CN102490435A - Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method - Google Patents
Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method Download PDFInfo
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- CN102490435A CN102490435A CN2011104320202A CN201110432020A CN102490435A CN 102490435 A CN102490435 A CN 102490435A CN 2011104320202 A CN2011104320202 A CN 2011104320202A CN 201110432020 A CN201110432020 A CN 201110432020A CN 102490435 A CN102490435 A CN 102490435A
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Abstract
The invention provides a method for manufacturing an asymmetric factor multi-layer hardboard in a soft and hard combination board by adopting a separation lamination method. The method comprises the following steps: A. manufacturing a first double-side inner-layer hardboard, a second double-side inner-layer hardboard, a third double-side inner-layer hardboard and an integration curing board respectively; and B. arranging and sequentially laminating the first double-side inner-layer hardboard, a first prepreg, the second double-side inner-layer hardboard, a second prepreg, the third double-side inner-layer hardboard, a third prepreg and the integration curing board according to the sequence from top to bottom. The method has the following beneficial effects: due to the adoption of the method, the lamination becomes even, the copper electroplating is made to be uniform, the film lamination is compact, the net sticking phenomenon is reduced, and the misjudgment on electrical logging is reduced, therefore, the yield in production is improved. The material cost and the production cost are improved a little, but the yield in production is effectively improved; more important, when an IC (integrated circuit) or a BGA (ball grid array) is laminated on the surface of the board by a terminal client, bad empty welding caused by warping of the board is avoided, and the risk of goods returning from the client is reduced.
Description
Technical field
The present invention relates to the high-end asymmetry radix multilayer hardboard production lamination of flexible circuit board and circuit board, relate in particular to adopt and separate the method that the pressing method is produced the asymmetry radix multilayer hardboard in the Rigid Flex.
Background technology
The interior production asymmetry radix multilayer hardboard of industry by the technological process of conventional one step press method is at present:
1. on request needed which floor internal layer is carried out.
2. size is cut out well prepreg, the pure copper foil of outer base material on request.
3. by hierarchical structure requirement pressing together, do skin again.
Though a production procedure like this is succinct, clear; But the result is undesirable; Radix multi-layer sheet after the pressing is better because of the toughness of prepreg (epoxy resin), and through the high temperature easy deformation, the dimensional stability of pure copper foil is relatively good; So be case of bending, the back operation is produced process abnormality: copper facing copper thickness ununiformity is even, pad pasting pastes not tight, the sticking net of silk-screen; It is low to cause high end plate to produce yield; Plate sticks up and also has fatal problem, when terminal client surface mount IC, installation LSI and various electronic component, owing to the out-of-flatness of plate face, causes empty weldering bad.This also is the radix multilayer hardboard most thorny issue in high-end radix multilayer hardboard or the Rigid Flex in the present industry.
Summary of the invention
In order to solve the problems of the prior art, the invention provides a kind of employing and separate the method that the pressing method is produced the asymmetry radix multilayer hardboard in the Rigid Flex.
The invention provides a kind of employing and separate the method that the pressing method is produced the asymmetry radix multilayer hardboard in the Rigid Flex, comprise the steps:
A. make the first two-sided internal layer hardboard, the second two-sided internal layer hardboard, the 3rd two-sided internal layer hardboard respectively, integrate cured plate;
B. according to from top to bottom the arrangement first two-sided internal layer hardboard, first prepreg, the second two-sided internal layer hardboard, second prepreg, the 3rd two-sided internal layer hardboard, the 3rd prepreg, the order of the integrating cured plate lamination of connecting.
As further improvement of the present invention, in said steps A, to integrate cured plate and form by the 4th prepreg and two pure copper foil, the 4th prepreg two sides is sticked respectively and is carried out laminated heat after two pure copper foil and solidify to form the integration cured plate.
As further improvement of the present invention, in said steps A, after the integration cured plate completes, the pure copper foil that contacts with the 3rd prepreg is carried out pad pasting and etching.
As further improvement of the present invention, said pure copper foil is the 0.5Z pure copper foil, and said the 4th prepreg is 50 microns prepregs.
As further improvement of the present invention, said the 3rd prepreg is 50 microns prepregs.
As further improvement of the present invention, the said first two-sided internal layer hardboard is made up of first substrate, the first bronze medal copper-clad plate and the second bronze medal copper-clad plate, and the said first substrate two sides is sticked the first bronze medal copper-clad plate and the second bronze medal copper-clad plate respectively; The said second two-sided internal layer hardboard is made up of second substrate, the 3rd bronze medal copper-clad plate and the 4th bronze medal copper-clad plate, and the said second substrate two sides is sticked the 3rd bronze medal copper-clad plate and the 4th bronze medal copper-clad plate respectively; The said the 3rd two-sided internal layer hardboard is made up of the 3rd substrate, the 5th bronze medal copper-clad plate and the 6th bronze medal copper-clad plate, and said the 3rd substrate two sides is sticked the 5th bronze medal copper-clad plate and the 6th bronze medal copper-clad plate respectively.
As further improvement of the present invention, said first substrate and said the 3rd substrate are 300 microns substrates, and said second substrate is 200 microns substrates.
As further improvement of the present invention, the said first bronze medal copper-clad plate to the, six bronze medal copper-clad plates are the copper-clad plate of 1OZ copper.
The invention has the beneficial effects as follows: it is smooth to adopt method of the present invention to make behind the lamination, makes copper facing even, and pad pasting is fitted closely, and sticking net reduces, and the electrical measurement erroneous judgement reduces, thereby improves the yields of producing.Though Material Cost and production cost improve, effectively improve the yields of producing; When the more important thing is terminal client surface mount IC, BGA, avoid plate to stick up causing empty weldering bad, reduce client's risk of returning goods.
Description of drawings
Fig. 1 is a production method basic composition sketch map in the prior art.
Fig. 2 is a composition sketch map of the present invention.
The specific embodiment
As shown in Figure 2; The invention discloses a kind of employing and separate the method that the pressing method is produced the asymmetry radix multilayer hardboard in the Rigid Flex; Comprise the steps: in first step, make the two-sided internal layer hardboard of the two-sided internal layer hardboard of the first two-sided internal layer hardboard 1, second the 2, the 3rd 3 respectively, integrate cured plate 5.In second step, according to the two-sided internal layer hardboard of the two-sided internal layer hardboard of the two-sided internal layer hardboard of from top to bottom arrangement first 1, first prepreg 6, second 2, second prepreg the 7, the 3rd 3, the 3rd prepreg 8, the order of integrating cured plate 5 lamination of connecting.
In first step, to integrate cured plate 5 and form by the 4th prepreg 51 and two pure copper foil 52, the 4th prepreg 51 two sides are sticked respectively and are carried out laminated heat after two pure copper foil 52 and solidify to form integration cured plate 5.
In first step, after integration cured plate 5 completes, the pure copper foil 52 that contacts with the 3rd prepreg 8 is carried out pad pasting and etching.
Because of the 4th prepreg 51 and pure copper foil 52 through the thermosettings of high temperature lamination after, the 4th prepreg 51 is attached on the pure copper foil 52, is equivalent to the dimensional stability that the 4th prepreg 51 has pure copper foil 52, and then lamination together; Play booster action behind the 3rd prepreg 8 and pure copper foil 52 laminations, the tension force when offsetting asymmetric radix multi-layer sheet lamination, the plate of lamination is just smooth together.Thereby improve the plate bending, electric current is even at the plate face when making copper facing, and copper is thick evenly, and the live width line-spacing is even; After plate face during pad pasting was smooth, dry film and plate face were fitted closely, and etching just is not easy broken string like this; Serigraphy can not form sticking net wire mark because plate sticks up; Electrical measurement can not judged by accident because plate sticks up; Thereby improve the yields of producing.
Said pure copper foil 52 is the 0.5Z pure copper foil, and said the 4th prepreg 51 is 50 microns prepregs.Said the 3rd prepreg 8 is 50 microns prepregs.
The said first two-sided internal layer hardboard 1 is made up of first substrate 11, the first bronze medal copper-clad plate 12 and the second bronze medal copper-clad plate 13, and said first substrate 11 two sides are sticked the first bronze medal copper-clad plate 12 and the second bronze medal copper-clad plate 13 respectively; The said second two-sided internal layer hardboard 2 is made up of second substrate 21, the 3rd bronze medal copper-clad plate 22 and the 4th bronze medal copper-clad plate 23, and said second substrate 21 two sides are sticked the 3rd bronze medal copper-clad plate 22 and the 4th bronze medal copper-clad plate 23 respectively; The said the 3rd two-sided internal layer hardboard 3 is made up of the 3rd substrate 31, the 5th bronze medal copper-clad plate 32 and the 6th bronze medal copper-clad plate 33, and said the 3rd substrate 31 two sides are sticked the 5th bronze medal copper-clad plate 32 and the 6th bronze medal copper-clad plate 33 respectively.
Said first substrate 11 is 300 microns substrates with said the 3rd substrate 31, and said second substrate 21 is 200 microns substrates.
The said first bronze medal copper-clad plate to the, six bronze medal copper-clad plates 12,13,22,23,32,33 are the copper-clad plate of 10Z copper.
In the PCB industry, the 1OZ meaning is that the copper of weight 1OZ evenly is tiled in the thickness that is arrived on the area of 1 square feet (FT2).It is an average thickness of representing Copper Foil with the weight of cellar area.Represent promptly 1OZ=28.35g/FT2 with formula.
Said first substrate 11, second substrate 21 and the 3rd substrate 31 are FR4.
It is smooth to adopt method of the present invention to make behind the lamination, makes copper facing even, and pad pasting is fitted closely, and sticking net reduces, and the electrical measurement erroneous judgement reduces, thereby improves the yields of producing.Though Material Cost and production cost improve, effectively improve the yields of producing; When the more important thing is terminal client surface mount IC, BGA, avoid plate to stick up causing empty weldering bad, reduce client's risk of returning goods.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (8)
1. one kind is adopted the method for separating the asymmetry radix multilayer hardboard in the pressing method production Rigid Flex, it is characterized in that, comprises the steps:
A. make the first two-sided internal layer hardboard, the second two-sided internal layer hardboard, the 3rd two-sided internal layer hardboard respectively, integrate cured plate;
B. according to from top to bottom the arrangement first two-sided internal layer hardboard, first prepreg, the second two-sided internal layer hardboard, second prepreg, the 3rd two-sided internal layer hardboard, the 3rd prepreg, the order of the integrating cured plate lamination of connecting.
2. method according to claim 1 is characterized in that: in said steps A, integrate cured plate and be made up of the 4th prepreg and two pure copper foil, the 4th prepreg two sides is sticked respectively and is carried out laminated heat after two pure copper foil and solidify to form the integration cured plate.
3. method according to claim 2 is characterized in that: in said steps A, after the integration cured plate completes, the pure copper foil that contacts with the 3rd prepreg is carried out pad pasting and etching.
4. method according to claim 3 is characterized in that: said pure copper foil is the 0.5Z pure copper foil, and said the 4th prepreg is 50 microns prepregs.
5. method according to claim 4 is characterized in that: said the 3rd prepreg is 50 microns prepregs.
6. according to each described method of claim 1 to 5; It is characterized in that: the said first two-sided internal layer hardboard is made up of first substrate, the first bronze medal copper-clad plate and the second bronze medal copper-clad plate, and the said first substrate two sides is sticked the first bronze medal copper-clad plate and the second bronze medal copper-clad plate respectively; The said second two-sided internal layer hardboard is made up of second substrate, the 3rd bronze medal copper-clad plate and the 4th bronze medal copper-clad plate, and the said second substrate two sides is sticked the 3rd bronze medal copper-clad plate and the 4th bronze medal copper-clad plate respectively; The said the 3rd two-sided internal layer hardboard is made up of the 3rd substrate, the 5th bronze medal copper-clad plate and the 6th bronze medal copper-clad plate, and said the 3rd substrate two sides is sticked the 5th bronze medal copper-clad plate and the 6th bronze medal copper-clad plate respectively.
7. method according to claim 6 is characterized in that: said first substrate and said the 3rd substrate are 300 microns substrates, and said second substrate is 200 microns substrates.
8. method according to claim 7 is characterized in that: the said first bronze medal copper-clad plate to the, six bronze medal copper-clad plates are the copper-clad plate of 1OZ copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110432020.2A CN102490435B (en) | 2011-12-21 | 2011-12-21 | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110432020.2A CN102490435B (en) | 2011-12-21 | 2011-12-21 | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method |
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| CN102490435A true CN102490435A (en) | 2012-06-13 |
| CN102490435B CN102490435B (en) | 2014-08-27 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900143A (en) * | 2015-12-17 | 2017-06-27 | 冠锋电子科技(梅州)有限公司 | A kind of preparation method of Rigid Flex |
| CN112105175A (en) * | 2020-11-09 | 2020-12-18 | 广东科翔电子科技股份有限公司 | Process method of asymmetric multilayer rigid-flex printed circuit board with air cavity |
| CN113423199A (en) * | 2021-06-24 | 2021-09-21 | 皆利士多层线路版(中山)有限公司 | PCB laminating structure and PCB processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006224571A (en) * | 2005-02-21 | 2006-08-31 | Furukawa Circuit Foil Kk | Copper-metallized film and its production method |
| CN1913753A (en) * | 2006-08-24 | 2007-02-14 | 华为技术有限公司 | Manufacturing method of printed circuit board |
| CN101626660A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process for attaching and pressing copper surfaces of multilayer plates with asymmetrical structures |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN201550361U (en) * | 2009-11-27 | 2010-08-11 | 深圳市集锦线路板科技有限公司 | Multilayer printed circuit board |
-
2011
- 2011-12-21 CN CN201110432020.2A patent/CN102490435B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006224571A (en) * | 2005-02-21 | 2006-08-31 | Furukawa Circuit Foil Kk | Copper-metallized film and its production method |
| CN1913753A (en) * | 2006-08-24 | 2007-02-14 | 华为技术有限公司 | Manufacturing method of printed circuit board |
| CN101626660A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process for attaching and pressing copper surfaces of multilayer plates with asymmetrical structures |
| CN101699939A (en) * | 2009-11-05 | 2010-04-28 | 深南电路有限公司 | Method for rolling PCB |
| CN201550361U (en) * | 2009-11-27 | 2010-08-11 | 深圳市集锦线路板科技有限公司 | Multilayer printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900143A (en) * | 2015-12-17 | 2017-06-27 | 冠锋电子科技(梅州)有限公司 | A kind of preparation method of Rigid Flex |
| CN106900143B (en) * | 2015-12-17 | 2019-05-17 | 冠锋电子科技(梅州)有限公司 | A kind of preparation method of Rigid Flex |
| CN112105175A (en) * | 2020-11-09 | 2020-12-18 | 广东科翔电子科技股份有限公司 | Process method of asymmetric multilayer rigid-flex printed circuit board with air cavity |
| CN113423199A (en) * | 2021-06-24 | 2021-09-21 | 皆利士多层线路版(中山)有限公司 | PCB laminating structure and PCB processing method |
| CN113423199B (en) * | 2021-06-24 | 2023-03-14 | 皆利士多层线路版(中山)有限公司 | PCB laminating structure and PCB processing method |
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| CN102490435B (en) | 2014-08-27 |
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