CN105307398B - A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed - Google Patents
A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed Download PDFInfo
- Publication number
- CN105307398B CN105307398B CN201510690685.1A CN201510690685A CN105307398B CN 105307398 B CN105307398 B CN 105307398B CN 201510690685 A CN201510690685 A CN 201510690685A CN 105307398 B CN105307398 B CN 105307398B
- Authority
- CN
- China
- Prior art keywords
- rivet hole
- hole
- milling
- rivet
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The invention belongs to wiring board arts, and in particular to a kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, step are:Multilayer circuit board pressing number is altogether n times, and the rivet hole mill off after pressing is obtained n-th milling rivet hole using milling cutter after n-th pressing, the big 0.3mm 0.5mm in aperture for the milling rivet hole that the aperture ratio of n-th milling rivet hole milled out is the n-th 1 times;The rivet hole milled out is through-hole;2≤the n.The technique often presses primary using pressing groove milling that rivet hole cavity position milling is big, so as to cavity position mill off, prevent Tibetan medicine water, improve because of rivet hole site cavity Tibetan medicine water, it causes the plate bursting in rear process production process and causes unnecessary the problem of scrapping, the yield of production plate is promoted, ensures production quality.
Description
Technical field
The invention belongs to wiring board arts, and in particular to a kind of anti-work of multilayer circuit board rivet hole Zang Shui repeatedly pressed
Skill.
Background technology
It is repeatedly made during force fit plate one step press internal layer of riveter nail mode at present, according to rivet after pressing out
Size nozzle is bored by rivet to boring using the drilling of equal size, then make internal layer daughter board plating patterns etc., then carry out two
Secondary or even multiple pressing.
In multiple bonding processes, to bore rivet location primary only with nozzle is bored for rivet location, it is follow-up it is normal make, do not do and locate
Reason;It because rivet location head height of rivet factor influences, can not ensure uniform force in bonding processes, and position beside rivet position occur
Appearance cavity is put, rivet only is bored by drilling, without the place one in rivet location cavity pulls out of hole, in rear processes such as plating
In the process so as to which the position be made to keep moisture, during rear process makes, moisture is distributed in plate to occur producing position in plate plate
Pressing layering is caused to whiten due to moisture to scrap.
Invention content
For this purpose, the technical problems to be solved by the invention are to solve in the prior art because of rivet location hole, Tibetan medicine water
The problems such as, and there is moisture dispersion, the technical bottleneck that production plate is caused to scrap, so as to propose a kind of improve because of rivet hole site sky
Hole Tibetan medicine water improves production yield so as to reduce the technique of cost.
In order to solve the above technical problems, the invention discloses a kind of anti-multilayer circuit board rivet hole Zang Shui's repeatedly pressed
Technique, wherein, the technique includes the following steps:
The multilayer circuit board pressing number is altogether n times, and milling cutter is used after n-th pressing by the rivet hole milling after pressing
Fall, obtain n-th milling rivet hole, the aperture for the milling rivet hole that the aperture ratio of the n-th milling rivet hole milled out is (n-1)th time is big
0.3mm-0.5mm;The rivet hole milled out is through-hole;2≤the n.
Preferably, the wiring board further includes following steps after n-th milling rivet:Using milling cutter by rivet hole mill off,
The rivet hole milled out effective unit area in plate is cut, but does not contact effective unit area;The hole is through-hole, and mill out
Rivet hole shape is rectangle.
Preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the multilayer line
The initial aperture of rivet hole after the first time pressing of plate is 3.5mm.
Preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the rivet hole
To edges of boards distance >=2mm.
Preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the rivet hole
Hole centre distance plate unit form wire distance >=7mm.
More preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the institute
The edges of boards of multilayer circuit board are stated plus rivet hole and minimum widith >=14mm of the edges of boards figure of the multilayer circuit board.
The above technical solution of the present invention has the following advantages over the prior art:In multiple bonding processes, press every time
Rivet location has pp gummosis to enter hole, and position in hole is caused cavity occur, and often unification time uses pressing groove milling by rivet hole cavity
Position milling is big, so as to cavity position mill off, prevent Tibetan medicine water, improve because of rivet hole site cavity Tibetan medicine water, cause rear process
It plate bursting in production process and causes unnecessary the problem of scrapping, the yield of production plate is promoted, so as to ensure production quality;Have
Great market prospects and economic value.
Description of the drawings
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the process flow diagram of hole milling in embodiment;
Reference numeral is expressed as in figure:The hole milling of 1- first times;The hole milling of 2- n-ths;3- edges of boards;4- last time milling rivetings
The hole milling of nail.
Specific embodiment
Embodiment 1 is described present embodiment discloses a kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed
Processing step is as follows:
1st, the initial aperture of nail hole is 3.5mm, using milling cutter by rivet hole mill off in first time bonding processes, by rivet position
Mill off is put, obtains the hole milling 1 of first time, while the often pressing after requiring is primary, it is primary to carry out the aperture milling of milling rivet hole,
And ensure and 0.5mm apertures are increased on the basis of first time, the hole milling of n-th is obtained, and the rivet hole milled out is through-hole.
2nd, last time pressing milling rivet hole milling effective unit in plate, by this position milling rectangularity, ensures this
There is not cavity in position in protecting, and obtains the hole milling 4 of last time milling rivet, and the rivet hole milled out is logical
Hole.It is required that the rectangular length of side is more than or equal to last time milling rivet bore dia, the radius+0.5mm of short side >=last time milling rivet;It will
Seeking milling rivet hole, (edges of boards add riveting to hole centre distance plate unit form wire >=7mm of milling rivet hole to distance >=2mm of edges of boards 3
Minimum widith >=14mm of nail hole and edges of boards figure), and the rivet hole milled out is through-hole.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among changing still in the protection domain of the invention.
Claims (2)
1. a kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, which is characterized in that the technique includes as follows
Step:
Multilayer circuit board pressing number is altogether n times, using milling cutter by the rivet hole mill off after pressing after n-th pressing,
N-th milling rivet hole is obtained, the big 0.3mm- in aperture for the milling rivet hole that the aperture ratio of the n-th milling rivet hole milled out is (n-1)th time
0.5mm;The rivet hole milled out is through-hole;N >=2;
The wiring board further includes following steps after n-th milling rivet:Using milling cutter by rivet hole mill off, the riveting milled out is cut
Nail hole effective unit area in plate, but effective unit area is not contacted;The hole is through-hole, and the rivet hole shape milled out
For rectangle;
The initial aperture of the rivet hole of the multilayer circuit board is 3.5mm;
The rivet hole is to edges of boards distance >=2mm;
The hole centre distance plate unit form wire distance >=7mm of the rivet hole.
2. the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed as described in claim 1, which is characterized in that described
Multilayer circuit board edges of boards plus the edges of boards figure of rivet hole and the multilayer circuit board minimum widith >=14mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510690685.1A CN105307398B (en) | 2015-10-22 | 2015-10-22 | A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510690685.1A CN105307398B (en) | 2015-10-22 | 2015-10-22 | A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105307398A CN105307398A (en) | 2016-02-03 |
CN105307398B true CN105307398B (en) | 2018-06-15 |
Family
ID=55203995
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Application Number | Title | Priority Date | Filing Date |
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CN201510690685.1A Expired - Fee Related CN105307398B (en) | 2015-10-22 | 2015-10-22 | A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed |
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CN (1) | CN105307398B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108260281A (en) * | 2017-12-13 | 2018-07-06 | 深圳崇达多层线路板有限公司 | A kind of method that rivet is pressed on removal force fit plate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201550361U (en) * | 2009-11-27 | 2010-08-11 | 深圳市集锦线路板科技有限公司 | Multilayer printed circuit board |
CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
CN203814036U (en) * | 2014-03-31 | 2014-09-03 | 惠州中京电子科技股份有限公司 | Explosion-proof structure for PCB |
-
2015
- 2015-10-22 CN CN201510690685.1A patent/CN105307398B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201550361U (en) * | 2009-11-27 | 2010-08-11 | 深圳市集锦线路板科技有限公司 | Multilayer printed circuit board |
CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
CN103847097A (en) * | 2012-11-30 | 2014-06-11 | 北大方正集团有限公司 | Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB |
CN203814036U (en) * | 2014-03-31 | 2014-09-03 | 惠州中京电子科技股份有限公司 | Explosion-proof structure for PCB |
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CN105307398A (en) | 2016-02-03 |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180615 Termination date: 20201022 |
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CF01 | Termination of patent right due to non-payment of annual fee |