CN105307398B - A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed - Google Patents

A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed Download PDF

Info

Publication number
CN105307398B
CN105307398B CN201510690685.1A CN201510690685A CN105307398B CN 105307398 B CN105307398 B CN 105307398B CN 201510690685 A CN201510690685 A CN 201510690685A CN 105307398 B CN105307398 B CN 105307398B
Authority
CN
China
Prior art keywords
rivet hole
hole
milling
rivet
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201510690685.1A
Other languages
Chinese (zh)
Other versions
CN105307398A (en
Inventor
王佐
王群芳
刘克敢
刘�东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Suntak Multilayer PCB Co Ltd
Original Assignee
Shenzhen Suntak Multilayer PCB Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Suntak Multilayer PCB Co Ltd filed Critical Shenzhen Suntak Multilayer PCB Co Ltd
Priority to CN201510690685.1A priority Critical patent/CN105307398B/en
Publication of CN105307398A publication Critical patent/CN105307398A/en
Application granted granted Critical
Publication of CN105307398B publication Critical patent/CN105307398B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching

Abstract

The invention belongs to wiring board arts, and in particular to a kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, step are:Multilayer circuit board pressing number is altogether n times, and the rivet hole mill off after pressing is obtained n-th milling rivet hole using milling cutter after n-th pressing, the big 0.3mm 0.5mm in aperture for the milling rivet hole that the aperture ratio of n-th milling rivet hole milled out is the n-th 1 times;The rivet hole milled out is through-hole;2≤the n.The technique often presses primary using pressing groove milling that rivet hole cavity position milling is big, so as to cavity position mill off, prevent Tibetan medicine water, improve because of rivet hole site cavity Tibetan medicine water, it causes the plate bursting in rear process production process and causes unnecessary the problem of scrapping, the yield of production plate is promoted, ensures production quality.

Description

A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed
Technical field
The invention belongs to wiring board arts, and in particular to a kind of anti-work of multilayer circuit board rivet hole Zang Shui repeatedly pressed Skill.
Background technology
It is repeatedly made during force fit plate one step press internal layer of riveter nail mode at present, according to rivet after pressing out Size nozzle is bored by rivet to boring using the drilling of equal size, then make internal layer daughter board plating patterns etc., then carry out two Secondary or even multiple pressing.
In multiple bonding processes, to bore rivet location primary only with nozzle is bored for rivet location, it is follow-up it is normal make, do not do and locate Reason;It because rivet location head height of rivet factor influences, can not ensure uniform force in bonding processes, and position beside rivet position occur Appearance cavity is put, rivet only is bored by drilling, without the place one in rivet location cavity pulls out of hole, in rear processes such as plating In the process so as to which the position be made to keep moisture, during rear process makes, moisture is distributed in plate to occur producing position in plate plate Pressing layering is caused to whiten due to moisture to scrap.
Invention content
For this purpose, the technical problems to be solved by the invention are to solve in the prior art because of rivet location hole, Tibetan medicine water The problems such as, and there is moisture dispersion, the technical bottleneck that production plate is caused to scrap, so as to propose a kind of improve because of rivet hole site sky Hole Tibetan medicine water improves production yield so as to reduce the technique of cost.
In order to solve the above technical problems, the invention discloses a kind of anti-multilayer circuit board rivet hole Zang Shui's repeatedly pressed Technique, wherein, the technique includes the following steps:
The multilayer circuit board pressing number is altogether n times, and milling cutter is used after n-th pressing by the rivet hole milling after pressing Fall, obtain n-th milling rivet hole, the aperture for the milling rivet hole that the aperture ratio of the n-th milling rivet hole milled out is (n-1)th time is big 0.3mm-0.5mm;The rivet hole milled out is through-hole;2≤the n.
Preferably, the wiring board further includes following steps after n-th milling rivet:Using milling cutter by rivet hole mill off, The rivet hole milled out effective unit area in plate is cut, but does not contact effective unit area;The hole is through-hole, and mill out Rivet hole shape is rectangle.
Preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the multilayer line The initial aperture of rivet hole after the first time pressing of plate is 3.5mm.
Preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the rivet hole To edges of boards distance >=2mm.
Preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the rivet hole Hole centre distance plate unit form wire distance >=7mm.
More preferably, the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, wherein, the institute The edges of boards of multilayer circuit board are stated plus rivet hole and minimum widith >=14mm of the edges of boards figure of the multilayer circuit board.
The above technical solution of the present invention has the following advantages over the prior art:In multiple bonding processes, press every time Rivet location has pp gummosis to enter hole, and position in hole is caused cavity occur, and often unification time uses pressing groove milling by rivet hole cavity Position milling is big, so as to cavity position mill off, prevent Tibetan medicine water, improve because of rivet hole site cavity Tibetan medicine water, cause rear process It plate bursting in production process and causes unnecessary the problem of scrapping, the yield of production plate is promoted, so as to ensure production quality;Have Great market prospects and economic value.
Description of the drawings
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the process flow diagram of hole milling in embodiment;
Reference numeral is expressed as in figure:The hole milling of 1- first times;The hole milling of 2- n-ths;3- edges of boards;4- last time milling rivetings The hole milling of nail.
Specific embodiment
Embodiment 1 is described present embodiment discloses a kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed Processing step is as follows:
1st, the initial aperture of nail hole is 3.5mm, using milling cutter by rivet hole mill off in first time bonding processes, by rivet position Mill off is put, obtains the hole milling 1 of first time, while the often pressing after requiring is primary, it is primary to carry out the aperture milling of milling rivet hole, And ensure and 0.5mm apertures are increased on the basis of first time, the hole milling of n-th is obtained, and the rivet hole milled out is through-hole.
2nd, last time pressing milling rivet hole milling effective unit in plate, by this position milling rectangularity, ensures this There is not cavity in position in protecting, and obtains the hole milling 4 of last time milling rivet, and the rivet hole milled out is logical Hole.It is required that the rectangular length of side is more than or equal to last time milling rivet bore dia, the radius+0.5mm of short side >=last time milling rivet;It will Seeking milling rivet hole, (edges of boards add riveting to hole centre distance plate unit form wire >=7mm of milling rivet hole to distance >=2mm of edges of boards 3 Minimum widith >=14mm of nail hole and edges of boards figure), and the rivet hole milled out is through-hole.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or Among changing still in the protection domain of the invention.

Claims (2)

1. a kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed, which is characterized in that the technique includes as follows Step:
Multilayer circuit board pressing number is altogether n times, using milling cutter by the rivet hole mill off after pressing after n-th pressing, N-th milling rivet hole is obtained, the big 0.3mm- in aperture for the milling rivet hole that the aperture ratio of the n-th milling rivet hole milled out is (n-1)th time 0.5mm;The rivet hole milled out is through-hole;N >=2;
The wiring board further includes following steps after n-th milling rivet:Using milling cutter by rivet hole mill off, the riveting milled out is cut Nail hole effective unit area in plate, but effective unit area is not contacted;The hole is through-hole, and the rivet hole shape milled out For rectangle;
The initial aperture of the rivet hole of the multilayer circuit board is 3.5mm;
The rivet hole is to edges of boards distance >=2mm;
The hole centre distance plate unit form wire distance >=7mm of the rivet hole.
2. the anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed as described in claim 1, which is characterized in that described Multilayer circuit board edges of boards plus the edges of boards figure of rivet hole and the multilayer circuit board minimum widith >=14mm.
CN201510690685.1A 2015-10-22 2015-10-22 A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed Expired - Fee Related CN105307398B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510690685.1A CN105307398B (en) 2015-10-22 2015-10-22 A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510690685.1A CN105307398B (en) 2015-10-22 2015-10-22 A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed

Publications (2)

Publication Number Publication Date
CN105307398A CN105307398A (en) 2016-02-03
CN105307398B true CN105307398B (en) 2018-06-15

Family

ID=55203995

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510690685.1A Expired - Fee Related CN105307398B (en) 2015-10-22 2015-10-22 A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed

Country Status (1)

Country Link
CN (1) CN105307398B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108260281A (en) * 2017-12-13 2018-07-06 深圳崇达多层线路板有限公司 A kind of method that rivet is pressed on removal force fit plate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201550361U (en) * 2009-11-27 2010-08-11 深圳市集锦线路板科技有限公司 Multilayer printed circuit board
CN102196677A (en) * 2010-03-08 2011-09-21 深南电路有限公司 PCB (Printed Circuit Board) double-sided jack machining process
CN103847097A (en) * 2012-11-30 2014-06-11 北大方正集团有限公司 Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB
CN203814036U (en) * 2014-03-31 2014-09-03 惠州中京电子科技股份有限公司 Explosion-proof structure for PCB

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201550361U (en) * 2009-11-27 2010-08-11 深圳市集锦线路板科技有限公司 Multilayer printed circuit board
CN102196677A (en) * 2010-03-08 2011-09-21 深南电路有限公司 PCB (Printed Circuit Board) double-sided jack machining process
CN103847097A (en) * 2012-11-30 2014-06-11 北大方正集团有限公司 Riveting and positioning fixture, PCB riveting method, manufacturing method for PCB and PCB
CN203814036U (en) * 2014-03-31 2014-09-03 惠州中京电子科技股份有限公司 Explosion-proof structure for PCB

Also Published As

Publication number Publication date
CN105307398A (en) 2016-02-03

Similar Documents

Publication Publication Date Title
CN104470214B (en) A kind of flexible and hard combined circuit board soft board external form processing method
CN101790286B (en) Process for machining holes
CN106714460A (en) Method for manufacturing special-shaped slot hole in printed circuit board
CN105307398B (en) A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed
CN101927382B (en) Extrusion tap with burring function and burring processing method
CN204090295U (en) A kind of PCB jigsaw
CN206077826U (en) A kind of pcb board structure of optimization power plane channel pressure drop
CN206963203U (en) A kind of high-precision multi-layer PCB board riveted tool
CN103500576A (en) Microporous sound-absorbing plate and production method thereof
CN103889147A (en) Machining method of PCB stepped plate and PCB stepped plate
CN103302183A (en) PCB aluminum substrate stamping die and processing method of PCB aluminum substrate diameter
CN204046938U (en) A kind of pcb board and compression bonding apparatus
CN103847162B (en) A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof
CN203565671U (en) Compound punching die with screw for hago-ita
CN103491730A (en) Shape manufacturing method of soft and hard combined circuit board
CN203764750U (en) Steel heat insulation fireproof door hinge hole punching die
CN205660197U (en) Tool is supported in drilling of iron fluorine dragon PCB board
CN106141429B (en) It is a kind of exclude laser ferrite product hole in waste material technique
CN209531840U (en) A kind of aluminum substrate injecting hole stamping die
CN204180380U (en) A kind of pcb board with stepped hole
CN103962649B (en) PCB manufacturing method for modifying crooked short grooves and PCB
CN203725594U (en) Stamping die for tractor stopping brake plate
CN202591681U (en) Template for drilling surface of lead board
CN201593334U (en) Key blank and key
CN203788545U (en) PCB (Printed Circuit Board)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180615

Termination date: 20201022

CF01 Termination of patent right due to non-payment of annual fee