CN102361539A - Method for manufacturing groove-type printed wiring board - Google Patents
Method for manufacturing groove-type printed wiring board Download PDFInfo
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- CN102361539A CN102361539A CN2011103164758A CN201110316475A CN102361539A CN 102361539 A CN102361539 A CN 102361539A CN 2011103164758 A CN2011103164758 A CN 2011103164758A CN 201110316475 A CN201110316475 A CN 201110316475A CN 102361539 A CN102361539 A CN 102361539A
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Abstract
The invention discloses a method for manufacturing a groove-type printed wiring board which is characterized by comprising the following steps: 1, providing an inner layer of substrate; 2, overlapping the inner layer of substrate with a bonding sheet c and then carrying out press fit; 3, carrying out depth control on the milling and dragging; 4, removing the residual insulating mediums at the bottom of a groove; 5, electroplating coppers or plating tins; 6, removing parts of or all tins or coppers at the bottom of the groove, and keeping the tins at side walls; and 7, obtaining a finished product. The method is used for solving the problems such as time waste, manpower and material resource waste, inferior quality and the like which are caused by manually placing fillers and removing the fillers to avoid the bottom of the groove from being plated with the coppers in the process of plating the coppers, overcoming the problem of resin residues at the bottom of the groove, and avoiding the problems of incomplete patterns, extremely irregular deviation at the bottom of the groove caused by the use of the fillers. By using the method, the bottom of the groove is smooth and has regular patterns, is pollution-free, meets demands completely, and flow cost and manpower cost are greatly reduced.
Description
Technical field
The present invention relates to a kind of manufacture method of printed wiring board, especially relate to a kind of manufacture method that contains special defects groove wiring board, belong to pcb board and make the field.
Background technology
At present; This kind groove type printed circuit board is that the making of groove class pcb board is generally used and made the part internal substrate earlier; On bonding sheet, process groove; Insert filler 1 and internal substrate pressing simultaneously, mill after the pressing and pull groove, removal filler 1 out, in electroplating process, choose the right moment then all or part of zone of bottom portion of groove with filler 2 protections; Stop electric plated with copper; In electroplating process, choose the right moment filler 2 is removed, thereby reach the designing requirement that PCB upper groove sidewall has copper, the no copper in all or part of zone, bottom, the shortcoming of the method is: in the copper facing process, choose the right moment and insert filler and remove filler; Controlled deficiency of time, operating difficulties, process cycle is long, human cost is high, pcb board is surperficial and bottom portion of groove is prone to scratch, pollution, and bottom portion of groove figure incompleteness, off normal, irregular etc. bad.
Summary of the invention
In order to solve in the copper facing process to avoiding the bottom portion of groove plated with copper; Manually insert filler and remove problems such as time waste, the manpower and materials that filler brought are wasted, quality is bad; Overcome the problem of bottom portion of groove resin residue, also avoided the use filler to cause bottom portion of groove figure incompleteness, off normal and irregular problem simultaneously.The invention provides and a kind ofly utilize that the brand-new technological process of legacy equipment is short, cost is low, quality better and can not produce the manufacture method of the particular groove type printed circuit board (sidewall has electro-coppering, the local or whole base materials in bottom) of reliability/integrity problem.
In order to achieve the above object, the technical scheme that the present invention taked is:
A kind of manufacture method of groove type printed circuit board is characterized in that: may further comprise the steps:
(1), internal substrate is provided: at least two internal substrates are provided at first as required, and on each internal substrate, etch all internal layer circuits;
(2), lamination and pressing: after bonding sheet being placed between the internal substrate of required setting, each internal substrate stacks, and utilizes the press pressing;
(3), degree of depth control mills and drags for: utilize degree of depth control milling machine, the wiring board after the above-mentioned pressing is milled to drag for process groove, mill to drag for the most deeply and cannot be corrupted to the destination layer substrate;
(4), electroplate: all parts in the groove are plated required plating medium;
(5), remove the medium that plates: remove the some or all of medium that plates of bottom portion of groove, sidewall keeps the medium that plates;
(6), finished product: obtain this kind particular groove type printed circuit board finished product through etching and subsequent technique.
The manufacture method of aforesaid a kind of groove type printed circuit board is characterized in that: further comprising the steps of between step (3) and step (4): remove insulating dielectric layer: remove destination layer and mill the insulating dielectric layer that drags between the bottom portion of groove.
The manufacture method of aforesaid a kind of groove type printed circuit board is characterized in that: in the said step (4), required plating medium adopts any one the combination of electro-coppering and zinc-plated, zinc-plated lead.
The invention has the beneficial effects as follows: the present invention does not use any filler first; Utilize new process to mill and drag for and remove local or whole this type of particular groove printed wiring board of institute's medium that plates making of bottom portion of groove through degree of depth control; Its fabrication cycle is compared with the traditional handicraft method, has reduced by nearly 1/3rd time, and process cost and human cost have had significantly reduction; The present invention simultaneously utilizes common PCB machine table; Use new technological process to produce this type of particular groove deisgn product, had on the material cost significantly and to have reduced, and avoided using bottom portion of groove figure incompleteness that filler brought, off normal, quality problem such as irregular.
Description of drawings
Fig. 1 is a process chart of the present invention.
Fig. 2 is that the degree of depth of the present invention control is milled and dragged for the back structural representation.
Fig. 3 is some or all of tin of removal bottom portion of groove of the present invention or copper, and sidewall keeps the view of tin.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the finished product structural representation after the etching of the present invention.
Main Reference numeral implication is among the figure:
A, the first internal substrate c, bonding sheet e, electro-coppering
B, the second internal substrate d, groove f, tin
D-1, local or whole Wuxis, bottom perhaps do not have the copper area
D-2, sidewall keep the tin zone.
Embodiment
Below in conjunction with accompanying drawing the present invention is done further description.
Extremely shown in Figure 5 like Fig. 1: a kind of particular groove type printed circuit board (sidewall has electro-coppering, the local or whole base materials in bottom), comprise at least two internal substrates, promptly the first internal substrate a and the second internal substrate b are provided with bonding sheet c between two internal substrates.
The manufacture method of above-mentioned groove type printed circuit board may further comprise the steps:
(1), internal substrate is provided: the first internal substrate a and the second internal substrate b are provided at first as required, and on two internal substrates, etch all internal layer circuits;
(2), lamination and pressing: after the first internal substrate a, the second internal substrate b and bonding sheet c be stacked together, on the first internal substrate a, put steel plate,, utilize the press pressing then at the second internal substrate b underneath upper steel plate;
(3), as shown in Figure 2, degree of depth control is milled and is dragged for: utilize degree of depth control milling machine, the wiring board after the above-mentioned pressing is milled drag for, form grooves d, mill to drag for the most deeply and cannot be corrupted to the destination layer substrate;
(4), remove insulating dielectric layer (in case of necessity): remove destination layer and mill the insulating dielectric layer that drags for bottom portion of groove;
(5), electroplate: normal electrical copper facing e (in case of necessity) and zinc-plated f or zinc-plated lead;
(6), shown in Fig. 3-4, remove tin or copper: remove the some or all of tin or the copper (d-1 zone) of bottom portion of groove, sidewall keeps tin (d-2 zone);
(7), as shown in Figure 5, finished product: obtain this kind particular groove type printed circuit board finished product through behind etching and the subsequent technique.
The present invention is through using a kind of new flow process; Having solved tradition utilizes filler to make the problem of long flow path, operating difficulties; Overcome the problem that conventional method is made the bottom scratch, pollution, Aligning degree difference and the resin residue that are brought, also avoided the reliability problems such as plating cavity of using filler to bring simultaneously.The bottom portion of groove that process of the present invention makes is smooth, and is pollution-free, suits the requirements fully, and its fabrication cycle is compared with the traditional handicraft method, has reduced by nearly 1/3rd time, and process cost and human cost have had significantly reduction,
More than show and described basic principle of the present invention, principal character and advantage.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (3)
1. the manufacture method of a groove type printed circuit board is characterized in that: may further comprise the steps:
(1), internal substrate is provided: at least two internal substrates are provided at first as required, and on each internal substrate, etch all internal layer circuits;
(2), lamination and pressing: after bonding sheet being placed between the internal substrate of required setting, each internal substrate stacks, and utilizes the press pressing;
(3), degree of depth control mills and drags for: utilize degree of depth control milling machine, the wiring board after the above-mentioned pressing is milled to drag for process groove, mill to drag for the most deeply and cannot be corrupted to the destination layer substrate;
(4), electroplate: all parts in the groove are plated required plating medium;
(5), remove the medium that plates: remove the some or all of medium that plates of bottom portion of groove, sidewall keeps the medium that plates;
(6), finished product: obtain this kind particular groove type printed circuit board finished product through etching and subsequent technique.
2. the manufacture method of a kind of groove type printed circuit board according to claim 1 is characterized in that: further comprising the steps of between step (3) and step (4): remove insulating dielectric layer: remove destination layer and mill the insulating dielectric layer that drags between the bottom portion of groove.
3. the manufacture method of a kind of groove type printed circuit board according to claim 2 is characterized in that: in the said step (4), required plating medium adopts any one the combination of electro-coppering and zinc-plated, zinc-plated lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103164758A CN102361539A (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing groove-type printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103164758A CN102361539A (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing groove-type printed wiring board |
Publications (1)
| Publication Number | Publication Date |
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| CN102361539A true CN102361539A (en) | 2012-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103164758A Pending CN102361539A (en) | 2011-10-18 | 2011-10-18 | Method for manufacturing groove-type printed wiring board |
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| CN (1) | CN102361539A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661433A (en) * | 2013-11-20 | 2015-05-27 | 江苏苏杭电子有限公司 | Processing technology of PCB stepped slot |
| CN104684280A (en) * | 2015-03-10 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB with base copper-free metallized blind hole |
| CN106852029A (en) * | 2017-03-31 | 2017-06-13 | 竞华电子(深圳)有限公司 | A kind of manufacture craft of PCB Cavity design sections |
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| CN111295040A (en) * | 2020-02-29 | 2020-06-16 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), layout method and device thereof and storage medium |
| CN112533395A (en) * | 2020-12-21 | 2021-03-19 | 盐城华昱光电技术有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
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| WO2009036478A2 (en) * | 2007-09-21 | 2009-03-26 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Printed circuit board element and method for the production thereof |
| CN101511148A (en) * | 2009-03-13 | 2009-08-19 | 深圳市深南电路有限公司 | Method for preparing resonant cavity integrated on PCB |
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
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2011
- 2011-10-18 CN CN2011103164758A patent/CN102361539A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2009036478A2 (en) * | 2007-09-21 | 2009-03-26 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Printed circuit board element and method for the production thereof |
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
| CN101511148A (en) * | 2009-03-13 | 2009-08-19 | 深圳市深南电路有限公司 | Method for preparing resonant cavity integrated on PCB |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661433A (en) * | 2013-11-20 | 2015-05-27 | 江苏苏杭电子有限公司 | Processing technology of PCB stepped slot |
| CN104684280A (en) * | 2015-03-10 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB with base copper-free metallized blind hole |
| CN104684280B (en) * | 2015-03-10 | 2017-10-17 | 深圳崇达多层线路板有限公司 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
| CN106852029A (en) * | 2017-03-31 | 2017-06-13 | 竞华电子(深圳)有限公司 | A kind of manufacture craft of PCB Cavity design sections |
| CN106852029B (en) * | 2017-03-31 | 2018-12-14 | 竞华电子(深圳)有限公司 | A kind of manufacture craft of PCB Cavity design section |
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| CN111295040A (en) * | 2020-02-29 | 2020-06-16 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), layout method and device thereof and storage medium |
| CN111295040B (en) * | 2020-02-29 | 2022-06-14 | 苏州浪潮智能科技有限公司 | PCB (printed circuit board), layout method and device thereof and storage medium |
| CN112533395A (en) * | 2020-12-21 | 2021-03-19 | 盐城华昱光电技术有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
| CN112533395B (en) * | 2020-12-21 | 2021-12-24 | 北京同方信息安全技术股份有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
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Application publication date: 20120222 |