CN201550361U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
- Publication number
- CN201550361U CN201550361U CN200920260829XU CN200920260829U CN201550361U CN 201550361 U CN201550361 U CN 201550361U CN 200920260829X U CN200920260829X U CN 200920260829XU CN 200920260829 U CN200920260829 U CN 200920260829U CN 201550361 U CN201550361 U CN 201550361U
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- multilayer printed
- prepreg
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a printed circuit, in particular to a multilayer printed circuit board in a printing circuit. The multilayer printed circuit board comprises an inner layer core plate; prepregs are arranged at the upper part and the lower part of the inner-layer core plate respectively; and the inner-layer core plate is fixedly connected through rivets. For the multilayer printed circuit board, the inner layer core plate is riveted with the prepregs together through rivets and is then pressed in. Therefore, the prepregs cannot slide in the pressing-in process under the action of a dragging knife of the rivets, so that the defects that the prepregs are easy to slide during pressing can be solved.
Description
[technical field]
The utility model relates to a kind of printed circuit, relates in particular to a kind of multilayer printed circuit board in the printed circuit.
[background technology]
Printed substrate (Printde Circuit Board is called for short PCB) is the important electron parts, is the supporter of electronic devices and components, is the supplier that electronic devices and components are electrically connected.Along with developing rapidly of electronics industry, printed substrate is also towards the multiple stratification fast development.
The above product of three ply board promptly is called multi-layer sheet, traditional double sided board is the intensive assembling of mating parts, on limited plate face, can't settle too much spare part with and a large amount of circuits of being derived out, thereby multiple-plate development arranged, add that US Federal Communication Committee (FCC) announced after in October, 1984, the electric equipment products of all listings are if there is the fax of relating to intelligencer, or the network on-line of participation person is arranged, and all must do " ground connection " to eliminate influence of disturbing.But because of plate face area is not enough, printed substrate fabric swatch (pcb lay-out) just will " ground connection " and the big copper face immigration internal layer of " voltage " two functions, caused for four laminate moments rose in a large number, has also extended the requirement of impedance Control.Original four laminates then more upgrades to six laminates, and high-level multi-layer sheet is also increasing because of the high density assembling.And when making multilayer printed circuit board, then need Copper Foil (Copper Foil), core material group after prepreg (Prepreg) and the oxidation processes (Oxidation) is pressed into multilager base plate, its pressing flow process is mainly internal layer oxidation processes, lamination (Lay-up), pressing, reprocessing, and in lamination (Lay-up) process, the contraposition of core material group then is most important.Multilayer printed circuit board is when carrying out multilayer core material group pressing lamination (Lay-up) operation, during existing multilayer printed circuit board pressing is made, when the walkthrough operation is produced pressing structure and is monolateral 2 high glue prepregs or above product pressing structure, prepreg often occurs and slide and cause under-voltage unusual in multilayer printed circuit board limit.At present industry generally used the heating rate adjusted in the pressing program and last pressure time and pressure size to control the slip of prepreg in the pressing process.Change the pressing program and can control the slip of prepreg in the pressing process of a part, but can not solve this class problem fully.And changed after the pressing program, the thickness of slab uniformity of multilayer printed circuit board can compare instability, because generally control the method for the most effective adjustment pressing program of the slip of prepreg in the pressing process is the rise time of the quickening or the pressure that slows down, at this moment prepreg in the pressing process since on press and can cause gummosis too much to form the thickness attenuation too soon, last pressed cause slowly gummosis less not even gummosis form the thickness thickening or can not discharge fully and cause edges of boards white edge to occur because of the air in the prepreg, cause and scrap.
[utility model content]
The defective that prepreg easily slides when better overcoming above-mentioned multilayer printed circuit board pressing, the utility model provides a kind of multilayer printed circuit board.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of multilayer printed circuit board is provided, has comprised core material, described core material is respectively equipped with prepreg up and down, and described core material is fixedlyed connected by rivet with described prepreg.
Further improvement of the utility model is: described core material is provided with first rivet hole, and described prepreg is provided with second rivet hole, and described rivet is separately positioned on described first rivet hole, second rivet hole.
Further improvement of the utility model is: the aperture of described first rivet hole is 3.175mm.
Further improvement of the utility model is: the aperture of described second rivet hole is 4.5mm.
Compared with prior art, the beneficial effect that the utlity model has is: pass through such scheme, earlier core material and prepreg are riveted together by rivet, pressing again, prepreg is in the pressing process like this, because the power that the involves effect of rivet is arranged, can't slide, thus the defective that prepreg easily slides when solving pressing.
[description of drawings]
Fig. 1 is the structural representation of a kind of multilayer printed circuit board of the utility model;
Fig. 2 is the process for pressing flow process of a kind of multilayer printed circuit board of the utility model.
[embodiment]
Below in conjunction with accompanying drawing the utility model is described in further detail: in conjunction with Fig. 1 to Fig. 2, a kind of multilayer printed circuit board, comprise core material 1, this core material 1 is respectively equipped with prepreg 2 up and down, and this core material 1 is fixedlyed connected by rivet 3 with this prepreg 2.
Wherein, this core material 1 is provided with first rivet hole, and this prepreg 2 is provided with second rivet hole, and above-mentioned rivet 3 is separately positioned on first rivet hole, second rivet hole.
The aperture of this first rivet hole is 3.175mm, and the aperture of this second rivet hole is 4.5mm.
As shown in Figure 2, the process for pressing flow process of a kind of multilayer printed circuit board of providing of the utility model is:
1. at first need design first rivet hole position and the figure on the edges of boards figure of core material 1;
2. first rivet hole on the core material 1 edges of boards figure is got the aperture that diameter is 3.175mm with the CCD target-shooting machine, normal again brown also can be melanism;
3. after prepreg 2 is left, get out second rivet hole of prepreg according to the identical position of first rivet hole of core material 1, the aperture is 4.5mm;
4. the prepreg 2 that will arrange flaggy rivets together with core material 1 usefulness twin shaft rivet driver, core material 1 is fixedlyed connected with prepreg 2, but an outermost prepreg does not need riveted, prevents that rivet 3 position of blooming is too high, causes 3 Copper Foils 4 of rivet wrinkling;
5. do normal walkthrough with an outermost prepreg 2;
6. normally arrange plate and pressing, select normal pressing program for use, do not need to adjust parameter.
A kind of multilayer printed circuit board that the utility model provides rivets together core material and prepreg earlier by rivet, pressing again, prepreg is in the pressing process, because the power that the involves effect of rivet is arranged like this, can't slide, thus the defective that prepreg easily slides when solving pressing.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (4)
1. a multilayer printed circuit board comprises core material (1), it is characterized in that: described core material (1) is respectively equipped with prepreg (2) up and down, and described core material (1) is fixedlyed connected by rivet (3) with described prepreg (2).
2. multilayer printed circuit board according to claim 1, it is characterized in that: described core material (1) is provided with first rivet hole, described prepreg (2) is provided with second rivet hole, and described rivet (3) is separately positioned on described first rivet hole, second rivet hole.
3. multilayer printed circuit board according to claim 2 is characterized in that: the aperture of described first rivet hole is 3.175mm.
4. multilayer printed circuit board according to claim 2 is characterized in that: the aperture of described second rivet hole is 4.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920260829XU CN201550361U (en) | 2009-11-27 | 2009-11-27 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920260829XU CN201550361U (en) | 2009-11-27 | 2009-11-27 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201550361U true CN201550361U (en) | 2010-08-11 |
Family
ID=42605544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920260829XU Expired - Fee Related CN201550361U (en) | 2009-11-27 | 2009-11-27 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201550361U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101965105A (en) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | Printed circuit board lamination manufacturing process |
| CN102490435A (en) * | 2011-12-21 | 2012-06-13 | 博罗县精汇电子科技有限公司 | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method |
| CN102843875A (en) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | Alignment control method for multiple layers of PCBs |
| CN103153005A (en) * | 2013-02-02 | 2013-06-12 | 汕头超声印制板（二厂）有限公司 | Multilayer printed board lamination method |
| CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
| CN105307398A (en) * | 2015-10-22 | 2016-02-03 | 深圳崇达多层线路板有限公司 | Technology for preventing liquid from being hidden in rivet hole of multi-laminated multilayer circuit board |
| CN109246930A (en) * | 2018-10-17 | 2019-01-18 | 深圳崇达多层线路板有限公司 | A method of preceding riveted positioning is pressed for improving the inclined rivet of pressing layer and PCB |
| CN113597102A (en) * | 2021-06-30 | 2021-11-02 | 湖北金禄科技有限公司 | Circuit board pressing processing method and high-frequency circuit board |
-
2009
- 2009-11-27 CN CN200920260829XU patent/CN201550361U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101965105A (en) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | Printed circuit board lamination manufacturing process |
| CN102843875A (en) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | Alignment control method for multiple layers of PCBs |
| CN102490435A (en) * | 2011-12-21 | 2012-06-13 | 博罗县精汇电子科技有限公司 | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method |
| CN102490435B (en) * | 2011-12-21 | 2014-08-27 | 博罗县精汇电子科技有限公司 | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method |
| CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
| CN103153005A (en) * | 2013-02-02 | 2013-06-12 | 汕头超声印制板（二厂）有限公司 | Multilayer printed board lamination method |
| CN103153005B (en) * | 2013-02-02 | 2015-10-28 | 汕头超声印制板（二厂）有限公司 | A kind of multilayer printed board laminating method |
| CN105307398A (en) * | 2015-10-22 | 2016-02-03 | 深圳崇达多层线路板有限公司 | Technology for preventing liquid from being hidden in rivet hole of multi-laminated multilayer circuit board |
| CN105307398B (en) * | 2015-10-22 | 2018-06-15 | 深圳崇达多层线路板有限公司 | A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed |
| CN109246930A (en) * | 2018-10-17 | 2019-01-18 | 深圳崇达多层线路板有限公司 | A method of preceding riveted positioning is pressed for improving the inclined rivet of pressing layer and PCB |
| CN113597102A (en) * | 2021-06-30 | 2021-11-02 | 湖北金禄科技有限公司 | Circuit board pressing processing method and high-frequency circuit board |
| CN113597102B (en) * | 2021-06-30 | 2023-11-24 | 湖北金禄科技有限公司 | Circuit board pressing processing method and high-frequency circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SHENZHEN ELEGANT PCB TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 518000, Shenzhen, Guangdong, Baoan District manhole street, Xinqiao Industrial Zone, Henggang New Jade Road 3 on the third floor (office space) Patentee after: Shenzhen Suntak Circuit Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Tong Mei Road on the eastern side of CSG community Patentee before: Shenzhen Jijin P.C.B. Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20141127 |
|
| EXPY | Termination of patent right or utility model |