CN201114989Y

CN201114989Y - No binding agent double-side copper foil base board

Info

Publication number: CN201114989Y
Application number: CNU2007201389281U
Authority: CN
Inventors: 刘明俊; 黄正欣; 王富民; 陈建宏; 李再兴
Original assignee: Taiflex Scientific Co Ltd
Current assignee: Taiflex Scientific Co Ltd
Priority date: 2007-08-20
Filing date: 2007-08-20
Publication date: 2008-09-10
Anticipated expiration: 2017-08-20

Abstract

The utility model relates to a non-adhesive type double-faced copper foil base plate, which consists of a thermoplastic polymide layer (TPI), two thermosetting polymide layers (PI) which are respectively arranged on the upper and lower surface of the thermoplastic polymide layer (TPI), and two copper foil layers (Cu) which are respectively arranged on an external side face of the polymide layers (PI); therefore, the two thermosetting polymide layers (PI) with a moderate coefficient of thermal expansion (CTE) is arranged between the external side of the copper foil layers (Cu) and the thermoplastic polymide layer (TPI), therefore, the difference of the coefficient of thermal expansion (CTE) between the adjacent material layers is reduced; moreover, under the high temperature operation when the electronic module is pasted on the interface, the electronic module is boarded on the thermosetting polymide layers (PI) and the copper foil interface with a higher glass transition temperature (Tg), thus avoiding stratified phenomenon of fusion or plate explosion caused by high temperature if the electronic module is boarded on the copper foil interface and the thermoplastic polymide layer (TPI) with lower Tg.

Description

There is not the then two-sided copper clad laminate of formulation

Technical field

The utility model is about a kind of flexible copper foil substrate (FCCL), refers to that especially a kind of nothing follows the structure design of the two-sided copper clad laminate of formulation.

Background technology

Be applied to the high density structure at present and adorn the structure that required soft nothing is followed the two-sided copper clad laminate of formulation, as shown in Figure 6, it mainly is in a thermosetting polyimide (Polyimide, PI) 40 upper and lower surfaces are respectively established a thermoplasticity polyimide (Thermal plastic Polyimide, TPI) 50, respectively establish a copper foil layer (Cu) 60 in these two thermoplasticity polyimide, 50 lateral surfaces again, provide shaping patterned circuit usefulness respectively with this two copper foil layer 60, and become a soft two-sided copper clad laminate.

Aforementioned two-sided copper clad laminate thereon the copper foil layer of lower surface through after the patterned circuit processing, in case, or when in the reflow stove, heating, the phenomenon of plate bursting layering takes place easily by surface mount technology (SMT) welding electronic building brick.Probe into its because of, it mainly is because in this two-sided copper clad laminate, thermal coefficient of expansion (CTE) value of the thermosetting polyimide (PI) in the middle of being positioned at is about 20～25ppm/ ℃, thermal coefficient of expansion (CTE) value that is positioned at the thermoplasticity polyimide (TPI) of this thermosetting polyimide (PI) upper and lower surface is about 40～50ppm/ ℃, both thermal coefficient of expansions (CTE) differ 15～30ppm/ ℃, thermal coefficient of expansion (CTE) value as for the copper foil layer of this polyimide (PI) outer surface is about 18ppm/ ℃, and the thermal coefficient of expansion (CTE) of the thermoplasticity polyimide (TPI) that is adjacent differs 22～32ppm/ ℃.Big because of having thermal expansion coefficient difference between two adjacent material layers, when this two-sided copper clad laminate welds electronic building brick by surface mount technology (SMT), or in the reflow stove, under high-temperature operation (more than 250 ℃), this substrate is easily excessive because of the thermal expansion proportional difference of each material layer, is easy to the plate bursting phenomenon of generating material split layer.

The utility model content

The purpose of this utility model is to provide a kind of nothing to follow the two-sided copper clad laminate of formulation, and double-sided substrate produces the plate bursting problem of material layer division down in the known technology in high-temperature operation in the hope of overcoming.

For achieving the above object, the nothing that the utility model provides is followed the two-sided copper clad laminate of formulation, it comprises that a thermoplasticity polyimide (TPI), two thermosetting polyimides (PI) are divided into this thermoplasticity polyimide (TPI) upper and lower surface, and two copper foil layers (Cu) are located at this thermosetting polyimide (PI) lateral surface respectively.

Described nothing is followed the two-sided copper clad laminate of formulation, and wherein this thermoplasticity polyimide is by two thermoplasticity polyimides and close and form.

Described nothing is followed the two-sided copper clad laminate of formulation, and wherein the thickness of this thermoplasticity polyimide (TPI) is that the thickness of 2～6 μ m, the inferior amide layer of this dimerization (PI) is 5～22 μ m, and the thickness of this two copper foil layer (Cu) is 9～50 μ m.

The utility model is by the structure design of double-sided substrate, double-sided substrate design compared to known technology, characteristics of the present utility model are: this double-sided substrate mainly is to make the thermoplastic poly imine layer (TPI) of thermal coefficient of expansion (CTE) big (40～50ppm/ ℃) be positioned in the middle of this substrate, the copper foil layer (Cu) of two thermal coefficient of expansions (CTE) less (18ppm/ ℃) is positioned at two sides, and make two thermosetting polyimides (PI) of thermal coefficient of expansion (CTE) (20～25ppm/ ℃) placed in the middle be divided between copper foil layer (Cu) and this thermoplastic poly imine layer (TPI), with this, make between two adjacent material layers (between thermoplastic poly imine layer (TPI) and the thermosetting polyimide (PI), and between the poly-imine layer (PI) of thermosetting and the copper foil layer (Cu)) thermal coefficient of expansion (CTE) differ from and be respectively 2～7ppm/ ℃ and 15～30ppm/ ℃, compare the double-sided substrate design of known technology, the utility model can reduce the difference of thermal coefficient of expansion between material layer (CTE), and then when overcoming this substrate material layer be easily because of high temperature SMT under high-temperature operation, the different mistake of CTE value difference takes place the plate bursting problem takes place very much in Copper Foil and thermoplasticity pi (TPI), or thermoplasticity pi (TPI) takes place when the crimping of Hot-bar high temperature be stained with the bad phenomenon that sticks in thermal head (temperature of thermal head＞300 ℃) because of the elevated temperature heat fusion, make the product operation that the utlity model has good reliability and excellence.

Description of drawings

Fig. 1 is the floor map of a preferred embodiment of the two-sided copper clad laminate of the utility model.

Fig. 2 is that the poly-imine layer in the two-sided copper clad laminate of the utility model is the floor map of affixed another preferred embodiment that forms of two strata imine layers.

Fig. 3～Fig. 5 is a preferable manufacturing process schematic diagram of the two-sided copper clad laminate of the utility model.

Fig. 6 is the floor map of the two-sided copper clad laminate structure of known technology.

Primary clustering symbol description among the figure:

(1) base material

(2) Copper Foil

(3) shower nozzle

(4) air irradiation modules

(5) shower nozzle

(6) air irradiation modules

(7) air treatment module

(8) nitrogen treatment module

(9) high temperature press fit device

(10) thermoplasticity polyimide (TPI)

(11) thermoplasticity polyimide (TPI)

(12) thermoplasticity polyimide (TPI)

(20) thermosetting polyimide (PI)

(30) copper foil layer

(40) thermosetting polyimide (PI)

(50) thermoplasticity polyimide (TPI)

(60) copper foil layer

Embodiment

As shown in Figure 1, disclose the utility model and do not have a preferred embodiment that connects the agent double-sided substrate, by can see among the figure and, this nothing meets agent double-sided substrate system and comprises a thermoplasticity polyimide (TPI) 10, two thermosetting polyimides (PI) 20 and two copper foil layers (Cu) 30, wherein, this two thermosetting polyimide (PI) the 20th is divided into this thermoplasticity polyimide (TPI) 10 upper and lower surfaces, and this 30 of two copper foil layer (Cu) is located at this thermosetting polyimide (PI) 20 lateral surfaces respectively.

In this preferred embodiment, still can further make the thickness of the thickness of this thermoplasticity polyimide (TPI) 10 less than this two thermosetting polyimide (PI) 20 and this two copper foil layer (Cu) 30, wherein the thickness of this thermoplasticity polyimide (TPI) 10 is 2～6 μ m, the thickness of the inferior amide layer of this dimerization (PI) 20 is 5～22 μ m, the thickness of this two copper foil layer (Cu) 3 is 9～50 μ m, with this, thermal coefficient of expansion (CTE) size according to each material layer, change its thickness, and then the ratio of mediation adjacent materials interlayer thermal expansion change in size amount, in this preferred embodiment, be to make this have the reduced down in thickness of the thermoplasticity polyimide (TPI) (1) of big thermal coefficient of expansion (CTE).

As shown in Figure 2, the aforementioned thermoplasticity polyimide (TPI) 10 that is positioned at this two-sided copper clad laminate centre can be two layers of identical thermoplasticity polyimide (TPI) 11,12 and unifies body and constitutes.

The utility model was taken off the double-sided substrate structure design of no solid in the past, when making, can utilize following fabrication steps to finish fast, and was extremely shown in Figure 5 as Fig. 3:

One Copper Foil (Cu) 2 is provided;

In a shaping surface one thermosetting polyimide (PI) of this Copper Foil (Cu), in this preferred embodiment, be to utilize shower nozzle 3 to spray the surface-coated thermosetting polyimide (PI) of attached means in this Copper Foil (Cu) with machinery;

With dry means this thermosetting polyimide (PI) being solidified is attached to this Copper Foil (Cu) surface, is with this thermosetting polyimide (PI) of air-dry means rapid draing in this preferred embodiment with air irradiation modules 4;

In this thermosetting polyimide (PI) shaping surface one thermoplasticity polyimide (TPI), in this preferred embodiment, be to utilize shower nozzle 5 to spray attached means in the surface-coated thermoplasticity polyimide (TPI) of this thermosetting polyimide (PI) with machinery;

With dry means this thermoplasticity polyimide (TPI) being solidified is attached to this thermosetting polyimide (PI) surface, is with this thermoplasticity polyimide (TPI) of air-dry means rapid draing in this preferred embodiment with air irradiation modules 6;

Make this base material 1 that is combined with copper foil layer (Cu), thermosetting polyimide (PI) and thermoplasticity polyimide (TPI) pass through gas treatment equipment, described gas treatment equipment comprises an air (Air) processing module 7 and nitrogen (N2) processing module 8, wherein be to utilize air treatment module 7 to make dried, utilize nitrogen (N2) processing module 8 to make this thermosetting polyimide (PI) and the further dry cyclisation of thermoplastic poly imine layer (TPI) again; And

Make two groups of base materials 1 that respectively include copper foil layer (Cu), thermosetting polyimide (PI) and thermoplasticity polyimide (TPI) with the relative laminating type of thermoplasticity polyimide (TPI), and to make the two fixed by continuous high temperature press fit device 9 with the pressing means be one, when hot pressing, can under nitrogen (N2) environment, carry out, make this two base material 2 bind fixed one, and make the two-sided copper clad laminate of soft no solid of the present utility model because of its thermoplasticity polyimide (TPI).

Claims

1. one kind is not had the then two-sided copper clad laminate of formulation, it is characterized in that, comprise that a thermoplasticity polyimide, two thermosetting polyimides are divided into this thermoplasticity polyimide upper and lower surface, and two copper foil layers are located at this thermosetting polyimide lateral surface respectively.

2. nothing as claimed in claim 1 is followed the two-sided copper clad laminate of formulation, it is characterized in that, wherein this thermoplasticity polyimide is by two thermoplasticity polyimides and close and form.

3. nothing as claimed in claim 1 or 2 is followed the two-sided copper clad laminate of formulation, it is characterized in that, wherein the thickness of this thermoplasticity polyimide is that the thickness of 2～6 μ m, this two thermosetting polyimide is 5～22 μ m, and the thickness of this two copper foil layer is 9～50 μ m.