer face 2 of one embodiment of the invention.
Fig. 3 is the glue-coated single-side coated copper plate of one embodiment of the invention, utilizes mould to punch out the structural representation of hollow out mouth 5.
Fig. 4 is one embodiment of the invention; The no glue single-side coated copper plate of forming by circuit Copper Foil 1, polyimides 2; On polyimide insulative layer, coat adhesive layer 3, hollow out mouth 5 is set, the structural representation of the metal base circuit panel material of the half hollow out type of processing with metal-based layer 4 heat pressure adhesives.
Fig. 5 is another exemplary of the utility model; By what circuit Copper Foil 1, adhesive layer 3, polyimides 2 were formed the glue single-side coated copper plate arranged; Coat adhesive layer 3 at the another side of polyimide insulative layer; Hollow out mouth 5 is set, the structural representation of the metal base circuit panel material of the half hollow out type of processing with metal-based layer 4 heat pressure adhesives.
Fig. 6 is made into circuit board for postorder with the Metal Substrate copper-clad plate that half hollow out type contains polyimide insulative layer, then the cross-sectional structure sketch map behind the SMT welding assembly components and parts.
Embodiment
The specific embodiment that will combine a kind of half hollow out type to contain the Metal Substrate copper-clad plate of polyimide insulative layer below comes the utility model is described in more detail.
But, it will be appreciated by those skilled in the art that these execution modes have only enumerated the embodiment of some the utility model, the utility model and protection range thereof there are not any restriction.
In the utility model, " wiring board " and " circuit board " can use with exchanging.
Embodiment one is following.
Gluing
Adopt as shown in Figure 1ly, utilize full-automatic glue production line, coated with adhesive 3 (as shown in Figure 2) on polyimide insulative layer face 2 by 1, the 2 no glue single-side coated copper plates (wherein 1 is the circuit Copper Foil, and 2 is polyimide insulative layer) formed.
The hollow out mouth is set
With glue-coated no glue single-side coated copper plate, the heat conduction leg position according to postorder will be made the components and parts on the wiring board gets out or utilizes mould to punch out hollow out mouth (5) (as shown in Figure 3) with the FPC rig.
Mount pressing
Single spreading copper-clad plate that processes hollow out mouth 5 and metal-based layer 4 contrapositions are fit together, with 150 ℃ to 180 ℃, 100 in the permanent PCB pressing machine that reaches to 150kg/cm
2Parameter under hot pressing 30 to 120 minutes, realize that the curing of single-side coated copper plate 1,2, adhesive layer 3 and metal-based layer 4 is bonding, form a kind of half final hollow out type Metal Substrate copper-clad plate (as shown in Figure 4) according to the utility model.
Embodiment two is following.
Another exemplary according to the utility model; Employing by 1,3 ', 2 form glue single-side coated copper plate (wherein 1 for the circuit Copper Foil, and 3 ' is adhesive layer, and 2 is polyimide insulative layer) arranged; Utilize full-automatic glue production line; Coated with adhesive 3 on polyimide insulative layer face 2, according to the element heat conduction leg position that will make on the wiring board, get out or punch out hollow out mouth 5 with mould with the FPC rig; Fit together with metal-based layer 4 contrapositions then, with 150 ℃ to 180 ℃, 100 in the permanent PCB pressing machine that reaches to 150kg/cm
2Parameter under hot pressing 30 to 120 minutes, realize having the curing of glue single-side coated copper plate 1,3 ', 2, adhesive layer 3 and metal-based layer 4 bonding, form another kind half hollow out type Metal Substrate copper-clad plate (as shown in Figure 5) according to the utility model.
Like this, as stated, through the foregoing description just and then accomplish the making of wiring board material of the Metal Substrate copper-clad plate of half hollow out type with high insulation and high heat-transfer performance.
Embodiment three is following.
In order to embody height insulation and the high heat-transfer performance that a kind of half hollow out type contains the Metal Substrate copper-clad plate of polyimide insulative layer more clearly, will make further example description below.
An exemplary according to the utility model; With the Metal Substrate copper-clad plate of the half hollow out type of making, adopt conventional wiring board manufacture method to manufacture into circuit board, then SMT welding assembly components and parts; As shown in Figure 6, each sign is respectively: 1 is the circuit Copper Foil; 2 is polyimide insulative layer; 3 is adhesive layer; 4 is metal-based layer; 5.1 for being used for the scolding tin of welding component heat conduction leg; 6 is the circuit board solder mask; 7 is components and parts; 8 is the scolding tin of welding component conductive weld leg; 9 is the heat conduction leg of components and parts; 10 is the conductive weld leg of components and parts.
This structure as shown in Figure 6; The heat conduction leg 9 of components and parts 7 just utilizes the scolding tin 5.1 that is filled in the hollow out mouth 5 to be welded direct on the metal-based layer 4 through the hollow out mouth 5 of circuit board; Thereby the thermal impedance that has not had insulating barrier 2; Because scolding tin 5.1 has good conduction and the performance of distribute heat with metal-based layer 4, thereby having realized that heat with generation can conduct as early as possible distributes, and has improved the conduction velocity of heat.And insulating barrier adopts polyimides, makes its class of insulation high, and it is high that proof voltage punctures grade, the reliability and the life-span of having improved end product, and the Metal Substrate method for manufacturing cover clad laminate that this half hollow out type contains polyimide insulative layer is simple, economical and practical.
More than combine accompanying drawing the utility model to be carried out detailed description with specific embodiment and manufacture craft thereof that a kind of half hollow out type contains the Metal Substrate copper-clad plate of polyimide insulative layer.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to the scope of the utility model, especially the scope of claim does not have any restriction.
For example, although in the utility model, adopted the preferred material of polyimides as insulating barrier, the insulating material of other type, polymeric material or the like for example also can be used as the insulating layer material of the copper-clad plate of the utility model.
Therefore, the scope of the utility model is only limited accompanying claims.
Claims (10)
1. the Metal Substrate copper-clad plate of one and half hollow out types is characterized in that, said Metal Substrate copper-clad plate comprises:
Single-side coated copper plate;
Be applied to first adhesive layer (3) on the said single-side coated copper plate one side;
Be bonded in the metal-based layer (4) on said first adhesive layer (3) of said single-side coated copper plate; With
Be arranged to run through one or more hollow out mouths (5) of said single-side coated copper plate and said first adhesive layer (3).
2. Metal Substrate copper-clad plate according to claim 1 is characterized in that, said single-side coated copper plate is no glue single-side coated copper plate, comprises the circuit Copper Foil (1) and the polyimide insulative layer (2) that directly are laminated with together.
3. Metal Substrate copper-clad plate according to claim 1; It is characterized in that; Said single-side coated copper plate is that the glue single-side coated copper plate is arranged, comprise circuit Copper Foil (1), polyimide insulative layer (2) and be bonded in said circuit Copper Foil (1) and polyimide insulative layer (2) between second adhesive layer (3 ').
4. Metal Substrate copper-clad plate according to claim 3 is characterized in that, said second adhesive layer (3 ') is the heat curing-type adhesive layer.
5. according to claim 2 or 3 described Metal Substrate copper-clad plates; It is characterized in that; Said first adhesive layer (3) is applied on the said polyimide insulative layer (2) of said single-side coated copper plate, and said thus polyimide insulative layer (2) is passed through said first adhesive layer (3) heat pressure adhesive on said metal-based layer (4).
6. according to each described Metal Substrate copper-clad plate among the claim 1-3; It is characterized in that the constituent material of said metal-based layer (4) is selected from that aluminium, copper, aluminium are zinc-plated, aluminium nickel plating, aluminium alloy, copper are zinc-plated, copper nickel plating, copper alloy, iron, iron are zinc-plated, iron nickel plating or ferroalloy.
7. according to each described Metal Substrate copper-clad plate among the claim 1-3, it is characterized in that said first adhesive layer (3) is the heat curing-type adhesive layer.
8. according to each described Metal Substrate copper-clad plate among the claim 1-3, it is characterized in that said one or more hollow out mouths (5) run through said single-side coated copper plate and said first adhesive layer (3), but do not pass said metal-based layer (4).
9. rigidity wiring board; It is characterized in that; The utilization of said rigidity wiring board is made according to each described Metal Substrate copper-clad plate in the above claim; And said rigidity wiring board also comprises the components and parts (7) that are mounted thereon, and the heat conduction leg (9) of said components and parts (7) is welded on the said metal-based layer (4) via said hollow out mouth (5).
10. rigidity wiring board according to claim 9 is characterized in that, the heat conduction leg (9) of said components and parts (7) is welded on the said metal-based layer (4) through the scolding tin (5.1) that is filled in the said hollow out mouth (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202300159U CN202178913U (en) | 2011-07-01 | 2011-07-01 | Half hollow type metal-base copper coated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202300159U CN202178913U (en) | 2011-07-01 | 2011-07-01 | Half hollow type metal-base copper coated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202178913U true CN202178913U (en) | 2012-03-28 |
Family
ID=45868774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202300159U Expired - Lifetime CN202178913U (en) | 2011-07-01 | 2011-07-01 | Half hollow type metal-base copper coated board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202178913U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793483A (en) * | 2016-12-30 | 2017-05-31 | 广州市铭基电子实业有限公司 | A kind of composite base plate and preparation method thereof |
| CN110300489A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive double-layer circuit board and preparation method thereof |
-
2011
- 2011-07-01 CN CN2011202300159U patent/CN202178913U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793483A (en) * | 2016-12-30 | 2017-05-31 | 广州市铭基电子实业有限公司 | A kind of composite base plate and preparation method thereof |
| CN110300489A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive double-layer circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huizhou State Fair Electronics Co., Ltd. Assignor: Wang Dingfeng Contract record no.: 2013440020007 Denomination of utility model: Half hollow type metal-base copper coated board Granted publication date: 20120328 License type: Exclusive License Record date: 20130114 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120328 |