KR20100068593A

KR20100068593A - Method for laminating copper layer on seramic board

Info

Publication number: KR20100068593A
Application number: KR1020080126998A
Authority: KR
Inventors: 이상원; 장광태
Original assignee: (주)상아프론테크
Priority date: 2008-12-15
Filing date: 2008-12-15
Publication date: 2010-06-24

Abstract

The present invention provides a method of manufacturing a disc of a circuit board, comprising: preparing a ceramic plate made by injection molding by mixing PPS (Polyphenylsulfide), which is one of ceramics and engineering plastics, and PE for providing lubricity; Preparing copper foil; Applying an adhesive, which is a polyester-based heat pressure-curable adhesive, on the copper foil to a thickness of 1 to 10 μm; Firstly drying the copper foil coated with the adhesive at 60 ° C. for 10 minutes using an air circulating heating oven, and then performing second drying at 130 ° C. for 10 minutes to obtain a flatness of the adhesive surface upon solvent volatilization; And placing the ceramic plate between the two copper foils applied to the adhesive, between the rollers, performing instant adhesion, and then heating and pressing using a hot press in a nitrogen atmosphere. It is supposed to be.

Description

Method for laminating copper foil on a ceramic substrate {method for laminating copper layer on seramic board}

The present invention relates to a method of laminating a copper foil on a ceramic material substrate.

In recent years, electronic devices are becoming more and more efficient due to the light and small size of electronic component devices. As a result, many existing electronic component materials have been filmed, and in order to solve the thermal problem caused by miniaturization, high integration, and high performance, the demand for heat-resistant heat-resistant PCB products has recently increased due to the characteristics of PCBs. The demand for specialized PCBs (ceramic PCBs and metal PCBs) is increasing. As a method for realizing this, metallization technology of metal materials having high thermal diffusivity such as aluminum and copper is being developed. Metallizing methods include electroplating, laminating, and vacuum deposition.

Surface treatment technology including metallizing technology increases the added value of the final product by giving functions such as corrosion resistance, durability, conductivity, etc. by physical treatment, chemical treatment, and electrochemical treatment of materials and parts, It is the core technology of the material and parts industry.

The conventional plating method is mainly composed of a wet plating method in an aqueous solution and a lamination method in which an adhesive layer is inserted between the substrate and the copper foil and then the copper foil is laminated.

The wet plating structure includes a substrate which is a dielectric layer to be plated, an adhesive layer interposed between the substrate and the plating to form a uniform film, and a continuous interface, and a surface treatment on the upper side of the adhesive layer. It is comprised including the copper foil which becomes.

However, the wet plating is difficult to control the residual stress of the film formed during the plating process, which limits the plating thickness of the synthesized film. In the manufacture of a thick film of several hundred micrometers, high adhesion due to the residual stress cannot be expected. The thick film has a low density, and may cause a long time due to low plating rate, a complicated process, and environmental pollution due to the use of a toxic electrolyte. In addition, there is a problem that the material forming the thick film is limited.

On the other hand, in the conventional laminated structure of a printed circuit board, the disc structure is formed by applying a bonding layer between the substrate, which is a dielectric layer to form a thick film, and then bonding the copper foil to the thick film. There is a problem that can not be easily adhered to peel easily.

In the present invention, by directly heating and pressing the copper foil and the ceramic substrate without an adhesive, a method of manufacturing a disk of a printed circuit board and a circuit board of which the adhesive strength is improved by interposing a polyester adhesive of a thermosetting material between the copper foil and the ceramic substrate. It is about a method.

The present invention provides a ceramic plate made by injection molding by mixing a polyphenylsulfide (PPS), which is one of ceramics and engineering plastics, and PE for providing lubricity, as a first embodiment; Preparing copper foil; Applying an adhesive, which is a polyester-based heat pressure-curable adhesive, on the copper foil to a thickness of 1 to 10 μm; Firstly drying the copper foil coated with the adhesive at 60 ° C. for 10 minutes using an air circulating heating oven, and then performing second drying at 130 ° C. for 10 minutes to obtain a flatness of the adhesive surface upon solvent volatilization; And placing the ceramic plate between the two copper foils applied to the adhesive, between the rollers, performing instant adhesion, and then heating and pressing using a hot press in a nitrogen atmosphere. It is supposed to be.

The present invention provides a ceramic plate made by injection molding by mixing a polyphenylsulfide (PPS), which is one of ceramics and engineering plastics, and PE for providing lubricity, as a second embodiment; Preparing copper foil; And placing the copper foil on the top and bottom surfaces of the ceramic plate in a hot press, and performing heat treatment at a temperature of 280 to 310 ° C. at a pressure of 2 to 10 Kgf / cm 2 and for 10 to 180 minutes. Here, the ceramic plate is subjected to surface treatment by plasma and etching.

The present invention made it possible to manufacture a disc of a circuit board having strong adhesive strength at low cost by means of solving the above problems.

Hereinafter, a method of manufacturing the original plate of the circuit board according to the present invention will be described.

1. First Embodiment (Method of Manufacturing Disc of Circuit Board Using Adhesive)

First, a ceramic plate made by injection molding is prepared by mixing PPS (Polyphenylsulfide), which is one of ceramics and engineering plastics, and PE to provide lubricity.

In addition, prepare copper foil.

1oz, 1 / 2oz, 1 / 3oz are used as the copper foil, and it is preferable to use 1 / 3oz copper foil in that a fine pattern can be formed.

Then, the adhesive is applied on the 1 / 3oz copper foil by using an applicator, and the coating thickness thereof is about 1 to 10 μm, particularly preferably about 1 to 2 μm.

The adhesive used herein is a polyester-based hot press-curable adhesive that uses a product of Bulim Chemical (Hardening Agent: GR-HK 4706 Hardening Agent, Topic: GF-HK4706).

The copper foil coated with the adhesive was first dried at 60 ° C. for 10 minutes using an air circulation heating oven, and then secondly dried at 130 ° C. for 10 minutes.

The reason why the drying is carried out twice is to obtain the flatness of the adhesive surface upon solvent volatilization.

The ceramic plate is interposed between the two copper foils applied to the adhesive, and is interposed between the rollers to perform instantaneous adhesion, followed by heating and pressing using a hot press in a nitrogen atmosphere.

The heating pressurization is carried out at a temperature of 90 ~ 200 ℃, preferably at a temperature of 120 ~ 150 ℃, the holding time is about 30 ~ 180 minutes, preferably 60 ~ 120 minutes.

2. Second embodiment (method of manufacturing original plate of circuit board by direct pressure heating without adhesive)

First, the same copper foil and ceramic plate as in the first embodiment are prepared.

The copper foil is laminated on the top and bottom surfaces of the ceramic plate.

The laminate is put into a hot press and heat treated at a temperature of 280 to 310 ° C. Preferably it is carried out at a temperature of 295 ~ 300 ℃.

The pressure at this time is maintained at 2 ~ 10Kgf / cm2, preferably carried out at a pressure of 2 ~ 5Kgf / cm2.

The holding time applied at this time is also about 10 to 180 minutes, preferably 30 to 60 minutes.

PPS, one of the engineering plastics, is poor in adhesion and easy to injection molding.

Therefore, in the second embodiment, since the adhesive property of the ceramic plate made of the PPS material is poor, in order to improve this, surface treatment, that is, uneven treatment by plasma treatment and etching was performed.

Claims

Preparing a ceramic plate made by injection molding by mixing PPS (Polyphenylsulfide), which is one of ceramic and engineering plastic, and PE to provide lubricity;

Preparing copper foil;

Applying an adhesive, which is a polyester-based heat pressure-curable adhesive, on the copper foil to a thickness of 1 to 10 μm;

Firstly drying the copper foil coated with the adhesive at 60 ° C. for 10 minutes using an air circulating heating oven, and then performing second drying at 130 ° C. for 10 minutes to obtain a flatness of the adhesive surface upon solvent volatilization; And

And placing the ceramic plate between the two copper foils applied to the adhesive, between the rollers, performing instant bonding, and then heating and pressing using a hot press in a nitrogen atmosphere. A method of laminating copper foil on a ceramic material substrate.

Preparing copper foil; And

Putting the copper foil on the top and bottom surfaces of the ceramic plate in a laminated state, and performing heat treatment at a temperature of 280-310 ° C. at a pressure of 2-10 Kgf / cm 2 and for 10-180 minutes.

Here, the said ceramic plate is surface-treated by plasma and etching, The method of laminating | stacking copper foil on the ceramic material substrate characterized by the above-mentioned.