CN106793483A - A kind of composite base plate and preparation method thereof - Google Patents
A kind of composite base plate and preparation method thereof Download PDFInfo
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- CN106793483A CN106793483A CN201611264564.1A CN201611264564A CN106793483A CN 106793483 A CN106793483 A CN 106793483A CN 201611264564 A CN201611264564 A CN 201611264564A CN 106793483 A CN106793483 A CN 106793483A
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- 239000002131 composite material Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 113
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 113
- 239000004411 aluminium Substances 0.000 claims abstract description 94
- 238000004080 punching Methods 0.000 claims abstract description 33
- WBLJAACUUGHPMU-UHFFFAOYSA-N copper platinum Chemical compound [Cu].[Pt] WBLJAACUUGHPMU-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000011190 CEM-3 Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 13
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000005491 wire drawing Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 101100257134 Caenorhabditis elegans sma-4 gene Proteins 0.000 abstract description 40
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000005187 foaming Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
Abstract
The present invention relates to a kind of composite base plate, including plate body, it is characterised in that：Described plate body includes the first aluminium base flaggy, the flaggies of CEM 3, second aluminium base flaggy, copper platinum layer is constituted, first aluminium base flaggy is provided with punching, the described flaggies of CEM 3 are filled out and are located in substrate layer punching, copper platinum layer is attached to the second aluminium base flaggy one side, the another side of the second aluminium base flaggy respectively with the first aluminium base flaggy, the flaggies of CEM 3 are bonded, size of the described flaggies of CEM 3 less than or equal to punching, inventive structure is simple, low cost, at a temperature of heat resistance reaches 288 DEG C 30 seconds it is not stratified, it is non-foaming, the substrate is effectively used in LED, realize wear-resisting, high temperature resistant, high efficiency and heat radiation, improve product service life.
Description
Technical field
The present invention relates to a kind of substrate sheet material, and in particular to a kind of composite base plate of use electronic circuit board and its preparation side
Method.
Background technology
In life, the aluminium base that electrical equipment is used is very universal, and aluminium base is a kind of Metal Substrate with good heat radiating function
Copper-clad plate, general single sided board is made up of three-decker, is respectively circuit layer (Copper Foil), insulating barrier and metal-based layer.For height
What end used is also designed as dual platen, and structure is circuit layer, insulating barrier, aluminium base, insulating barrier, circuit layer.Only a few application is
Multi-layer sheet, can be fitted with insulating barrier, aluminium base by common multi-layer sheet and formed.
Particularly LED aluminum base plate, can because LED larger, the wiring board usually aluminium bases of LED lamp of heating
Realize that heat conduction is fast, aluminium base board quality directly affects the quality of final products, and the aluminium base timber-used for currently using is when product
Life-span is not long, non-refractory, and when product line is processed, scrappage is also high, meanwhile, realize reducing product cost, improve and produce
Quality, it is the demand for development that product is used efficiently to improve radiating.
The content of the invention
It is an object of the invention to provide a kind of composite base plate, the substrate is effectively used in LED, realize wear-resisting, high temperature resistant,
High efficiency and heat radiation, improves product service life.
To realize the purpose of foregoing invention, the technical scheme that the present invention takes is as follows：
A kind of composite base plate, including plate body, it is characterised in that：Described plate body includes the first aluminium base flaggy, CEM-3 plates
Layer, the second aluminium base flaggy, copper platinum layer composition, the first aluminium base flaggy are provided with punching, and described CEM-3 flaggies are filled out and are located at substrate layer punching
In hole, copper platinum layer is attached to the second aluminium base flaggy one side, the another side of the second aluminium base flaggy respectively with the first aluminium base flaggy, CEM-
3 flaggies are bonded, described size of the CEM-3 flaggies less than or equal to punching.
Described CEM-3 flaggies are consistent with punching shape, and the minimum number of the punching of the first aluminium base flaggy is 1.
Described CEM-3 flaggies surface is provided with a rough layer.
The rough layer of described CEM-3 flaggies is provided with line map, and copper platinum layer correspondence CEM-3 flaggies position sets symmetrical line
Lu Tu.
The shape of described punching can be with circle, quadrangle, arc or star.
The roughness of described rough layer is at least 5 shore.
Location hole, installing port are additionally provided with described plate body.
Frangible lines are additionally provided with described plate body.
A kind of preparation method of composite base plate, it is characterised in that：Comprise the following steps：1) two blocks of aluminium of a size are first selected
Plate, thickness is 0.85mm~0.75mm, and one of aluminium sheet is processed by the following method to get ready to form the first aluminum layer：With
Punch press machine onboard goes out the punching of shape needed for minimum of one, and then the aluminium sheet to hole punch is aoxidized with silicon Anhui coupling agent
Surface treatment, then an attached tunic on the surface of aluminium sheet one, the shore of film hardness 5, film thickness is 2.5um, then on another side surface
On paste one layer of high temperature membrane again, 0.1~0.2mm of thickness, heatproof requirement in 60 minutes at a temperature of 260 degree not fall glue；
Attached copper platinum is carried out to another piece of aluminium sheet one side to get ready, form the second aluminum layer and copper platinum layer；
2) one piece of thickness is chosen for 0.85mm~0.75mmCEM-3 plates, and treatment by the following method is got ready：Drawn with wire drawing machine
Stretch, its surface is formed rough layer, surface reaches more than roughness 5um, to improve bonding force, then to coarse treated CEM-
3 plate punch press machines be washed into above-mentioned first aluminum layer punching shape of the same size, punch shaping after clean with acetone, clean 2
Secondary, one time 10 minutes, then airing carried out 150 DEG C and dries, roasting to form CEM-3 layers within 20 minutes；
3) the second aluminium sheet treated CEM-3 plates, the first aluminium sheet and with copper platinum layer, is aligned using filling perforation machine, is adopted
The one side that CEM-3 plates, the first aluminium sheet post high temperature membrane is bonded on the second aluminium sheet aluminium sheet on one side with epoxy resin, is formed
Substrate sheet material；
4) the substrate sheet material for having bonded is carried out pressing and fixiform with molding press.
Described substrate sheet material sets location hole, cuts out peace with cutting machine according to setting requirements puncher needed for product
Mouth is filled, frangible lines position is set with cutting auxiliary machinery, press printing line map is used.
The beneficial effects of the invention are as follows：Simple structure of the present invention, low cost, heat resistance reach 288 DEG C at a temperature of 30 seconds
Not stratified, non-foaming, the substrate is effectively used in LED, realizes wear-resisting, high temperature resistant, high efficiency and heat radiation, improves product and uses the longevity
Life.
Brief description of the drawings
Fig. 1 side structure schematic diagrams of the invention；
Fig. 2 is a planar structure schematic diagram of the invention.
Specific embodiment
The present invention is described in further details below by example, these examples are only used for illustrating the present invention, do not limit
The scope of the present invention processed；
A kind of composite base plate, including plate body, described plate body include the first aluminium base flaggy 1, CEM-3 flaggies 2, the second aluminium base
Flaggy 3, copper platinum layer 4 are constituted, and the first aluminium base flaggy 1 is provided with punching 11, and described CEM-3 flaggies 2 are filled out and are located at the punching 11 of substrate layer 1
Interior, copper platinum layer 4 is attached to the one side of the second aluminium base flaggy 3, the another side of the second aluminium base flaggy 3 respectively with the first aluminium base flaggy 1,
CEM-3 flaggies 3 are bonded, described size of the CEM-3 flaggies 2 less than or equal to punching 11.
Used as the further improvement of technology, described CEM-3 flaggies 2 are consistent with the shape of punching 11, first aluminium base
The minimum number of the punching of layer 1 is 1.
Used as the further improvement of technology, the described surface of CEM-3 flaggies 2 is provided with a rough layer 21.
Used as the further improvement of technology, the rough layer 21 of described CEM-3 flaggies 3 is provided with line map, the correspondence of copper platinum layer 4
CEM-3 flaggies (3) position sets symmetrical line map.
Used as the further improvement of technology, the shape of described punching 11 can be with circle, quadrangle, arc or star.
Used as the further improvement of technology, the roughness of described rough layer 21 is at least 5 shore.
As the further improvement of technology, location hole 5, installing port 7 are additionally provided with described plate body.
As the further improvement of technology, frangible lines 6 are additionally provided with described plate body.
Simple structure of the present invention, low cost, 30 seconds not stratified, non-foaming, substrates at a temperature of heat resistance reaches 288 DEG C
LED is effectively used in, wear-resisting, high temperature resistant, high efficiency and heat radiation is realized, product service life is improved.
A kind of preparation method of composite base plate, comprises the following steps：
1) two blocks of aluminium sheets of a size are first selected, thickness is 0.85mm~0.75mm, one of aluminium sheet is carried out by with
Lower method treatment is got ready to form the first aluminum layer：The punching of shape needed for minimum of one is onboard gone out with punch press machine, it is then right
The aluminium sheet of hole punch carries out oxidized surface treatment, then an attached tunic on the surface of aluminium sheet one, Shao of film hardness 5 with silicon Anhui coupling agent
Family name, film thickness is 2.5um, then pastes one layer of high temperature membrane, 0.1~0.2mm of thickness again on another side surface, and heatproof requirement is
Do not fall glue in 60 minutes at a temperature of 260 degree；
Attached copper platinum is carried out to another piece of aluminium sheet one side to get ready, form the second aluminum layer and copper platinum layer；
2) one piece of thickness is chosen for 0.85mm~0.75mmCEM-3 plates, and treatment by the following method is got ready：Drawn with wire drawing machine
Stretch, its surface is formed rough layer, surface reaches more than roughness 5um, to improve bonding force, then to coarse treated CEM-
3 plate punch press machines be washed into above-mentioned first aluminum layer punching shape of the same size, punch shaping after clean with acetone, clean 2
Secondary, one time 10 minutes, then airing carried out 150 DEG C and dries, roasting to form CEM-3 layers within 20 minutes；
3) the second aluminium sheet treated CEM-3 plates, the first aluminium sheet and with copper platinum layer, is aligned using filling perforation machine, is adopted
The one side that CEM-3 plates, the first aluminium sheet post high temperature membrane is bonded on the second aluminium sheet aluminium sheet on one side with epoxy resin, is formed
Substrate sheet material；
4) the substrate sheet material for having bonded is carried out pressing and fixiform with molding press.
Described substrate sheet material sets location hole, cuts out peace with cutting machine according to setting requirements puncher needed for product
Mouth is filled, frangible lines position is set with cutting auxiliary machinery, press printing line map is used.
Embodiment 1
A kind of preparation method of composite base plate, comprises the following steps：
1) two blocks of aluminium sheets of a size are first selected, thickness is 0.8mm, and one of aluminium sheet is processed by the following method
Get ready to form the first aluminum layer：The punching of shape needed for minimum of one is onboard gone out with punch press machine, then to the aluminium of hole punch
Plate carries out oxidized surface treatment, then an attached tunic on the surface of aluminium sheet one, the shore of film hardness 5 with silicon Anhui coupling agent, and film thickness is
2.5um, then pastes one layer of high temperature membrane again on another side surface, and thickness 0.15mm, heatproof requirement is 60 minutes at a temperature of 260 degree
Do not fall glue inside；
Attached copper platinum is carried out to another piece of aluminium sheet one side to get ready, form the second aluminum layer and copper platinum layer；
2) one piece of thickness is chosen for 0.8mmCEM-3 plates, and treatment by the following method is got ready：Stretched with wire drawing machine, make its surface
Rough layer is formed, surface reaches more than roughness 5um, to improve bonding force, then to coarse treated CEM-3 plates punch press machine
Be washed into above-mentioned first aluminum layer punching shape of the same size, punch shaping after clean with acetone, cleaning 2 times, one time 10 points
Then clock, airing carries out 150 DEG C and dries, roasting to form CEM-3 layers within 20 minutes；
3) the second aluminium sheet treated CEM-3 plates, the first aluminium sheet and with copper platinum layer, is aligned using filling perforation machine, is adopted
The one side that CEM-3 plates, the first aluminium sheet post high temperature membrane is bonded on the second aluminium sheet aluminium sheet on one side with epoxy resin, is formed
Substrate sheet material；
4) the substrate sheet material for having bonded is carried out pressing and fixiform with molding press.
Substrate sheet material according to setting requirements puncher needed for product set location hole, cut out with cutting machine installing port,
Frangible lines position is set with cutting auxiliary machinery, press printing line map is used.
Embodiment 2
A kind of preparation method of composite base plate, comprises the following steps：
1) two blocks of aluminium sheets of a size are first selected, thickness is 0.75mm, and one of aluminium sheet is located by the following method
Reason is got ready to form the first aluminum layer：The punching of shape needed for minimum of one is onboard gone out with punch press machine, then to hole punch
Aluminium sheet carries out oxidized surface treatment, then an attached tunic on the surface of aluminium sheet one, the shore of film hardness 5, film thickness with silicon Anhui coupling agent
It is 2.5um, then pastes one layer of high temperature membrane again on another side surface, thickness 0.2mm, heatproof requirement is 60 points at a temperature of 260 degree
Do not fall glue in clock；
Attached copper platinum is carried out to another piece of aluminium sheet one side to get ready, form the second aluminum layer and copper platinum layer；
2) one piece of thickness is chosen for 0.75mmCEM-3 plates, and treatment by the following method is got ready：Stretched with wire drawing machine, make its table
Face forms rough layer, and surface reaches more than roughness 5um, to improve bonding force, then to coarse treated CEM-3 plate punch presses
Machine be washed into above-mentioned first aluminum layer punching shape of the same size, punch shaping after clean with acetone, cleaning 2 times, one time 10
Minute, then airing carries out 150 DEG C and dries, roasting to form CEM-3 layers within 20 minutes；
3) the second aluminium sheet treated CEM-3 plates, the first aluminium sheet and with copper platinum layer, is aligned using filling perforation machine, is adopted
The one side that CEM-3 plates, the first aluminium sheet post high temperature membrane is bonded on the second aluminium sheet aluminium sheet on one side with epoxy resin, is formed
Substrate sheet material；
4) the substrate sheet material for having bonded is carried out pressing and fixiform with molding press.
Described substrate sheet material sets location hole, cuts out peace with cutting machine according to setting requirements puncher needed for product
Mouth is filled, frangible lines position is set with cutting auxiliary machinery, press printing line map is used.
Implement 3
A kind of preparation method of composite base plate, comprises the following steps：
1) two blocks of aluminium sheets of a size are first selected, thickness is 0.85mm, and one of aluminium sheet is located by the following method
Reason is got ready to form the first aluminum layer：The punching of shape needed for minimum of one is onboard gone out with punch press machine, then to hole punch
Aluminium sheet carries out oxidized surface treatment, then an attached tunic on the surface of aluminium sheet one, the shore of film hardness 5, film thickness with silicon Anhui coupling agent
It is 2.5um, then pastes one layer of high temperature membrane again on another side surface, thickness 0.1mm, heatproof requirement is 60 points at a temperature of 260 degree
Do not fall glue in clock；
Attached copper platinum is carried out to another piece of aluminium sheet one side to get ready, form the second aluminum layer and copper platinum layer；
2) one piece of thickness is chosen for 0.85mmCEM-3 plates, and treatment by the following method is got ready：Stretched with wire drawing machine, make its table
Face forms rough layer, and surface reaches more than roughness 5um, to improve bonding force, then to coarse treated CEM-3 plate punch presses
Machine be washed into above-mentioned first aluminum layer punching shape of the same size, punch shaping after clean with acetone, cleaning 2 times, one time 10
Minute, then airing carries out 150 DEG C and dries, roasting to form CEM-3 layers within 20 minutes；
3) the second aluminium sheet treated CEM-3 plates, the first aluminium sheet and with copper platinum layer, is aligned using filling perforation machine, is adopted
The one side that CEM-3 plates, the first aluminium sheet post high temperature membrane is bonded on the second aluminium sheet aluminium sheet on one side with epoxy resin, is formed
Substrate sheet material；
4) the substrate sheet material for having bonded is carried out pressing and fixiform with molding press.
Described substrate sheet material sets location hole, cuts out peace with cutting machine according to setting requirements puncher needed for product
Mouth is filled, frangible lines position is set with cutting auxiliary machinery, press printing line map is used.
Claims (10)
1. a kind of composite base plate, including plate body, it is characterised in that：Described plate body includes the first aluminium base flaggy (1), CEM-3 plates
Layer (2), the second aluminium base flaggy (3), copper platinum layer (4) composition, the first aluminium base flaggy (1) are provided with punching (11), described CEM-3 plates
Layer (2) is filled out and is located in substrate layer (1) punching (11), and copper platinum layer (4) is attached to second aluminium base flaggy (3) one side, the second aluminium base
The another side of layer (3) is bonded with the first aluminium base flaggy (1), CEM-3 flaggies (3) respectively, described CEM-3 flaggies (2) less than or
Equal to the size of punching (11).
2. composite base plate according to claim 1, it is characterised in that：Described CEM-3 flaggies (2) and punching (11) shape
Unanimously, the minimum number of the punching of the first aluminium base flaggy (1) is 1.
3. composite base plate according to claim 1, it is characterised in that：It is coarse that described CEM-3 flaggies (2) surface is provided with one
Layer (21).
4. composite base plate according to claim 1, it is characterised in that：The rough layer (21) of described CEM-3 flaggies (3) sets
There is line map, copper platinum layer (4) correspondence CEM-3 flaggy (3) position sets symmetrical line map.
5. composite base plate according to claim 1, it is characterised in that：The shape of described punching (11) can with circle, four
Side shape, arc or star.
6. composite base plate according to claim 3, it is characterised in that：The roughness of described rough layer (21) is at least 5
Shore.
7. composite base plate according to claim 1, it is characterised in that：Location hole (5) is additionally provided with described plate body, is installed
Mouth (7).
8. composite base plate according to claim 1, it is characterised in that：Frangible lines (6) are additionally provided with described plate body.
9. the preparation method of a kind of composite base plate according to any of the above-described claims, it is characterised in that：Including following
Step：1) two blocks of aluminium sheets of a size are first selected, thickness is 0.85mm~0.75mm, and one of aluminium sheet is carried out by with lower section
Method treatment is got ready to form the first aluminum layer：The punching of shape needed for minimum of one is onboard gone out with punch press machine, then to made
The aluminium sheet in hole carries out oxidized surface treatment, then an attached tunic on the surface of aluminium sheet one, the shore of film hardness 5, film with silicon Anhui coupling agent
Thickness is 2.5um, then pastes one layer of high temperature membrane, 0.1~0.2mm of thickness again on another side surface, and heatproof requirement is 260 degree of temperature
Spend in lower 60 minutes and do not fall glue；
Attached copper platinum is carried out to another piece of aluminium sheet one side to get ready, form the second aluminum layer and copper platinum layer；
2) one piece of thickness is chosen for 0.85mm~0.75mmCEM-3 plates, and treatment by the following method is got ready：Stretched with wire drawing machine, made
Its surface forms rough layer, and surface reaches more than roughness 5um, to improve bonding force, then coarse treated CEM-3 plates is used
Punch press machine be washed into above-mentioned first aluminum layer punching shape of the same size, punch shaping after clean with acetone, cleaning 2 times, one
Secondary 10 minutes, then airing carried out 150 DEG C and dries, roasting to form CEM-3 layers within 20 minutes；
3) the second aluminium sheet treated CEM-3 plates, the first aluminium sheet and with copper platinum layer, is aligned, using ring using filling perforation machine
Oxygen tree fat is bonded in the one side that CEM-3 plates, the first aluminium sheet post high temperature membrane on the second aluminium sheet aluminium sheet on one side, forms substrate
Sheet material；
4) the substrate sheet material for having bonded is carried out pressing and fixiform with molding press.
10. composite base plate preparation method according to claim 9, it is characterised in that：Described substrate sheet material is according to product
Required setting requirements puncher sets location hole, installing port is cut out with cutting machine, sets easy with cutting auxiliary machinery
Broken line position, use press printing line map.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611264564.1A CN106793483A (en) | 2016-12-30 | 2016-12-30 | A kind of composite base plate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611264564.1A CN106793483A (en) | 2016-12-30 | 2016-12-30 | A kind of composite base plate and preparation method thereof |
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| CN106793483A true CN106793483A (en) | 2017-05-31 |
Family
ID=58951741
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